C2012X7R2A103KT5_技术文档

C Series

Open Mode Design

Type:

C2012 [EIA CC0805]

C3216 [EIA CC1206]

C3225 [EIA CC1210]

C4532 [EIA CC1812]

C5750 [EIA CC2220]

Issue date:

April 2011

TDK MLCC

US Catalog

Version B11

REMINDERS

Please read before using this product

SAFETY REMINDERS

REMINDERS

1.

2.

3.

If you intend to use a product listed in this catalog for a purpose that may cause loss of life or other

damage, you must contact our company’s sales window.

We may modify products or discontinue production of a product listed in this catalog without prior

notification.

We provide “Delivery Specification” that explain precautions for the specifications and safety of each

product listed in this catalog. We strongly recommend that you exchange these delivery specifications

with customers that use one of these products.

4.

If you plan to export a product listed in this catalog, keep in mind that it may be a restricted item according

to the “Foreign Exchange and Foreign Trade Control Law”. In such cases, it is necessary to acquire export

permission in harmony with this law.

5.

6.

Any reproduction or transferring of the contents of this catalog is prohibited without prior permission from

our company.

We are not responsible for problems that occur related to the intellectual property rights or other rights of

our company or a third party when you use a product listed in this catalog. We do not grant license of

these rights.

7.

This catalog only applies to products purchased through our company or one of our company’s official

agencies. This catalog does not apply to products that are purchased through other third parties.

TDK MLCC US Catalog

Page 180

Version B11

C Series

Open Mode Design

Type: C2012, C3216, C3225, C4532, C5750

• Automotive and other high stress

applications

• Battery line circuits with high board

flex stress

• Increase resistance to mechanical bending,

temperature cycle, vibration, and electrical stresses

• Available in X7R and X8R dielectrics

• When a chip capacitor is cracked by mechanical

stress such as board bending, open mode construction

helps user reduce the risk of short circuits

Features

Applications

• The Open Mode design defines that the L-Gap length

shall be wider than the terminal band width

Shape &

Dimensions

Fail Short

Fail Open

L-Gap

L

W

T

Body Length

Body Width

Body Height

Terminal Width

B

Dimensions in mm

Crack

• The Open Mode concept does not guaranteed MLCC

will always fail open. This design is intended to reduce

the risk of the MLCC failing short. All MLCC caution

guidelines apply.

Symbol

Design

Part Number

Construction

5

Open Mode

C

3216 X7R 2A 105 K T 5XXX

Series Name

Dimensions L x W (mm)

Internal Codes

Termination Code

5xxx

Packaging Style

Style

Open Mode Design

Case Code

C2012

Length

Width

2.00 ± 0.20

3.20 ± 0.20

3.20 ± 0.40

4.50 ± 0.40

5.70 ± 0.40

1.25 ± 0.20

1.60 ± 0.20

2.50 ± 0.30

3.20 ± 0.40

5.00 ± 0.40

C3216

Packaging Code

T

Capacitance Tolerance

Style

Tape & Reel

C3225

C4532

C5750

Tolerance Code

Tolerance

K

M

± 10%

± 20%

Temperature Characteristic

Temperature

Capacitance

Change

Temperature

Range

Nominal Capacitance (pF)

Characteristics

±15%

-55 to +125ºC

-55 to +150ºC

The capacitance is expressed in three

digit codes and in units of pico Farads

(pF). The first and second digits identify

the first and second significant figures of

the capacitance. The third digit identifies

the multiplier. R designates a decimal

point.

X7R

X8R

Rated Voltage (DC)

Voltage Code

Voltage (DC)

16V

25V

50V

100V

250V

630V

1C

1E

1H

2A

2E

2J

Capacitance Code Capacitance

0R5

010

102

105

0.5pF

1pF

1,000pF (1nF)

1,000,000pF (1µF)

TDK MLCC US Catalog

Page 181

Version B11

Capacitance

Range Chart

C2012 [EIA CC0805]

Capacitance Range Chart

Temperature Characteristics: X7R, (± 15%), X8R (± 15%)

Rated Voltage: 250V (2E), 100V (2A), 50V (1H)

X7R

X8R

Capacitance

(pF)

Cap

Code

Tolerance

K: ± 10%

2E

2A

1H

(50V)

1H

(50V)

(250V) (100V)

1,000

1,500

2,200

3,300

4,700

102

152

222

332

472

682

103

153

223

333

473

683

104

6,800

10,000

15,000

22,000

33,000

47,000

68,000

100,000

Standard Thickness

0.85 mm

1.25 mm

Capacitance

Range Table

C2012 [EIA CC0805]

Class 2 (Temperature Stable)

Temperature Characteristics X7R (-55 to +125ºC, ±15%), X8R (-55 to +150ºC, ±15%)

TDK Part Number

(Ordering Code)

Temperature

Characteristics

Rated

Voltage

Capacitance

(pF)

Capacitance

Tolerance

Thickness

(mm)

C2012X7R1H104KT5

C2012X7R2A102KT5

C2012X7R2A152KT5

C2012X7R2A222KT5

C2012X7R2A332KT5

C2012X7R2A472KT5

C2012X7R2A682KT5

C2012X7R2A103KT5

C2012X7R2A153KT5

C2012X7R2A223KT5

C2012X7R2E102KT5

C2012X7R2E152KT5

C2012X7R2E222KT5

C2012X7R2E332KT5

C2012X7R2E472KT5

C2012X7R2E682KT5

C2012X7R2E103KT5

C2012X7R2E153KT5

C2012X8R1H223KT5

C2012X8R1H333KT5

C2012X8R1H473KT5

C2012X8R1H683KT5

X7R

X8R

50V

100V

250V

50V

100,000

± 10%

1.25 ± 0.20

0.85 ± 0.10

1.25 ± 0.20

0.85 ± 0.10

1.25 ± 0.20

0.85 ± 0.10

1.25 ± 0.20

1,000

1,500

2,200

3,300

4,700

6,800

10,000

15,000

22,000

1,000

1,500

2,200

3,300

4,700

6,800

10,000

15,000

22,000

33,000

47,000

68,000

50V

TDK MLCC US Catalog

Page 182

Version B11

Capacitance

Range Chart

C3216 [EIA CC1206]

Capacitance Range Chart

Temperature Characteristics: X7R, (± 15%)

Rated Voltage: 630V (2J), 250V (2E), 100V (2A), 16V (1C)

X7R

Capacitance

(pF)

Cap

Code

Tolerance

K: ± 10%

2J

2E

2A

1C

(16V)

(630V) (250V) (100V)

1,000

1,500

2,200

3,300

4,700

102

152

222

332

472

682

103

153

223

333

473

683

104

154

105

475

6,800

10,000

15,000

22,000

33,000

47,000

68,000

100,000

150,000

1,000,000

4,700,000

Standard Thickness

1.15 mm

1.30 mm

1.60 mm

Capacitance

Range Table

C3216 [EIA CC1206]

Class 2 (Temperature Stable)

Temperature Characteristics X7R (-55 to +125ºC, ±15%)

TDK Part Number

(Ordering Code)

Temperature

Characteristics

Rated

Voltage

Capacitance

(pF)

Capacitance

Tolerance

Thickness

(mm)

C3216X7R1C475MT5

C3216X7R2A333KT5

C3216X7R2A473KT5

C3216X7R2A683KT5

C3216X7R2A104KT5

C3216X7R2A154KT5

C3216X7R2A105KT5

C3216X7R2E153KT5

C3216X7R2E223KT5

C3216X7R2E333KT5

C3216X7R2E473KT5

C3216X7R2E683KT5

C3216X7R2E104KT5

C3216X7R2J102KT5

C3216X7R2J152KT5

C3216X7R2J222KT5

C3216X7R2J332KT5

C3216X7R2J472KT5

C3216X7R2J682KT5

C3216X7R2J103KT5

C3216X7R2J153KT5

C3216X7R2J223KT5

C3216X7R2J333KT5

X7R

16V

4,700,000

± 20%

± 10%

1.60 ± 0.30

1.15 ± 0.10

1.60 ± 0.30

1.15 ± 0.10

1.60 ± 0.30

1.15 ± 0.10

1.30 ± 0.15

1.60 ± 0.30

100V

250V

630V

33,000

47,000

68,000

100,000

150,000

1,000,000

15,000

22,000

33,000

47,000

68,000

100,000

1,000

1,500

2,200

3,300

4,700

6,800

10,000

15,000

22,000

33,000

TDK MLCC US Catalog

Page 183

Version B11

Capacitance

Range Chart

C3225 [EIA CC1210]

Capacitance Range Chart

Temperature Characteristics: X7R, (± 15%)

Rated Voltage: 630V (2J), 250V (2E), 100V (2A), 50V (1H), 25V (1E), 16V (1C)

X7R

Capacitance

(pF)

Cap

Code

Tolerance

K: ± 10%

2J

2E

2A

1H

1E

1C

(630V) (250V) (100V)

(50V)

(25V)

(16V)

47,000

68,000

473

683

104

154

224

334

474

684

105

155

225

335

475

100,000

150,000

220,000

330,000

470,000

680,000

1,000,000

1,500,000

2,200,000

3,300,000

4,700,000

Standard Thickness

1.15 mm

1.60 mm

2.00 mm

2.30 mm

2.50 mm

Capacitance

Range Table

C3225 [EIA CC1210]

Class 2 (Temperature Stable)

Temperature Characteristics X7R (-55 to +125ºC, ±15%)

TDK Part Number

(Ordering Code)

Temperature

Characteristics

Rated

Voltage

Capacitance

(pF)

Capacitance

Tolerance

Thickness

(mm)

C3225X7R1C335KT5

C3225X7R1C475KT5

C3225X7R1E105KT5

C3225X7R1E155KT5

C3225X7R1E225KT5

C3225X7R1H474KT5

C3225X7R1H684KT5

C3225X7R2A334KT5

C3225X7R2A105KT5

C3225X7R2A225KT5

C3225X7R2E104KT5

C3225X7R2E154KT5

C3225X7R2E224KT5

C3225X7R2J473KT5

C3225X7R2J683KT5

X7R

16V

3,300,000

± 10%

2.00 ± 0.20

2.50 ± 0.30

1.15 ± 0.10

1.60 ± 0.30

2.00 ± 0.20

1.60 ± 0.30

2.00 ± 0.20

2.30 ± 0.20

2.00 ± 0.20

4,700,000

1,000,000

1,500,000

2,200,000

470,000

680,000

330,000

1,000,000

2,200,000

100,000

150,000

220,000

47,000

25V

50V

100V

250V

630V

68,000

TDK MLCC US Catalog

Page 184

Version B11

Capacitance

Range Chart

C4532 [EIA CC1812]

Capacitance Range Chart

Temperature Characteristics: X7R, (± 15%)

Rated Voltage: 630V (2J), 250V (2E), 100V (2A), 50V (1H), 25V (1E), 16V (1C)

X7R

Capacitance

(pF)

Cap

Code

Tolerance

K: ± 10%

2J

2E

2A

1H

1E

1C

(630V) (250V) (100V)

(50V)

(25V)

(16V)

68,000

100,000

150,000

220,000

330,000

683

104

154

224

334

474

684

105

155

335

475

685

106

470,000

680,000

1,000,000

1,500,000

3,300,000

4,700,000

6,800,000

10,000,000

Standard Thickness

1.60 mm

2.00 mm

2.30 mm

Capacitance

Range Table

C4532 [EIA CC1812]

Class 2 (Temperature Stable)

Temperature Characteristics X7R (-55 to +125ºC, ±15%)

TDK Part Number

(Ordering Code)

Temperature

Characteristics

Rated

Voltage

Capacitance

(pF)

Capacitance

Tolerance

Thickness

(mm)

C4532X7R1C685KT5

C4532X7R1C106KT5

C4532X7R1E335KT5

C4532X7R1E475KT5

C4532X7R1H105KT5

C4532X7R1H155KT5

C4532X7R2A684KT5

C4532X7R2E154KT5

C4532X7R2E224KT5

C4532X7R2E334KT5

C4532X7R2E474KT5

C4532X7R2J683KT5

C4532X7R2J104KT5

X7R

16V

6,800,000

± 10%

2.00 ± 0.20

2.30 ± 0.20

1.60 ± 0.30

2.00 ± 0.20

1.60 ± 0.30

2.30 ± 0.20

1.60 ± 0.30

2.30 ± 0.20

1.60 ± 0.30

2.30 ± 0.20

10,000,000

3,300,000

4,700,000

1,000,000

1,500,000

680,000

150,000

220,000

330,000

470,000

68,000

25V

50V

100V

250V

630V

100,000

TDK MLCC US Catalog

Page 185

Version B11

Capacitance

Range Chart

C5750 [EIA CC2220]

Capacitance Range Chart

Temperature Characteristics: X7R, (± 15%)

Rated Voltage: 630V (2J), 250V (2E), 100V (2A), 50V (1H), 25V (1E), 16V (1C)

X7R

Capacitance

(pF)

Cap

Code

Tolerance

K: ± 10%

2J

2E

2A

1H

1E

1C

(630V) (250V) (100V)

(50V)

(25V)

(16V)

150,000

220,000

330,000

470,000

680,000

154

224

334

474

684

105

155

225

335

475

685

106

156

226

1,000,000

1,500,000

2,200,000

3,300,000

4,700,000

6,800,000

10,000,000

15,000,000

22,000,000

Standard Thickness

1.60 mm

2.00 mm

2.30 mm

2.80 mm

Capacitance

Range Table

C5750 [EIA CC2220]

Class 2 (Temperature Stable)

Temperature Characteristics X7R (-55 to +125ºC, ±15%)

TDK Part Number

(Ordering Code)

Temperature

Characteristics

Rated

Voltage

Capacitance

(pF)

Capacitance

Tolerance

Thickness

(mm)

C5750X7R1C226MT5

C5750X7R1E685KT5

C5750X7R1E106KT5

C5750X7R1E156MT5

C5750X7R1H225KT5

C5750X7R1H335KT5

C5750X7R1H475KT5

C5750X7R2A684KT5

C5750X7R2A105KT5

C5750X7R2A155KT5

C5750X7R2E334KT5

C5750X7R2E474KT5

C5750X7R2E684KT5

C5750X7R2E105KT5

C5750X7R2J154KT5

C5750X7R2J224KT5

X7R

16V

25V

22,000,000

± 20%

± 10%

± 20%

± 10%

2.80 ± 0.20

1.60 ± 0.30

2.00 ± 0.20

2.80 ± 0.20

1.60 ± 0.30

2.30 ± 0.20

2.80 ± 0.20

1.60 ± 0.30

2.30 ± 0.20

1.60 ± 0.30

2.30 ± 0.20

1.60 ± 0.30

2.30 ± 0.20

6,800,000

10,000,000

15,000,000

2,200,000

3,300,000

4,700,000

680,000

25V

50V

100V

250V

630V

1,000,000

1,500,000

330,000

470,000

680,000

1,000,000

150,000

220,000

TDK MLCC US Catalog

Page 186

Version B11

General

Specifications

C Series – Open Mode Design

No.

1

Item

Performance

Test or Inspection Method

External

Appearance

No defects which may affect

performance.

Inspect with magnifying glass (3×).

2

Insulation

Resistance

10,000MΩ or 500MΩ•μF min.,

whichever smaller. (As for the

Apply rated voltage for 60s. As for the rated voltage

630V DC, apply 500V DC.

capacitors of rated voltage 16V DC,

10,000 MΩ or 100MΩ•μF min.,)

Rated Voltage

RV ≤ 100V

Apply voltage

2.5 ×rated voltage

1.5 ×rated voltage

3

Voltage Proof

Capacitance

Withstand test voltage without

insulation breakdown or other damage.

RV > 100V

Above DC voltage shall be applied for 1 to 5s. Charge /

discharge current shall not exceed 50mA.

Measuring

Frequency

1kHz±10%

Rated

Capacitance

Measuring

voltage

4

Within the specified tolerance.

Class

C ≤ 10uF

1.0±0.2V_rms

Class 2

C > 10uF

120Hz±20%

0.5±0.2 V_rms

T.C. Rated Voltage (DC) D.F.

5

6

Dissipation

Factor

See No.4 in this table for measuring condition.

X7R RV = 25V& 50V

X8R

3% max.

5% max.

(Class 2)

RV ≤ 16V

Temperature

Characteristics

Capacitance Change (%)

Capacitance shall be measured by the steps shown in

the following table after thermal equilibrium is obtained

for each step.

No Voltage Applied

of Capacitance

(Class 2)

X7R: ± 15%

X8R: ± 15%

∆C be calculated ref. STEP 3 reading

Step

Temperature (ºC)

1

2

3

4

Reference temp. ± 2

Min. operating temp. ± 2

Reference temp. ± 2

Max. operating temp. ± 2

7

Robustness of

Terminations

No sign of termination coming off,

breakage of ceramic, or other abnormal

signs.

Reflow solder the capacitors on P.C. board (shown in

Appendix 1a or Appendix 1b) and apply a pushing

force of 5N for 10±1s.

Pushing force

P.C. board

Capacitor

8

Bending

No mechanical damage.

Reflow solder the capacitor on P.C. board (shown in

Appendix 2) and bend it for 1mm.

20

50

F

R230

1

45

Unit: mm

TDK MLCC US Catalog

Page 187

Version B11

General

Specifications

C Series – Open Mode Design

No.

9

Item

Performance

Test or Inspection Method

Solderability

New solder to cover over 75% of

termination.

Completely soak both terminations in solder at

235±5ºC for 2±0.5s.

Solder: H63A (JIS Z 3282)

25% may have pinholes or rough spots

but not concentrated in one spot.

Flux: Isopropyl alcohol (JIS K 8839)

Rosin (JIS K 5902) 25% solid solution.

Ceramic surface of “A sections” shall

not be exposed due to melting or

shifting of termination material.

A section

10

Resistance to solder heat

Completely soak both terminations in solder at

260±5ºC for 5±1s.

External

No cracks are allowed and terminations

Preheating condition

Temp.: 150±10ºC

Time : 1 to 2min.

appearance

shall be covered at least 60% with new

solder.

Capacitance

Change from the

Characteristics

value before test

Flux: Isopropyl alcohol (JIS K 8839)

Rosin (JIS K 5902) 25% solid solution.

X7R

Class 2

± 7.5%

X8R

Solder: H63A (JIS Z 3282)

D.F. (Class 2)

Meet the initial spec.

Leave the capacitor in ambient conditions for 6 to 24h

before measurement.

Insulation

Resistance

Voltage

Proof

No insulation breakdown or other

damage.

11

Vibration

Reflow solder the capacitor on P.C. board (shown in

Appendix 1a or Appendix 1b) before testing.

External

No mechanical damage.

Vibrate the capacitor with amplitude of 1.5mm P-P

sweeping the frequencies from 10Hz to 55Hz and back

to 10Hz after 1min.

appearance

Capacitance

Change from the

Characteristics

value before test

Repeat this for 2h each in 3 perpendicular directions.

X7R

Class 2

± 7.5%

X8R

D.F. (Class 2)

Meet the initial spec.

TDK MLCC US Catalog

Page 188

Version B11

General

Specifications

C Series – Open Mode Design

No.

12

Item

Performance

Test or Inspection Method

Temperature cycle

Reflow solder the capacitors on a P.C. board (shown in

Appendix 1a or Appendix 1b) before testing.

External

No mechanical damage.

Expose the capacitor in the conditions in step 1

through step 4, and repeat 5 times consecutively.

appearance

Capacitance

Change from the

value before test

Characteristics

Leave the capacitor in ambient conditions for 24±2h

before measurement.

X7R

Class 2

± 7.5%

Step

Temperature (ºC)

Time (min.)

30 ± 3

2 – 5

X8R

1

2

3

4

Min. operating temp. ±3

Reference Temp.

D.F. (Class 2)

Meet the initial spec.

Max. operating temp. ± 2

Reference Temp.

30 ± 2

2 - 5

Insulation

Resistance

Voltage

Proof

No insulation breakdown or other

damage.

13

Moisture Resistance (Steady State)

Reflow solder the capacitor on P.C. board (shown in

Appendix 1a or Appendix 1b) before testing.

External

No mechanical damage.

Leave at temperature 40±2ºC, 90 to 95%RH for 500

appearance

+24,0h.

Capacitance

Change from the

value before test

Characteristics

Leave the capacitor in ambient condition for 24±2h

before measurement.

X7R

Class 2

± 12.5%

X8R

D.F. (Class 2)

Characteristics

X7R: 200% of initial spec. max.

X8R: 200% of initial spec. max.

Insulation

1,000MΩ or 50MΩ•μF min., whichever

smaller. (As for the capacitors of rated

voltage 16V DC, 1,000 MΩ or 10MΩ•μF

min.,)

Resistance

TDK MLCC US Catalog

Page 189

Version B11

General

Specifications

C Series – Open Mode Design

No.

14

Item

Performance

Test or Inspection Method

Moisture Resistance

Reflow solder the capacitors on P.C. board (shown in

Appendix 1a or Appendix 1b) before testing.

External

No mechanical damage.

Apply the rated voltage at temperature 40±2ºC and 90

to 95%RH for 500 +24,0h.

appearance

Capacitance

Change from the

value before test

Characteristics

Charge/discharge current shall not exceed 50mA.

X7R

Class 2

Leave the capacitor in ambient conditions for 24±2h

before measurement.

± 12.5%

X8R

Voltage conditioning:

D.F. (Class 2)

Characteristics

Voltage treat the capacitors under testing temperature

and voltage for 1 hour.

X7R: 200% of initial spec. max.

X8R: 200% of initial spec. max.

Leave the capacitors in ambient condition for 24±2h

before measurement.

Insulation

500MΩ or 25MΩ•μF min., whichever

smaller. (As for the capacitors of rated

voltage 16V DC, 500 MΩ or 5MΩ•μF

min.,)

Resistance

Use this measurement for initial value.

15

Life

Reflow solder the capacitors on P.C. board (shown in

Appendix 1a or Appendix 1b) before testing.

External

No mechanical damage.

Apply rated voltage at maximum operating temperature

±2ºC for 1,000 +48, 0h. Some items may be tested at

higher voltage (1.2x, 1.5x or 2xRV).

appearance

Change from the

Characteristics

Capacitance

value before test

Charge/discharge current shall not exceed 50mA.

X7R

Class 2

± 15%

X8R

Leave the capacitor in ambient conditions for 24±2h

before measurement.

D.F. (Class 2)

Characteristics

X7R: 200% of initial spec. max.

X8R: 200% of initial spec. max.

Voltage conditioning:

Voltage treat the capacitors under testing temperature

and voltage for 1 hour.

Insulation

1,000MΩ or 50MΩ•μF min., whichever

smaller. (As for the capacitors of rated

voltage 16V DC, 1,000 MΩ or 10MΩ•μF

min.,)

Leave the capacitors in ambient condition for 24±2h

before measurement.

Resistance

Use this measurement for initial value.

*As for the initial measurement of capacitors (Class 2) on number 6, 10, 11, 12 and 13, leave capacitor at 150 -10, 0°C for

1 hour and measure the value after leaving capacitor for 24±2h in ambient condition.

TDK MLCC US Catalog

Page 190

Version B11

General

Specifications

C Series – Open Mode Design

Appendix - 1a

Appendix - 1b

P.C. Board for reliability test

Applied for C2012, C3216

Applied for C3225, C4532, C5750

c

100 mm

c

100 mm

Copper

Solder Resist

Slit

Solder Resist

Copper

Appendix - 2

P.C. Board for bending test

100 mm

b

a

Copper

Solder Resist

Material : Glass Epoxy ( As per JIS C6484 GE4 )

P.C. Board thickness: 1.6mm

Case Code

Dimensions (mm)

JIS

EIA

a

b

c

C2012

C3216

C3225

C4532

C5750

CC0805

CC1206

CC1210

CC1812

CC2220

1.2

2.2

3.5

4.5

4.0

5.0

7.0

8.0

1.65

2.0

2.9

3.7

5.6

Copper ( thickness 0.035mm )

Solder resist

TDK MLCC US Catalog

Page 191

Version B11

Soldering

Information

C Series – Open Mode Design

• Recommended Soldering Land Pattern

• Recommended Soldering Profile

Chip capacitor

Wave Soldering

Reflow Soldering

Solder land

Soldering

Natural

cooling

Soldering

Preheating

cooling

Peak

Temp

Peak

Temp

C

∆ T

∆T

A

B

Solder resist

0

Wave Soldering

Type

Unit: mm

C3216

Over 60 sec.

C2012

Peak Temp time

[CC0805]

1.0 - 1.3

1.0 - 1.2

0.8 - 1.1

[CC1206]

2.1 - 2.5

1.1 - 1.3

1.0 - 1.3

Symbol

Manual soldering

(Solder iron)

A

B

C

300

Reflow Soldering

C2012

Unit: mm

C3216

∆T

Type

[CC0805]

0.9 - 1.2

0.7 - 0.9

0.9 - 1.2

[CC1206]

2.0 - 2.4

Symbol

A

Preheating

3sec. (As short as possible)

0

B

C

1.0 - 1.2

1.1 - 1.6

Recommended soldering duration

Reflow Soldering

C3225

Unit: mm

C5750

Wave Soldering

Reflow Soldering

Temp./

Dura.

C4532

[CC1812]

3.1 - 3.7

1.2 - 1.4

2.4 - 3.2

Type

Peak temp

Duration

(sec.)

Peak temp

Duration

[CC1210]

2.0 - 2.4

1.0 - 1.2

1.9 - 2.5

[CC2220]

4.1 - 4.8

1.2 - 1.4

4.0 - 5.0

Symbol

Solder

(°C)

(sec.)

A

B

C

Sn-Pb

Solder

250 max.

3 max.

5 max.

230 max.

20 max.

Lead-Free

Solder

260 max.

10 max.

• Recommended Solder Amount

Recommended solder compositions

Sn-37Pb (Sn-Pb solder)

Higher tensile

force on the chip

capacitor may

Sn-3.0Ag-0.5Cu (Lead Free Solder)

Excessive

solder

Preheating Condition

cause cracking.

Soldering

Case Size - JIS (EIA)

C2012(CC0805), C3216(CC1206)

Temp. (ºC)

∆T ≤ 150

∆T ≤ 130

∆T ≤ 150

∆T ≤ 130

Wave

soldering

Maximum amount

Minimum amount

Adequate

solder

C2012(CC0805), C3216(CC1206)

Reflow

soldering

C3225(CC1210), C4532(CC1812),

C5750(CC2220)

Small solder fillet

may cause

C2012(CC0805), C3216(CC1206)

Manual

soldering

Insufficient

solder

contact failure or

failure to hold the

chip capacitor to

the P.C. board.

C3225(CC1210), C4532(CC1812),

C5750(CC2220)

TDK MLCC US Catalog

Page 192

Version B11

Packaging

Information

C Series – Open Mode Design

• Carrier Tape Configuration

Bulk

Chips

160mm min

160mm min.

Leader

Drawing direction

400mm min

• Peel Back Force (Top Tape)

• Carrier tape shall be flexible enough to be

wound around a minimum radius of 30mm with

components in tape.

• The missing of components shall be less than

0.1%

Direction & angle of pull

Top cover tape

0.05 – 0.7 N

Carrier tape

• Components shall not stick to the cover tape.

• The cover tape shall not protrude beyond the

edges of the carrier tape and shall not cover the

sprocket holes.

0~15°

• Chip Quantity Per Reel and Structure of Reel (Paper & Plastic)

Paper Carrier Tape & Reel

Plastic Carrier Tape & Reel

Top cover tape

Pitch hole

Plastic carrier tape

Paper carrier tape

Bottom cover tape

Case Code

Chip quantity (pcs.)

Chip

Taping Material

Thickness

0.85 mm

1.25 mm

1.15 mm

1.30 mm

1.60 mm

1.15 mm

1.60 mm

2.00 mm

2.30 mm

2.50 mm

1.60 mm

2.00 mm

2.30 mm

1.60 mm

2.00 mm

2.30 mm

2.80 mm

JIS

EIA

φ178mm (7”) reel φ330mm (13”) reel

Paper/Plastic

Plastic

4,000

10,000

2,000

C2012

CC0805

10,000

2,000

C3216

C3225

CC1206

CC1210

Plastic

8,000

10,000

2,000

8,000

Plastic

1,000

5,000

3,000

1,000

C4532

C5750

CC1812

CC2220

Plastic

500

1,000

3,000

2,000

500

TDK MLCC US Catalog

Page 193

Version B11

Additional

Information

C Series – Open Mode Design

• Shape & Dimensions

• Environmental Information

TDK Corporation established internal product environmental

assurance standards that include the six hazardous

substances banned by the EU RoHS Directive¹enforced on

July 1, 2006 along with additional substances independently

banned by TDK and has successfully completed making

general purpose electronic components conform to the

RoHS Directive².

Terminal electrode

W

B

L

G

B

T

1.

Abbreviation for Restriction on Hazardous

Substances, which refers to the regulation EU

Directive 2002/95/EC on hazardous substances by

the European Union (EU) effective from July 1, 2006.

The Directive bans the use of six specific hazardous

substances in electric and electronic devices and

products handled within the EU. The six substances

are lead, mercury, cadmium, hexavalent chromium,

PBB (polybrominated biphenyls), and PBDE

(polybrominated diphenyl ethers).

Internal electrode

Ceramic dielectric

Case Code

JIS EIA

Dimensions (mm)

L

W

T

B

G

0.85

1.25

1.15

1.30

1.60

1.15

1.60

2.00

2.30

2.50

1.60

2.00

2.30

1.60

2.00

2.30

2.80

C2012 CC0805

2.00

1.20

0.20 min. 0.50 min.

2.

This means that, in conformity with the EU Directive

2002/95/EC, lead, cadmium, mercury, hexavalent

chromium, and specific bromine-based flame

retardants, PBB and PBDE, have not been used,

except for exempted applications.

C3216 CC1206

3.20

1.60

2.50

0.20 min. 1.00 min.

0.20 min.

1.00 min.

For REACH (SVHC : 15 substances according to ECHA /

October 2008) : All TDK MLCC do not contain these

15 substances.

For European Directive 2000/53/CE and 2005/673/CE :

Cadmium, Hexavalent Chromium, Mercury, Lead are

not contained in all TDK MLCC.

For European Directive 2003/11/CE : Pentabromodiphenyl-

ether, Octabromodiphenyl-ether are not contained in

all TDK MLCC.

C3225 CC1210

0.30 min.

C4532 CC1812

C5750 CC2220

4.50

5.70

3.20

5.00

0.20 min. 2.00 min.

• Inside Structure & Material System

3

4

5

2

1

No.

NAME

MATERIAL

Class 1

CaZrO₃

Class 2

(1)

(2)

(3)

(4)

(5)

Ceramic Dielectric

Internal Electrode

BaTiO₃

Nickel (Ni)

Copper (Cu)

Nickel (Ni)

Tin (Sn)

Termination

TDK MLCC US Catalog

Page 194

Version B11


型号：	C2012X7R2A103KT5
厂家：	TDK ELECTRONICS
描述：	Ceramic Capacitor, Multilayer, Ceramic, 100V, 10% -Tol, X7R, 15% TC, 0.01uF, Surface Mount, 0805, CHIP, ROHS COMPLIANT 电容器
文件：	总16页 (文件大小：1087K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

C2012X7R2A103KT5 [TDK]

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