C3225X5R1H106K250AB_17 [TDK]
Multilayer Ceramic Chip Capacitors;
| 型号： | C3225X5R1H106K250AB_17 |
| 厂家： | 
TDK ELECTRONICS |
| 描述： | Multilayer Ceramic Chip Capacitors |
| 文件： | 总3页 (文件大小：235K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
1 of 3
Creation Date : June 02, 2017 (GMT)
Multilayer Ceramic Chip Capacitors
C3225X5R1H106K250AB
TDK item description C3225X5R1H106KT****
Applications
Commercial Grade
Feature
Series
Status
General General (Up to 50V)
C3225 [EIA 1210]
Production
Size
3.20mm ±0.40mm
Length(L)
Width(W)
2.50mm ±0.30mm
2.50mm ±0.30mm
0.20mm Min.
Thickness(T)
Terminal Width(B)
Terminal Spacing(G)
Recommended Land Pattern (PA)
Recommended Land Pattern (PB)
Recommended Land Pattern (PC)
2.00mm to 2.40mm
1.00mm to 1.20mm
1.90mm to 2.50mm
Electrical Characteristics
Capacitance
10μF ±10%
50VDC
Rated Voltage
Temperature Characteristic
Dissipation Factor (Max.)
Insulation Resistance (Min.)
X5R(±15%)
5%
50MΩ
Other
Soldering Method
AEC-Q200
Reflow
No
Packing
Blister (Plastic)Taping [180mm Reel]
1000pcs
Package Quantity
! Images are for reference only and show exemplary products.
! This PDF document was created based on the data listed on the TDK Corporation website.
! All specifications are subject to change without notice.
Copyright(c) TDK Corporation. All rights reserved.
2 of 3
Creation Date : June 02, 2017 (GMT)
Multilayer Ceramic Chip Capacitors
C3225X5R1H106K250AB
Characteristic Graphs(This is reference data, and does not guarantee the products characteristics.)
Impedance
ESR
C3225X5R1H106K250AB
C3225X5R1H106K250AB
Capacitance
DC Bias Characteristic
C3225X5R1H106K250AB
C3225X5R1H106K250AB
Temperature Characteristic
Ripple Temperature Rising
C3225X5R1H106K250AB(100kHz) C3225X5R1H106K250AB(500kHz) C3225X5R1H106K250AB(1MHz)
C3225X5R1H106K250AB(DC Bias =
25V )
C3225X5R1H106K250AB(No Bias)
! Images are for reference only and show exemplary products.
! This PDF document was created based on the data listed on the TDK Corporation website.
! All specifications are subject to change without notice.
Copyright(c) TDK Corporation. All rights reserved.
3 of 3
Creation Date : June 02, 2017 (GMT)
Multilayer Ceramic Chip Capacitors
C3225X5R1H106K250AB
Associated Images
Land Pattern (Terminal Connection)
! Images are for reference only and show exemplary products.
! This PDF document was created based on the data listed on the TDK Corporation website.
! All specifications are subject to change without notice.
Copyright(c) TDK Corporation. All rights reserved.
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