C0603X6S0G334M030BC_17 [TDK]
Multilayer Ceramic Chip Capacitors;
| 型号： | C0603X6S0G334M030BC_17 |
| 厂家： | 
TDK ELECTRONICS |
| 描述： | Multilayer Ceramic Chip Capacitors |
| 文件： | 总3页 (文件大小：235K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
1 of 3
Creation Date : March 30, 2017 (GMT)
Multilayer Ceramic Chip Capacitors
C0603X6S0G334K030BC
TDK item description C0603X6S0G334KT****
Applications
Commercial Grade
Feature
Series
Status
General General (Up to 50V)
C0603 [EIA 0201]
Production (Not Recommended for New Design)
Size
Length(L)
0.60mm ±0.05mm
Width(W)
0.30mm ±0.05mm
0.30mm ±0.05mm
0.10mm Min.
Thickness(T)
Terminal Width(B)
Terminal Spacing(G)
Recommended Land Pattern (PA)
Recommended Land Pattern (PB)
Recommended Land Pattern (PC)
0.20mm Min.
0.25mm to 0.35mm
0.20mm to 0.30mm
0.25mm to 0.35mm
Electrical Characteristics
Capacitance
330nF ±10%
4VDC
Rated Voltage
Temperature Characteristic
Dissipation Factor (Max.)
Insulation Resistance (Min.)
X6S(±22%)
10%
303MΩ
Other
Soldering Method
AEC-Q200
Reflow
No
Packing
Punched (Paper)Taping [180mm Reel]
15000pcs
Package Quantity
! Images are for reference only and show exemplary products.
! This PDF document was created based on the data listed on the TDK Corporation website.
! All specifications are subject to change without notice.
Copyright(c) TDK Corporation. All rights reserved.
2 of 3
Creation Date : March 30, 2017 (GMT)
Multilayer Ceramic Chip Capacitors
C0603X6S0G334K030BC
Characteristic Graphs(This is reference data, and does not guarantee the products characteristics.)
Impedance
ESR
C0603X6S0G334K030BC
C0603X6S0G334K030BC
Capacitance
DC Bias Characteristic
C0603X6S0G334K030BC
C0603X6S0G334K030BC
Temperature Characteristic
Ripple Temperature Rising
C0603X6S0G334K030BC(100kHz) C0603X6S0G334K030BC(500kHz) C0603X6S0G334K030BC(1MHz)
C0603X6S0G334K030BC(DC Bias =
2V )
C0603X6S0G334K030BC(No Bias)
! Images are for reference only and show exemplary products.
! This PDF document was created based on the data listed on the TDK Corporation website.
! All specifications are subject to change without notice.
Copyright(c) TDK Corporation. All rights reserved.
3 of 3
Creation Date : March 30, 2017 (GMT)
Multilayer Ceramic Chip Capacitors
C0603X6S0G334K030BC
Associated Images
Land Pattern (Terminal Connection)
! Images are for reference only and show exemplary products.
! This PDF document was created based on the data listed on the TDK Corporation website.
! All specifications are subject to change without notice.
Copyright(c) TDK Corporation. All rights reserved.
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