C1608C0G1V153J080AC_17 [TDK]

Multilayer Ceramic Chip Capacitors;
C1608C0G1V153J080AC_17
型号: C1608C0G1V153J080AC_17
厂家: TDK ELECTRONICS    TDK ELECTRONICS
描述:

Multilayer Ceramic Chip Capacitors

文件: 总3页 (文件大小:105K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
1 of 3  
Creation Date : April 20, 2017 (GMT)  
Multilayer Ceramic Chip Capacitors  
C1608C0G1V153J080AC  
TDK item description C1608C0G1V153JT****  
Applications  
Commercial Grade  
Feature  
Series  
Status  
General General (Up to 50V)  
C1608 [EIA 0603]  
Production  
Size  
1.60mm ±0.10mm  
Length(L)  
Width(W)  
0.80mm ±0.10mm  
0.80mm ±0.10mm  
0.20mm Min.  
Thickness(T)  
Terminal Width(B)  
Terminal Spacing(G)  
0.30mm Min.  
0.70mm to 1.00mm(Flow Soldering)  
0.60mm to 0.80mm(Reflow Soldering)  
Recommended Land Pattern (PA)  
Recommended Land Pattern (PB)  
Recommended Land Pattern (PC)  
0.80mm to 1.00mm(Flow Soldering)  
0.60mm to 0.80mm(Reflow Soldering)  
0.60mm to 0.80mm(Flow Soldering)  
0.60mm to 0.80mm(Reflow Soldering)  
Electrical Characteristics  
Capacitance  
15nF ±5%  
35VDC  
Rated Voltage  
Temperature Characteristic  
Q (Min.)  
C0G(0±30ppm/°C)  
1000  
Insulation Resistance (Min.)  
10000MΩ  
Other  
Wave (Flow)  
Reflow  
Soldering Method  
AEC-Q200  
No  
Packing  
Punched (Paper)Taping [180mm Reel]  
4000pcs  
Package Quantity  
! Images are for reference only and show exemplary products.  
! This PDF document was created based on the data listed on the TDK Corporation website.  
! All specifications are subject to change without notice.  
Copyright(c) TDK Corporation. All rights reserved.  
2 of 3  
Creation Date : April 20, 2017 (GMT)  
Multilayer Ceramic Chip Capacitors  
C1608C0G1V153J080AC  
Characteristic Graphs(This is reference data, and does not guarantee the products characteristics.)  
! Images are for reference only and show exemplary products.  
! This PDF document was created based on the data listed on the TDK Corporation website.  
! All specifications are subject to change without notice.  
Copyright(c) TDK Corporation. All rights reserved.  
3 of 3  
Creation Date : April 20, 2017 (GMT)  
Multilayer Ceramic Chip Capacitors  
C1608C0G1V153J080AC  
Associated Images  
Land Pattern (Terminal Connection)  
! Images are for reference only and show exemplary products.  
! This PDF document was created based on the data listed on the TDK Corporation website.  
! All specifications are subject to change without notice.  
Copyright(c) TDK Corporation. All rights reserved.  

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