B82722S0862A020 [TDK]

共模滤波器/扼流圈;


型号：	B82722S0862A020
厂家：	TDK ELECTRONICS
描述：	共模滤波器/扼流圈
文件：	总10页 (文件大小：954K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

SMD common-mode chokes

Current-compensated SMD ring core double chokes

0.16 ... 5.6 mH, 3.25 ... 19 A / +40 °C

Series/Type:

B82722S0

Date:

November 2021

 TDK Electronics AG 2021. Reproduction, publication and dissemination of this publication, enclosures hereto

and the information contained therein without TDK Electronics’ prior express consent is prohibited.

SMD common-mode chokes

B82722S0

Current-compensated SMD ring core double chokes

Rated current 3.25 ... 19 A / +40 °C

Nominal inductance 0.16 ... 5.6 mH

Construction

 Current−compensated ring core double choke

 Ferrite core with epoxy coating (UL 94 V−0)

 Plastic case (UL 94 V−0)

 Silicon glue

 Sector windings

 SMD terminals

Features

 Approx. 0.4 ... 1.2% stray inductance for differential−mode

interference suppression

 Low height

 Suitable for reflow soldering

 RoHS-compatible

Applications

 Suppression of common−mode interferences

 Compact switch−mode applications

 Low voltage applications

 DC/DC power converters

Terminals

 Ends of winding wires

 Hot-dip tinned

Marking

 Marking on component:

Product brand (EPCOS), ordering code,

graphic symbol, date of manufacture (YYWWD), production place identification code

 Minimum data on reel:

Product brand (EPCOS), ordering code

quantity, date of packing

Delivery mode and packing unit

 44-mm blister tape, wound on 330-mm Ø reel

 Packing unit: 100 pcs./reel

Please read Cautions and warnings and

Important notes at the end of this document.

11/21

SMD common-mode chokes

B82722S0

Current-compensated SMD ring core double chokes

Dimensional drawing and pin configuration

Layout recommendation (top view)

Please read Cautions and warnings and

Important notes at the end of this document.

11/21

SMD common-mode chokes

B82722S0

Current-compensated SMD ring core double chokes

Taping and packing

Blister tape

Reel

Dimensions in mm

Blister tape and reel are designed to IEC 60286-3

Please read Cautions and warnings and

Important notes at the end of this document.

11/21

SMD common-mode chokes

B82722S0

Current-compensated SMD ring core double chokes

Technical data and measuring conditions

Rated Voltage V_R

Test voltage V_test

Rated temperature T_R

Rated current I_R

48 V AC (50/60 Hz) / 80 V DC

1000 V_RMS, 2 s (line/line)

+40 °C

Referred to DC or 50/60 Hz and rated temperature

(free−air convection cooling)

Nominal inductance L_N

Measured with Agilent 4284A, 0.1 mA, +20 °C

Measuring frequency: L_R≤ 1 mH = 100 kHz

L_R> 1 mH = 10 kHz

Inductance is specified per winding

±35% at +20 °C

Inductance tolerance

Inductance decrease ∆L/L₀

Stray inductance L_stray,typ

< 10% at DC magnetic bias with I_R, +20 °C

Measured at 5 mA, +20 °C, typical values

Measuring frequency: L_R≤ 1 mH = 100 kHz

L_R> 1 mH = 10 kHz

DC resistance R_typ

Measured at +20 °C, typical value, specified per winding

Sn96.5Ag3.0Cu0.5:(±245 ±3) °C, (3 ±0.3) s

Wetting of soldering area ≥ 95%

Solderability (lead-free)

(to IEC 60068−2−58, test Td₁, method 1)

(+260 ±5) °C, (10 ±1) s

Resistance to soldering heat

Climatic category

(to IEC 60068−2−58, test Td₂, method 1)

40/125/56 (to IEC 60068-1)

Storage conditions (packaged) –25 °C to +40 °C, ≤ 75% RH

Weight Approx. 15 g

Characteristics and ordering codes

I_R

L_N

L_stray,typ

µH

R_typ

mΩ

Ordering code

3.25

8.6

10.4

5.60

B82722S0322A040

B82722S0862A020

B82722S0103A020

B82722S0133A020

B82722S0193A040

B82722S0193A041

0.810

0.630

0.470

0.380

0.160

6.6

8.8

6.7

4.3

2.5

0.8

2.5

Please read Cautions and warnings and

Important notes at the end of this document.

11/21

SMD common-mode chokes

B82722S0

Current-compensated SMD ring core double chokes

Impedance |Z| versus frequency f

measured with windings in parallel at +20 °C,

typical value

measured with windings in parallel at +20 °C,

typical value

Current derating I_op/I_Rversus

temperature T_A

rated temperature = +40 °C

Please read Cautions and warnings and

Important notes at the end of this document.

11/21

SMD common-mode chokes

B82722S0

Current-compensated SMD ring core double chokes

Recommended reflow soldering profile

Pb-free solder material (based on JEDEC J-STD 020E)

T₁

T₂

T₃

T₄

t₁

t₂

t₃

°C

+150

+200

+217

+245

< 110

< 90

< 30 at T₄–5 °C

Time from +25 °C to T₄: max 300 s

Max. numbers of reflow cycles: 2

Please read Cautions and warnings and

Important notes at the end of this document.

11/21

Ferrites and accessories

Cautions and warnings

 Please note the recommendations in our Inductors data book (latest edition) and in the data

sheets.

– Particular attention should be paid to the derating curves given there.

– The soldering conditions should also be observed. Temperatures quoted in relation to wave

soldering refer to the pin, not the housing.

 If the components are to be washed varnished it is necessary to check whether the washing

varnish agent that is used has a negative effect on the wire insulation, any plastics that are used,

or on glued joints. In particular, it is possible for washing varnish agent residues to have a

negative effect in the long-term on wire insulation.

Washing processes may damage the product due to the possible static or cyclic mechanical

loads (e.g. ultrasonic cleaning). They may cause cracks to develop on the product and its parts,

which might lead to reduced reliability or lifetime.

 The following points must be observed if the components are potted in customer applications:

– Many potting materials shrink as they harden. They therefore exert a pressure on the plastic

housing or core. This pressure can have a deleterious effect on electrical properties, and in

extreme cases can damage the core or plastic housing mechanically.

– It is necessary to check whether the potting material used attacks or destroys the wire, wire

insulation, plastics or glue.

– The effect of the potting material can change the high-frequency behaviour of the components.

– Many coating materials have a negative effect (chemically and mechanically) on the winding

wires, insulation materials and connecting points. Customers are always obligated to

determine whether and to what extent their coating materials influence the component.

Customers are responsible and bear all risk for the use of the coating material. TDK

Electronics does not assume any liability for failures of our components that are caused by the

coating material.

 Ceramics / ferrites are sensitive to direct impact. This can cause the core material to flake, or

lead to breakage of the core.

 Even for customer-specific products, conclusive validation of the component in the circuit can

only be carried out by the customer.

Display of ordering codes for TDK Electronics products

The ordering code for one and the same product can be represented differently in data sheets, data

books, other publications, on the company website, or in order-related documents such as shipping

notes, order confirmations and product labels. The varying representations of the ordering

codes are due to different processes employed and do not affect the specifications of the

respective products. Detailed information can be found on the Internet under

www.tdk-electronics.tdk.com/orderingcodes.

Please read Cautions and warnings and

Important notes at the end of this document.

11/21

Important notes

The following applies to all products named in this publication:

1. Some parts of this publication contain statements about the suitability of our products for

certain areas of application. These statements are based on our knowledge of typical

requirements that are often placed on our products in the areas of application concerned. We

nevertheless expressly point out that such statements cannot be regarded as binding

statements about the suitability of our products for a particular customer application. As

a rule, we are either unfamiliar with individual customer applications or less familiar with them

than the customers themselves. For these reasons, it is always ultimately incumbent on the

customer to check and decide whether a product with the properties described in the product

specification is suitable for use in a particular customer application.

2. We also point out that in individual cases, a malfunction of electronic components or

failure before the end of their usual service life cannot be completely ruled out in the

current state of the art, even if they are operated as specified. In customer applications

requiring a very high level of operational safety and especially in customer applications in which

the malfunction or failure of an electronic component could endanger human life or health (e.g.

in accident prevention or life-saving systems), it must therefore be ensured by means of suitable

design of the customer application or other action taken by the customer (e.g. installation of

protective circuitry or redundancy) that no injury or damage is sustained by third parties in the

event of malfunction or failure of an electronic component.

3. The warnings, cautions and product-specific notes must be observed.

4. In order to satisfy certain technical requirements, some of the products described in this

publication may contain substances subject to restrictions in certain jurisdictions (e.g.

because they are classed as hazardous). Useful information on this will be found in our

Material Data Sheets on the Internet (www.tdk-electronics.tdk.com/material). Should you have

any more detailed questions, please contact our sales offices.

5. We constantly strive to improve our products. Consequently, the products described in this

publication may change from time to time. The same is true of the corresponding product

specifications. Please check therefore to what extent product descriptions and specifications

contained in this publication are still applicable before or when you place an order.

We also reserve the right to discontinue production and delivery of products.

Consequently, we cannot guarantee that all products named in this publication will always be

available. The aforementioned does not apply in the case of individual agreements deviating

from the foregoing for customer-specific products.

6. Unless otherwise agreed in individual contracts, all orders are subject to our General Terms

and Conditions of Supply.

11/21

Important notes

7. Our manufacturing sites serving the automotive business apply the IATF 16949

standard. The IATF certifications confirm our compliance with requirements regarding the

quality management system in the automotive industry. Referring to customer requirements

and customer specific requirements (“CSR”) TDK always has and will continue to have the

policy of respecting individual agreements. Even if IATF 16949 may appear to support the

acceptance of unilateral requirements, we hereby like to emphasize that only requirements

mutually agreed upon can and will be implemented in our Quality Management System.

For clarification purposes we like to point out that obligations from IATF 16949 shall only

become legally binding if individually agreed upon.

8. The trade names EPCOS, CarXield, CeraCharge, CeraDiode, CeraLink, CeraPad, CeraPlas,

CSMP,

CTVS, DeltaCap, DigiSiMic, ExoCore, FilterCap, FormFit, LeaXield, MiniBlue,

MiniCell, MKD, MKK, ModCap, MotorCap, PCC, PhaseCap, PhaseCube, PhaseMod, PhiCap,

PowerHap, PQSine, PQvar, SIFERRIT, SIFI, SIKOREL, SilverCap, SIMDAD, SiMic, SIMID,

SineFormer, SIOV, ThermoFuse, WindCap, XieldCap are trademarks registered or pending

in Europe and in other countries. Further information will be found on the Internet at

www.tdk-electronics.tdk.com/trademarks.

Release 2020-06

10 11/21

B82722S0862A020 [TDK]

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