C3225C0G3A562J200AC [TDK]

Multilayer Ceramic Chip Capacitors;
C3225C0G3A562J200AC
型号: C3225C0G3A562J200AC
厂家: TDK ELECTRONICS    TDK ELECTRONICS
描述:

Multilayer Ceramic Chip Capacitors

文件: 总3页 (文件大小:103K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
1 of 3  
Creation Date : January 17, 2017 (GMT)  
Multilayer Ceramic Chip Capacitors  
C3225C0G3A122J200AC  
TDK item description C3225C0G3A122JT****  
Commercial Grade  
Applications  
Please refer to Part No. CGA6M1C0G3A122J200AC for Automotive use.  
Feature  
Series  
Status  
High High Voltage (1000V and over)  
C3225 [EIA 1210]  
Production (Not Recommended for New Design)  
Size  
Length(L)  
3.20mm ±0.40mm  
Width(W)  
2.50mm ±0.30mm  
2.00mm ±0.20mm  
0.20mm Min.  
Thickness(T)  
Terminal Width(B)  
Terminal Spacing(G)  
Recommended Land Pattern (PA)  
Recommended Land Pattern (PB)  
Recommended Land Pattern (PC)  
Recommended Slit Pattern (SD)  
2.00mm to 2.40mm  
1.00mm to 1.20mm  
1.90mm to 2.50mm  
Electrical Characteristics  
Capacitance  
1.2nF ±5%  
1kVDC  
Rated Voltage  
Temperature Characteristic  
Q (Min.)  
C0G(0±30ppm/°C)  
1000  
Insulation Resistance (Min.)  
10000MΩ  
Other  
Soldering Method  
AEC-Q200  
Reflow  
No  
Packing  
Blister (Plastic)Taping [180mm Reel]  
1000pcs  
Package Quantity  
! Images are for reference only and show exemplary products.  
! This PDF document was created based on the data listed on the TDK Corporation website.  
! All specifications are subject to change without notice.  
Copyright(c) TDK Corporation. All rights reserved.  
2 of 3  
Creation Date : January 17, 2017 (GMT)  
Multilayer Ceramic Chip Capacitors  
C3225C0G3A122J200AC  
Characteristic Graphs(This is reference data, and does not guarantee the products characteristics.)  
! Images are for reference only and show exemplary products.  
! This PDF document was created based on the data listed on the TDK Corporation website.  
! All specifications are subject to change without notice.  
Copyright(c) TDK Corporation. All rights reserved.  
3 of 3  
Creation Date : January 17, 2017 (GMT)  
Multilayer Ceramic Chip Capacitors  
C3225C0G3A122J200AC  
Associated Images  
Land Pattern (Terminal Connection)  
! Images are for reference only and show exemplary products.  
! This PDF document was created based on the data listed on the TDK Corporation website.  
! All specifications are subject to change without notice.  
Copyright(c) TDK Corporation. All rights reserved.  

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