C2012C0G1H153J085AE [TDK]
Multilayer Ceramic Chip Capacitors;
| 型号： | C2012C0G1H153J085AE |
| 厂家： | 
TDK ELECTRONICS |
| 描述： | Multilayer Ceramic Chip Capacitors |
| 文件： | 总3页 (文件大小：168K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
1 of 3
Creation Date : November 30, 2017 (GMT)
Multilayer Ceramic Chip Capacitors
C2012C0G1H153J085AE
TDK item description C2012C0G1H153JT***S
Commercial Grade
Applications
Please refer to Part No. CGA4F2C0G1H153J085AE for Automotive use.
Soft Soft Termination
Feature
Series
Status
C2012 [EIA 0805]
Production
Size
2.00mm +0.45,-0.20mm
Length(L)
Width(W)
1.25mm +0.25,-0.20mm
0.85mm ±0.15mm
0.20mm Min.
Thickness(T)
Terminal Width(B)
Terminal Spacing(G)
0.50mm Min.
1.00mm to 1.30mm(Flow Soldering)
0.90mm to 1.20mm(Reflow Soldering)
Recommended Land Pattern (PA)
Recommended Land Pattern (PB)
Recommended Land Pattern (PC)
1.00mm to 1.20mm(Flow Soldering)
0.70mm to 0.90mm(Reflow Soldering)
0.80mm to 1.10mm(Flow Soldering)
0.90mm to 1.20mm(Reflow Soldering)
Electrical Characteristics
Capacitance
15nF ±5%
50VDC
Rated Voltage
Temperature Characteristic
Q (Min.)
C0G(0±30ppm/°C)
1000
Insulation Resistance (Min.)
10000MΩ
Other
Wave (Flow)
Reflow
Soldering Method
AEC-Q200
No
Packing
Punched (Paper)Taping [180mm Reel]
4000pcs
Package Quantity
! Images are for reference only and show exemplary products.
! This PDF document was created based on the data listed on the TDK Corporation website.
! All specifications are subject to change without notice.
Copyright(c) TDK Corporation. All rights reserved.
2 of 3
Creation Date : November 30, 2017 (GMT)
Multilayer Ceramic Chip Capacitors
C2012C0G1H153J085AE
Characteristic Graphs(This is reference data, and does not guarantee the products characteristics.)
Impedance
Capacitance
C2012C0G1H153J085AE
C2012C0G1H153J085AE
DC Bias Characteristic
Temperature Characteristic
C2012C0G1H153J085AE(DC Bias =
25V)
C2012C0G1H153J085AE
C2012C0G1H153J085AE(No Bias)
! Images are for reference only and show exemplary products.
! This PDF document was created based on the data listed on the TDK Corporation website.
! All specifications are subject to change without notice.
Copyright(c) TDK Corporation. All rights reserved.
3 of 3
Creation Date : November 30, 2017 (GMT)
Multilayer Ceramic Chip Capacitors
C2012C0G1H153J085AE
Associated Images
Land Pattern (Terminal Connection)
! Images are for reference only and show exemplary products.
! This PDF document was created based on the data listed on the TDK Corporation website.
! All specifications are subject to change without notice.
Copyright(c) TDK Corporation. All rights reserved.
相关型号：
C2012C0G1H162JT
Ceramic Capacitor, Multilayer, Ceramic, 50V, 5% +Tol, 5% -Tol, C0G, 30ppm/Cel TC, 0.0016uF, Surface Mount, 0805, CHIP
TDK
C2012C0G1H181KB
Ceramic Capacitor, Multilayer, Ceramic, 50V, 10% +Tol, 10% -Tol, C0G, 30ppm/Cel TC, 0.00018uF, Surface Mount, 0805, CHIP
TDK
C2012C0G1H200JB
Ceramic Capacitor, Multilayer, Ceramic, 50V, 5% +Tol, 5% -Tol, C0G, 30ppm/Cel TC, 0.00002uF, Surface Mount, 0805, CHIP
TDK
C2012C0G1H201JB
Ceramic Capacitor, Multilayer, Ceramic, 50V, 5% +Tol, 5% -Tol, C0G, 30ppm/Cel TC, 0.0002uF, Surface Mount, 0805, CHIP
TDK
©2020 ICPDF网 联系我们和版权申明