C2012X5R1V106K125AC_17 [TDK]
Multilayer Ceramic Chip Capacitors;
| 型号： | C2012X5R1V106K125AC_17 |
| 厂家： | 
TDK ELECTRONICS |
| 描述： | Multilayer Ceramic Chip Capacitors |
| 文件： | 总3页 (文件大小：217K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
1 of 3
Creation Date : May 16, 2017 (GMT)
Multilayer Ceramic Chip Capacitors
C2012JB1V106M125AC
TDK item description C2012JB1V106MT****
Applications
Commercial Grade
Feature
Series
Status
General General (Up to 50V)
C2012 [EIA 0805]
Production
Size
2.00mm ±0.20mm
Length(L)
Width(W)
1.25mm ±0.20mm
1.25mm ±0.20mm
0.20mm Min.
Thickness(T)
Terminal Width(B)
Terminal Spacing(G)
0.50mm Min.
1.00mm to 1.30mm(Flow Soldering)
0.90mm to 1.20mm(Reflow Soldering)
Recommended Land Pattern (PA)
Recommended Land Pattern (PB)
Recommended Land Pattern (PC)
1.00mm to 1.20mm(Flow Soldering)
0.70mm to 0.90mm(Reflow Soldering)
0.80mm to 1.10mm(Flow Soldering)
0.90mm to 1.20mm(Reflow Soldering)
Electrical Characteristics
Capacitance
10μF ±20%
35VDC
Rated Voltage
Temperature Characteristic
Dissipation Factor (Max.)
Insulation Resistance (Min.)
JB(±10%)
10%
50MΩ
Other
Wave (Flow)
Reflow
Soldering Method
AEC-Q200
No
Packing
Blister (Plastic)Taping [180mm Reel]
2000pcs
Package Quantity
! Images are for reference only and show exemplary products.
! This PDF document was created based on the data listed on the TDK Corporation website.
! All specifications are subject to change without notice.
Copyright(c) TDK Corporation. All rights reserved.
2 of 3
Creation Date : May 16, 2017 (GMT)
Multilayer Ceramic Chip Capacitors
C2012JB1V106M125AC
Characteristic Graphs(This is reference data, and does not guarantee the products characteristics.)
Impedance
ESR
C2012JB1V106M125AC
C2012JB1V106M125AC
Capacitance
DC Bias Characteristic
C2012JB1V106M125AC
C2012JB1V106M125AC
Ripple Temperature Rising
C2012JB1V106M125AC(100kHz) C2012JB1V106M125AC(500kHz) C2012JB1V106M125AC(1MHz)
! Images are for reference only and show exemplary products.
! This PDF document was created based on the data listed on the TDK Corporation website.
! All specifications are subject to change without notice.
Copyright(c) TDK Corporation. All rights reserved.
3 of 3
Creation Date : May 16, 2017 (GMT)
Multilayer Ceramic Chip Capacitors
C2012JB1V106M125AC
Associated Images
Land Pattern (Terminal Connection)
! Images are for reference only and show exemplary products.
! This PDF document was created based on the data listed on the TDK Corporation website.
! All specifications are subject to change without notice.
Copyright(c) TDK Corporation. All rights reserved.
相关型号：
C2012X5R1V106M085AC
Ceramic Capacitor, Multilayer, Ceramic, 35V, 20% +Tol, 20% -Tol, X5R, 15% TC, 10uF, Surface Mount, 0805, CHIP, ROHS COMPLIANT
TDK
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