B82473M1683K000 [TDK]

SMD/SMT 电感器(线圈);
B82473M1683K000
型号: B82473M1683K000
厂家: TDK ELECTRONICS    TDK ELECTRONICS
描述:

SMD/SMT 电感器(线圈)

电感器
文件: 总7页 (文件大小:272K)
中文:  中文翻译
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SMT power inductors  
Size 8.3 x 7.5 x 5.5 (mm)  
Series/Type:  
B82473M1  
Ordering code:  
Date:  
June 2012  
Content of header bars 1 and 2 of data sheet will be automatically entered in headers and footers! Please fill in the  
table and then change the color to "white". This ensures that the table disappears (invisible) for the customer PDF.  
Don't change formatting when entering or pasting text in the table and don't add any cell or line in and to it!  
Identification/Classification 1  
(header 1 + top left bar):  
SMT power inductors  
Identification/Classification 2  
Size 8.3 x 7.5 x 5.5 (mm)  
(header 2 + bottom left header bar):  
Ordering code: (top right header bar)  
Series/Type: (bottom right header bar)  
B82473M1  
Preliminary data (optional):  
(if necessary)  
Department:  
Date:  
IN TCF PMD A  
June 2012  
EPCOS AG 2012. Reproduction, publication and dissemination of this publication, enclosures hereto and the information  
contained therein without EPCOS' prior express consent is prohibited.  
SMT power inductors  
Size 8.3 x 7.5 x 5.5 (mm)  
B82473M1  
Rated inductance 10 ... 470 µH  
Rated current 0.34 ... 2.3 A  
Construction  
Ferrite core  
Winding: enamel copper wire  
Winding soldered to terminals  
Injection molded base  
Features  
High mechanical stability  
Temperature range up to +150 °C  
High rated current  
Low DC resistance  
Suitable for lead-free reflow soldering  
as referenced in JEDEC J-STD 020D  
Qualification to AEC-Q200  
RoHS-compatible  
Applications  
Filtering of supply voltages  
Coupling, decoupling  
DC/DC converters  
Automotive electronics  
Terminals  
Base material CuSn6P  
Layer composition Ni, Sn (lead-free)  
Electro-plated  
Marking  
Marking on component:  
L value (µH, coded),  
manufacturing date (YWWD)  
Minimum data on reel:  
Manufacturer, ordering code, L value,  
quantity, date of packing  
Delivery mode and packing unit  
16-mm blister tape, wound on 330-mm reel  
Packing unit: 1000 pcs./reel  
IN TCF PMD A  
June 2012  
Please read Cautions and warnings and  
Page 2 of 7  
Important notes at the end of this document.  
SMT power inductors  
Size 8.3 x 7.5 x 5.5 (mm)  
B82473M1  
Dimensional drawing and layout recommendation  
7.5 max.  
3.9  
1)  
1)  
Marking  
Dimensions in mm  
7.3 max.  
1) Soldering area  
Component tolerances 0.2 mm unless otherwise  
noted.  
IND0482-K-E  
Taping and packing  
Blister tape  
Reel  
4±0.1  
21±0.5  
2.5±0.5  
13±0.2  
1.5+0.1  
2±0.1  
Component  
1.0  
22.4 max.  
330±1  
1.5 min.  
IND0347-5  
6.05 max.  
12±0.1  
Direction of unreeling  
IND0364-H-E  
Dimensions in mm  
IN TCF PMD A  
June 2012  
Please read Cautions and warnings and  
Page 3 of 7  
Important notes at the end of this document.  
SMT power inductors  
Size 8.3 x 7.5 x 5.5 (mm)  
B82473M1  
Technical data and measuring conditions  
Rated inductance LR  
Measured with LCR meter Agilent 4284A at frequency fL,  
0.1 V, +20 °C  
Rated temperature TR  
Rated current IR  
+85 °C  
Max. permissible DC with temperature increase of 40 K  
at rated temperature  
Saturation current ISat  
Max. permissible DC with inductance decrease L/L0 of  
approx. 10%,  
DC resistance Rtyp  
Measured at +20 °C  
Solderability (lead-free)  
Dip and look method Sn95.5Ag3.8Cu0.7:  
+(245 5) °C, (3 0.3) s  
Wetting of soldering area 90%  
(based on IEC 60068-2-58)  
Resistance to soldering heat  
Climatic category  
Storage conditions  
+260 °C, 40 s (as referenced in JEDEC J-STD 020D)  
55/150/56 (to IEC 60068-1)  
Mounted: –55 °C … +150 °C  
Packaged: –25 °C … +40 °C, 75% RH  
Approx. 0.8 g  
Weight  
Characteristics and ordering codes  
LR  
µH  
Tolerance fL  
MHz  
IR  
A
Isat  
A
Rmax  
Ordering code  
10  
10% = K  
0.1  
0.1  
0.1  
0.1  
0.1  
0.1  
0.1  
0.1  
0.1  
0.1  
0.1  
2.30  
2.50  
0.07  
B82473M1103K000  
B82473M1153K000  
B82473M1223K000  
B82473M1333K000  
B82473M1473K000  
B82473M1683K000  
B82473M1104K000  
B82473M1154K000  
B82473M1224K000  
B82473M1334K000  
B82473M1474K000  
15  
1.80  
1.50  
1.20  
1.10  
0.85  
0.72  
0.58  
0.49  
0.40  
0.34  
2.00  
1.60  
1.30  
1.20  
0.90  
0.80  
0.65  
0.55  
0.45  
0.40  
0.09  
0.11  
0.13  
0.18  
0.28  
0.43  
0.64  
0.96  
1.26  
1.96  
22  
33  
47  
68  
100  
150  
220  
330  
470  
IN TCF PMD A  
June 2012  
Please read Cautions and warnings and  
Important notes at the end of this document.  
Page 4 of 7  
SMT power inductors  
Size 8.3 x 7.5 x 5.5 (mm)  
B82473M1  
Impedance versus frequency (typical curve)  
1000000.0  
Z/Ohm  
10000.0  
100.0  
1.0  
0.0  
0.0  
0.1  
1.0  
10.0  
100.0  
f/MHz  
Inductance derating  
Current derating Iop/IR  
versus load current (typical curve)  
versus ambient temperature TA  
(rated temperature TR = +85 °C)  
IND0602-K  
1.2  
1000  
Iop  
IR  
1.0  
L/µH  
100  
0.8  
0.6  
0.4  
0.2  
0
10  
1
0.1  
1.0  
10.0  
I/A  
0
20 40 60 80 100 120 C 150  
˚
TA  
IN TCF PMD A  
June 2012  
Please read Cautions and warnings and  
Page 5 of 7  
Important notes at the end of this document.  
SMT power inductors  
Size 8.3 x 7.5 x 5.5 (mm)  
B82473M1  
Cautions and warnings  
Please note the recommendations in our Inductors data book (latest edition) and in the data  
sheets.  
– Particular attention should be paid to the derating curves given there.  
– The soldering conditions should also be observed. Temperatures quoted in relation to wave  
soldering refer to the pin, not the housing.  
If the components are to be washed varnished it is necessary to check whether the washing  
varnish agent that is used has a negative effect on the wire insulation, any plastics that are used,  
or on glued joints. In particular, it is possible for washing varnish agent residues to have a  
negative effect in the long-term on wire insulation  
Washing processes may damage the product due to the possible static or cyclic mechanical  
loads (e.g. ultrasonic cleaning). They may cause cracks to develop on the product and its parts,  
which might lead to reduced reliability or lifetime.  
The following points must be observed if the components are potted in customer applications:  
– Many potting materials shrink as they harden. They therefore exert a pressure on the plastic  
housing or core. This pressure can have a deleterious effect on electrical properties, and in  
extreme cases can damage the core or plastic housing mechanically.  
– It is necessary to check whether the potting material used attacks or destroys the wire  
insulation, plastics or glue.  
– The effect of the potting material can change the high-frequency behaviour of the components.  
Ferrites are sensitive to direct impact. This can cause the core material to flake, or lead to  
breakage of the core.  
Even for customer-specific products, conclusive validation of the component in the circuit can  
only be carried out by the customer.  
IN TCF PMD A  
June 2012  
Please read Cautions and warnings and  
Page 6 of 7  
Important notes at the end of this document.  
Important notes  
The following applies to all products named in this publication:  
1. Some parts of this publication contain statements about the suitability of our products for  
certain areas of application. These statements are based on our knowledge of typical  
requirements that are often placed on our products in the areas of application concerned. We  
nevertheless expressly point out that such statements cannot be regarded as binding  
statements about the suitability of our products for a particular customer application. As a  
rule, EPCOS is either unfamiliar with individual customer applications or less familiar with them  
than the customers themselves. For these reasons, it is always ultimately incumbent on the  
customer to check and decide whether an EPCOS product with the properties described in the  
product specification is suitable for use in a particular customer application.  
2. We also point out that in individual cases, a malfunction of electronic components or failure  
before the end of their usual service life cannot be completely ruled out in the current state  
of the art, even if they are operated as specified. In customer applications requiring a very high  
level of operational safety and especially in customer applications in which the malfunction or  
failure of an electronic component could endanger human life or health (e.g. in accident  
prevention or life-saving systems), it must therefore be ensured by means of suitable design of the  
customer application or other action taken by the customer (e.g. installation of protective circuitry  
or redundancy) that no injury or damage is sustained by third parties in the event of malfunction or  
failure of an electronic component.  
3. The warnings, cautions and product-specific notes must be observed.  
4. In order to satisfy certain technical requirements, some of the products described in this  
publication may contain substances subject to restrictions in certain jurisdictions (e.g.  
because they are classed as hazardous). Useful information on this will be found in our Material  
Data Sheets on the Internet (www.epcos.com/material). Should you have any more detailed  
questions, please contact our sales offices.  
5. We constantly strive to improve our products. Consequently, the products described in this  
publication may change from time to time. The same is true of the corresponding product  
specifications. Please check therefore to what extent product descriptions and specifications  
contained in this publication are still applicable before or when you place an order.  
We also reserve the right to discontinue production and delivery of products. Consequently,  
we cannot guarantee that all products named in this publication will always be available.  
The aforementioned does not apply in the case of individual agreements deviating from the  
foregoing for customer-specific products.  
6. Unless otherwise agreed in individual contracts, all orders are subject to the current version of  
the “General Terms of Delivery for Products and Services in the Electrical Industry”  
published by the German Electrical and Electronics Industry Association (ZVEI).  
7. The trade names EPCOS, BAOKE, Alu-X, CeraDiode, CeraLink, CSMP, CSSP, CTVS, DeltaCap,  
DigiSiMic, DSSP, FilterCap, FormFit, MiniBlue, MiniCell, MKD, MKK, MLSC, MotorCap, PCC,  
PhaseCap, PhaseCube, PhaseMod, PhiCap, SIFERRIT, SIFI, SIKOREL, SilverCap, SIMDAD,  
SiMic, SIMID, SineFormer, SIOV, SIP5D, SIP5K, ThermoFuse, WindCap are trademarks  
registered or pending in Europe and in other countries. Further information will be found on the  
Internet at www.epcos.com/trademarks.  
Page 7 of 7  

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