C0402X5R0G222K020BC_17 [TDK]
Multilayer Ceramic Chip Capacitors;
| 型号： | C0402X5R0G222K020BC_17 |
| 厂家： | 
TDK ELECTRONICS |
| 描述： | Multilayer Ceramic Chip Capacitors |
| 文件： | 总3页 (文件大小：236K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
1 of 3
Creation Date : March 21, 2017 (GMT)
Multilayer Ceramic Chip Capacitors
C0402X5R0G222K020BC
TDK item description C0402X5R0G222KT****
Applications
Commercial Grade
Feature
Series
Status
General General (Up to 50V)
C0402 [EIA 01005]
Production (Not Recommended for New Design)
Size
Length(L)
0.40mm ±0.02mm
Width(W)
0.20mm ±0.02mm
0.20mm ±0.02mm
0.07mm Min.
Thickness(T)
Terminal Width(B)
Terminal Spacing(G)
Recommended Land Pattern (PA)
Recommended Land Pattern (PB)
Recommended Land Pattern (PC)
0.14mm Min.
0.15mm to 0.25mm
0.15mm to 0.25mm
0.15mm to 0.25mm
Electrical Characteristics
Capacitance
2.2nF ±10%
4VDC
Rated Voltage
Temperature Characteristic
Dissipation Factor (Max.)
Insulation Resistance (Min.)
X5R(±15%)
5%
10000MΩ
Other
Soldering Method
AEC-Q200
Reflow
No
Packing
Punched (Paper)Taping [180mm Reel]
20000pcs
Package Quantity
! Images are for reference only and show exemplary products.
! This PDF document was created based on the data listed on the TDK Corporation website.
! All specifications are subject to change without notice.
Copyright(c) TDK Corporation. All rights reserved.
2 of 3
Creation Date : March 21, 2017 (GMT)
Multilayer Ceramic Chip Capacitors
C0402X5R0G222K020BC
Characteristic Graphs(This is reference data, and does not guarantee the products characteristics.)
Impedance
ESR
C0402X5R0G222K020BC
C0402X5R0G222K020BC
Capacitance
DC Bias Characteristic
C0402X5R0G222K020BC
C0402X5R0G222K020BC
Temperature Characteristic
Ripple Temperature Rising
C0402X5R0G222K020BC(100kHz) C0402X5R0G222K020BC(500kHz) C0402X5R0G222K020BC(1MHz)
C0402X5R0G222K020BC(DC Bias =
C0402X5R0G222K020BC(No Bias)
2V )
! Images are for reference only and show exemplary products.
! This PDF document was created based on the data listed on the TDK Corporation website.
! All specifications are subject to change without notice.
Copyright(c) TDK Corporation. All rights reserved.
3 of 3
Creation Date : March 21, 2017 (GMT)
Multilayer Ceramic Chip Capacitors
C0402X5R0G222K020BC
Associated Images
Land Pattern (Terminal Connection)
! Images are for reference only and show exemplary products.
! This PDF document was created based on the data listed on the TDK Corporation website.
! All specifications are subject to change without notice.
Copyright(c) TDK Corporation. All rights reserved.
相关型号：
©2020 ICPDF网 联系我们和版权申明