C1608C0G1H101KT [TDK]
Ceramic Capacitor, Ceramic;
| 型号： | C1608C0G1H101KT |
| 厂家： | 
TDK ELECTRONICS |
| 描述： | Ceramic Capacitor, Ceramic |
| 文件： | 总2页 (文件大小：279K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
C SERIES | Conductive Epoxy
B
TDK’s Conductive Epoxy Series is a conductive glue-mounted device
L
W
B
L
Body Length
rather than solder-mounted.
In high-temperature environments, the
W Body Width
T
B
connectivity reliability is focused on the solder fillet because there are thermal
expansion coefficient differences between the substrate, MLCC, and solder
fillet. A conductive glue-mounted device allows for more “flexibility” during
periods of expansion and contraction because the thermal expansion
differences have been reduced by using a non-solder attachment.
T
Body Height
Terminal Width
Case Code
L (mm)
W (mm)
T (mm)
Conductive glue is a common method of mounting components in
applications that demand reliability at high temperatures, particularly in
automotive environments. It's also used in applications that cannot be
subjected to the heat of the solder paste mounting process, such as LCD
panels, organic EL and LED displays, and CCD devices, which are particularly
sensitive to high temperatures.
C1005/0402
C1608/0603
C2012/0805
C3216/1206
C3225/1210
1.00
1.60
2.00
3.20
3.20
0.50
0.80
1.25
1.60
2.50
0.50
0.80
1.25
1.60
2.50
Part Number Description
TEMPERATURE CHARACTERISTICS
RATED VOLTAGE (DC)
PACKAGING STYLE
INTERNAL CODES
C3216
X7R
1E
106
K
T
���B
SERIES NAME & DIMENSION CODE
CAPACITANCE TOLERANCE
NOMINAL CAPACITANCE (pF)
Standard Termination
AgPdCu Termination
Features:
3
3
4
4
5
AgPdCu termination for conductive glue mounting
Reduce risk of silver migration
Improved mechanical/thermal strength when use with conductive glue
AEC Q-200 compliant
RoHS, WEE, and REACH compliant
2
2
MATERIAL
1
1
Applications:
No.
NAME
Class 1
CaZrO3
Class 2
BaTiO3
MATERIAL
Transmission control
Engine sensor module
No.
NAME
(1) Ceramic Dielectric
(2) Internal Electrode
(3)
(4)
(5)
Class 1
Class 2
Nickel (Ni)
(1) Ceramic Dielectric
(2) Internal Electrode
CaZrO3
BaTiO3
Automotive power train
Anti-Lock Breaking System
Application requiring conductive glue mounting method
Copper (Cu)
Nickel (Ni)
Tin (Sn)
Nickel (Ni)
Copper (Cu)
AgPdCu
Termination
(3)
Termination
(4)
©TDK Corporation of America – Contents are subject to change without notice.
C SERIES | Conductive Epoxy / C0G, X7R, X8R
C100C5GJ2
C01400025/CC0402
C160C8GJ3
C01660038/CC0603
C2012 CGJC43216 C3225
080C52012/CC10280065 1210
CCaappaacciittaannccee
((ppFF))
CCaapp
CCooddee
11HH
((550VV))
11EE
((2255VV))
1C 2A 1H
(16V(1) 00V(5) 0V)
1E
(25V)
11HC
((5106VV))
1A
10EJ
11HH
11EE
((2255VV))
11CE
11HA
(10V) ((62.53VV)) ((5500VV))
((2156VV)) ((5100VV))
10 100
100 101
220 221
470 471
1,000 102
2,200 222
4,700 472
10,000 103
22,000 223
47,000 473
100,000 104
1,000,000 105
10,000,000 106
C0G
X7R
X8R
©TDK Corporation of America – Contents are subject to change without notice.
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