B82720H0014A016 [TDK]
共模滤波器/扼流圈;
| 型号： | B82720H0014A016 |
| 厂家： | 
TDK ELECTRONICS |
| 描述： | 共模滤波器/扼流圈 LTE |
| 文件： | 总6页 (文件大小：232K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Data and signal line chokes
Common-mode chokes, ring core
4.7 … 10 mH, 200 … 300 mA, 40 °C
Series/Type:
B82720H14
Date:
October 2008
© EPCOS AG 2015. Reproduction, publication and dissemination of this publication, enclosures hereto and the
information contained therein without EPCOS' prior express consent is prohibited.
EPCOS AG is a TDK Group Company.
Data and signal line chokes
B82720H14
Common-mode chokes, ring core
Rated voltage 42 V AC/80 V DC
Rated inductance 4.7 mH to 10 mH
Rated current 200 mA to 300 mA
Construction
■ Current-compensated ring core double choke
■ Ferrite core
■ Polycarbonate case (UL 94 V-0)
■ Polyurethane potting (UL 94 V-0)
Features
■ Suitable for automatic insertion
■ Suitable for wave soldering
■ RoHS-compatible
Applications
■ Telecom switching systems
■ Terminal systems
■ Measuring and control lines
Terminals
■ Base material CuNi18Zn20
■ Layer composition Ni, Sn
■ Hot-dipped
Marking
Manufacturer, ordering code, rated inductance,
rated current, date of manufacture (YYWWD)
Delivery mode
Cardboard box
Please read Cautions and warnings and
Important notes at the end of this document.
2
10/08
Data and signal line chokes
B82720H14
Common-mode chokes, ring core
Dimensional drawing and pin configuration
13±0.3
10±0.2
5±0.2
1
8
2
3
4
1
2
3
4
7
6
5
8
7
6 5
7.6_0.3
Tolerances to ISO 2768-M
unless otherwise noted.
(2.54)
0.5 x 0.5
IND0218-R
Dimensions in mm
Technical data and measuring conditions
Rated voltage VR
42 V AC (50/60 Hz) / 80 V DC
40 °C
Rated temperature TR
Rated current IR
Referred to 50 Hz and rated temperature
Rated inductance LR
Measured with Agilent 4284A at 10 kHz, 0.1 mA, 20 °C
Inductance is specified per winding.
Inductance tolerance
–30%/+50% at 20 °C
Inductance decrease ΔL/L0
Stray inductance Lstray,typ
< 10% at DC magnetic bias with IR, 20 °C
Measured with Agilent 4284A at 10 kHz, 5 mA, 20 °C,
typical values
DC resistance Rtyp
Measured at 20 °C, typical values
Solderability (lead-free)
Sn96.5Ag3.0Cu0.5: (245 ±5) °C, (3 ±0.3) s
Wetting of soldering area ≥ 95%
(to IEC 60068-2-20, test Ta)
Resistance to soldering heat
(wave soldering)
(260 ±5) °C, (10 ±1) s
(to IEC 60068-2-20, test Tb)
Climatic category
Storage conditions (packaged)
Weight
40/125/56 (to IEC 60068-1)
–25 °C … +40 °C, ≤ 75% RH
Approx. 2.3 g
Please read Cautions and warnings and
Important notes at the end of this document.
3
10/08
Data and signal line chokes
B82720H14
Common-mode chokes, ring core
Characteristics and ordering codes
LR
Lstray,typ
nH
IR
Rtyp
Vtest
Ordering code
mH
mA
300
300
200
mΩ
V DC, 2 s
750
4.7
5.0
10
350
900
B82720H0014A016
B82720H0014A013
B82720H0014A025
400
550
750
450
1300
750
Impedance |Z| versus frequency f
Current derating Iop/IR
measured with windings in parallel at 20 °C,
typical values
versus ambient temperature
IND0682-K-E
IND0219-1
106
1.4
Iop
B82720
Ω
IR
1.2
1.0
0.8
0.6
0.4
0.2
0
|Z|
105
TR = 40 C
˚
104
H0014A025
H0014A013
H0014A016
103
102
101
104
105
106
Hz 107
f
0
20
40
60
80 100
C
TA
140
˚
Please read Cautions and warnings and
Important notes at the end of this document.
4
10/08
Cautions and warnings
■ Please note the recommendations in our Inductors data book (latest edition) and in the data
sheets.
– Particular attention should be paid to the derating curves given there.
– The soldering conditions should also be observed. Temperatures quoted in relation to wave
soldering refer to the pin, not the housing.
■ If the components are to be washed varnished it is necessary to check whether the washing
varnish agent that is used has a negative effect on the wire insulation, any plastics that are used,
or on glued joints. In particular, it is possible for washing varnish agent residues to have a
negative effect in the long-term on wire insulation.
■ The following points must be observed if the components are potted in customer applications:
– Many potting materials shrink as they harden. They therefore exert a pressure on the plastic
housing or core. This pressure can have a deleterious effect on electrical properties, and in
extreme cases can damage the core or plastic housing mechanically.
– It is necessary to check whether the potting material used attacks or destroys the wire
insulation, plastics or glue.
– The effect of the potting material can change the high-frequency behaviour of the components.
■ Ferrites are sensitive to direct impact. This can cause the core material to flake, or lead to
breakage of the core.
■ Even for customer-specific products, conclusive validation of the component in the circuit can
only be carried out by the customer.
Please read Cautions and warnings and
Important notes at the end of this document.
5
10/08
Important notes
The following applies to all products named in this publication:
1. Some parts of this publication contain statements about the suitability of our products for certain
areas of application. These statements are based on our knowledge of typical requirements that are
often placed on our products in the areas of application concerned. We nevertheless expressly point
out that such statements cannot be regarded as binding statements about the suitability of our
products for a particular customer application. As a rule we are either unfamiliar with individual
customer applications or less familiar with them than the customers themselves. For these reasons, it is
always ultimately incumbent on the customer to check and decide whether a product with the properties
described in the product specification is suitable for use in a particular customer application.
2. We also point out that in individual cases, a malfunction of electronic components or failure
before the end of their usual service life cannot be completely ruled out in the current state of the
art, even if they are operated as specified. In customer applications requiring a very high level of
operational safety and especially in customer applications in which the malfunction or failure of an
electronic component could endanger human life or health (e.g. in accident prevention or life-saving
systems), it must therefore be ensured by means of suitable design of the customer application or other
action taken by the customer (e.g. installation of protective circuitry or redundancy) that no injury or
damage is sustained by third parties in the event of malfunction or failure of an electronic component.
3. The warnings, cautions and product-specific notes must beobserved.
4. In order to satisfy certain technical requirements, some of the products described in this publication
may contain substances subject to restrictions in certain jurisdictions (e.g. because they are
classed as hazardous). Useful information on this will be found in our Material Data Sheets on the
Internet (www.tdk-electronics.tdk.com/material). Should you have any more detailed questions, please
contact our sales offices.
5. We constantly strive to improve our products. Consequently, the products described in this
publication may change from time to time. The same is true of the corresponding product
specifications. Please check therefore to what extent product descriptions and specifications contained
in this publication are still applicable before or when you place an order.
We also reserve the right to discontinue production and delivery of products. Consequently, we
cannot guarantee that all products named in this publication will always be available. The
aforementioned does not apply in the case of individual agreements deviating from the foregoing for
customer-specific products.
6. Unless otherwise agreed in individual contracts, all orders are subject to our General Terms and
Conditions of Supply.
7. Our manufacturing sites serving the automotive business apply the IATF 16949 standard. The
IATF certifications confirm our compliance with requirements regarding the quality management system
in the automotive industry. Referring to customer requirements and customer specific requirements
(“CSR”) TDK always has and will continue to have the policy of respecting individual agreements. Even
if IATF 16949 may appear to support the acceptance of unilateral requirements, we hereby like to
emphasize that only requirements mutually agreed upon can and will be implemented in our
Quality Management System. For clarification purposes we like to point out that obligations from IATF
16949 shall only become legally binding if individually agreed upon.
8. The trade names EPCOS, CeraCharge, CeraDiode, CeraLink, CeraPad, CeraPlas, CSMP, CTVS,
DeltaCap, DigiSiMic, ExoCore, FilterCap, FormFit, LeaXield, MiniBlue, MiniCell, MKD, MKK, MotorCap,
PCC, PhaseCap, PhaseCube, PhaseMod, PhiCap, PowerHap, PQSine, PQvar, SIFERRIT, SIFI,
SIKOREL, SilverCap, SIMDAD, SiMic, SIMID, SineFormer, SIOV, ThermoFuse, WindCap are
trademarks registered or pending in Europe and in other countries. Further information will be found
on the Internet at www.tdk-electronics.tdk.com/trademarks.
Release 2018-10
6
03/09
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