C3216X7R1C475M085AB_17 [TDK]
Multilayer Ceramic Chip Capacitors;型号: | C3216X7R1C475M085AB_17 |
厂家: | TDK ELECTRONICS |
描述: | Multilayer Ceramic Chip Capacitors |
文件: | 总3页 (文件大小:236K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
1 of 3
Creation Date : May 25, 2017 (GMT)
Multilayer Ceramic Chip Capacitors
C3216X7R1C475K085AB
TDK item description C3216X7R1C475KT****
Commercial Grade
Applications
Please refer to Part No. CGA5L3X7R1C475K160AB for Automotive use.
General General (Up to 50V)
C3216 [EIA 1206]
Production (Not Recommended for New Design)
Feature
Series
Status
Size
3.20mm ±0.20mm
Length(L)
Width(W)
1.60mm ±0.20mm
0.85mm ±0.15mm
0.20mm Min.
Thickness(T)
Terminal Width(B)
Terminal Spacing(G)
1.00mm Min.
2.10mm to 2.50mm(Flow Soldering)
2.00mm to 2.40mm(Reflow Soldering)
Recommended Land Pattern (PA)
Recommended Land Pattern (PB)
Recommended Land Pattern (PC)
1.10mm to 1.30mm(Flow Soldering)
1.00mm to 1.20mm(Reflow Soldering)
1.00mm to 1.30mm(Flow Soldering)
1.10mm to 1.60mm(Reflow Soldering)
Electrical Characteristics
Capacitance
4.7μF ±10%
16VDC
Rated Voltage
Temperature Characteristic
Dissipation Factor (Max.)
Insulation Resistance (Min.)
X7R(±15%)
5%
21MΩ
Other
Wave (Flow)
Reflow
Soldering Method
AEC-Q200
No
Packing
Punched (Paper)Taping [180mm Reel]
4000pcs
Package Quantity
! Images are for reference only and show exemplary products.
! This PDF document was created based on the data listed on the TDK Corporation website.
! All specifications are subject to change without notice.
Copyright(c) TDK Corporation. All rights reserved.
2 of 3
Creation Date : May 25, 2017 (GMT)
Multilayer Ceramic Chip Capacitors
C3216X7R1C475K085AB
Characteristic Graphs(This is reference data, and does not guarantee the products characteristics.)
Impedance
ESR
C3216X7R1C475K085AB
C3216X7R1C475K085AB
Capacitance
DC Bias Characteristic
C3216X7R1C475K085AB
C3216X7R1C475K085AB
Temperature Characteristic
Ripple Temperature Rising
C3216X7R1C475K085AB(100kHz) C3216X7R1C475K085AB(500kHz) C3216X7R1C475K085AB(1MHz)
C3216X7R1C475K085AB(DC Bias =
8V )
C3216X7R1C475K085AB(No Bias)
! Images are for reference only and show exemplary products.
! This PDF document was created based on the data listed on the TDK Corporation website.
! All specifications are subject to change without notice.
Copyright(c) TDK Corporation. All rights reserved.
3 of 3
Creation Date : May 25, 2017 (GMT)
Multilayer Ceramic Chip Capacitors
C3216X7R1C475K085AB
Associated Images
Land Pattern (Terminal Connection)
! Images are for reference only and show exemplary products.
! This PDF document was created based on the data listed on the TDK Corporation website.
! All specifications are subject to change without notice.
Copyright(c) TDK Corporation. All rights reserved.
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