B82794C2475N465 [TDK]
共模滤波器/扼流圈;
| 型号： | B82794C2475N465 |
| 厂家： | 
TDK ELECTRONICS |
| 描述： | 共模滤波器/扼流圈 LTE |
| 文件： | 总8页 (文件大小：1371K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Data and signal line chokes
Common-mode chokes, ring core
4.7 … 10 mH, 200 … 300 mA, 60 °C
Series/Type:
B82794C2
Date:
a~í~=pÜÉÉí January 2010
EPCOS AG 2015. Reproduction, publication and dissemination of this publication, enclosures hereto and the information
contained therein without EPCOS' prior express consent is prohibited.
EPCOS AG is a TDK Group Company.
Data and signal line chokes
B82794C2
Common-mode chokes, ring core
Rated voltage 42 V AC/80 V DC
Rated inductance 4.7 mH to 10 mH
Rated current 200 mA to 300 mA
Construction
■ Current-compensated ring core quad choke
■ Ferrite core
■ LCP case (UL 94 V-0)
■ Silicone potting
■ Bifilar winding
Features
■ Suitable for reflow soldering
■ RoHS-compatible
Function
Suppression of asymmetrical interference
coupled in on lines, whereas data signals
up to some MHz can pass unaffectedly
Applications
■ Telecom interfaces
■ ISDN systems
Terminals
■ Base material CuSn6
■ Layer composition Ni, Sn
■ Hot-dipped
Marking
■ Marking on component:
Manufacturer, ordering code inductance, graphic symbol,
date of manufacture (YYWWD)
■ Minimum data on reel:
Manufacturer, ordering code,
L value, current, quantity, date of packing
Delivery mode and packing unit
■ 24-mm blister tape, wound on 330-mm # reel
■ Packing unit: 250 pcs./reel
Please read Cautions and warnings and
Important notes at the end of this document.
2
01/10
Data and signal line chokes
B82794C2
Common-mode chokes, ring core
Dimensional drawing and pin configuration
Layout recommendation
2.2 0.2
1.5 min.1)
4
3
5
6
4
3
2
1
5
6
7
8
12
2
1
7
8
17.6
IND0200-G
14.9 0.3
14.5 max.
16.6 0.4
13.3 max.
0.1
Marking
Dimensions in mm
1) Soldering area
IND0199-K-E
Taping and packing
Blister tape
Reel
Dimensions in mm
Please read Cautions and warnings and
Important notes at the end of this document.
3
01/10
Data and signal line chokes
B82794C2
Common-mode chokes, ring core
Technical data and measuring conditions
Rated voltage VR
42 V AC (50/60 Hz) / 80 V DC
Rated temperature TR
Rated current IR
60 °C
Referred to 50 Hz and rated temperature
Rated inductance LR
Measured with Agilent 4284A at 10 kHz, 50 mV, 20 °C
Inductance is specified per winding.
Inductance tolerance
–30%/+50% at 20 °C
Inductance decrease ꢀL/L0
Stray inductance Lstray,typ
< 10% at DC magnetic bias with IR, 20 ꢁC
Measured with Agilent 4284A at 10 kHz, 50 mV, 20 °C,
typical values
DC resistance Rtyp
Measured at 20 ꢁC, typical values, specified per winding
Solderability (lead-free)
Sn96.5Ag3.0Cu0.5: (245 ꢂ5) °C, (3 ꢂ0.3) s
Wetting of soldering area ꢃꢄ95%
(to IEC 60068-2-58)
Resistance to soldering heat
Climatic category
(260 ꢂ5) °C, (10 ꢂ1) s (to IEC 60068-2-58)
40/125/56 (to IEC 60068-1)
–25 °C … +40 °C, ꢅꢄ75% RH
Approx. 2.5 g
Storage conditions (packaged)
Weight
Characteristics and ordering codes
LR
Lstray,typ
nH
IR
Rtyp
Vtest
Ordering code
mH
mA
300
200
mꢆ
V DC, 2 s
750
4.7
10
350
900
1400
B82794C2475N465
B82794C2106N465
900
750
Please read Cautions and warnings and
Important notes at the end of this document.
4
01/10
Data and signal line chokes
B82794C2
Common-mode chokes, ring core
Insertion loss ꢇ (typical values at |Z| = 50 ꢆ, 20 °C)
asymmetrical, all branches in parallel (common mode)
symmetrical (differential mode)
LR = 4.7 mH
LR = 10 mH
IND0201-C
IND0202-K
60
60
B82794C2475N465
B82794C2106N465
dB
dB
α
α
50
50
40
30
20
10
0
40
30
20
10
0
104
105
106
107
108 Hz 109
f
104
105
106
107
108 Hz 109
f
Current derating Iop/IR
versus ambient temperature
IND0681-C-E
1.4
Iop
IR
1.2
1.0
0.8
0.6
0.4
0.2
0
TR = 60 C
˚
0
20
40
60
80 100
C
TA
140
˚
Please read Cautions and warnings and
Important notes at the end of this document.
5
01/10
Data and signal line chokes
B82794C2
Common-mode chokes, ring core
Recommended reflow soldering curve
Pb-free solder material (based on JEDEC J-STD 020C)
t3
T4
T3
t2
T2
T1
t1
IND0814-F
T1
T2
°C
T3
°C
T4
°C
t1
s
t2
s
t3
s
°C
150
200
217
245
< 110
< 90
< 30 @ T4 –5 °C
Time from 25 °C to T4: max 300 s
Maximal numbers of reflow cycles: 3
Please read Cautions and warnings and
Important notes at the end of this document.
6
01/10
Cautions and warnings
■ Please note the recommendations in our Inductors data book (latest edition) and in the data
sheets.
– Particular attention should be paid to the derating curves given there.
– The soldering conditions should also be observed. Temperatures quoted in relation to wave
soldering refer to the pin, not the housing.
■ If the components are to be washed varnished it is necessary to check whether the washing
varnish agent that is used has a negative effect on the wire insulation, any plastics that are used,
or on glued joints. In particular, it is possible for washing varnish agent residues to have a
negative effect in the long-term on wire insulation.
■ The following points must be observed if the components are potted in customer applications:
– Many potting materials shrink as they harden. They therefore exert a pressure on the plastic
housing or core. This pressure can have a deleterious effect on electrical properties, and in
extreme cases can damage the core or plastic housing mechanically.
– It is necessary to check whether the potting material used attacks or destroys the wire
insulation, plastics or glue.
– The effect of the potting material can change the high-frequency behaviour of the components.
■ Ferrites are sensitive to direct impact. This can cause the core material to flake, or lead to
breakage of the core.
■ Even for customer-specific products, conclusive validation of the component in the circuit can
only be carried out by the customer.
Please read Cautions and warnings and
Important notes at the end of this document.
7
01/10
Important notes
The following applies to all products named in this publication:
1. Some parts of this publication contain statements about the suitability of our products for certain areas
of application. These statements are based on our knowledge of typical requirements that are often placed
on our products in the areas of application concerned. We nevertheless expressly point out that such
statements cannot be regarded as binding statements about the suitability of our products for a
particular customer application. As a rule we are either unfamiliar with individual customer applications or
less familiar with them than the customers themselves. For these reasons, it is always ultimately incumbent
on the customer to check and decide whether a product with the properties described in the product
specification is suitable for use in a particular customer application.
2. We also point out that in individual cases, a malfunction of electronic components or failure before
the end of their usual service life cannot be completely ruled out in the current state of the art, even
if they are operated as specified. In customer applications requiring a very high level of operational safety
and especially in customer applications in which the malfunction or failure of an electronic component could
endanger human life or health (e.g. in accident prevention or life-saving systems), it must therefore be
ensured by means of suitable design of the customer application or other action taken by the customer (e.g.
installation of protective circuitry or redundancy) that no injury or damage is sustained by third parties in the
event of malfunction or failure of an electronic component.
3. The warnings, cautions and product-specific notes must be observed.
4. In order to satisfy certain technical requirements, some of the products described in this publication
may contain substances subject to restrictions in certain jurisdictions (e.g. because they are
classed as hazardous). Useful information on this will be found in our Material Data Sheets on the Internet
(www.tdk-electronics.tdk.com/material). Should you have any more detailed questions, please contact our
sales offices.
5. We constantly strive to improve our products. Consequently, the products described in this publication
may change from time to time. The same is true of the corresponding product specifications. Please
check therefore to what extent product descriptions and specifications contained in this publication are still
applicable before or when you place an order.
We also reserve the right to discontinue production and delivery of products. Consequently, we
cannot guarantee that all products named in this publication will always be available. The aforementioned
does not apply in the case of individual agreements deviating from the foregoing for customer-specific
products.
6. Unless otherwise agreed in individual contracts, all orders are subject to our General Terms and
Conditions of Supply.
7. Our manufacturing sites serving the automotive business apply the IATF 16949 standard. The IATF
certifications confirm our compliance with requirements regarding the quality management system in the
automotive industry. Referring to customer requirements and customer specific requirements (“CSR”) TDK
always has and will continue to have the policy of respecting individual agreements. Even if IATF 16949
may appear to support the acceptance of unilateral requirements, we hereby like to emphasize that only
requirements mutually agreed upon can and will be implemented in our Quality Management
System. For clarification purposes we like to point out that obligations from IATF 16949 shall only become
legally binding if individually agreed upon.
8. The trade names EPCOS, CeraCharge, CeraDiode, CeraLink, CeraPad, CeraPlas, CSMP, CTVS,
DeltaCap, DigiSiMic, ExoCore, FilterCap, FormFit, LeaXield, MiniBlue, MiniCell, MKD, MKK, MotorCap,
PCC, PhaseCap, PhaseCube, PhaseMod, PhiCap, PowerHap, PQSine, PQvar, SIFERRIT, SIFI, SIKOREL,
SilverCap, SIMDAD, SiMic, SIMID, SineFormer, SIOV, ThermoFuse, WindCap are trademarks registered
or pending in Europe and in other countries. Further information will be found on the Internet at www.tdk-
electronics.tdk.com/trademarks.
Release 2018-10
8
01/10
相关型号：
©2020 ICPDF网 联系我们和版权申明