B82116S1221L026 [TDK]

电源线用扼流圈;


型号：	B82116S1221L026
厂家：	TDK ELECTRONICS
描述：	电源线用扼流圈
文件：	总11页 (文件大小：1414K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

Power line chokes

Mushroom Core Choke

3.1 µH, 25 A / +140 °C

Series/Type:

B82116S1221L026

Ordering code:

Date:

September 2022

 TDK Electronics AG 2022. Reproduction, publication and dissemination of this publication, enclosures hereto

and the information contained therein without TDK Electronics’ prior express consent is prohibited.

Power line chokes

B82116S1221L026

Mushroom Core Choke

Rated current 25 A / +140 °C

Rated Inductance 3.1 µH

Construction

 Mushroom Core Choke

 Ferrit core

 Double layer winding

 Core and winding glued

Features

 Enameled wire in accordance to EN 60317-13

(class 200, grade 2, UL listed)

 Suitable for wave soldering

 Qualified according AEC-Q200

 RoHS compatible

Applications

 EMC choke

Terminals

 Ends of winding wire

 Pins hot dip tinned Sn99Cu

 Cut surface tinned with tin or globular

Marking

 Product brand

 part of ordering code

 date of manufacture (YYWWD)

 internal ID code (optional)

Delivery mode

 Blister tray in cardboard box

Please read Cautions and warnings and

Important notes at the end of this document.

9/22

Power line chokes

B82116S1221L026

Mushroom Core Choke

Dimensional drawing

1) hot dip tinned Sn99Cu

pin ends tinned with tin or globular

2) twisting of core within this area permissible

3) no glue

4) no coil

5) coil is circumferential fixed on the core by glue

6) pin positions tested by gauge

7) nominal diameter of wire: 2.24 mm

8) above the tinned area of both pins bare copper wire

is permissible within tolerance of dimension 1^+5.5

Please read Cautions and warnings and

Important notes at the end of this document.

9/22

Power line chokes

B82116S1221L026

Mushroom Core Choke

only core shown

Voids at all edges:

Voids at the edge can be created by the

pressing, sintering or the following handling.

Allowed is a length of max. 5 mm, and a

area of max. 15 mm².

Maximum allowable are 3 voids per core be-

tween 10 mm²an 15 mm².

The voids don’t have any influence on the

properties of the inductor.

Voids on all surfaces:

Allowed is a length of max. 5 m, and a area

of max. 15 mm².

Maximum allowable are 3 voids per core be-

tween 10 mm²an 15 mm².

The voids don’t have any influence on the

properties of the inductor.

Cracks:

Small cracks in the ferrite are caused by

production and permissible, as long as there

is no risk of chips (ferrite particles).

The cracks don’t have any influence on the

properties of the inductor.

Scratches:

Scratched are caused by production. They

are created by moving the pressed core

(soft) on a fireproof panel on which they will

be sintered later on.

There may be several scratches on a core.

The cracks don’t have any influence on the

properties of the inductor.

Please read Cautions and warnings and

Important notes at the end of this document.

9/22

Power line chokes

B82116S1221L026

Mushroom Core Choke

Gauge for test in production

Please read Cautions and warnings and

Important notes at the end of this document.

9/22

Power line chokes

B82116S1221L026

Mushroom Core Choke

Technical data and measuring conditions

Rated temperature T_R

Rated current I_R

+140 °C

25 A

Referred to rated temperature T_R,

for current derating see next page

–40 °C ... +180 °C

3,1 µH

Operating temperature range

Rated inductance L_R

Measured with Agilent 4284A and Celvin cables

at 1 mA, 10 kHz, +20 °C

2.8 µH ¹⁾

Measured with Agilent 4284A and measurement

fixture Agilent 16047E at 1 mA, 10 kHz, +20 °C

Insulation between core and winding can not be

garanteed due to allowed leaks in winding wire

accordance EN 60317 ff

Insulation voltage

Inductance tolerance

Inductance decrease ΔL/L₀

DC resistance R_typ

Weight

20% at +20 °C

< 7% at DC magnetic bias with 50 A, +20 °C

1.8 m typ. value, measured at +20 °C

Approx. 25 g

Ferrite core

Three core suppliers are released for EPCOS Mush-

room core chokes. Mushroom core choke family rep-

resentatives with cores from all suppliers are qualified

according AEC-Q200.

1) inductance versus length of pins

3.5 µH

2.81 µH

The small distance between ferrite core and metal parts of measurement adapter causes a de-

crease of the measured inductance from 3.5 µH to 2.81 µH.

Please read Cautions and warnings and

Important notes at the end of this document.

9/22

Power line chokes

B82116S1221L026

Mushroom Core Choke

Impedance lZl (typical values at +20 °C)

Current derating I_op/I_Rversus temperature T_A

(rated temperature T_R= +140 °C)

Please read Cautions and warnings and

Important notes at the end of this document.

9/22

Power line chokes

B82116S1221L026

Mushroom Core Choke

Inductance versus I bias versus temperature (typical values)

Please read Cautions and warnings and

Important notes at the end of this document.

9/22

Power line chokes

B82116S1221L026

Mushroom Core Choke

Cautions and warnings

 Please note the recommendations in our Inductors data book (latest edition) and in the data

sheets.

– Particular attention should be paid to the derating curves given there.

– The soldering conditions should also be observed. Temperatures quoted in relation to wave

soldering refer to the pin, not the housing.

 If the components are to be washed varnished it is necessary to check whether the washing

varnish agent that is used has a negative effect on the wire insulation, any plastics that are used,

or on glued joints. In particular, it is possible for washing varnish agent residues to have a

negative effect in the long-term on wire insulation.

Washing processes may damage the product due to the possible static or cyclic mechanical

loads (e.g. ultrasonic cleaning). They may cause cracks to develop on the product and its parts,

which might lead to reduced reliability or lifetime.

 The following points must be observed if the components are potted in customer applications:

– Many potting materials shrink as they harden. They therefore exert a pressure on the plastic

housing or core. This pressure can have a deleterious effect on electrical properties, and in

extreme cases can damage the core or plastic housing mechanically.

– It is necessary to check whether the potting material used attacks or destroys the wire, wire

insulation, plastics or glue.

– The effect of the potting material can change the high-frequency behaviour of the components.

– Many coating materials have a negative effect (chemically and mechanically) on the winding

wires, insulation materials and connecting points. Customers are always obligated to

determine whether and to what extent their coating materials influence the component.

Customers are responsible and bear all risk for the use of the coating material. TDK

Electronics does not assume any liability for failures of our components that are caused by the

coating material.

 Ceramics / ferrites are sensitive to direct impact. This can cause the core material to flake, or

lead to breakage of the core.

 Even for customer-specific products, conclusive validation of the component in the circuit can

only be carried out by the customer.

 Due to product design and applied manufacturing process, appearance, symmetry, and shape

of not dimensioned details could vary within same lot, as well discoloration of housing is possible.

TDK does not expect detrimental effects on product function or reliability. In case of conflicts,

TDK reference standard shall prevail.

Display of ordering codes for TDK Electronics products

The ordering code for one and the same product can be represented differently in data sheets, data

books, other publications, on the company website, or in order-related documents such as shipping

notes, order confirmations and product labels. The varying representations of the ordering

codes are due to different processes employed and do not affect the specifications of the

respective products. Detailed information can be found on the Internet under

www.tdk-electronics.tdk.com/orderingcodes.

Please read Cautions and warnings and

Important notes at the end of this document.

9/22

Important notes

The following applies to all products named in this publication:

1. Some parts of this publication contain statements about the suitability of our products for

certain areas of application. These statements are based on our knowledge of typical require-

ments that are often placed on our products in the areas of application concerned. We never-

theless expressly point out that such statements cannot be regarded as binding statements

about the suitability of our products for a particular customer application. As a rule, we

are either unfamiliar with individual customer applications or less familiar with them than the cus-

tomers themselves. For these reasons, it is always ultimately incumbent on the customer to

check and decide whether a product with the properties described in the product specification is

suitable for use in a particular customer application.

2. We also point out that in individual cases, a malfunction of electronic components or fail-

ure before the end of their usual service life cannot be completely ruled out in the current

state of the art, even if they are operated as specified. In customer applications requiring a

very high level of operational safety and especially in customer applications in which the mal-

function or failure of an electronic component could endanger human life or health (e.g. in acci-

dent prevention or life-saving systems), it must therefore be ensured by means of suitable de-

sign of the customer application or other action taken by the customer (e.g. installation of pro-

tective circuitry or redundancy) that no injury or damage is sustained by third parties in the event

of malfunction or failure of an electronic component.

3. The warnings, cautions and product-specific notes must be observed.

4. In order to satisfy certain technical requirements, some of the products described in this pub-

lication may contain substances subject to restrictions in certain jurisdictions (e.g. be-

cause they are classed as hazardous). Useful information on this will be found in our Material

Data Sheets on the Internet (www.tdk-electronics.tdk.com/material). Should you have any more

detailed questions, please contact our sales offices.

5. We constantly strive to improve our products. Consequently, the products described in this

publication may change from time to time. The same is true of the corresponding product

specifications. Please check therefore to what extent product descriptions and specifications

contained in this publication are still applicable before or when you place an order.

We also reserve the right to discontinue production and delivery of products. Consequent-

ly, we cannot guarantee that all products named in this publication will always be available. The

aforementioned does not apply in the case of individual agreements deviating from the foregoing

for customer-specific products.

6. Unless otherwise agreed in individual contracts, all orders are subject to our General Terms

and Conditions of Supply.

10 9/22

Important notes

7. Our manufacturing sites serving the automotive business apply the IATF 16949 standard.

The IATF certifications confirm our compliance with requirements regarding the quality manage-

ment system in the automotive industry. Referring to customer requirements and customer spe-

cific requirements (“CSR”) TDK always has and will continue to have the policy of respecting in-

dividual agreements. Even if IATF 16949 may appear to support the acceptance of unilateral re-

quirements, we hereby like to emphasize that only requirements mutually agreed upon can

and will be implemented in our Quality Management System. For clarification purposes we

like to point out that obligations from IATF 16949 shall only become legally binding if individually

agreed upon.

8. The trade names EPCOS, CarXield, CeraCharge, CeraDiode, CeraLink, CeraPad, CeraPlas,

CSMP,

CTVS, DeltaCap, DigiSiMic, ExoCore, FilterCap, FormFit, InsuGate, LeaXield,

MiniBlue, MiniCell, MKD, MKK, ModCap, MotorCap, PCC, PhaseCap, PhaseCube, PhaseMod,

PhiCap, PowerHap, PQSine, PQvar, SIFERRIT, SIFI, SIKOREL, SilverCap, SIMDAD, SiMic,

SIMID, SineFormer, SIOV, ThermoFuse, WindCap, XieldCap are trademarks registered or

pending in Europe and in other countries. Further information will be found on the Internet at

www.tdk-electronics.tdk.com/trademarks.

Release 2022-07

11 9/22

B82116S1221L026 [TDK]

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