B58035U7105M062 [TDK]
CeraLink®电容器;
| 型号： | B58035U7105M062 |
| 厂家： | 
TDK ELECTRONICS |
| 描述： | CeraLink®电容器 电容器 |
| 文件： | 总31页 (文件大小：3347K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
CeraLink
Capacitor for fast-switching semiconductors
Series/Type:
Ordering code:
Flex Assembly (FA) series
B58035U*
Date:
Version:
2022-05-06
6.3
Content of header bars 1 and 2 of data sheet will be automatically entered in headers and footers! Please fill in the table and then
change the color to "white". This ensures that the table disappears (invisible) for the customer PDF.
Don't change formatting when entering or pasting text in the table and don't add any cell or line in and to it!
Identification/Classification 1
(header 1 + top left bar):
Identification/Classification 2
(header 2 + bottom left header bar):
Ordering code: (top right header bar)
Series/Type: (bottom right header bar)
Preliminary data (optional):
Department:
CeraLink
Capacitor for fast-switching semiconductors
B58035U*
Flex Assembly (FA) series
PPD PI AE/IE PD
Date:
2022-05-06
Version:
6.3
Prepared by:
Dr. Hopfer
Signed by:
Dr. Hopfer, Krumphals, Lic
Modifications/Remarks:
Higher voltage-rating with temperature derating added (p3, p4), AEC-Q200
table & glossary updated; Dual Use footnote added (p3)
TDK Electronics AG 2022. Reproduction, publication and dissemination of this publication, enclosures hereto and the
information contained therein without TDK Electronics' prior express consent is prohibited.
CeraLink
B58035U*
Capacitor for fast-switching semiconductors
Flex Assembly (FA) series
Applications
Power converters and inverters
DC link/snubber capacitor for power converters and inverters
Features
High ripple current capability
High temperature robustness
Low equivalent serial inductance (ESL)
Low equivalent serial resistance (ESR)
Low power loss
Low dielectric absorption
Optimized for high frequencies up to several MHz
Increasing capacitance with DC bias up to operating voltage
High capacitance density
Minimized dielectric loss at high temperatures
Qualification based on AEC-Q200 rev. D
Suitable for reflow soldering only
Construction
RoHS-compatible PLZT ceramic (lead lanthanum zirconium titanate)
Copper inner electrodes
Silver outer electrodes
Silver coated copper-invar lead frame
Epoxy resin adhesive
General technical data
Dissipation factor
tan ꢀ
< 0.02
*)
Insulation resistance
Operating device temperature
Rins,typ
Tdevice
> 0.1
GΩ
-40 … +150
°C
*) Typical insulation resistance, measured at operating voltage Vop and measurement time > 240s, +25 °C
PPD PI AE/IE PD
2022-05-06
Please read Cautions and warnings and
Page 2 of 31
Important notes at the end of this document.
CeraLink
B58035U*
Capacitor for fast-switching semiconductors
Flex Assembly (FA) series
Overview of available types
VR,Tmax (VDC
)
500
700
900
FA2
FA3
0.5
0.75
1
FA2
FA3
1.5
2
2.5
3
FA2
FA3
FA10
5
FA10
10
FA10
Electrical specifications and ordering codes
*)
Type
Vpk,max
V
VR,Tmax
V
Vop
V
Cnom,typ
µF
Ceff,typ
µF
C0
µF
Ordering code
FA2
650
1000
1300
650
500
700
900
500
700
900
400
600
800
400
600
800
2
1.20
0.50
0.26
1.80
0.75
0.39
0.70 ±20% B58035U5205M062
B58035U5205M052 **)
1
0.28 ±20% B58035U7105M062
B58035U7105M052 **)
0.14 ±20% B58035U9504M062 ***)
B58035U9504M052 **) ***)
0.5
3
FA3
1.05 ±20% B58035U5305M062
B58035U5305M052 **)
1000
1300
1.5
0.75
0.42 ±20% B58035U7155M062
B58035U7155M052 **)
0.21 ±20% B58035U9754M062 ***)
B58035U9754M052 **) ***)
FA10
650
1000
1300
500
700
900
400
600
800
10
5
6.00
2.50
1.30
3.50 ±20% B58035U5106M001
1.40 ±20% B58035U7505M001
0.70 ±20% B58035U9255M001 ***)
2.5
*)
V
denotes the permissible rated voltage for the maximum device temperature Tmax = +150 °C. Operation at higher rated voltage
R,Tmax
VR > VR,Tmax is possible, where the permissible rated voltage VR can be extracted from the temperature derating curves on the next page.
**) smaller packaging unit (180-mm reel), see section “Packaging” for details
***) this part is affected by "Dual Use" regulations according to the law of the country the production site is located in. Deliveries of such
products are subject to prior approval of the respective local authorities based on customer declarations. The delivery to certain countries
may be restricted.
Aging
The capacitance has an aging behavior which shows a decrease of capacitance with time.
The typical aging rate is about 2.5% per logarithmic decade in hours.
PPD PI AE/IE PD
2022-05-06
Please read Cautions and warnings and
Page 3 of 31
Important notes at the end of this document.
CeraLink
B58035U*
Capacitor for fast-switching semiconductors
Flex Assembly (FA) series
Rated Voltage VR and Temperature Derating
The CeraLink FA series can be operated at elevated rated voltage, i.e. VR ≥ VR,Tmax. However, the device
temperature of the component should be kept within the temperature-derated conditions detailed in the following
graphs. Higher device temperatures are permissible at reduced lifetime.
VR,Tmax = 500 V
(B58035U5*)
600
575
550
525
500
475
450
115 120 125 130 135 140 145 150 155
Tdevice [°C]
V
R,Tmax = 700 V
850
800
750
700
650
600
(B58035U7*)
115 120 125 130 135 140 145 150 155
Tdevice [°C]
V
R,Tmax = 900 V
1100
1050
1000
950
(B58035U9*)
900
850
800
115 120 125 130 135 140 145 150 155
Tdevice [°C]
PPD PI AE/IE PD
2022-05-06
Please read Cautions and warnings and
Page 4 of 31
Important notes at the end of this document.
CeraLink
B58035U*
Capacitor for fast-switching semiconductors
Flex Assembly (FA) series
Dimensional drawings
FA 2
FA 3
9.0 ±0.5
6.0 ±0.5
FA 10
30.0 ±0.5
Dimensions in mm
Recommended solder pads
Type
FA2
a
7
b
c
5
5
5
2.85
2.85
2.85
FA3
10
31
FA10
Dimensions in mm
PPD PI AE/IE PD
2022-05-06
Please read Cautions and warnings and
Page 5 of 31
Important notes at the end of this document.
CeraLink
B58035U*
Capacitor for fast-switching semiconductors
Flex Assembly (FA) series
Polarity and marking of components
FAX Y µF
Z V
Manufacturer’s logo
X = CeraLink FA type (e.g. FA2)
Y = Nominal capacitance
Z = Rated voltage
Note that polarity is only for incoming inspection purposes and it does not affect operation. If put under reverse
rated voltage VR, CeraLink is repoled and works identically, see our CeraLink Technical Guide for further details.
Typical values as a design reference for CeraLink® applications
*)
*)
Type
VR,Tmax
Weight ESR
ESR
0 VDC
ESL
Iop
Iop
0 VDC
,
,
Vop,
Vop,
0.5 VAC,RMS
25°C, 1kHz
Ω
,
0.5 VAC,RMS
25°C, 1MHz
mΩ
,
100 kHz,
TA = 85°C
ARMS
100 kHz,
TA = 105°C
ARMS
V
G
nH
3
FA2
FA3
FA10
FA2
FA3
FA10
FA2
FA3
FA10
2.3
3.5
3
2
5
4
17
20
47
12
16
39
8
14
17
38
11
13
30
7
500
11.5
2.3
1
3
2
6
17
12
5
3
700
900
3.5
4
11.5
2.3
1
2
11
7
29
20
7
3
3.5
11
32
9
11.5
2
2
23
*) Normal operating current without forced cooling at Tdevice = +150 °C. Higher values permissible at reduced lifetime.
PPD PI AE/IE PD
2022-05-06
Please read Cautions and warnings and
Page 6 of 31
Important notes at the end of this document.
CeraLink
B58035U*
Capacitor for fast-switching semiconductors
Flex Assembly (FA) series
Typical characteristics as a function of temperature and voltage - VR,Tmax = 500 V
(0.5 VAC,RMS, frequency = 1 kHz)
All given temperatures are device temperatures.
The curves show the relative changes of the capacitance, dissipation factor and ESR. The 100%
values correspond to Ceff,typ and tanδ which are given on pages 2, 3 and 4 of this data sheet.
T [°C]
-25
25
Bias
[VDC]
0
400
500
120
110
100
90
120
110
100
90
80
70
75
125
80
70
60
50
40
30
60
50
40
0
100
100
100
200
200
200
300
400
400
400
500
500
500
600
600
600
-50
-50
-50
-25
-25
-25
0
0
0
25
50
75
100
100
100
125
125
125
150
150
150
Voltage [VDC]
Temperature [°C]
600
500
400
300
200
100
0
600
500
400
300
200
100
0
T [°C]
-25
25
Bias
[VDC]
0
400
500
75
125
0
300
25
50
75
Voltage [VDC]
Temperature [°C]
500
400
300
200
100
0
T [°C]
-25
25
75
125
Bias
[VDC]
0
400
500
600
500
400
300
200
100
0
0
300
25
50
75
Voltage [VDC]
Temperature [°C]
PPD PI AE/IE PD
2022-05-06
Please read Cautions and warnings and
Important notes at the end of this document.
Page 7 of 31
CeraLink
B58035U*
Capacitor for fast-switching semiconductors
Flex Assembly (FA) series
Application Notes
Further typical electrical characteristics as a design reference for CeraLink applications.
Typical capacitance values as a function of voltage - VR,Tmax = 500 V
(valid for FA2, FA3 and FA10)
Large signal capacitance:
225
200
175
150
125
100
75
Variable
large signal
small signal
Quasistatic (slow variation of the voltage), +25 °C
The nominal capacitance is defined as the large
signal capacitance at Vop.
See glossary for further information.
Small signal capacitance:
0.5 VAC,RMS, 1 kHz, +25 °C
The effective capacitance is defined as the small
signal capacitance at Vop.
50
0
100
200
300
400
500
600
Voltage [VDC]
PPD PI AE/IE PD
2022-05-06
Please read Cautions and warnings and
Page 8 of 31
Important notes at the end of this document.
CeraLink
B58035U*
Capacitor for fast-switching semiconductors
Flex Assembly (FA) series
Typical impedance, ESR and permissible current as a function of frequency - VR,Tmax = 500 V
VDC = 0 V,
Measurements performed at Vop.
VAC = 0.5 VRMS
Tdevice = +25 °C
,
The values correspond to a device temperature of
+150 °C. No forced cooling was used.
17.5
15.0
12.5
10.0
7.5
Tamb
[°C]
85
105
FA2
5.0
0
20
40
60
80
80
80
100
Frequency [kHz]
Tamb
[°C]
85
20.0
17.5
15.0
12.5
10.0
7.5
105
FA3
5.0
0
20
40
60
100
Frequency [kHz]
50
40
30
20
Tamb
[°C]
85
105
FA10
10
0
20
40
60
100
Frequency [kHz]
PPD PI AE/IE PD
2022-05-06
Please read Cautions and warnings and
Page 9 of 31
Important notes at the end of this document.
CeraLink
B58035U*
Capacitor for fast-switching semiconductors
Flex Assembly (FA) series
Typical characteristics as a function of temperature and voltage - VR,Tmax = 700 V
(0.5 VAC,RMS, frequency = 1 kHz)
All given temperatures are device temperatures.
The curves show the relative changes of the capacitance, dissipation factor and ESR. The 100%
values correspond to Ceff,typ and tanδ which are given on pages 2, 3 and 4 of this data sheet.
130
T [°C]
-25
25
Bias
[VDC]
0
600
700
120
110
100
90
75
120
110
100
90
125
80
80
70
70
60
60
50
50
40
0
100
100
100
200
200
200
300
400
500
600
600
600
700
700
700
800
800
800
-50
-50
-50
-25
-25
-25
0
0
0
25
50
75
100
100
100
125
125
125
150
150
150
Voltage [VDC]
Temperature [°C]
700
600
500
400
300
200
100
0
T [°C]
-25
25
Bias
[VDC]
0
600
500
400
300
200
100
0
75
600
700
125
0
300
400
500
25
50
75
Voltage [VDC]
Temperature [°C]
500
400
300
200
100
0
T [°C]
-25
25
75
125
Bias
[VDC]
0
600
700
600
500
400
300
200
100
0
25
50
75
0
300
400
500
Temperature [°C]
Voltage [VDC]
PPD PI AE/IE PD
2022-05-06
Please read Cautions and warnings and
Page 10 of 31
Important notes at the end of this document.
CeraLink
B58035U*
Capacitor for fast-switching semiconductors
Flex Assembly (FA) series
Application Notes
Further typical electrical characteristics as a design reference for CeraLink applications.
Typical capacitance values as a function of voltage - VR,Tmax = 700 V
(valid for FA2, FA3 and FA10)
Large signal capacitance:
225
200
175
150
125
100
75
Variable
large signal
small signal
Quasistatic (slow variation of the voltage), +25 °C
The nominal capacitance is defined as the large
signal capacitance at Vop.
See glossary for further information.
Small signal capacitance:
0.5 VAC,RMS, 1 kHz, +25 °C
The effective capacitance is defined as the small
signal capacitance at Vop.
50
0
100
200
300
400
500
600
700
800
Voltage [VDC]
PPD PI AE/IE PD
2022-05-06
Please read Cautions and warnings and
Page 11 of 31
Important notes at the end of this document.
CeraLink
B58035U*
Capacitor for fast-switching semiconductors
Flex Assembly (FA) series
Typical impedance, ESR and permissible current as a function of frequency - VR,Tmax = 700 V
VDC = 0 V,
Measurements performed at Vop.
VAC = 0.5 VRMS
Tdevice = +25 °C
,
The values correspond to a device temperature of
+150 °C. No forced cooling was used.
Tamb
[°C]
85
12
10
8
105
FA2
FA3
FA10
6
4
2
0
20
40
60
80
80
80
100
Frequency [kHz]
Tamb
[°C]
85
15.0
12.5
10.0
7.5
105
5.0
0
20
40
60
100
Frequency [kHz]
Tamb
[°C]
85
40
35
30
25
20
15
105
10
0
20
40
60
100
Frequency [kHz]
PPD PI AE/IE PD
2022-05-06
Please read Cautions and warnings and
Page 12 of 31
Important notes at the end of this document.
CeraLink
B58035U*
Capacitor for fast-switching semiconductors
Flex Assembly (FA) series
Typical characteristics as a function of temperature and voltage - VR,Tmax = 900 V
(0.5 VAC,RMS, frequency = 1 kHz)
All given temperatures are device temperatures.
The curves show the relative changes of the capacitance, dissipation factor and ESR. The 100%
values correspond to Ceff,typ and tanδ which are given on pages 2, 3 and 4 of this data sheet.
130
120
110
100
90
130
120
110
100
90
T [°C]
-25
25
Bias
[VDC]
0
800
900
75
125
80
80
70
70
60
60
50
50
40
0
100 200 300 400 500 600 700 800 900 1000 1100
Voltage [VDC]
-50
-50
-50
-25
-25
-25
0
0
0
25
50
75
100
100
100
125
125
125
150
150
150
Temperature [°C]
700
600
500
400
300
200
100
0
700
600
500
400
300
200
100
0
T [°C]
-25
25
Bias
[VDC]
0
75
800
900
125
0
100 200 300 400 500 600 700 800 900 1000 1100
Voltage [VDC]
25
50
75
Temperature [°C]
600
500
400
300
200
100
0
T [°C]
-25
25
75
125
Bias
[VDC]
0
800
900
500
400
300
200
100
0
0
100 200 300 400 500 600 700 800 900 1000 1100
Voltage [VDC]
25
50
75
Temperature [°C]
PPD PI AE/IE PD
2022-05-06
Please read Cautions and warnings and
Page 13 of 31
Important notes at the end of this document.
CeraLink
B58035U*
Capacitor for fast-switching semiconductors
Flex Assembly (FA) series
Application Notes
Further typical electrical characteristics as a design reference for CeraLink applications.
Typical capacitance values as a function of voltage - VR,Tmax = 900 V
(valid for FA2, FA3 and FA10)
Large signal capacitance:
225
200
175
150
125
100
75
Variable
large signal
small signal
Quasistatic (slow variation of the voltage), +25 °C
The nominal capacitance is defined as the large
signal capacitance at Vop.
See glossary for further information.
Small signal capacitance:
0.5 VAC,RMS, 1 kHz, +25 °C
The effective capacitance is defined as the small
signal capacitance at Vop.
50
0
100 200 300 400 500 600 700 800 900 1000 1100
Voltage [VDC]
PPD PI AE/IE PD
2022-05-06
Please read Cautions and warnings and
Page 14 of 31
Important notes at the end of this document.
CeraLink
B58035U*
Capacitor for fast-switching semiconductors
Flex Assembly (FA) series
Typical impedance, ESR and permissible current as a function of frequency - VR,Tmax = 900 V
VDC = 0 V,
Measurements performed at Vop.
VAC = 0.5 VRMS
Tdevice = +25 °C
,
The values correspond to a device temperature of
+150 °C. No forced cooling was used.
Tamb
[°C]
85
8
7
6
5
4
3
2
105
FA2
FA3
FA10
0
20
40
60
80
80
80
100
Frequency [kHz]
Tamb
[°C]
85
11
105
10
9
8
7
6
5
4
3
2
0
20
40
60
100
Frequency [kHz]
35
30
25
20
15
10
5
Tamb
[°C]
85
105
0
0
20
40
60
100
Frequency [kHz]
PPD PI AE/IE PD
2022-05-06
Please read Cautions and warnings and
Page 15 of 31
Important notes at the end of this document.
CeraLink
B58035U*
Capacitor for fast-switching semiconductors
Flex Assembly (FA) series
Reliability
A. Preconditioning:
Reflow solder the capacitor on a PCB using the recommended soldering profile
Check of external appearance
*)
Measurement of isolation resistance Rins
o Apply Vpk,max for 7 seconds and measure Rins at room temperature:
Isolation resistance (@ Vpk,max, 7 s, 25 °C)
Rins > 100 MΩ
Measurement of electrical parameters C0 and tanδ according to specification
o
Measure C0 and tanδ within 10 minutes to 1 hour afterwards:
Initial capacitance (@ 0 VDC, 0.5 VAC,RMS, 1 kHz, 25 °C)
Dissipation factor (@ 0 VDC, 0.5 VAC,RMS, 1 kHz, 25 °C)
C0 acc. spec. on page 3
tanδ < 0.02
B. Performance of a specific reliability test.
C. After performing a specific test:
Check the external appearance again
Repeat the measurement of the electrical parameters
o Apply Vpk,max for 7 seconds and measure Rins at room temperature:
Isolation resistance (@ Vpk,max, 7 s, 25 °C)
Rins > 100 MΩ
o
Measure C and tanδ:
Change of initial capacitance (@ 0 VDC, 0.5 VAC,RMS, 1 kHz, 25 °C) |ΔC0 / C0| < 15%
Dissipation factor (@ 0 VDC, 0.5 VAC,RMS, 1 kHz, 25 °C) tanδ < 0.05
o
*) Note that the measurement of the isolation resistance Rins using the described measurement conditions is for pre- and post-measurement
within the scope of the AEC-Q200 reliability tests only.
Qualification tests based on AEC-Q200 Rev. D (Table 2)
Test
AEC-
Standard
Test conditions
Criteria
Q200 No.
Pre- and Post-
1
-
As described above
|ΔC0/C0|, tanδ and Rins
Stress Electrical
within defined limits.
High
Temperature
Exposure
3
MIL-STD-202 +150 °C, unpowered, 1000 hours
Method 108
No mechanical damage.
|ΔC0/C0|, tanδ and Rins
within defined limits.
Temperature
Cycling
4
IEC 60384-9, -55 °C to +150 °C, ≤ 20 seconds
No mechanical damage
4.8
transfer time, 15 minutes dwell time, |ΔC0 / C0|, tanδ and Rins
1000 cycles
within defined limits
Destructive
Physical Analysis
5
7
8
EIA-469
-
No internal defects that
might affect performance
or reliability
Biased Humidity
MIL-STD-202, +85 °C, 85% rel. hum., VR,Tmax, 1000 No mechanical damage
Method 103
hours
|ΔC0 / C0|, tanδ and Rins
within defined limits
High
Temperature
Operating Life
MIL-STD-202, +150 °C, VR,Tmax, 1000 hours
Method 108
No mechanical damage
|ΔC0 / C0|, tanδ and Rins
within defined limits
PPD PI AE/IE PD
2022-05-06
Please read Cautions and warnings and
Page 16 of 31
Important notes at the end of this document.
CeraLink
B58035U*
Capacitor for fast-switching semiconductors
Flex Assembly (FA) series
Test
AEC-
Standard
Test conditions
Criteria
Q200 No.
External Visual
9
MIL-STD-883 Visual inspection with magnifying
Method 2009 glass
No defects that might affect
performance
Physical
Dimension
10
12
JESD22 JB-
100
Verify physical dimensions to the
device specification using a caliper
Within specified tolerance
in the chapter construction
Resistance to
Solvent
MIL-STD-202 Dipping and cleaning with
Method 215 isopropanol
Marking must be legible
|ΔC0 / C0|, tanδ and Rins
within defined limits
Mechanical
Shock
13
14
MIL-STD-202, Acceleration 400 m/s², half-sine
No mechanical damage
method 213
pulse, duration 6 msec, 4000 bumps |ΔC0 / C0|, tanδ and Rins
within defined limits
Vibration
MIL-STD-202, 5 g / 20 min, 12 cycles, 3 axis,
No mechanical damage
|ΔC0 / C0|, tanδ and Rins
within defined limits
method 204
10 Hz to 2000 Hz
Solderability
Board Flex
18
21
See below
AEC-Q200-
005
Bending of 2 mm for 60 seconds
No mechanical damage
|ΔC0 / C0|, tanδ and Rins
within defined limits
Dimensions in mm
Terminal
Strength
22
AEC-Q200-
006
Apply a force of 17.7 N for 60
seconds
No detaching of
termination. No rupture of
ceramic
|ΔC0 / C0|, tanδ and Rins
within defined limits
Solderability Tests
Wettability
(leadframe only) 235 °C, cat. 3
J-STD-002, Method A @ Dip test of contact areas in solder
> 95% wettability of lead
frame
bath
(+235 °C for 5 ± 0.5 seconds)
Leaching test
(leadframe only) 210, cond. B
MIL-STD-202, Method
Dip test of contact areas in solder
bath
No damage of lead frame
silver coating
(+260 °C for 10 seconds)
Reflow test
-
3 times recommended reflow
soldering profile
No mechanical damage
Proper solder coating of
contact areas
|ΔC0 / C0|, tanδ and Rins
within defined limits
PPD PI AE/IE PD
2022-05-06
Please read Cautions and warnings and
Page 17 of 31
Important notes at the end of this document.
CeraLink
B58035U*
Capacitor for fast-switching semiconductors
Flex Assembly (FA) series
Packaging
The CeraLink FA2 type is delivered in a blister tape (taping to IEC 60286-3, 180-mm / 330-mm reel available
with 110 / 500 pieces per reel).
The CeraLink FA3 type is delivered in a blister tape (taping to IEC 60286-3, 180-mm / 330-mm reel available
with 100 / 350 pieces per reel).
The CeraLink FA10 type is delivered in a cardboard box with 100 pieces per box.
Blister tape for FA2
Part orientation
The part-orientation/polarity is the same for all CeraLink FA2 capacitors within the blister tape.
Component marking on this side
PPD PI AE/IE PD
2022-05-06
Please read Cautions and warnings and
Page 18 of 31
Important notes at the end of this document.
CeraLink
B58035U*
Capacitor for fast-switching semiconductors
Flex Assembly (FA) series
Blister tape for FA3
Part orientation
The part-orientation/polarity is the same for all CeraLink FA3 capacitors within the blister tape.
Component marking on this side
PPD PI AE/IE PD
2022-05-06
Please read Cautions and warnings and
Page 19 of 31
Important notes at the end of this document.
CeraLink
B58035U*
Capacitor for fast-switching semiconductors
Flex Assembly (FA) series
Taping information
Trailer: There is a minimum of 160 mm of carrier tape with empty compartments and sealed by the cover tape.
Leader: There is a minimum of 400 mm of cover tape, which includes at least 100 mm of carrier tape with empty
compartments.
Fixing peeling strength (top tape)
The peeling strength is 0.1 … 1.3 N.
PPD PI AE/IE PD
2022-05-06
Please read Cautions and warnings and
Page 20 of 31
Important notes at the end of this document.
CeraLink
B58035U*
Capacitor for fast-switching semiconductors
Flex Assembly (FA) series
Reel packing
FA2 & FA3 Type FA2 & FA3 Type
330-mm reel
180-mm reel
A
B
C
D
E
W
330 ±2
180 ±3
62 ±1
62 ±1
12.8 +0.7
19.1 min.
1.6 ±0.5
16.4 +2
13.1 ±0.5
19.1 min.
2.1 ±0.5
17.0 -0.5 / +2
Dimensions in mm
PPD PI AE/IE PD
2022-05-06
Please read Cautions and warnings and
Page 21 of 31
Important notes at the end of this document.
CeraLink
B58035U*
Capacitor for fast-switching semiconductors
Flex Assembly (FA) series
Cardboard box for FA10
Top cover
Base support tray
Dimensions in mm
Part orientation
The part-orientation/polarity is the same for all CeraLink FA10 capacitors within the tray. Parts are placed with
leadframes facing base support tray as shown.
PPD PI AE/IE PD
2022-05-06
Please read Cautions and warnings and
Page 22 of 31
Important notes at the end of this document.
CeraLink
B58035U*
Capacitor for fast-switching semiconductors
Flex Assembly (FA) series
Recommended reflow soldering profile
Profile feature
SAC, Sn95.5Ag3.8Cu0.7 @ N2 atmosphere
Preheat and soak
- Temperature min
Tsmin
+150 °C
- Temperature max
- Time
Average ramp-up rate
Liquidus temperature
Tsmax
tsmin to tsmax
TL to Tp
TL
+200 °C
60 … 120 seconds
3 °C/ second max.
+217 °C
Time at liquidus temperature
Peak package body temperature
Time (tp)3) within +5 °C of specified
classification temperature (Tc)
Average ramp-down rate
Time +25 °C to peak temperature
tL
Tp
60 … 150 seconds
245 °C … 260 °C max.2)
30 seconds3)
1)
Tp to TL
+6 °C/ second max.
maximum 8 minutes
1) Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum.
2) Depending on package thickness (cf. JEDEC J-STD-020D).
3) Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum.
Notes:
All temperatures refer to topside of the package, measured on the package body surface.
Max. number of reflow cycles: 3
After the soldering process, the capacitance is lowered. Applying VR to the device will re-establish the capacitance.
The proposed soldering profile is based on IEC 60068-2-58 (respectively JEDEC J-STD-020D) recommendations.
PPD PI AE/IE PD
2022-05-06
Please read Cautions and warnings and
Page 23 of 31
Important notes at the end of this document.
CeraLink
B58035U*
Capacitor for fast-switching semiconductors
Flex Assembly (FA) series
General technical information
Storage
Only store CeraLink capacitors in their original packaging. Do not open the package prior to
processing.
Storage conditions in original packaging: temperature −25 °C to +45 °C, relative humidity ≤ 75%
annual average, maximum 95%, dew precipitation is inadmissible.
Do not store CeraLink capacitors where they are exposed to heat or direct sunlight. Otherwise the
packaging material may be deformed or CeraLink may stick together, causing problems during
mounting.
Avoid contamination of the CeraLink surface during storage, handling and processing.
Avoid storing CeraLink devices in harmful environments where they are exposed to corrosive
gases (e.g. SOx, Cl).
Use CeraLink as soon as possible after opening factory seals such as polyvinyl-sealed packages.
Solder CeraLink components within 6 months after shipment.
Handling
Do not drop CeraLink components or allow them to be chipped.
Do not clamp CeraLink components on the face sides (e.g. during pick-and-place). A vacuum-
based pick-and-place process picking the component on the top side is recommended.
Do not touch CeraLink with your bare hands - gloves are recommended.
Avoid contamination of the CeraLink surface during handling.
The CeraLink FA series was tested to withstand the board flex test defined in the AEC-Q200 rev D,
method 005.
The CeraLink FA series uses copper-invar lead frames to prevent mechanical stress to the ceamic.
Too much bending causes open mode. Avoid high mechanical stress like twisting after soldering
on a PCB.
bending
PPD PI AE/IE PD
2022-05-06
Please read Cautions and warnings and
Page 24 of 31
Important notes at the end of this document.
CeraLink
B58035U*
Capacitor for fast-switching semiconductors
Flex Assembly (FA) series
Mounting
Do not subject CeraLink devices to mechanical stress when encapsulating them with sealing
material or overmolding with plastic material. Encapsulation may lead to worse heat dissipation
too. Please ask for further information.
Do not scratch the electrodes before, during or after the mounting process.
Make sure contacts and housings used for assembly with CeraLink components are clean before
mounting.
The surface temperature of an operating CeraLink can be higher than the ambient temperature.
Ensure that adjacent components are placed at a sufficient distance from a CeraLink to allow
proper cooling.
Avoid contamination of the CeraLink surface during processing.
Soldering guidelines
The use of mild, non-activated fluxes for soldering is recommended, as well as proper cleaning of
the PCB.
Complete removal of flux is recommended to avoid surface contamination that can result in an
instable and/or high leakage current.
Use resin-type or non-activated flux.
Bear in mind that insufficient preheating may cause ceramic cracks.
Rapid cooling by dipping in solvent is not recommended, otherwise a component may crack.
Excessive usage of solder paste can reduce the mechanical robustness of the device, whereas
insufficient solder may cause the CeraLink to detach from the PCB. Use an adequate amount of
solder paste, but on the landing pads only.
If an unsuitable cleaning fluid is used, flux residue or foreign particles may stick to the CeraLink
surface and deteriorate its insulation resistance. Insufficient or improper cleaning of the CeraLink
may cause damage to the component.
Excessive washing like ultrasonic cleaning, can affect the connection between the ceramic chip
and the outer electrode. To avoid this, we give the following recommendation:
o Power: 20 W/l max.
o Frequency: 40 kHz max.
o Washing time: 5 minutes max.
PPD PI AE/IE PD
2022-05-06
Please read Cautions and warnings and
Page 25 of 31
Important notes at the end of this document.
CeraLink
B58035U*
Capacitor for fast-switching semiconductors
Flex Assembly (FA) series
Glossary
Initial capacitance C0:
Is the value at the origin of the hysteresis without any applied direct
voltage.
Effective capacitance Ceff:
Occurs at Vop and is measured with an applied ripple voltage of
0.5 VAC,RMS and 1 kHz. The CeraLink is designed to have its highest
capacitance value at the operating voltage Vop.
Nominal capacitance Cnom
:
Is the value derived by the tangent of the mean hysteresis as the
derivative of the mean hysteresis is dQ/dV ~ C.
See our CeraLink Technical Guide for further details.
PPD PI AE/IE PD
2022-05-06
Please read Cautions and warnings and
Page 26 of 31
Important notes at the end of this document.
CeraLink
B58035U*
Capacitor for fast-switching semiconductors
Flex Assembly (FA) series
Symbols and terms
AC
Alternating current
C0
Initial capacitance @ 0 VDC, 0.5 VAC,RMS, 1 kHz, +25 °C
Ceff,typ
Cnom,typ
Typical effective capacitance @ Vop, 0.5 VAC,RMS, 1 kHz, +25 °C
Typical nominal capacitance @ Vop, quasistatic, +25 °C. See glossary for
definition of the nominal capacitance
DC
Direct current
ESL
ESR
Iop
Equivalent serial inductance
Equivalent serial resistance
Operating ripple current, root mean square value of sinusoidal AC current
Low profile
LP
PCB
PLZT
Rins
Printed circuit board
Lead lanthanum zirconium titanate
Insulation resistance @ Vpk,max, measurement time t = 7 s, +25 °C
Insulation resistance @ Vop, measurement time t > 240 s, +25 °C
Tin silver copper alloy; lead-free solder paste
Ambient temperature
Rins,typ
SAC
Tamb
tanδ
Tdevice
Dissipation factor @ 0 VDC, 0.5 VAC,RMS,1 kHz, +25 °C
Device temperature. Tdevice = Tamb + ΔT (ΔT defines the self-heating of the device
due to applied current).
Tmax
Vop
VR
Max. device temperature, Tmax = +150°C. Reference temperature for reliability tests
Operating voltage at maximum attenuation capability
Rated voltage for Tdevice ≤ Tmax. Depends on the temperature derating conditions
defined on page 4 and can be higher than VR,Tmax
VR,Tmax
VAC,RMS
Vpk,max
Rated voltage for Tmax. Reference DC voltage for reliability tests
Root mean square value of sinusoidal AC voltage
Maximum peak operating voltage
ΔT
Increase of temperature during operation
PPD PI AE/IE PD
2022-05-06
Please read Cautions and warnings and
Page 27 of 31
Important notes at the end of this document.
CeraLink
B58035U*
Capacitor for fast-switching semiconductors
Flex Assembly (FA) series
Cautions and warnings
General
Not for use in resonant circuits, where a voltage of alternating polarity occurs.
Not for AC applications. Consult our local representative for further details.
If used in snubber circuits, ensure that the sum of all voltages remains at the same polarity.
Some parts of this publication contain statements about the suitability of our CeraLink components for
certain areas of application, including recommendations about incorporation/design-in of these
products into customer applications. The statements are based on our knowledge of typical
requirements often made of our CeraLink devices in the particular areas. We nevertheless expressly
point out that such statements cannot be regarded as binding statements about the suitability of our
CeraLink components for a particular customer application. As a rule, TDK is either unfamiliar with
individual customer applications or less familiar with them than the customers themselves. For these
reasons, it is always incumbent on the customer to check and decide whether the CeraLink devices
with the properties described in the product specification are suitable for use in a particular customer
application.
Do not use CeraLink components for purposes not identified in our specifications.
Ensure the suitability of a CeraLink in particular by testing it for reliability during design-in.
Always evaluate a CeraLink component under worst-case conditions.
Pay special attention to the reliability of CeraLink devices intended for use in safety-critical
applications (e.g. medical equipment, automotive, spacecraft, nuclear power plant).
Design notes
Consider derating at higher operating temperatures. As a rule, lower temperatures and voltages
increase the lifetime of CeraLink devices.
If steep surge current edges are to be expected, make sure your design is as low-inductive as
possible.
In some cases, the malfunctioning of passive electronic components or failure before the end of
their service life cannot be completely ruled out in the current state of the art, even if they are
operated as specified. In applications requiring a very high level of operational safety and
especially when the malfunction or failure of a passive electronic component could endanger
human life or health (e.g. in accident prevention, life-saving systems, or automotive battery line
applications such as clamp 30), ensure by suitable design of the application or other measures
(e.g. installation of protective circuitry, fuse or redundancy) that no injury or damage is sustained
by third parties in the event of such a malfunction or failure.
Specified values only apply to CeraLink components that have not been subject to prior electrical,
mechanical or thermal damage. The use of CeraLink devices in line-to-ground applications is
therefore not advisable, and it is only allowed together with safety countermeasures such as
thermal fuses.
PPD PI AE/IE PD
2022-05-06
Please read Cautions and warnings and
Page 28 of 31
Important notes at the end of this document.
CeraLink
B58035U*
Capacitor for fast-switching semiconductors
Flex Assembly (FA) series
Operation
Use CeraLink only within the specified operating temperature range.
Use CeraLink only within specified voltage and current ranges.
The CeraLink has to be operated in a dry atmosphere, which must not contain any additional
chemical vapors or substances.
Environmental conditions must not harm the CeraLink. Use the capacitors under normal
atmospheric conditions only. A reduction of the oxygen partial pressure to below 1 mbar is not
permissible.
Prevent a CeraLink from contacting liquids and solvents.
Avoid dewing and condensation.
During operation, the CeraLink can produce audible noise due to its piezoelectric characteristic.
CeraLink components are mainly designed for encased applications. Under all circumstances
avoid exposure to:
o direct sunlight
o rain or condensation
o steam, saline spray
o corrosive gases
o atmosphere with reduced oxygen content
This listing does not claim to be complete, but merely reflects the experience of the manufacturer.
Display of ordering codes for TDK Electronics products
The ordering code for one and the same product can be represented differently in data sheets, data books,
other publications, on the company website, or in order-related documents such as shipping notes, order
confirmations and product labels. The varying representations of the ordering codes are due to different
processes employed and do not affect the specifications of the respective products. Detailed
information can be found on the Internet under www.tdk-electronics.tdk.com/orderingcodes.
PPD PI AE/IE PD
2022-05-06
Please read Cautions and warnings and
Page 29 of 31
Important notes at the end of this document.
Important notes
The following applies to all products named in this publication:
1. Some parts of this publication contain statements about the suitability of our products for
certain areas of application. These statements are based on our knowledge of typical
requirements that are often placed on our products in the areas of application concerned. We
nevertheless expressly point out that such statements cannot be regarded as binding
statements about the suitability of our products for a particular customer application. As a
rule we are either unfamiliar with individual customer applications or less familiar with them than the
customers themselves. For these reasons, it is always ultimately incumbent on the customer to
check and decide whether a product with the properties described in the product specification is
suitable for use in a particular customer application.
2. We also point out that in individual cases, a malfunction of electronic components or failure
before the end of their usual service life cannot be completely ruled out in the current state
of the art, even if they are operated as specified. In customer applications requiring a very high
level of operational safety and especially in customer applications in which the malfunction or failure
of an electronic component could endanger human life or health (e.g. in accident prevention or life-
saving systems), it must therefore be ensured by means of suitable design of the customer
application or other action taken by the customer (e.g. installation of protective circuitry or
redundancy) that no injury or damage is sustained by third parties in the event of malfunction or
failure of an electronic component.
3. The warnings, cautions and product-specific notes must be observed.
4. In order to satisfy certain technical requirements, some of the products described in this
publication may contain substances subject to restrictions in certain jurisdictions (e.g.
because they are classed as hazardous). Useful information on this will be found in our Material
Data Sheets on the Internet (www.tdk-electronics.tdk.com/material). Should you have any more
detailed questions, please contact our sales offices.
5. We constantly strive to improve our products. Consequently, the products described in this
publication may change from time to time. The same is true of the corresponding product
specifications. Please check therefore to what extent product descriptions and specifications
contained in this publication are still applicable before or when you place an order.
We also reserve the right to discontinue production and delivery of products. Consequently,
we cannot guarantee that all products named in this publication will always be available.
The aforementioned does not apply in the case of individual agreements deviating from the
foregoing for customer-specific products.
6. Unless otherwise agreed in individual contracts, all orders are subject to our General Terms and
Conditions of Supply.
7. Our manufacturing sites serving the automotive business apply the IATF 16949 standard.
The IATF certifications confirm our compliance with requirements regarding the quality
management system in the automotive industry. Referring to customer requirements and customer
specific requirements (“CSR”) TDK always has and will continue to have the policy of respecting
individual agreements. Even if IATF 16949 may appear to support the acceptance of unilateral
requirements, we hereby like to emphasize that only requirements mutually agreed upon can
and will be implemented in our Quality Management System. For clarification purposes we like
to point out that obligations from IATF 16949 shall only become legally binding if individually agreed
upon.
Page 30 of 31
Important notes
8. The trade names EPCOS, CarXield, CeraCharge, CeraDiode, CeraLink, CeraPad, CeraPlas,
CSMP, CTVS, DeltaCap, DigiSiMic, ExoCore, FilterCap, FormFit, LeaXield, MiniBlue, MiniCell,
MKD, MKK, ModCap, MotorCap, PCC, PhaseCap, PhaseCube, PhaseMod, PhiCap, PowerHap,
PQSine, PQvar, SIFERRIT, SIFI, SIKOREL, SilverCap, SIMDAD, SiMic, SIMID, SineFormer, SIOV,
ThermoFuse, WindCap, XieldCap are trademarks registered or pending in Europe and in other
countries.
Further
information
will
be
found
on
the
Internet
at
www.tdk-electronics.tdk.com/trademarks.
Release 2020-06
Page 31 of 31
相关型号：
©2020 ICPDF网 联系我们和版权申明