C5750NP02A154J230KA [TDK]
CAP CER 0.15UF 100V NP0 2220;
| 型号： | C5750NP02A154J230KA |
| 厂家： | 
TDK ELECTRONICS |
| 描述： | CAP CER 0.15UF 100V NP0 2220 |
| 文件： | 总37页 (文件大小：1684K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
GC110H0002
SPEC. No. C-150C-e
DELIVERY SPECIFICATION
D A T E : Aug, 2020
To
Non-Controlled Copy
Upon the acceptance of this spec. previous
spec. (C2011-0454) shall be abolished.
CUSTOMER’S PRODUCT NAME
TDK PRODUCT NAME
Multilayer Ceramic Chip Capacitors
(Guaranteed at High Temperature)
Bulk and tape packaging【RoHS compliant】
C1005,C1608,C2012,C3216,C3225,C4532,C5750 Type
NP0,X8R,X8L Characteristics
Please return this specification to TDK representatives with your signature.
If orders are placed without returned specification, please allow us to judge that specification is
accepted by your side.
RECEIPT CONFIRMATION
DATE:
YEAR
MONTH
DAY
TDK Corporation
Sales
Engineering
Electronic Components Business Company
Ceramic Capacitors Business Group
Electronic Components
Sales & Marketing Group
APPROVED
Person in charge
APPROVED
CHECKED
Person in charge
GC110H0002
■CATALOG NUMBER CONSTRUCTION
C
3225
X8L
1C 226
M 250 A
C
(1)
(2)
(3)
(4)
(5)
(6)
(7)
(8)
(9)
(1) Series
(2) Dimensions L x W (mm)
(6) Capacitance tolerance
Terminal
Code
Tolerance
±0.25pF
±0.50pF
±5%
±10%
±20%
Code
EIA
Length Width
width
0.10
0.20
0.20
0.20
0.20
0.20
0.20
C
D
J
K
M
C1005
C1608
C2012
C3216
C3225
C4532
C5750
CC0402
CC0603
CC0805
CC1206
CC1210
CC1812
CC2220
1.00
1.60
2.00
3.20
3.20
4.50
5.70
0.50
0.80
1.25
1.60
2.50
3.20
5.00
(7) Thickness
Code
050
060
080
085
115
125
160
200
230
250
280
Thickness
0.50mm
0.60mm
0.80mm
0.85mm
1.15mm
1.25mm
1.60mm
2.00mm
2.30mm
2.50mm
2.80mm
3.20mm
(3) Temperature characteristics
Temperature
characteristics
NP0
X8R
X8L
Temperature coefficient
or capacitance change
0±30 ppm/℃
±15%
±15%,-40%
Temperature
range
-55 to +150℃
-55 to +150℃
-55 to +150℃
(4) Rated voltage (DC)
Code
0G
0J
1A
1C
1E
1H
2A
2E
2W
2J
Voltage (DC)
4V
6.3V
10V
16V
25V
50V
100V
250V
320
(8) Packaging style
Code
A
B
K
Style
178mm reel, 4mm pitch
178mm reel, 2mm pitch
178mm reel, 8mm pitch
450V
630V
(5) Nominal capacitance (pF)
(9) Special reserved code
Code
A,B,C,N
Description
TDK internal code
The capacitance is expressed in three digit codes and in
units of pico Farads (pF). The first and second digits
identify the first and second significant figures of the
capacitance. The third digit identifies the multiplier. R
designates a decimal point.
(Example) 0R5 = 0.5pF
101 = 100pF
225 = 2,200,000pF = 2.2μF
— 1 —
GC110H0002
SCOPE
This delivery specification shall be applied to chip type multilayer ceramic capacitors to be delivered to
.
PRODUCTIONPLACES
Production places defined in this specification shall be TDK Corporation, TDK(Suzhou)Co.,Ltd
and TDK Components U.S.A.,Inc.
PRODUCT NAME
The name of the product to be defined in this specifications shall be C◇◇◇◇○○○△△□□□×.
REFERENCE STANDARD
JIS C 5101－1：2010
Fixed capacitors for use in electronic equipment-Part 1: Generic specification
C 5101－21：2014 Fixed capacitors for use in electronic equipment-Part 21 : Sectional specification
: Fixed surface mount multilayer capacitors of ceramic dielectric,Class1
C 5101－22：2014 Fixed capacitors for use in electronic equipment-Part 22 : Sectional specification
: Fixed surface mount multilayer capacitors of ceramic dielectric,Class2
C 0806－3：2014
Packaging of components for automatic handling - Part 3: Packaging of
surface mount components on continuous tapes
JEITA RCR－2335 C 2014 Safety application guide for fixed ceramic capacitors for use in electronic
equipment
CONTENTS
1. CODE CONSTRUCTION
2. COMBINATION OF RATED CAPACITANCE AND TOLERANCE
3.
4.
5.
OPERATING TEMPERATURE RANGE
STORING CONDITION AND TERM
P.C. BOARD
6.
7.
INDUSTRIAL WASTE DISPOSAL
PERFORMANCE
8.
9.
INSIDE STRUCTURE AND MATERIAL
PACKAGING
10.
11.
12.
13.
RECOMMENDATION
SOLDERING CONDITION
CAUTION
TAPE PACKAGING SPECIFICATION
<EXPLANATORY NOTE>
When the mistrust in the spec arises, this specification is given priority. And it will be confirmed by written
spec change after conference of both posts involved.
This specification warrants the quality of the ceramic chip capacitor. Capacitors should be evaluated or
confirmed a state of mounted on your product.
If the use of the capacitors goes beyond the bounds of this specification, we can not afford to guarantee.
Division
Date
SPEC. No.
C-150C-e
Aug, 2020
Ceramic Capacitors Business Group
— 2 —
GC110H0002
1. CODE CONSTRUCTION
(Example)
C1005
(1)
X8R
(2)
1E
(3)
103
(4)
K
(5)
T
(6)
ΟΟΟΟ
(7)
(1) Case size
Terminal electrode
B
L
W
G
B
T
Internal electrode
Ceramic dielectric
Dimensions (Unit : mm)
T
Case size
[EIA style]
L
W
B
G
1.00±0.05
1.00±0.10
1.60±0.10
1.60±0.15
1.60±0.20
0.50±0.05
0.50±0.10
0.80±0.10
0.80±0.15
0.80±0.20
0.50±0.05
0.50±0.10
0.80±0.10
0.80±0.15
0.80±0.20
0.60±0.15
0.85±0.15
1.25±0.20
C1005
[CC0402]
0.10 min.
0.30 min.
C1608
[CC0603]
0.20 min.
0.20 min.
0.30 min.
2.00±0.20
1.25±0.20
C2012
[CC0805]
0.50 min.
1.00 min.
+0.25
2.00
+0.25
1.25
+0.25
1.25
- 0.15
- 0.15
- 0.15
0.60±0.15
0.85±0.15
1.15±0.15
1.60±0.20
3.20±0.20
1.60±0.20
C3216
[CC1206]
0.20 min.
0.20 min.
+0.30
3.20
+0.30
1.60
+0.30
1.60
- 0.10
- 0.10
- 0.10
1.25±0.20
1.60±0.20
2.00±0.20
2.30±0.20
2.50±0.30
2.00±0.20
2.30±0.20
3.20±0.30
2.30±0.20
2.80±0.30
C3225
[CC1210]
――
3.20±0.40
2.50±0.30
C4532
[CC1812]
0.20 min.
0.20 min.
――
――
4.50±0.40
5.70±0.40
3.20±0.40
5.00±0.40
C5750
[CC2220]
* As for each item, please refer to detail page on TDK web.
— 3 —
GC110H0002
(2) Temperature Characteristics
* Details are shown in table 1 No.6 and No.7 at 7.PERFORMANCE
(3) Rated Voltage
Symbol Rated Voltage
Symbol Rated Voltage
2 J
2 W
2 E
2 A
1 H
DC 630 V
DC 450 V
DC 250 V
DC 100 V
DC 50 V
1 E
1 C
1 A
0 J
DC 25 V
DC 16 V
DC 10 V
DC 6.3 V
DC 4 V
0 G
(Example)
Symbol
(4) Rated Capacitance
Rated
Capacitance
Stated in three digits and in units of pico farads (pF).
The first and Second digits identify the first and second
significant figures of the capacitance, the third digit
identifies the multiplier.
103
10,000 pF
(5) Capacitance tolerance
Symbol
Tolerance
Capacitance
C
D
J
±
0.25 pF
0.5 pF
5 %
10pF and under
±
±
K
M
± 10 %
± 20 %
Over 10pF
(6) Packaging
* C1005 type is applicable to tape packaging only.
Symbol
Packaging
Bulk
B
T
Taping
(7) TDK internal code
— 4 —
GC110H0002
2. COMBINATION OF RATED CAPACITANCE AND TOLERANCE
Temperature
Characteristics
Class
Capacitance tolerance
C (± 0.25pF)
Rated capacitance
1, 2, 3, 4, 5
10pF and under
D (± 0.5pF)
J (± 5 %)
6, 7, 8, 9, 10
1
NP0
E – 6 series
E – 12 series
Over 10pF
X8R
X8L
2
K (± 10 %) M (± 20 %)
E – 6 series
Capacitance Step in E series
Capacitance Step
2.2 3.3
1.0 1.2 1.5 1.8 2.2 2.7 3.3 3.9 4.7 5.6 6.8 8.2
E series
1.0
1.5
4.7
6.8
E- 6
E-12
3. OPERATING TEMPERATURE RANGE
Min. operating
Temperature
Max. operating
Temperature
Reference
Temperature
-55°C
25°C
150°C
4. STORING CONDITION AND TERM
Storing temperature
Storing humidity
Storing term
Within 6 months
upon receipt.
5~40°C
20~70%RH
5. P.C. BOARD
When mounting on an aluminum substrate, large case sizes such as C3225[CC1210] and larger
are more likely to be affected by heat stress from the substrate.
Please inquire separate specification for the large case sizes when mounted on the substrate.
6. INDUSTRIAL WASTE DISPOSAL
Dispose this product as industrial waste in accordance with the Industrial Waste Law.
— 5 —
GC110H0002
7. PERFORMANCE
table 1
Performance
No.
1
Item
Test or inspection method
External Appearance No defects which may affect
performance.
Inspect with magnifying glass (3×)
Measuring voltage：Rated voltage
(As for the capacitors of rated voltage (As for the capacitor of rated voltage
10,000MΩ or 500MΩ·μF min.
2
3
Insulation Resistance
16V DC and lower, 100MΩ·μF min.)
630V DC, apply 500V DC.)
Voltage application time：60s.
Voltage Proof
Withstand test voltage without
insulation breakdown or other
damage.
Rated
voltage(RV)
Class
Apply voltage
3 × rated voltage
RV≦100V
1
2
100V＜RV≦500V 1.5×ratedvoltage
500V＜RV
RV≦100V
1.3×ratedvoltage
2.5×ratedvoltage
Voltage application time : 1s.
Charge / discharge current : 50mA or lower
4
5
Capacitance
Within the specified tolerance.
Please contact with our sales representative.
Q
Please refer to detail page on
TDK web.
See No.4 in this table for measuring
condition.
(Class1)
Dissipation Factor
(Class2)
6
Temperature
Characteristics
of Capacitance
(Class1)
Temperature coefficient shall be calculated
based on values at 25°C and 85°C
temperature.
Temperature Coefficient
T.C.
(ppm/°C)
NP0
0 ± 30
Measuring temperature below 25°C shall be
-10°C and -25°C.
Capacitance Within ± 0.2% or
drift
± 0.05pF,
whichever larger.
Capacitance shall be measured by the
steps shown in the following table after
thermal equilibrium is obtained for each
step.
7
Temperature
Characteristics
of Capacitance
(Class2)
Capacitance Change (%)
No voltage applied
∆C be calculated ref. STEP3 reading
X8R : ±15
Step
Temperature(°C)
25 ± 2
+15
- 40
X8L :
1
2
3
4
-55 ± 2
25 ± 2
150 ± 2
As for measuring voltage, please contact
with our sales representative.
— 6 —
GC110H0002
(continued)
No.
Item
Performance
Test or inspection method
Reflow solder the capacitors on a
P.C.Board shown in Appendix2.
Apply a pushing force gradually at the
center of a specimen in a horizontal
direction of P.C.board.
8
Robustness of
No sign of termination coming off,
breakage of ceramic, or other
abnormal signs.
Terminations
Pushing force : 5N
(2N is applied for C1005 type.)
Holding time : 10±1s
Pushing force
P.C.Board
Capacitor
9
Bending
No mechanical damage.
Reflow solder the capacitors on a
P.C.Board shown in Appendix1 and bend
it for 1mm.
20
50
F
R230
1
(Unit : mm)
45
45
Solder :
Flux :
Sn-3.0Ag-0.5Cu
10 Solderability
New solder to cover over 75% of
termination.
Isopropyl alcohol (JIS K
8839) Rosin (JIS K 5902)
25% solid solution.
25% may have pin holes or rough
spots but not concentrated in one
spot.
Solder temp. : 245±5°C
Dwell time : 3±0.3s.
Solder
Ceramic surface of Asections shall
not be exposed due to melting or
shifting of termination material.
position :
Until both terminations are
completely soaked.
A section
— 7 —
GC110H0002
(continued)
No.
Item
Performance
Test or inspection method
Solder :
Flux :
Sn-3.0Ag-0.5Cu
11 Resistance External
No cracks are allowed and
to solder
heat
appearance terminations shall be covered at
Isopropyl alcohol (JIS K
8839) Rosin (JIS K 5902)
25% solid solution.
least 60% with new solder.
Capacitance
Solder temp. : 260±5°C
Change from the
Characteristics
value before test
Dwell time :
10±1s.
Capacitance drift
within ±2.5% or
±0.25pF,
whichever larger.
Class1 NP0
Solder
position :
Until both terminations
are completely soaked.
X8R
X8L
Class2
± 7.5 %
Pre-heating : Temp. ― 110~140°C
Time ― 30～60s.
Q
Meet the initial spec.
(Class1)
Leave the capacitors in ambient
condition for
Class 1 : 6~24h
D.F.
Meet the initial spec.
Meet the initial spec.
(Class2)
Class 2 : 24±2h before measurement.
Insulation
Resistance
Voltage
No insulation breakdown or other
damage.
proof
12 Vibration
External
No mechanical damage.
Frequency : 10~55~10Hz
Reciprocating sweep time : 1 min.
Amplitude : 1.5mm
appearance
Capacitance
Change from the
Characteristics
Repeat this for 2h each in 3 perpendicular
directions(Total 6h).
value before test
±2.5% or ±0.25pF,
Class1 NP0
whichever larger.
Reflow solder the capacitors on a
P.C.Board shown in Appendix2 before
testing.
X8R
X8L
Class2
± 7.5 %
Q
Meet the initial spec.
Meet the initial spec.
(Class1)
D.F.
(Class2)
— 8 —
GC110H0002
(continued)
No.
Item
Performance
Test or inspection method
Expose the capacitors in the condition
step1 through step 4 listed in the
following table.
13 Temperature External
No mechanical damage.
cycle
appearance
Capacitance
Temp. cycle : 5 cycles
Change from the
value before test
Characteristics
Class1 NP0
Temperature(°C) Time (min.)
Step
Please contact
with our sales
representative.
-55 ± 3
Ambient Temp.
150 ± 2
1
2
3
4
30 ± 3
2 ~ 5
X8R
Class2
X8L
30 ± 2
2 ~ 5
Q
Meet the initial spec.
Meet the initial spec.
Meet the initial spec.
Ambient Temp.
(Class1)
Leave the capacitors in ambient
condition for
Class 1 : 6~24h
D.F.
(Class2)
Class 2 : 24±2h before measurement.
Insulation
Resistance
Reflow solder the capacitors on a
P.C.Board shown in Appendix2 before
testing.
Voltage
No insulation breakdown or other
damage.
proof
14 Moisture
Resistance
(Steady
No mechanical damage.
Test temp. : 40±2°C
External
appearance
Test humidity : 90~95%RH
Test time : 500 +24,0h
Capacitance
Change from the
Characteristics
State)
value before test
Leave the capacitors in ambient
condition for
Class 1 : 6~24h
Class1 NP0
Please contact
with our sales
representative.
X8R
Class2
Class 2 : 24±2h before measurement.
X8L
Q
Reflow solder the capacitors on a
P.C.Board shown in Appendix2 before
testing.
Capacitance
Q
(Class1)
30pF and over
350 min.
10pF and over
under 30pF
275+5/2×C min.
200+10×C min.
Under 10pF
C : Rated capacitance (pF)
D.F.
200% of initial spec. max.
(Class2)
1,000MΩ or 50MΩ·μF min.
whichever smaller.
Insulation
Resistance
(As for the capacitors of rated voltage
16V DC and lower, 10MΩ·μF min.)
— 9 —
GC110H0002
(continued)
No.
Item
External
Performance
Test or inspection method
Test temp. : 40±2°C
Test humidity : 90~95%RH
Applied voltage : Rated voltage
Test time : 500 +24,0h
15 Moisture
No mechanical damage.
appearance
Resistance
Capacitance
Change from the
value before test
Characteristics
Class1 NP0
Charge/discharge current : 50mA or
lower
Leave the capacitors in ambient
condition for
Class 1 : 6~24h
Class 2 : 24±2h before measurement.
Please contact
with our sales
representative.
X8R
Class2
X8L
Q
Reflow solder the capacitors on a
P.C.Board shown in Appendix2 before
testing.
Capacitance
30pF and over
Under 30pF
Q
(Class1)
200 min.
100+10/3×C min.
Initial value setting (only for class 2)
Voltage conditioning 《After voltage
treat the capacitors under testing
temperature and voltage for 1 hour,》
leave the capacitors in ambient
condition for 24±2h before
C : Rated capacitance (pF)
D.F.
(Class2)
200% of initial spec. max.
500MΩ or 25MΩ·μF min. whichever
smaller.
Insulation
measurement.
Use this measurement for initial value.
Resistance
(As for the capacitors of rated voltage
16V DC and lower, 5MΩ·μF min.)
Test temp. : 150±2°C
16 Life
External
No mechanical damage.
Applied voltage : Please contact
with our sales representative.
appearance
Test time : 1,000 +48,0h
Capacitance
Change from the
Characteristics
Charge/discharge current : 50mA or
lower
value before test
Leave the capacitors in ambient
condition for
Class 1 : 6~24h
Class1 NP0
Please contact
with our sales
representative.
X8R
Class2
X8L
Class 2 : 24±2h before measurement.
Q
Reflow solder the capacitors on a
P.C.Board shown in Appendix2 before
testing.
Capacitance
Q
(Class1)
30pF and over
350 min.
10pF and over
under 30pF
275+5/2×C min.
200+10×C min.
Initial value setting (only for class 2)
Voltage conditioning 《After voltage
treat the capacitors under testing
temperature and voltage for 1 hour,》
leave the capacitors in ambient
condition for 24±2h before
Under 10pF
C : Rated capacitance (pF)
D.F.
200% of initial spec. max.
(Class2)
measurement.
Use this measurement for initial value.
1,000MΩ or 50MΩ·μF min.
whichever smaller.
Insulation
Resistance
(As for the capacitors of rated voltage
16V DC and lower, 10MΩ·μF min.)
*As for the initial measurement of capacitors (Class2) on number 7,11,12,13 and 14, leave capacitors at
150 0,-10°C for 1 hour and measure the value after leaving capacitors for 24 ± 2h in ambient condition.
— 10 —
GC110H0002
Appendix1
P.C.Board for bending test
(C1005)
(C1608,C2012,C3216,C3225,C4532,C5750)
100
b
100
b
40
40
a
a
Solder resist
Solder resist
1.0
1.0
c
c
Copper
Copper
Appendix2
P.C. Board for reliability test
100
c
a
b
40
Copper
Solder resist
*Slit
* It is recommended to provide a slit on P.C.Board for C3225,C4532 and C5750.
（Unit：mm）
Symbol
a
b
c
Case size
C1005 [CC0402]
C1608 [CC0603]
C2012 [CC0805]
C3216 [CC1206]
C3225 [CC1210]
C4532 [CC1812]
C5750 [CC2220]
0.4
1.0
1.2
2.2
2.2
3.5
4.5
1.5
3.0
4.0
5.0
5.0
7.0
8.0
0.5
1.2
1.65
2.0
2.9
3.7
5.6
1. Material : Glass Epoxy(As per JIS C6484 GE4)
2. Thickness : Appendix 1 ― 0.8mm (C1005)
― 1.6mm (C1608,C2012,C3216,C3225,C4532,C5750)
: Appendix 2 ― 1.6mm
Copper(Thickness:0.035mm)
Solder resist
— 11 —
GC110H0002
8. INSIDE STRUCTURE AND MATERIAL
3
4
5
2
1
MATERIAL
No.
NAME
Class1
Class2
BaTiO3
1
2
3
4
5
Dielectric
Electrode
CaZrO3
Nickel (Ni)
Copper (Cu)
Nickel (Ni)
Tin (Sn)
Termination
— 12 —
GC110H0002
9. PACKAGING
Packaging shall be done to protect the components from the damage during transportation and storing, and a
label which has the following information shall be attached.
9.1 Each plastic bag for bulk packaging contains 1000pcs. And the minimum quantity for
Bulk packaging is 1000pcs.
9.2 Tape packaging is as per 13. TAPE PACKAGING SPECIFICATION.
*C1005[CC0402] type is applicable to tape packaging only.
1) Inspection No.*
2) TDK P/N
3) Customer's P/N
4) Quantity
*Composition of Inspection No.
Example
F
0
A
– 23
(d)
–
001
(e)
(a) (b) (c)
(a) Line code
(b) Last digit of the year
(c) Month and A for January and B for February and so on. (Skip I)
(d) Inspection Date of the month.
(e) Serial No. of the day
*Composition of new Inspection No.
(Implemented on and after May 1, 2019 in sequence)
Example
I
F
0
E
2 3 A 0 0 1
(a) (b) (c) (d) (e) (f) (g)
(a) Prefix
(b) Line code
(c) Last digit of the year
(d) Month and A for January and B for February and so on. (Skip I)
(e) Inspection Date of the month.
(f) Serial No. of the day(00 ~ ZZ)
(g) Suffix(00 ~ ZZ)
* It was shifted to the new inspection No. on and after May 2019, but the implementation timing may be
different depending on shipment bases. Until the shift is completed, either current or new composition
of inspection No. will be applied.
10. RECOMMENDATION
As for C3225[CC1210] and larger, It is recommended to provide a slit (about 1mm width)
in the board under the components to improve washing Flux. And please make sure to dry
detergent up completely before.
11. SOLDERING CONDITION
As for C1005[CC0402], C3225[CC1210] and larger, reflow soldering only.
For other case sizes than the above, reflow soldering is recommended.
— 13 —
GC110H0002
12. CAUTION
No.
Process
Condition
1-1. Storage, Use
1
Operating
The capacitors must be stored in an ambient temperature of 5 to 40°C with a
relative humidity of 20 to 70%RH. JIS C 60721-3-1 Class 1K2 should be followed for
the other climatic conditions.
Condition
(Storage, Use,
Transportation)
1) High temperature and humidity environment may affect a capacitor's solder ability
because it accelerates terminal oxidization. They also deteriorate performance of
taping and packaging. Therefore, SMD capacitors shall be used within 6 months.
For capacitors with terminal electrodes consisting of silver or silver-palladium which
tend to become oxidized or sulfurized, use as soon as possible, such as within one
month after opening the bag.
2) When capacitors are stored for a longer time period than 6 months, confirm the
solderability of the capacitors prior to use.
During storage, keep the minimum packaging unit in its original packaging without
opening it.
Do not deviate from the above temperature and humidity conditions even for a
short term.
3) Corrosive gasses in the air or atmosphere may result in deterioration of the
reliability, such as poor solderability of the terminal electrodes. Do not store
capacitors where they will be exposed to corrosive gas (e.g., hydrogen sulfide,
sulfur dioxide, chlorine ammonia etc.)
4) Solderability and electrical performance may deteriorate due to photochemical
change in the terminal electrode if stored in direct sunlight, or due to condensation
from rapid changes in humidity.
The capacitors especially which use resin material must be operated and stored in
an environment free of dew condensation, as moisture absorption due to
condensation may affect the performance.
5) Refer to JIS C 60721-3-1, class 1K2 for other climate conditions.
1-2. Handling in transportation
In case of the transportation of the capacitors, the performance of the capacitors
may be deteriorated depending on the transportation condition.
(Refer to JEITA RCR-2335C 9.2 Handling in transportation)
2-1. Operating temperature
2
Circuit design
1) Upper category temperature (maximum operating temperature) is specified.
It is necessary to select a capacitor whose rated temperature us higher than the
operating temperature. Also, it is necessary to consider the temperature
distribution in the equipment and seasonal temperature variation.
!
△
Caution
2) Do not use capacitors above the maximum allowable operating temperature.
Surface temperature including self heating should be below maximum operating
temperature.
(Due to dielectric loss, capacitors will heat itself when AC is applied. Especially at
high frequencies around its SRF, the heat might be so extreme that it may damage
itself or the product mounted on. Please design the circuit so that the maximum
temperature of the capacitors including the self heating to be below the maximum
allowable operating temperature. Temperature rise at capacitor surface shall be
below 20°C)
3) The electrical characteristics of the capacitors will vary depending on the
temperature. The capacitors should be selected and designed in taking the
temperature into consideration.
2-2. When overvoltage is applied
Applying overvoltage to a capacitor may cause dielectric breakdown and result in
a short circuit. The duration until dielectric breakdown depends on the applied
voltage and the ambient temperature.
— 14 —
GC110H0002
No.
2
Process
Condition
2-3. Operating voltage
1)
Circuit design
Operating voltage across the terminals should be below the rated voltage.
When AC and DC are super imposed, V0-P must be below the rated voltage.
— (1) and (2)
! Caution
△
AC or pulse with overshooting, VP-P must be below the rated voltage.
— (3), (4) and (5)
When the voltage is started to apply to the circuit or it is stopped applying, the
irregular voltage may be generated for a transit period because of resonance or
switching. Be sure to use the capacitors within rated voltage containing these
Irregular voltage.
Voltage
(1) DC voltage
(2) DC+AC voltage
(3) AC voltage
Positional
Measurement
(Rated voltage)
0
VP-P
V0-P
V0-P
0
0
Voltage
(4) Pulse voltage (A) (5) Pulse voltage (B)
Positional
Measurement
VP-P
VP-P
0
(Rated voltage)
0
2) Even below the rated voltage, if repetitive high frequency AC or pulse is applied, the
reliability of the capacitors may be reduced.
3) The effective capacitance will vary depending on applied DC and AC voltages.
The capacitors should be selected and designed in taking the voltages into
consideration.
4) Abnormal voltage (surge voltage, static electricity, pulse voltage, etc.) shall not
exceed the rated voltage.
5) When capacitors are used in a series connection, it is necessary to add a balancing
circuit such as voltage dividing resistors in order to avoid an imbalance in the voltage
applied to each capacitor.
2-4. Frequency
When the capacitors (Class 2) are used in AC and/or pulse voltages, the
capacitors may vibrate themselves and generate audible sound.
— 15 —
GC110H0002
No.
3
Process
Designing
P.C.board
Condition
The amount of solder at the terminations has a direct effect on the reliability of the
capacitors.
1) The greater the amount of solder, the higher the stress on the chip capacitors,
and the more likely that it will break. When designing a P.C.board, determine the
shape and size of the solder lands to have proper amount of solder on the
terminations.
2) Avoid using common solder land for multiple terminations and provide individual
solder land for each terminations.
3) Size and recommended land dimensions.
Chip capacitors
Solder land
C
Solder resist
A
B
Reflow soldering
Case size
(Unit : mm)
C3216
C1005
C1608
C2012
[CC0402]
[CC0603]
[CC0805]
[CC1206]
Symbol
A
0.3 ~ 0.5
0.35 ~ 0.45
0.4 ~ 0.6
0.6 ~ 0.8
0.6 ~ 0.8
0.6 ~ 0.8
0.9 ~ 1.2
0.7 ~ 0.9
0.9 ~ 1.2
2.0 ~ 2.4
1.0 ~ 1.2
1.1 ~ 1.6
B
C
Case size
C3225
C4532
C5750
[CC1210]
[CC1812]
[CC2220]
Symbol
A
2.0 ~ 2.4
1.0 ~ 1.2
1.9 ~ 2.5
3.1 ~ 3.7
1.2 ~ 1.4
2.4 ~ 3.2
4.1 ~ 4.8
1.2 ~ 1.4
4.0 ~ 5.0
B
C
Flow soldering (Unrecommend)
(Unit : mm)
Case size
C1608
C2012
C3216
[CC0603]
[CC0805]
[CC1206]
Symbol
A
B
C
0.7 ~ 1.0
0.8 ~ 1.0
0.6 ~ 0.8
1.0 ~ 1.3
1.0 ~ 1.2
0.8 ~ 1.1
2.1 ~ 2.5
1.1 ~ 1.3
1.0 ~ 1.3
— 16 —
GC110H0002
No.
3
Process
Condition
Designing
P.C.board
4) Recommended chip capacitors layout is as following.
Disadvantage against
bending stress
Advantage against
bending stress
Perforation or slit
Perforation or slit
Mounting
face
Break P.C.board with
mounted side up.
Break P.C.board with
mounted side down.
Mount perpendicularly to
perforation or slit
Mount in parallel with
perforation or slit
Perforation or slit
Perforation or slit
Chip
arrangement
(Direction)
Closer to slit is higher stress
Away from slit is less stress
ℓ1
ℓ2
Distance from
slit
( ℓ1 < ℓ2 )
( ℓ1 < ℓ2 )
— 17 —
GC110H0002
No.
3
Process
Condition
5) Mechanical stress varies according to location of chip capacitors on the P.C.board.
Designing
P.C.board
E
D
Perforation
C
B
A
Stress force
A＞B＞E
A＞D＞E
A＞C
Slit
When dividing printed wiring boards, the intensities of mechanical stress applied to
capacitors are different according to each dividing method in the order of :
Push-back < Slit < V-groove < Perforation. Therefore consider not only position of
capacitors, but also the way of the dividing the printed wiring boards.
6) Layout recommendation
Use of common
solder land with
other SMD
Use of common
solder land
Soldering with
chassis
Example
Lead wire
Solder
Chassis
Excessive solder
Solder
land
Chip
Need to
avoid
Excessive solder
PCB
Adhesive
Solder land
ℓ1
Solder
land
Missing solder
Lead wire
Solder resist
Solder resist
Recommen-
dation
Solder resist
ℓ2
ℓ2 > ℓ1
— 18 —
GC110H0002
No.
4
Process
Condition
Mounting
4-1. Stress from mounting head
If the mounting head is adjusted too low, it may induce excessive stress in the chip
capacitors to result in cracking. Please take following precautions.
1) Adjust the bottom dead center of the mounting head to reach on the P.C.board
surface and not press it.
2) Adjust the mounting head pressure to be 1 to 3N of static weight.
3) To minimize the impact energy from mounting head, it is important to provide
support from the bottom side of the P.C.board.
See following examples.
Not recommended
Recommended
Single-sided
mounting
Crack
A support pin
is not to be
underneath
the capacitor.
Support pin
Double-sides
mounting
Solder
peeling
Crack
Support pin
When the centering jaw is worn out, it may give mechanical impact on the
capacitors to cause crack. Please control the close up dimension of the centering
jaw and provide sufficient preventive maintenance and replacement of it.
4-2. Amount of adhesive
a
a
b
c
c
Example : C2012 [CC0805], C3216 [CC1206]
a
b
c
0.2mm min.
70 ~ 100μm
Do not touch the solder land
— 19 —
GC110H0002
No.
5
Process
Condition
5-1. Flux selection
Soldering
Flux can seriously affect the performance of capacitors. Confirm the following to
select the appropriate flux.
1) It is recommended to use a mildly activated rosin flux (less than 0.1wt% chlorine).
Strong flux is not recommended.
2) Excessive flux must be avoided. Please provide proper amount of flux.
3) When water-soluble flux is used, enough washing is necessary.
5-2. Recommended soldering profile : Reflow method
Refer to the following temperature profile at Reflow soldering.
Reflow soldering
Soldering
Preheating
Natural cooling
Peak
Temp
∆T
0
Over 60 sec.
Peak Temp time
Reflow soldering is recommended for C1608,C2012,C3216 types, but only reflow
soldering is allowed for other case sizes.
5-3. Recommended soldering peak temp and peak temp duration for Reflow soldering
Pb free solder is recommended, but if Sn-37Pb must be used, refer to below.
Temp./Duration
Reflow soldering
Peak temp(°C)
260 max.
Duration(sec.)
10 max.
Solder
Lead Free Solder
230 max.
20 max.
Sn-Pb Solder
Recommended solder compositions
Lead Free Solder : Sn-3.0Ag-0.5Cu
— 20 —
GC110H0002
No.
5
Process
Condition
Soldering
5-4. Soldering profile : Flow method (Unrecommend)
Refer to the following temperature profile at Flow soldering.
Flow soldering
Soldering
Preheating
Natural cooling
Peak
Temp
△T
0
Over 60 sec.
Over 60 sec.
Peak Temp time
Reflow soldering is recommended for C1608,C2012,C3216 types.
5-5. Recommended soldering peak temp and peak temp duration for Flow soldering
Pb free solder is recommended, but if Sn-37Pb must be used, refer to below.
Temp./Duration
Flow soldering
Peak temp(°C)
260 max.
Duration(sec.)
5 max.
Solder
Lead Free Solder
250 max.
3 max.
Sn-Pb Solder
Recommended solder compositions
Lead Free Solder : Sn-3.0Ag-0.5Cu
5-6. Avoiding thermal shock
1)
Preheating condition
Soldering
Case size
Temp. (°C)
C1005(CC0402),C1608(CC0603),
C2012(CC0805),C3216(CC1206)
C3225(CC1210), C4532(CC1812),
C5750(CC2220)
∆T ≦ 150
Reflow soldering
∆T ≦ 130
∆T ≦ 150
C1608(CC0603),C2012(CC0805),
C3216(CC1206)
Flow soldering
Cooling condition
2)
Natural cooling using air is recommended. If the chips are dipped into a solvent for
cleaning, the temperature difference (∆T) must be less than 100°C.
— 21 —
GC110H0002
No.
5
Process
Condition
Soldering
5-7. Amount of solder
Excessive solder will induce higher tensile force in chip capacitors when
temperature changes and it may result in chip cracking. In sufficient solder may
detach the capacitors from the P.C.board.
Higher tensile force in
chip capacitors to cause
crack
Excessive
solder
Maximum amount
Minimum amount
Adequate
Low robustness may
Insufficient
solder
cause contact failure or
chip capacitors come off
the P.C.board.
5-8. Sn-Zn solder
Sn-Zn solder affects product reliability.
Please contact TDK in advance when utilize Sn-Zn solder.
5-9. Countermeasure for tombstone
The misalignment between the mounted positions of the capacitors and the land
patterns should be minimized. The tombstone phenomenon may occur especially
the capacitors are mounted (in longitudinal direction) in the same direction of the
reflow soldering.
(Refer to JEITA RCR-2335C Annex A (Informative), Recommendations to prevent
the tombstone phenomenon.)
— 22 —
GC110H0002
No.
6
Process
Condition
Solder repairing is unavoidable, refer to below.
6-1.Soldering rework using spot heater
Solder repairing
Heat stress during rework may possibly be reduced by using a spot heater
(also called a “blower”) rather than a soldering iron.
It is applied only to adding solder in the case of insufficient solder amount.
1) Reworking using a spot heater may suppress the occurrence of cracks in the
capacitor compared to using a soldering iron. A spot heater can heat up a
capacitor uniformly with a small heat gradient which leads to lower thermal
stress caused by quick heating and cooling or localized heating.
Moreover, where ultra-small capacitors are mounted close together on a printed
circuit board, reworking with a spot heater can eliminate the risk of direct contact
between the tip of a soldering iron and a capacitor.
2) Rework condition
If the blower nozzle of a spot heater is too close to a capacitor, a crack in the
capacitor may occur due to heat stress. Below are recommendations for avoiding
such an occurrence.
Keep more than 5mm between a capacitor and a spot heater nozzle.
The blower temperature of the spot heater shall be lower than 400°C.
The airflow shall be set as weak as possible.
The diameter of the nozzle is recommended to be 2mm(one-outlet type).The size
is standard and common.
Duration of blowing hot air is recommended to be 10s or less for C1608(CC0603),
C2012(CC0805) and C3216(CC1206), and 30s or less for C3225(CC1210),
C4532(CC1812) and C5750(CC2220), considering surface area of the capacitor
and melting temperature of solder.
The angle between the nozzle and the capacitor is recommended to be
45degrees in order to work easily and to avoid partial area heating.
As is the case when using a soldering iron, preheating reduces thermal stress on
capacitors and improves operating efficiency.
・Recommended rework condition（Consult the component manufacturesfor details.）
Distance from nozzle
Nozzle angle
5mm and over
45degrees
Nozzle temp.
400°C and less
Set as weak as possible
Airflow
(The airflow shall be the minimum value necessary for
solder to melt in the conditions mentioned above.)
Nozzle diameter
Blowing duration
⌀2mm（one-outlet type）
10s and less(C1608[CC0603], C2012[CC0805], C3216[CC1206])
30s and less(C3225[CC1210], C4532[CC1812], C5750[CC2220])
・Example of recommended spot heater use
One-outlet type nozzle
Angle : 45degrees
3) Amount of solder should be suitable to from a proper fillet shape.
Excess solder causes mechanical and thermal stress on a capacitor and results
in cracks. Insufficient solder causes weak adherence of the capacitor to the
substrate and may result in detachment of a capacitor and deteriorate reliability
of the printed wiring board.
See the example of appropriate solder fillet shape for 5-5.Amount of solder.
— 23 —
GC110H0002
No.
6
Process
Condition
Solder repairing 6-2. Solder repair by solder iron
1) Selection of the soldering iron tip
Tip temperature of solder iron varies by its type, P.C.board material and
solder
land size. The higher the tip temperature, the quicker the operation. However,
heat shock may cause a crack in the chip capacitors.
Please make sure the tip temp. before soldering and keep the peak temp and
time in accordance with following recommended condition.
Manual soldering
(Solder iron)
Peak
Temp
∆T
Preheating
0
3sec. (As short as possible)
Recommended solder iron condition (Sn-Pb Solder and Lead Free Solder)
Case size
Temp. (°C) Duration (sec.) Wattage (W) Shape (mm)
C1005(CC0402)
C1608(CC0603)
C2012(CC0805)
C3216(CC1206)
350 max.
3 max.
20 max.
⌀3.0 max.
C3225(CC1210)
C4532(CC1812)
C5750(CC2220)
280 max.
* Please preheat the chip capacitors with the condition in 6-3 to avoid the thermal
shock.
2) Direct contact of the soldering iron with ceramic dielectric of chip capacitors
may cause crack. Do not touch the ceramic dielectric and the terminations by
solder iron.
6-3. Avoiding thermal shock
Preheating condition
Soldering
Case size
Temp. (°C)
C1005(CC0402),C1608(CC0603),
C2012(CC0805),C3216(CC1206)
C3225(CC1210), C4532(CC1812),
C5750(CC2220)
∆T ≦ 150
Manual soldering
∆T ≦ 130
— 24 —
GC110H0002
No.
7
Process
Condition
Cleaning
1) If an unsuitable cleaning fluid is used, flux residue or some foreign articles may
stick to chip capacitors surface to deteriorate especially the insulation resistance.
2) If cleaning condition is not suitable, it may damage the chip capacitors.
2)-1. Insufficient washing
(1) Terminal electrodes may corrode by Halogen in the flux.
(2) Halogen in the flux may adhere on the surface of capacitors, and lower the
insulation resistance.
(3) Water soluble flux has higher tendency to have above mentioned problems
(1) and (2).
2)-2. Excessive washing
When ultrasonic cleaning is used, excessively high ultrasonic energy output
can affect the connection between the ceramic chip capacitor's body and the
terminal electrode. To avoid this, following is the recommended condition.
Power : 20 W/ℓ max.
Frequency : 40 kHz max.
Washing time : 5 minutes max.
2)-3. If the cleaning fluid is contaminated, density of Halogen increases, and it may
bring the same result as insufficient cleaning.
1) When the P.C.board is coated, please verify the quality influence on the product.
8
Coating and
molding of the
P.C.board
2) Please verify carefully that there is no harmful decomposing or reaction gas
emission during curing which may damage the chip capacitors.
3) Please verify the curing temperature.
— 25 —
GC110H0002
No.
9
Process
Condition
Handling after
chip mounted
1) Please pay attention not to bend or distort the P.C.board after soldering in
handling otherwise the chip capacitors may crack.
! Caution
△
Bend
Twist
Printed circuit board cropping should not be carried out by hand, but by using the
proper tooling. Printed circuit board cropping should be carried out using a board
cropping jig as shown in the following figure or a board cropping apparatus to
2)
prevent inducing mechanical stress on the board.
(1)Example of a board cropping jig
Recommended example: The board should be pushed from the back side,
close to the cropping jig so that the board is not bent and the stress applied to
the capacitor is compressive.
Unrecommended example: If the pushing point is far from the cropping jig and
the pushing direction is from the front side of the board, large tensile stress is
applied to the capacitor, which may cause cracks.
Outline of jig
Recommended
Unrecommended
Direction
of load
Direction of
load
Printed
circuit
board
V-groove
Printed
circuit
board
Load point
Components
Load point
Printed
circuit
board
Components
V-groove
Board
cropping jig
V-groove
Slot
Slot
Slot
— 26 —
GC110H0002
No.
9
Process
Condition
(2)Example of a board cropping machine
Handling after
chip mounted
An outline of a printed circuit board cropping machine is shown below. The
top and bottom blades are aligned with one another along the lines with the
V-grooves on printed circuit board when cropping the board.
Unrecommended example: Misalignment of blade position between top and
bottom, right and left, or front and rear blades may cause a crack in the
capacitor.
! Caution
△
Outline of machine
Principle of operation
Top blade
Top
blade
Printed circuit board
V-groove
Bottom blade
Printed circuit board
Cross-section diagram
Top blade
Printed circuit board
V-groove
Bottom blade
Unrecommended
Recommended
Top-bottom
Left-right
Front-rear
misalignment
misalignment
misalignment
Top blade
Top blade
Top blade
Top blade
Board
Bottom blade
Bottom blade
Bottom blade
Bottom blade
When functional check of the P.C.board is performed, check pin pressure tends
to be adjusted higher for fear of loose contact. But if the pressure is excessive
and bend the P.C.board, it may crack the chip capacitors or peel the
terminations off. Please adjust the check pins not to bend the P.C.board.
3)
Item
Not recommended
Recommended
Support pin
Termination
peeling
Board
bending
Check pin
Check pin
— 27 —
GC110H0002
No.
Process
Condition
10 Handling of loose
chip capacitors
1) If dropped the chip capacitors may crack. Once dropped do not use it. Especially,
the large case sized chip capacitors are tendency to have cracks easily, so
please handle with care.
Crack
Floor
2) Piling the P.C.board after mounting for storage or handling, the corner of the P.C.
board may hit the chip capacitors of another board to cause crack.
P.C.board
Crack
The capacitors (Class 2) have aging in the capacitance. They may not be used in
precision time constant circuit. In case of the time constant circuit, the evaluation
should be done well.
11 Capacitance aging
As per the estimated life and the estimated failure rate depend on the temperature
and the voltage. This can be calculated by the equation described in JEITA
RCR-2335C Annex F (Informative) Calculation of the estimated lifetime and the
estimated failure rate ( Voltage acceleration coefficient : 3 multiplication rule,
Temperature acceleration coefficient : 10°C rule)
12 Estimated life and
estimated failure
rate of capacitors
The failure rate can be decreased by reducing the temperature and the voltage but
they will not be guaranteed.
— 28 —
GC110H0002
No.
Process
Condition
1) A capacitor shall not be touched directly with bare hands during operation in
order to avoid electric shock.
13 Caution during
operation of
Electric energy held by the capacitor may be discharged through the human
body when touched with a bare hand.
equipment
Even when the equipment is off, a capacitor may stay charged. The capacitor
should be handled after being completely discharged using a resistor.
2) The terminals of a capacitor shall not be short-circuited by any accidental
contact with a conductive object. A capacitor shall not be exposed to a
conductive liquid such as an acid or alkali solution. A conductive object or liquid,
such as acid and alkali, between the terminals may lead to the breakdown of a
capacitor due to short circuit.
3) Confirm that the environment to which the equipment will be exposed during
transportation and operation meets the specified conditions. Do not to use the
equipment in the following environments.
(1) Environment where a capacitor is spattered with water or oil
(2) Environment where a capacitor is exposed to direct sunlight
(3) Environment where a capacitor is exposed to Ozone, ultraviolet rays or
radiation
(4) Environment where a capacitor exposed to corrosive gas(e.g. hydrogen
sulfide, sulfur dioxide, chlorine. ammonia gas etc.)
(5) Environment where a capacitor exposed to vibration or mechanical shock
exceeding the specified limits.
(6) Atmosphere change with causes condensation
The products listed on this specification sheet are intended for use in general
electronic equipment (AV equipment, telecommunications equipment, home
appliances, amusement equipment, computer equipment, personal equipment, office
equipment, measurement equipment, industrial robots) under a normal operation and
use condition.
14 Others
! Caution
△
The products are not designed or warranted to meet the requirements of the
applications listed below, whose performance and/or quality require a more stringent
level of safety or reliability, or whose failure, malfunction or trouble could cause
serious damage to society, person or property. Please understand that we are not
responsible for any damage or liability caused by use of the products in any of the
applications below or for any other use exceeding the range or conditions set forth in
this specification sheet. If you intend to use the products in the applications listed
below or if you have special requirements exceeding the range or conditions set forth
in this specification, please contact us.
(1) Aerospace/Aviation equipment
(2) Transportation equipment (cars, electric trains, ships, etc.)
(3) Medical equipment (Excepting Pharmaceutical Affairs Law classification Class1, 2)
(4) Power-generation control equipment
(5) Atomic energy-related equipment
(6) Seabed equipment
(7) Transportation control equipment
(8) Public information-processing equipment
(9) Military equipment
(10) Electric heating apparatus, burning equipment
(11) Disaster prevention/crime prevention equipment
(12) Safety equipment
(13) Other applications that are not considered general-purpose applications
When designing your equipment even for general-purpose applications, you are
kindly requested to take into consideration securing protection circuit/device or
providing backup circuits in your equipment.
— 29 —
GC110H0002
13. TAPE PACKAGING SPECIFICATION
1. CONSTRUCTION AND DIMENSION OF TAPING
1-1. Dimensions of carrier tape
Dimensions of paper tape shall be according to Appendix 3, 4.
Dimensions of plastic tape shall be according to Appendix 5, 6.
1-2. Bulk part and leader of taping
Chips
Empty
Trailer(Empty)
160mm min.
160mm min.
Leader
Drawing direction
400mm min
1-3. Dimensions of reel
Dimensions of ⌀178 reel shall be according to Appendix 7, 8.
Dimensions of ⌀330 reel shall be according to Appendix 9, 10.
1-4. Structure of taping
<Paper>
<Plastic>
Top cover tape
Top cover tape
Pitch hole
Cavity (Chip insert)
Pitch hole
Cavity (Chip insert)
Paper carrier tape
Plastic carrier tape
Bottom cover tape
(Bottom cover tape is not always applied)
2. CHIP QUANTITY
Please refer to detail page on TDK web.
— 30 —
GC110H0002
3. PERFORMANCE SPECIFICATIONS
3-1. Fixing peeling strength (top tape)
0.05N < Peeling strength < 0.7N
<Paper>
Direction of cover tape pulling
Top cover tape
Carrier tape
0～15°
Direction of pulling
Paper tape should not adhere to top
cover tape when pull the cover tape.
<Plastic>
Direction of pulling
Top cover tape
Carrier tape
0～15°
Direction of pulling
3-2. Carrier tape shall be flexible enough to be wound around a minimum radius
of 30mm with components in tape.
3-3. The missing of components shall be less than 0.1%
3-4. Components shall not stick to fixing tape.
3-5. When removing the cover tape, there shall not be difficulties by unfitting clearance
gap, burrs and crushes of cavities. Also the sprocket holes shall not be covered
by absorbing dust into the suction nozzle.
— 31 —
GC110H0002
Appendix 3
Paper Tape
Pitch hole
J
Cavity (Chip insert)
E
D
A
B
C
G
H
F
T
(Unit：mm)
Symbol
A
B
C
D
E
F
Case size
C1005
[CC0402]
( 0.65 )
( 1.15 )
H
8.00 ± 0.30 3.50 ± 0.05 1.75 ± 0.10 2.00 ± 0.05
Symbol
Case size
G
J
T
C1005
[CC0402]
+0.10
0
0.60±0.05
2.00 ± 0.05 4.00 ± 0.10 ⌀ 1.50
(
) Reference value.
Appendix 4
Paper Tape
Cavity (Chip insert)
Pitch hole
J
E
D
A
C
B
T
H
G
F
(Unit：mm)
Symbol
Case size
C1608
A
B
C
D
E
F
( 1.10 )
( 1.50 )
( 1.90 )
( 1.90 )
( 2.30 )
( 3.50 )
[CC0603]
C2012
[CC0805]
C3216
8.00 ± 0.30 3.50 ± 0.05 1.75 ± 0.10 4.00 ± 0.10
[CC1206]
Symbol
Case size
G
H
J
T
C1608
[CC0603]
C2012
+0.10
0
2.00 ± 0.05 4.00 ± 0.10
1.20 max.
⌀ 1.50
[CC0805]
C3216
[CC1206]
(
) Reference value.
— 32 —
GC110H0002
Appendix 5
Plastic Tape
Cavity (Chip insert)
Pitch hole
J
E
D
A
C
B
T
Q
F
G
H
K
(Unit : mm)
F
Symbol
Case size
A
B
C
D
E
C2012
[CC0805]
C3216
[CC1206]
C3225
( 1.50 )
( 1.90 )
( 2.90 )
( 2.30 )
( 3.50 )
( 3.60 )
8.00 ± 0.30 3.50 ± 0.05
*12.0 ± 0.30 *5.50 ± 0.05
1.75 ± 0.10 4.00 ± 0.10
[CC1210]
Symbol
Case size
G
H
J
K
T
Q
C2012
[CC0805]
2.50 max.
3.40 max.
C3216
[CC1206]
C3225
+0.10
0
2.00 ± 0.05 4.00 ± 0.10 ⌀ 1.50
0.60 max.
⌀ 0.50 min.
[CC1210]
(
) Reference value.
* Applied to thickness, 2.5mm products.
Exceptionally no hole in the cavity is applied. Please inquire if hole in cavity is mandatory.
— 33 —
GC110H0002
Appendix 6
Plastic Tape
Cavity (Chip insert)
Pitch hole
J
E
D
A
C
B
T
Q
G
H
F
K
(Unit : mm)
F
Symbol
A
B
C
D
E
Case size
C4532
( 3.60 )
( 4.90 )
( 6.10 )
[CC1812]
12.0 ± 0.30 5.50 ± 0.05 1.75 ± 0.10 8.00 ± 0.10
C5750
[CC2220]
( 5.40 )
G
Symbol
Case size
H
J
K
T
Q
C4532
[CC1812]
+0.10
0
2.00 ± 0.05 4.00 ± 0.10
6.50 max.
0.60 max.
⌀ 1.50
⌀ 1.50 min.
C5750
[CC2220]
(
) Reference value.
Exceptionally no hole in the cavity is applied. Please inquire if hole in cavity is mandatory.
— 34 —
GC110H0002
Appendix 7
Dimensions of reel (Material : Polystyrene)
C1005, C1608, C2012, C3216, C3225
W2
E
C
B
D
R
W1
A
(Unit : mm)
Symbol
A
B
C
D
E
W1
Dimension ⌀ 178 ± 2.0 ⌀ 60 ± 2.0
⌀ 13 ± 0.5
⌀ 21 ± 0.8
2.0 ± 0.5
9.0 ± 0.3
Symbol
W2
R
Dimension 13.0 ± 1.4
1.0
Appendix 8
Dimensions of reel (Material : Polystyrene)
C3225(2.5mm thickness products), C4532, C5750
W2
E
C
B
D
R
W1
A
(Unit : mm)
W1
Symbol
A
B
C
D
E
Dimension ⌀ 178 ± 2.0 ⌀ 60 ± 2.0
⌀ 13 ± 0.5
⌀ 21 ± 0.8
2.0 ± 0.5
13.0 ± 0.3
Symbol
W2
R
Dimension 17.0 ± 1.4
1.0
— 35 —
GC110H0002
Appendix 9
Dimensions of reel (Material : Polystyrene)
C1005, C1608, C2012, C3216, C3225
E
C
B
D
R
A
t
W
(Unit : mm)
Symbol
A
B
C
D
E
W
⌀ 382 max.
(Nominal ⌀ 330)
Dimension
⌀ 50 min.
⌀ 13 ± 0.5
⌀ 21 ± 0.8
2.0 ± 0.5
10.0 ± 1.5
Symbol
t
R
Dimension
2.0 ± 0.5
1.0
Appendix 10
Dimensions of reel (Material : Polystyrene)
C3225(2.5mm thickness products), C4532, C5750
E
C
B
D
R
W
t
A
(Unit : mm)
W
Symbol
A
B
C
D
E
⌀ 382 max.
(Nominal ⌀ 330)
Dimension
2.0 ± 0.5
14.0 ± 1.5
⌀ 50 min.
⌀ 13 ± 0.5
⌀ 21 ± 0.8
Symbol
t
R
Dimension
2.0 ± 0.5
1.0
— 36 —
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