B78308A2387A003 [TDK]

IGBT/FET用变压器;
B78308A2387A003
型号: B78308A2387A003
厂家: TDK ELECTRONICS    TDK ELECTRONICS
描述:

IGBT/FET用变压器

变压器 双极性晶体管
文件: 总12页 (文件大小:776K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
SMD Transformers  
E13 EMHV series  
Series/Type:  
B78308*A003  
Ordering code:  
Date:  
May 2022  
TDK Electronics AG 2022. Reproduction, publication and dissemination of this publication, enclosures hereto  
and the information contained therein without TDK Electronics’ prior express consent is prohibited.  
SMD Transformers  
E13 EMHV series  
B78308*A003  
Construction  
Ferrite core MnZn  
SMD gullwing pins  
Triple insulated wire class F (155 °C)  
Non-conductive pick-and-place cap on top  
Features  
Height: 11.6 mm max  
Footprint: 16.2 mm x 13.4 mm  
Plastic Bobbin CTI IIIa class material  
Wide temperature range from –40 °C up to +150 °C  
Qualified to AEC-Q200  
RoHS compatible  
Applications  
Isolated DC/DC converters  
Insulation characteristics  
PRI / SEC (Cumulative): Creepage 11.2 mm, Clearance 8.14 mm  
Core / Top surface: Creepage and Clearance 3.25 mm  
PRI / core: Creepage 7.5 mm, Clearance 5.1 mm  
SEC / core: Creepage 3.7 mm, Clearance 3.05 mm  
Insulation distances sufficient for basic insulation according to IEC 60664-1, 61558-2-16 for  
working voltage 1000 V DC, Transient over voltage 2500 VPeak, P2, CTI IIIa, 5000 m altitude.  
Insulation distances sufficient for reinforced insulation according to IEC 60664-1, 61558-2-16 for  
working voltage 300 V, P2, OVC II, CTI IIIa, 2000 m altitude.  
Marking  
Product brand, middle block of ordering code, date code, pin 1 marker, production place  
identification code  
Delivery mode  
Tape and reel 13” diameter  
Packing unit: 190 pcs per reel  
Please read Cautions and warnings and  
Important notes at the end of this document.  
2
5/22  
SMD Transformers  
E13 EMHV series  
B78308*A003  
Dimensional drawing and recommendation  
Dimensions in mm  
Recommended PCB layout (Top View)  
Please read Cautions and warnings and  
Important notes at the end of this document.  
3
5/22  
SMD Transformers  
E13 EMHV series  
B78308*A003  
Flyback Topology applicable Transformer Product parameters  
Characteristics and ordering code: specified at +25 °C if not mentioned otherwise, all values without  
tolerances are typical values.  
Units  
Ordering codes  
B78308A2461A003  
B78308A2462A003  
F2  
Reference Schematic  
Turns ratio  
F1  
1 : 0.22 : 0.78  
1 : 0.33 : 0.67  
Typical operational frequency  
kHz  
µH  
100 ... 400 kHz  
LN1 (1-4)  
4.1 10%  
4.1 10%  
at 100 kHz, 10 mV  
LL, N1 (1-4)  
nH  
330  
300  
at 100 kHz, 10 mV  
short 5, 6, 8  
short 5, 6, 8  
R
R
R
DC, N1  
DC, N2  
DC, N3  
m  
m  
m  
A
100  
50  
100  
75  
150  
4
130  
4
Saturation Current ISAT, N1  
at T +150 °C, L=Lo-20%  
Typical diagram for LN1  
saturation  
G1  
High Voltage Test  
V AC  
V AC  
VPEAK  
VPEAK  
3000  
Routine test: 50 Hz, 1 sec  
High Voltage Test  
(N1) / (N2,N3)  
3750  
Type test: 50 Hz, 1 min  
Partial discharge inception  
voltage, Type test  
(N1) / (N2,N3)  
1500  
(N1) / (N2,N3)  
1200  
Partial discharge extinction  
voltage, Type test  
(N1) / (N2,N3)  
Surge voltage Test  
Type test  
6 kV peak; 1.2/50 µs,  
(N1) / (N2,N3)  
Recommonded IC  
L9502 – STMicroelectronics  
Please read Cautions and warnings and  
Important notes at the end of this document.  
4
5/22  
SMD Transformers  
E13 EMHV series  
B78308*A003  
Schematics and saturation graph  
F1  
F2  
B78308A2461A003 and B78308A2462A003 - Saturation at different temperatures (typical  
curves)  
G1  
Please read Cautions and warnings and  
Important notes at the end of this document.  
5
5/22  
SMD Transformers  
E13 EMHV series  
B78308*A003  
Push Pull / Half Bridge topology applicable Transformer Product parameters  
Characteristics and ordering codes: specified at +25 °C if not mentioned otherwise, all values  
without tolerance are typical values.  
Units  
Ordering codes  
B78308A2387A003 B78308A2484A003 B78308A2485A003  
Reference Schematic  
Turns ratio  
F3  
F3  
F4  
1 : 1.07  
1 : 1.07  
1 : 1 : 0.57 : 2.14  
Typical operational  
frequency  
kHz  
µH  
100 ... 400 kHz  
L
N1 (min)  
100  
90  
90  
at 100 kHz, 100 mV  
LL, N1  
short (2, 3)  
µH  
0.8  
2.6  
1.1  
at 100 kHz, 100 mV  
short 8-5  
short 8-5  
short (2, 3) &  
5, 6, 7, 8  
CP  
pF  
9
2
6
at 20 kHz, 1 V  
(N1 / N2)  
(N1 / N2)  
(N1,N2) / (N3,N4)  
R
R
R
R
DC, N1  
DC, N2  
DC, N3  
DC, N4  
m  
m  
m  
m  
260  
350  
260  
350  
175  
175  
85  
280  
25  
Voltage Time Product V x µVs  
Unipolar, Bmax = 220 mT  
15  
15  
Voltage Time Product V x µVs  
Unipolar, Bmax = 440 mT  
30  
30  
50  
High Voltage test  
V AC  
3000  
3000  
3000  
(N1,N2) / (N3,N4)  
3750  
Routine test: 50 Hz, 1 sec  
High Voltage Test  
(N1 / N2)  
(N1 / N2)  
V AC  
3750  
Type test: 50 Hz, 1 min  
(N1 / N2)  
1500  
(N1,N2) / (N3,N4)  
1500  
Partial discharge incep- VPEAK  
voltage, type test  
(N1 / N2)  
1200  
(N1,N2) / (N3,N4)  
1200  
Partial discharge extinc- VPEAK  
voltage, type test  
(N1 / N2)  
(N1,N2) / (N3,N4)  
Please read Cautions and warnings and  
Important notes at the end of this document.  
6
5/22  
SMD Transformers  
E13 EMHV series  
B78308*A003  
Other characteristics  
Storage conditions  
Climatic category  
Resistance to reflow  
soldering heat  
–25 °C ... +40 °C, humidity 75% RH  
40/150/56 (to IEC 60068)  
In accordance with JEDEC J-STD-020D Tpeak = +245 °C  
(Tpeak –5 °C for 30 seconds)  
Operating temperature range  
Weight  
–40 °C ... +150 °C (component)  
Approx. 2.5 g  
Referenced Schematics  
F3  
F4  
Please read Cautions and warnings and  
Important notes at the end of this document.  
7
5/22  
SMD Transformers  
E13 EMHV series  
B78308*A003  
Blister tape  
Reel  
Please read Cautions and warnings and  
Important notes at the end of this document.  
8
5/22  
SMD Transformers  
E13 EMHV series  
B78308*A003  
Recommended reflow soldering curve  
Pb-free solder material (based on JEDEC J-STD 020E)  
T1  
T2  
T3  
T4  
t1  
t2  
t3  
s
°C  
°C  
°C  
°C  
s
s
150  
200  
217  
245  
60 – 120  
60 – 150  
< 30 at T4 –5 °C  
Time from +24 °C to T4: max. 480 s  
Maximal numbers of reflow cycles: 3  
Please read Cautions and warnings and  
Important notes at the end of this document.  
9
5/22  
SMD Transformers  
E13 EMHV series  
B78308*A003  
Cautions and warnings  
Please note the recommendations in our Inductors data book (latest edition) and in the data  
sheets.  
– Particular attention should be paid to the derating curves given there.  
– The soldering conditions should also be observed. Temperatures quoted in relation to wave  
soldering refer to the pin, not the housing.  
If the components are to be washed varnished it is necessary to check whether the washing  
varnish agent that is used has a negative effect on the wire insulation, any plastics that are used,  
or on glued joints. In particular, it is possible for washing varnish agent residues to have a  
negative effect in the long-term on wire insulation.  
Washing processes may damage the product due to the possible static or cyclic mechanical  
loads (e.g. ultrasonic cleaning). They may cause cracks to develop on the product and its parts,  
which might lead to reduced reliability or lifetime.  
The following points must be observed if the components are potted in customer applications:  
– Many potting materials shrink as they harden. They therefore exert a pressure on the plastic  
housing or core. This pressure can have a deleterious effect on electrical properties, and in  
extreme cases can damage the core or plastic housing mechanically.  
– It is necessary to check whether the potting material used attacks or destroys the wire, wire  
insulation, plastics or glue.  
– The effect of the potting material can change the high-frequency behaviour of the components.  
– Many coating materials have a negative effect (chemically and mechanically) on the winding  
wires, insulation materials and connecting points. Customers are always obligated to  
determine whether and to what extent their coating materials influence the component.  
Customers are responsible and bear all risk for the use of the coating material. TDK  
Electronics does not assume any liability for failures of our components that are caused by the  
coating material.  
Ceramics / ferrites are sensitive to direct impact. This can cause the core material to flake, or  
lead to breakage of the core.  
Even for customer-specific products, conclusive validation of the component in the circuit can  
only be carried out by the customer.  
Display of ordering codes for TDK Electronics products  
The ordering code for one and the same product can be represented differently in data sheets, data  
books, other publications, on the company website, or in order-related documents such as shipping  
notes, order confirmations and product labels. The varying representations of the ordering  
codes are due to different processes employed and do not affect the specifications of the  
respective products. Detailed information can be found on the Internet under  
www.tdk-electronics.tdk.com/orderingcodes.  
Please read Cautions and warnings and  
Important notes at the end of this document.  
10 5/22  
Important notes  
The following applies to all products named in this publication:  
1. Some parts of this publication contain statements about the suitability of our products for  
certain areas of application. These statements are based on our knowledge of typical  
requirements that are often placed on our products in the areas of application concerned. We  
nevertheless expressly point out that such statements cannot be regarded as binding  
statements about the suitability of our products for a particular customer application. As  
a rule, we are either unfamiliar with individual customer applications or less familiar with them  
than the customers themselves. For these reasons, it is always ultimately incumbent on the  
customer to check and decide whether a product with the properties described in the product  
specification is suitable for use in a particular customer application.  
2. We also point out that in individual cases, a malfunction of electronic components or  
failure before the end of their usual service life cannot be completely ruled out in the  
current state of the art, even if they are operated as specified. In customer applications  
requiring a very high level of operational safety and especially in customer applications in which  
the malfunction or failure of an electronic component could endanger human life or health (e.g.  
in accident prevention or life-saving systems), it must therefore be ensured by means of suitable  
design of the customer application or other action taken by the customer (e.g. installation of  
protective circuitry or redundancy) that no injury or damage is sustained by third parties in the  
event of malfunction or failure of an electronic component.  
3. The warnings, cautions and product-specific notes must be observed.  
4. In order to satisfy certain technical requirements, some of the products described in this  
publication may contain substances subject to restrictions in certain jurisdictions (e.g.  
because they are classed as hazardous). Useful information on this will be found in our  
Material Data Sheets on the Internet (www.tdk-electronics.tdk.com/material). Should you have  
any more detailed questions, please contact our sales offices.  
5. We constantly strive to improve our products. Consequently, the products described in this  
publication may change from time to time. The same is true of the corresponding product  
specifications. Please check therefore to what extent product descriptions and specifications  
contained in this publication are still applicable before or when you place an order.  
We also reserve the right to discontinue production and delivery of products.  
Consequently, we cannot guarantee that all products named in this publication will always be  
available. The aforementioned does not apply in the case of individual agreements deviating  
from the foregoing for customer-specific products.  
6. Unless otherwise agreed in individual contracts, all orders are subject to our General Terms  
and Conditions of Supply.  
11 5/22  
Important notes  
7. Our manufacturing sites serving the automotive business apply the IATF 16949  
standard. The IATF certifications confirm our compliance with requirements regarding the  
quality management system in the automotive industry. Referring to customer requirements  
and customer specific requirements (“CSR”) TDK always has and will continue to have the  
policy of respecting individual agreements. Even if IATF 16949 may appear to support the  
acceptance of unilateral requirements, we hereby like to emphasize that only requirements  
mutually agreed upon can and will be implemented in our Quality Management System.  
For clarification purposes we like to point out that obligations from IATF 16949 shall only  
become legally binding if individually agreed upon.  
8. The trade names EPCOS, CarXield, CeraCharge, CeraDiode, CeraLink, CeraPad, CeraPlas,  
CSMP,  
CTVS, DeltaCap, DigiSiMic, ExoCore, FilterCap, FormFit, LeaXield, MiniBlue,  
MiniCell, MKD, MKK, ModCap, MotorCap, PCC, PhaseCap, PhaseCube, PhaseMod, PhiCap,  
PowerHap, PQSine, PQvar, SIFERRIT, SIFI, SIKOREL, SilverCap, SIMDAD, SiMic, SIMID,  
SineFormer, SIOV, ThermoFuse, WindCap, XieldCap are trademarks registered or pending  
in Europe and in other countries. Further information will be found on the Internet at  
www.tdk-electronics.tdk.com/trademarks.  
Release 2020-06  
12 5/22  

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