B82450H2364A000 [TDK]

应答器线圈;
B82450H2364A000
型号: B82450H2364A000
厂家: TDK ELECTRONICS    TDK ELECTRONICS
描述:

应答器线圈

PC 测试 射频感应器 电感器
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SMT Inductors  
Transponder coils  
Size 11.4 u 3.5 u 2.4 mm  
Series/Type:  
B82450H2364A000  
Date:  
a~í~=pÜÉÉí October 2019  
¤ꢀTDK Electronics AG 2019. Reproduction, publication and dissemination of this publication, enclosures hereto  
and the information contained therein without TDK Electronics’ prior express consent is prohibited.  
Transponder coils  
B82450H2364A000  
Size 11.4 x 3.5 x 2.4 mm  
Rated inductance 2.36 mH  
Sensitivity 30 mV/μT  
Construction  
Ferrite core  
Winding: enamel copper wire welded to terminals  
Flame-retardant molding  
Features  
Robust construction for a high mechanical stability when exposed to  
shock, drop and bending tests  
High sensitivity in X/Y direction  
High quality factor  
Suitable for pick and place and AOI  
(Automatic Optical Inspection)  
Qualified to AEC-Q200  
Suitable for lead-free reflow soldering  
as referenced in JEDEC J-STD 020D  
RoHS-compatible  
Applications  
Car access systems  
- immobilzer  
- PEPS (Passive Entry, Passive Start)  
Terminals  
Base material CuSn6  
Layer composition Ni, Sn  
Electro-plated  
Marking  
Marking on component:  
Manufacturer, L value (nH, coded), letter “A”, date of manufacture (YWWD, coded),  
last five digits of lot number, internal information  
Minimum data on reel:  
Manufacturer, ordering code, L value, quantity, date of packing  
Delivery mode and packing unit  
24-mm blister tape, wound on 330-mm ‡ reel  
Packing unit: 2500 pcs./reel  
Please read Cautions and warnings and  
Important notes at the end of this document.  
2
10/19  
Transponder coils  
B82450H2364A000  
Size 11.4 x 3.5 x 2.4 mm  
Dimensional drawing and layout recommendation  
Dimensions in mm  
Taping and packing  
Blister tape  
Reel  
Dimensions in mm  
Please read Cautions and warnings and  
Important notes at the end of this document.  
3
10/19  
Transponder coils  
B82450H2364A000  
Size 11.4 x 3.5 x 2.4 mm  
Technical data and measuring conditions  
Rated inductance LR  
Measured with impedance analyzer Agilent 4294A and test  
fixture Agilent 16034 or equivalent at frequency fL, 0.5 V,  
+20 °C  
Q factor Qmin  
Measured with impedance analyzer Agilent 4294A and test  
fixture Agilent 16034 or equivalent at frequency fQ, 0.5 V,  
+20 °C  
Sensitivity Styp  
Measured with Helmholtz coil test setup at 125 kHz  
Self-resonance frequency fres  
Measured with Agilent 4294A and test fixture Agilent 16034 or  
equivalent, +20 °C  
DC resistance Rmax  
Measured at +20 °C  
Solderability (lead-free)  
Sn95.5Ag3.8Cu0.7: +(245 r5) °C, 3 s  
Wetting of soldering area tꢀ90%  
(based on IEC 60068-2-58)  
Resistance to soldering heat  
Climatic category  
+260 °C, 40 s (as referenced in JEDEC J-STD 020D)  
40/125/56 (to IEC 60068-1)  
Storage conditions  
Mounted: 40 °C … +125 °C  
Packaged: –25 °C … +40 °C, dꢀ75% RH  
Weight  
Approx. 0.32 g  
Characteristics and ordering codes  
LR  
L tolerance  
fL, fQ  
Qmin  
Styp  
mV  
PT  
Rmax  
fres  
Ordering code  
mH  
kHz  
125  
:
MHz  
> 2.0  
2.36  
r3%  
55  
30  
25  
B82450H2364A000  
Please read Cautions and warnings and  
Important notes at the end of this document.  
4
10/19  
Cautions and warnings  
Please note the recommendations in our Inductors data book (latest edition) and in the data  
sheets.  
– Particular attention should be paid to the derating curves given there.  
– The soldering conditions should also be observed. Temperatures quoted in relation to wave  
soldering refer to the pin, not the housing.  
If the components are to be washed varnished it is necessary to check whether the washing  
varnish agent that is used has a negative effect on the wire insulation, any plastics that are used,  
or on glued joints. In particular, it is possible for washing varnish agent residues to have a  
negative effect in the long-term on wire insulation.  
Washing processes may damage the product due to the possible static or cyclic mechanical  
loads (e.g. ultrasonic cleaning). They may cause cracks to develop on the product and its parts,  
which might lead to reduced reliability or lifetime.  
The following points must be observed if the components are potted in customer applications:  
– Many potting materials shrink as they harden. They therefore exert a pressure on the plastic  
housing or core. This pressure can have a deleterious effect on electrical properties, and in  
extreme cases can damage the core or plastic housing mechanically.  
– It is necessary to check whether the potting material used attacks or destroys the wire, wire  
insulation, plastics or glue.  
– The effect of the potting material can change the high-frequency behaviour of the components.  
– Many coating materials have a negative effect (chemically and mechanically) on the winding  
wires, insulation materials and connecting points. Customers are always obligated to  
determine whether and to what extent their coating materials influence the component.  
Customers are responsible and bear all risk for the use of the coating material. TDK  
Electronics does not assume any liability for failures of our components that are caused by the  
coating material.  
Ceramics / Ferrites are sensitive to direct impact. This can cause the core material to flake, or  
lead to breakage of the core.  
Even for customer-specific products, conclusive validation of the component in the circuit can  
only be carried out by the customer.  
Display of ordering codes for TDK Electronics products  
The ordering code for one and the same product can be represented differently in data sheets, data  
books, other publications, on the company website, or in order-related documents such as shipping  
notes, order confirmations and product labels. The varying representations of the ordering  
codes are due to different processes employed and do not affect the specifications of the  
respective products. Detailed information can be found on the Internet under  
www.tdk-electronics.tdk.com/orderingcodes.  
Please read Cautions and warnings and  
Important notes at the end of this document.  
5
10/19  
Important notes  
The following applies to all products named in this publication:  
1. Some parts of this publication contain statements about the suitability of our products for  
certain areas of application. These statements are based on our knowledge of typical require-  
ments that are often placed on our products in the areas of application concerned. We never-  
theless expressly point out that such statements cannot be regarded as binding statements  
about the suitability of our products for a particular customer application. As a rule, we  
are either unfamiliar with individual customer applications or less familiar with them than the cus-  
tomers themselves. For these reasons, it is always ultimately incumbent on the customer to  
check and decide whether a product with the properties described in the product specification is  
suitable for use in a particular customer application.  
2. We also point out that in individual cases, a malfunction of electronic components or fail-  
ure before the end of their usual service life cannot be completely ruled out in the current  
state of the art, even if they are operated as specified. In customer applications requiring a  
very high level of operational safety and especially in customer applications in which the mal-  
function or failure of an electronic component could endanger human life or health (e.g. in acci-  
dent prevention or life-saving systems), it must therefore be ensured by means of suitable de-  
sign of the customer application or other action taken by the customer (e.g. installation of pro-  
tective circuitry or redundancy) that no injury or damage is sustained by third parties in the event  
of malfunction or failure of an electronic component.  
3. The warnings, cautions and product-specific notes must be observed.  
4. In order to satisfy certain technical requirements, some of the products described in this pub-  
lication may contain substances subject to restrictions in certain jurisdictions (e.g. be-  
cause they are classed as hazardous). Useful information on this will be found in our Material  
Data Sheets on the Internet (www.tdk-electronics.tdk.com/material). Should you have any more  
detailed questions, please contact our sales offices.  
5. We constantly strive to improve our products. Consequently, the products described in this  
publication may change from time to time. The same is true of the corresponding product  
specifications. Please check therefore to what extent product descriptions and specifications  
contained in this publication are still applicable before or when you place an order.  
We also reserve the right to discontinue production and delivery of products. Consequent-  
ly, we cannot guarantee that all products named in this publication will always be available. The  
aforementioned does not apply in the case of individual agreements deviating from the foregoing  
for customer-specific products.  
6. Unless otherwise agreed in individual contracts, all orders are subject to our General Terms  
and Conditions of Supply.  
6
10/19  
Important notes  
7. Our manufacturing sites serving the automotive business apply the IATF 16949 standard.  
The IATF certifications confirm our compliance with requirements regarding the quality manage-  
ment system in the automotive industry. Referring to customer requirements and customer spe-  
cific requirements (“CSR”) TDK always has and will continue to have the policy of respecting in-  
dividual agreements. Even if IATF 16949 may appear to support the acceptance of unilateral re-  
quirements, we hereby like to emphasize that only requirements mutually agreed upon can  
and will be implemented in our Quality Management System. For clarification purposes we  
like to point out that obligations from IATF 16949 shall only become legally binding if individually  
agreed upon.  
8. The trade names EPCOS, CeraCharge, CeraDiode, CeraLink, CeraPad, CeraPlas, CSMP,  
CTVS, DeltaCap, DigiSiMic, ExoCore, FilterCap, FormFit, LeaXield, MiniBlue, MiniCell, MKD,  
MKK, MotorCap, PCC, PhaseCap, PhaseCube, PhaseMod, PhiCap, PowerHap, PQSine,  
PQvar, SIFERRIT, SIFI, SIKOREL, SilverCap, SIMDAD, SiMic, SIMID, SineFormer, SIOV,  
ThermoFuse, WindCap are trademarks registered or pending in Europe and in other coun-  
tries. Further information will be found on the Internet at  
www.tdk-electronics.tdk.com/trademarks.  
Release 2018-10  
7
10/19  

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