C5750X7R2J224KT5 [TDK]
Ceramic Capacitor, Multilayer, Ceramic, 630V, 10% -Tol, X7R, 15% TC, 0.22uF, Surface Mount, 2220, CHIP, ROHS COMPLIANT;型号: | C5750X7R2J224KT5 |
厂家: | TDK ELECTRONICS |
描述: | Ceramic Capacitor, Multilayer, Ceramic, 630V, 10% -Tol, X7R, 15% TC, 0.22uF, Surface Mount, 2220, CHIP, ROHS COMPLIANT |
文件: | 总16页 (文件大小:1087K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
C Series
Open Mode Design
Type:
C2012 [EIA CC0805]
C3216 [EIA CC1206]
C3225 [EIA CC1210]
C4532 [EIA CC1812]
C5750 [EIA CC2220]
Issue date:
April 2011
TDK MLCC
US Catalog
Version B11
REMINDERS
Please read before using this product
SAFETY REMINDERS
REMINDERS
1.
2.
3.
If you intend to use a product listed in this catalog for a purpose that may cause loss of life or other
damage, you must contact our company’s sales window.
We may modify products or discontinue production of a product listed in this catalog without prior
notification.
We provide “Delivery Specification” that explain precautions for the specifications and safety of each
product listed in this catalog. We strongly recommend that you exchange these delivery specifications
with customers that use one of these products.
4.
If you plan to export a product listed in this catalog, keep in mind that it may be a restricted item according
to the “Foreign Exchange and Foreign Trade Control Law”. In such cases, it is necessary to acquire export
permission in harmony with this law.
5.
6.
Any reproduction or transferring of the contents of this catalog is prohibited without prior permission from
our company.
We are not responsible for problems that occur related to the intellectual property rights or other rights of
our company or a third party when you use a product listed in this catalog. We do not grant license of
these rights.
7.
This catalog only applies to products purchased through our company or one of our company’s official
agencies. This catalog does not apply to products that are purchased through other third parties.
TDK MLCC US Catalog
Page 180
Version B11
C Series
Open Mode Design
Type: C2012, C3216, C3225, C4532, C5750
• Automotive and other high stress
applications
• Battery line circuits with high board
flex stress
• Increase resistance to mechanical bending,
temperature cycle, vibration, and electrical stresses
• Available in X7R and X8R dielectrics
• When a chip capacitor is cracked by mechanical
stress such as board bending, open mode construction
helps user reduce the risk of short circuits
Features
Applications
• The Open Mode design defines that the L-Gap length
shall be wider than the terminal band width
<Standard>
<Open Mode Design>
Shape &
Dimensions
Fail Short
Fail Open
L-Gap
L-Gap
L
W
T
Body Length
Body Width
Body Height
Terminal Width
B
Dimensions in mm
Crack
Crack
• The Open Mode concept does not guaranteed MLCC
will always fail open. This design is intended to reduce
the risk of the MLCC failing short. All MLCC caution
guidelines apply.
Symbol
Design
Part Number
Construction
5
Open Mode
C
3216 X7R 2A 105 K T 5XXX
Series Name
Dimensions L x W (mm)
Internal Codes
Termination Code
5xxx
Packaging Style
Style
Open Mode Design
Case Code
C2012
Length
Width
2.00 ± 0.20
3.20 ± 0.20
3.20 ± 0.40
4.50 ± 0.40
5.70 ± 0.40
1.25 ± 0.20
1.60 ± 0.20
2.50 ± 0.30
3.20 ± 0.40
5.00 ± 0.40
C3216
Packaging Code
T
Capacitance Tolerance
Style
Tape & Reel
C3225
C4532
C5750
Tolerance Code
Tolerance
K
M
± 10%
± 20%
Temperature Characteristic
Temperature
Capacitance
Change
Temperature
Range
Nominal Capacitance (pF)
Characteristics
±15%
±15%
-55 to +125ºC
-55 to +150ºC
The capacitance is expressed in three
digit codes and in units of pico Farads
(pF). The first and second digits identify
the first and second significant figures of
the capacitance. The third digit identifies
the multiplier. R designates a decimal
point.
X7R
X8R
Rated Voltage (DC)
Voltage Code
Voltage (DC)
16V
25V
50V
100V
250V
630V
1C
1E
1H
2A
2E
2J
Capacitance Code Capacitance
0R5
010
102
105
0.5pF
1pF
1,000pF (1nF)
1,000,000pF (1µF)
TDK MLCC US Catalog
Page 181
Version B11
Capacitance
Range Chart
C2012 [EIA CC0805]
Capacitance Range Chart
Temperature Characteristics: X7R, (± 15%), X8R (± 15%)
Rated Voltage: 250V (2E), 100V (2A), 50V (1H)
X7R
X8R
Capacitance
(pF)
Cap
Code
Tolerance
K: ± 10%
2E
2A
1H
(50V)
1H
(50V)
(250V) (100V)
1,000
1,500
2,200
3,300
4,700
102
152
222
332
472
682
103
153
223
333
473
683
104
6,800
10,000
15,000
22,000
33,000
47,000
68,000
100,000
Standard Thickness
0.85 mm
1.25 mm
Capacitance
Range Table
C2012 [EIA CC0805]
Class 2 (Temperature Stable)
Temperature Characteristics X7R (-55 to +125ºC, ±15%), X8R (-55 to +150ºC, ±15%)
TDK Part Number
(Ordering Code)
Temperature
Characteristics
Rated
Voltage
Capacitance
(pF)
Capacitance
Tolerance
Thickness
(mm)
C2012X7R1H104KT5
C2012X7R2A102KT5
C2012X7R2A152KT5
C2012X7R2A222KT5
C2012X7R2A332KT5
C2012X7R2A472KT5
C2012X7R2A682KT5
C2012X7R2A103KT5
C2012X7R2A153KT5
C2012X7R2A223KT5
C2012X7R2E102KT5
C2012X7R2E152KT5
C2012X7R2E222KT5
C2012X7R2E332KT5
C2012X7R2E472KT5
C2012X7R2E682KT5
C2012X7R2E103KT5
C2012X7R2E153KT5
C2012X8R1H223KT5
C2012X8R1H333KT5
C2012X8R1H473KT5
C2012X8R1H683KT5
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X8R
X8R
X8R
X8R
50V
100V
100V
100V
100V
100V
100V
100V
100V
100V
250V
250V
250V
250V
250V
250V
250V
250V
50V
100,000
± 10%
± 10%
± 10%
± 10%
± 10%
± 10%
± 10%
± 10%
± 10%
± 10%
± 10%
± 10%
± 10%
± 10%
± 10%
± 10%
± 10%
± 10%
± 10%
± 10%
± 10%
± 10%
1.25 ± 0.20
0.85 ± 0.10
0.85 ± 0.10
0.85 ± 0.10
0.85 ± 0.10
0.85 ± 0.10
0.85 ± 0.10
0.85 ± 0.10
1.25 ± 0.20
1.25 ± 0.20
0.85 ± 0.10
0.85 ± 0.10
0.85 ± 0.10
0.85 ± 0.10
0.85 ± 0.10
1.25 ± 0.20
1.25 ± 0.20
1.25 ± 0.20
0.85 ± 0.10
0.85 ± 0.10
1.25 ± 0.20
1.25 ± 0.20
1,000
1,500
2,200
3,300
4,700
6,800
10,000
15,000
22,000
1,000
1,500
2,200
3,300
4,700
6,800
10,000
15,000
22,000
33,000
47,000
68,000
50V
50V
50V
TDK MLCC US Catalog
Page 182
Version B11
Capacitance
Range Chart
C3216 [EIA CC1206]
Capacitance Range Chart
Temperature Characteristics: X7R, (± 15%)
Rated Voltage: 630V (2J), 250V (2E), 100V (2A), 16V (1C)
X7R
Capacitance
(pF)
Cap
Code
Tolerance
K: ± 10%
2J
2E
2A
1C
(16V)
(630V) (250V) (100V)
1,000
1,500
2,200
3,300
4,700
102
152
222
332
472
682
103
153
223
333
473
683
104
154
105
475
6,800
10,000
15,000
22,000
33,000
47,000
68,000
100,000
150,000
1,000,000
4,700,000
Standard Thickness
1.15 mm
1.30 mm
1.60 mm
Capacitance
Range Table
C3216 [EIA CC1206]
Class 2 (Temperature Stable)
Temperature Characteristics X7R (-55 to +125ºC, ±15%)
TDK Part Number
(Ordering Code)
Temperature
Characteristics
Rated
Voltage
Capacitance
(pF)
Capacitance
Tolerance
Thickness
(mm)
C3216X7R1C475MT5
C3216X7R2A333KT5
C3216X7R2A473KT5
C3216X7R2A683KT5
C3216X7R2A104KT5
C3216X7R2A154KT5
C3216X7R2A105KT5
C3216X7R2E153KT5
C3216X7R2E223KT5
C3216X7R2E333KT5
C3216X7R2E473KT5
C3216X7R2E683KT5
C3216X7R2E104KT5
C3216X7R2J102KT5
C3216X7R2J152KT5
C3216X7R2J222KT5
C3216X7R2J332KT5
C3216X7R2J472KT5
C3216X7R2J682KT5
C3216X7R2J103KT5
C3216X7R2J153KT5
C3216X7R2J223KT5
C3216X7R2J333KT5
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
16V
4,700,000
± 20%
± 10%
± 10%
± 10%
± 10%
± 10%
± 10%
± 10%
± 10%
± 10%
± 10%
± 10%
± 10%
± 10%
± 10%
± 10%
± 10%
± 10%
± 10%
± 10%
± 10%
± 10%
± 10%
1.60 ± 0.30
1.15 ± 0.10
1.15 ± 0.10
1.60 ± 0.30
1.60 ± 0.30
1.60 ± 0.30
1.60 ± 0.30
1.15 ± 0.10
1.15 ± 0.10
1.60 ± 0.30
1.60 ± 0.30
1.60 ± 0.30
1.60 ± 0.30
1.15 ± 0.10
1.15 ± 0.10
1.15 ± 0.10
1.15 ± 0.10
1.15 ± 0.10
1.15 ± 0.10
1.15 ± 0.10
1.30 ± 0.15
1.30 ± 0.15
1.60 ± 0.30
100V
100V
100V
100V
100V
100V
250V
250V
250V
250V
250V
250V
630V
630V
630V
630V
630V
630V
630V
630V
630V
630V
33,000
47,000
68,000
100,000
150,000
1,000,000
15,000
22,000
33,000
47,000
68,000
100,000
1,000
1,500
2,200
3,300
4,700
6,800
10,000
15,000
22,000
33,000
TDK MLCC US Catalog
Page 183
Version B11
Capacitance
Range Chart
C3225 [EIA CC1210]
Capacitance Range Chart
Temperature Characteristics: X7R, (± 15%)
Rated Voltage: 630V (2J), 250V (2E), 100V (2A), 50V (1H), 25V (1E), 16V (1C)
X7R
Capacitance
(pF)
Cap
Code
Tolerance
K: ± 10%
2J
2E
2A
1H
1E
1C
(630V) (250V) (100V)
(50V)
(25V)
(16V)
47,000
68,000
473
683
104
154
224
334
474
684
105
155
225
335
475
100,000
150,000
220,000
330,000
470,000
680,000
1,000,000
1,500,000
2,200,000
3,300,000
4,700,000
Standard Thickness
1.15 mm
1.60 mm
2.00 mm
2.30 mm
2.50 mm
Capacitance
Range Table
C3225 [EIA CC1210]
Class 2 (Temperature Stable)
Temperature Characteristics X7R (-55 to +125ºC, ±15%)
TDK Part Number
(Ordering Code)
Temperature
Characteristics
Rated
Voltage
Capacitance
(pF)
Capacitance
Tolerance
Thickness
(mm)
C3225X7R1C335KT5
C3225X7R1C475KT5
C3225X7R1E105KT5
C3225X7R1E155KT5
C3225X7R1E225KT5
C3225X7R1H474KT5
C3225X7R1H684KT5
C3225X7R2A334KT5
C3225X7R2A105KT5
C3225X7R2A225KT5
C3225X7R2E104KT5
C3225X7R2E154KT5
C3225X7R2E224KT5
C3225X7R2J473KT5
C3225X7R2J683KT5
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
16V
16V
3,300,000
± 10%
± 10%
± 10%
± 10%
± 10%
± 10%
± 10%
± 10%
± 10%
± 10%
± 10%
± 10%
± 10%
± 10%
± 10%
2.00 ± 0.20
2.50 ± 0.30
1.15 ± 0.10
1.60 ± 0.30
2.00 ± 0.20
1.60 ± 0.30
2.00 ± 0.20
2.00 ± 0.20
2.00 ± 0.20
2.30 ± 0.20
2.00 ± 0.20
2.00 ± 0.20
2.00 ± 0.20
2.00 ± 0.20
2.00 ± 0.20
4,700,000
1,000,000
1,500,000
2,200,000
470,000
680,000
330,000
1,000,000
2,200,000
100,000
150,000
220,000
47,000
25V
25V
25V
50V
50V
100V
100V
100V
250V
250V
250V
630V
630V
68,000
TDK MLCC US Catalog
Page 184
Version B11
Capacitance
Range Chart
C4532 [EIA CC1812]
Capacitance Range Chart
Temperature Characteristics: X7R, (± 15%)
Rated Voltage: 630V (2J), 250V (2E), 100V (2A), 50V (1H), 25V (1E), 16V (1C)
X7R
Capacitance
(pF)
Cap
Code
Tolerance
K: ± 10%
2J
2E
2A
1H
1E
1C
(630V) (250V) (100V)
(50V)
(25V)
(16V)
68,000
100,000
150,000
220,000
330,000
683
104
154
224
334
474
684
105
155
335
475
685
106
470,000
680,000
1,000,000
1,500,000
3,300,000
4,700,000
6,800,000
10,000,000
Standard Thickness
1.60 mm
2.00 mm
2.30 mm
Capacitance
Range Table
C4532 [EIA CC1812]
Class 2 (Temperature Stable)
Temperature Characteristics X7R (-55 to +125ºC, ±15%)
TDK Part Number
(Ordering Code)
Temperature
Characteristics
Rated
Voltage
Capacitance
(pF)
Capacitance
Tolerance
Thickness
(mm)
C4532X7R1C685KT5
C4532X7R1C106KT5
C4532X7R1E335KT5
C4532X7R1E475KT5
C4532X7R1H105KT5
C4532X7R1H155KT5
C4532X7R2A684KT5
C4532X7R2E154KT5
C4532X7R2E224KT5
C4532X7R2E334KT5
C4532X7R2E474KT5
C4532X7R2J683KT5
C4532X7R2J104KT5
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
16V
16V
6,800,000
± 10%
± 10%
± 10%
± 10%
± 10%
± 10%
± 10%
± 10%
± 10%
± 10%
± 10%
± 10%
± 10%
2.00 ± 0.20
2.30 ± 0.20
1.60 ± 0.30
2.00 ± 0.20
1.60 ± 0.30
2.30 ± 0.20
2.30 ± 0.20
1.60 ± 0.30
2.30 ± 0.20
2.30 ± 0.20
2.30 ± 0.20
1.60 ± 0.30
2.30 ± 0.20
10,000,000
3,300,000
4,700,000
1,000,000
1,500,000
680,000
150,000
220,000
330,000
470,000
68,000
25V
25V
50V
50V
100V
250V
250V
250V
250V
630V
630V
100,000
TDK MLCC US Catalog
Page 185
Version B11
Capacitance
Range Chart
C5750 [EIA CC2220]
Capacitance Range Chart
Temperature Characteristics: X7R, (± 15%)
Rated Voltage: 630V (2J), 250V (2E), 100V (2A), 50V (1H), 25V (1E), 16V (1C)
X7R
Capacitance
(pF)
Cap
Code
Tolerance
K: ± 10%
2J
2E
2A
1H
1E
1C
(630V) (250V) (100V)
(50V)
(25V)
(16V)
150,000
220,000
330,000
470,000
680,000
154
224
334
474
684
105
155
225
335
475
685
106
156
226
1,000,000
1,500,000
2,200,000
3,300,000
4,700,000
6,800,000
10,000,000
15,000,000
22,000,000
Standard Thickness
1.60 mm
2.00 mm
2.30 mm
2.80 mm
Capacitance
Range Table
C5750 [EIA CC2220]
Class 2 (Temperature Stable)
Temperature Characteristics X7R (-55 to +125ºC, ±15%)
TDK Part Number
(Ordering Code)
Temperature
Characteristics
Rated
Voltage
Capacitance
(pF)
Capacitance
Tolerance
Thickness
(mm)
C5750X7R1C226MT5
C5750X7R1E685KT5
C5750X7R1E106KT5
C5750X7R1E156MT5
C5750X7R1H225KT5
C5750X7R1H335KT5
C5750X7R1H475KT5
C5750X7R2A684KT5
C5750X7R2A105KT5
C5750X7R2A155KT5
C5750X7R2E334KT5
C5750X7R2E474KT5
C5750X7R2E684KT5
C5750X7R2E105KT5
C5750X7R2J154KT5
C5750X7R2J224KT5
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
16V
25V
22,000,000
± 20%
± 10%
± 10%
± 20%
± 10%
± 10%
± 10%
± 10%
± 10%
± 10%
± 10%
± 10%
± 10%
± 10%
± 10%
± 10%
2.80 ± 0.20
1.60 ± 0.30
2.00 ± 0.20
2.80 ± 0.20
1.60 ± 0.30
2.30 ± 0.20
2.80 ± 0.20
1.60 ± 0.30
2.30 ± 0.20
2.30 ± 0.20
1.60 ± 0.30
2.30 ± 0.20
2.30 ± 0.20
2.30 ± 0.20
1.60 ± 0.30
2.30 ± 0.20
6,800,000
10,000,000
15,000,000
2,200,000
3,300,000
4,700,000
680,000
25V
25V
50V
50V
50V
100V
100V
100V
250V
250V
250V
250V
630V
630V
1,000,000
1,500,000
330,000
470,000
680,000
1,000,000
150,000
220,000
TDK MLCC US Catalog
Page 186
Version B11
General
Specifications
C Series – Open Mode Design
No.
1
Item
Performance
Test or Inspection Method
External
Appearance
No defects which may affect
performance.
Inspect with magnifying glass (3×).
2
Insulation
Resistance
10,000MΩ or 500MΩ•μF min.,
whichever smaller. (As for the
Apply rated voltage for 60s. As for the rated voltage
630V DC, apply 500V DC.
capacitors of rated voltage 16V DC,
10,000 MΩ or 100MΩ•μF min.,)
Rated Voltage
RV ≤ 100V
Apply voltage
2.5 ×rated voltage
1.5 ×rated voltage
3
Voltage Proof
Capacitance
Withstand test voltage without
insulation breakdown or other damage.
RV > 100V
Above DC voltage shall be applied for 1 to 5s. Charge /
discharge current shall not exceed 50mA.
Measuring
Frequency
1kHz±10%
Rated
Capacitance
Measuring
voltage
4
Within the specified tolerance.
Class
C ≤ 10uF
1.0±0.2Vrms
Class 2
C > 10uF
120Hz±20%
0.5±0.2 Vrms
T.C. Rated Voltage (DC) D.F.
5
6
Dissipation
Factor
See No.4 in this table for measuring condition.
X7R RV = 25V& 50V
X8R
3% max.
5% max.
(Class 2)
RV ≤ 16V
Temperature
Characteristics
Capacitance Change (%)
Capacitance shall be measured by the steps shown in
the following table after thermal equilibrium is obtained
for each step.
No Voltage Applied
of Capacitance
(Class 2)
X7R: ± 15%
X8R: ± 15%
∆C be calculated ref. STEP 3 reading
Step
Temperature (ºC)
1
2
3
4
Reference temp. ± 2
Min. operating temp. ± 2
Reference temp. ± 2
Max. operating temp. ± 2
7
Robustness of
Terminations
No sign of termination coming off,
breakage of ceramic, or other abnormal
signs.
Reflow solder the capacitors on P.C. board (shown in
Appendix 1a or Appendix 1b) and apply a pushing
force of 5N for 10±1s.
Pushing force
P.C. board
Capacitor
8
Bending
No mechanical damage.
Reflow solder the capacitor on P.C. board (shown in
Appendix 2) and bend it for 1mm.
20
50
F
R230
1
45
45
Unit: mm
TDK MLCC US Catalog
Page 187
Version B11
General
Specifications
C Series – Open Mode Design
No.
9
Item
Performance
Test or Inspection Method
Solderability
New solder to cover over 75% of
termination.
Completely soak both terminations in solder at
235±5ºC for 2±0.5s.
Solder: H63A (JIS Z 3282)
25% may have pinholes or rough spots
but not concentrated in one spot.
Flux: Isopropyl alcohol (JIS K 8839)
Rosin (JIS K 5902) 25% solid solution.
Ceramic surface of “A sections” shall
not be exposed due to melting or
shifting of termination material.
A section
10
Resistance to solder heat
Completely soak both terminations in solder at
260±5ºC for 5±1s.
External
No cracks are allowed and terminations
Preheating condition
Temp.: 150±10ºC
Time : 1 to 2min.
appearance
shall be covered at least 60% with new
solder.
Capacitance
Change from the
Characteristics
value before test
Flux: Isopropyl alcohol (JIS K 8839)
Rosin (JIS K 5902) 25% solid solution.
X7R
Class 2
± 7.5%
X8R
Solder: H63A (JIS Z 3282)
D.F. (Class 2)
Meet the initial spec.
Meet the initial spec.
Leave the capacitor in ambient conditions for 6 to 24h
before measurement.
Insulation
Resistance
Voltage
Proof
No insulation breakdown or other
damage.
11
Vibration
Reflow solder the capacitor on P.C. board (shown in
Appendix 1a or Appendix 1b) before testing.
External
No mechanical damage.
Vibrate the capacitor with amplitude of 1.5mm P-P
sweeping the frequencies from 10Hz to 55Hz and back
to 10Hz after 1min.
appearance
Capacitance
Change from the
Characteristics
value before test
Repeat this for 2h each in 3 perpendicular directions.
X7R
Class 2
± 7.5%
X8R
D.F. (Class 2)
Meet the initial spec.
TDK MLCC US Catalog
Page 188
Version B11
General
Specifications
C Series – Open Mode Design
No.
12
Item
Performance
Test or Inspection Method
Temperature cycle
Reflow solder the capacitors on a P.C. board (shown in
Appendix 1a or Appendix 1b) before testing.
External
No mechanical damage.
Expose the capacitor in the conditions in step 1
through step 4, and repeat 5 times consecutively.
appearance
Capacitance
Change from the
value before test
Characteristics
Leave the capacitor in ambient conditions for 24±2h
before measurement.
X7R
Class 2
± 7.5%
Step
Temperature (ºC)
Time (min.)
30 ± 3
2 – 5
X8R
1
2
3
4
Min. operating temp. ±3
Reference Temp.
D.F. (Class 2)
Meet the initial spec.
Meet the initial spec.
Max. operating temp. ± 2
Reference Temp.
30 ± 2
2 - 5
Insulation
Resistance
Voltage
Proof
No insulation breakdown or other
damage.
13
Moisture Resistance (Steady State)
Reflow solder the capacitor on P.C. board (shown in
Appendix 1a or Appendix 1b) before testing.
External
No mechanical damage.
Leave at temperature 40±2ºC, 90 to 95%RH for 500
appearance
+24,0h.
Capacitance
Change from the
value before test
Characteristics
Leave the capacitor in ambient condition for 24±2h
before measurement.
X7R
Class 2
± 12.5%
X8R
D.F. (Class 2)
Characteristics
X7R: 200% of initial spec. max.
X8R: 200% of initial spec. max.
Insulation
1,000MΩ or 50MΩ•μF min., whichever
smaller. (As for the capacitors of rated
voltage 16V DC, 1,000 MΩ or 10MΩ•μF
min.,)
Resistance
TDK MLCC US Catalog
Page 189
Version B11
General
Specifications
C Series – Open Mode Design
No.
14
Item
Performance
Test or Inspection Method
Moisture Resistance
Reflow solder the capacitors on P.C. board (shown in
Appendix 1a or Appendix 1b) before testing.
External
No mechanical damage.
Apply the rated voltage at temperature 40±2ºC and 90
to 95%RH for 500 +24,0h.
appearance
Capacitance
Change from the
value before test
Characteristics
Charge/discharge current shall not exceed 50mA.
X7R
Class 2
Leave the capacitor in ambient conditions for 24±2h
before measurement.
± 12.5%
X8R
Voltage conditioning:
D.F. (Class 2)
Characteristics
Voltage treat the capacitors under testing temperature
and voltage for 1 hour.
X7R: 200% of initial spec. max.
X8R: 200% of initial spec. max.
Leave the capacitors in ambient condition for 24±2h
before measurement.
Insulation
500MΩ or 25MΩ•μF min., whichever
smaller. (As for the capacitors of rated
voltage 16V DC, 500 MΩ or 5MΩ•μF
min.,)
Resistance
Use this measurement for initial value.
15
Life
Reflow solder the capacitors on P.C. board (shown in
Appendix 1a or Appendix 1b) before testing.
External
No mechanical damage.
Apply rated voltage at maximum operating temperature
±2ºC for 1,000 +48, 0h. Some items may be tested at
higher voltage (1.2x, 1.5x or 2xRV).
appearance
Change from the
Characteristics
Capacitance
value before test
Charge/discharge current shall not exceed 50mA.
X7R
Class 2
± 15%
X8R
Leave the capacitor in ambient conditions for 24±2h
before measurement.
D.F. (Class 2)
Characteristics
X7R: 200% of initial spec. max.
X8R: 200% of initial spec. max.
Voltage conditioning:
Voltage treat the capacitors under testing temperature
and voltage for 1 hour.
Insulation
1,000MΩ or 50MΩ•μF min., whichever
smaller. (As for the capacitors of rated
voltage 16V DC, 1,000 MΩ or 10MΩ•μF
min.,)
Leave the capacitors in ambient condition for 24±2h
before measurement.
Resistance
Use this measurement for initial value.
*As for the initial measurement of capacitors (Class 2) on number 6, 10, 11, 12 and 13, leave capacitor at 150 -10, 0°C for
1 hour and measure the value after leaving capacitor for 24±2h in ambient condition.
TDK MLCC US Catalog
Page 190
Version B11
General
Specifications
C Series – Open Mode Design
Appendix - 1a
Appendix - 1b
P.C. Board for reliability test
P.C. Board for reliability test
Applied for C2012, C3216
Applied for C3225, C4532, C5750
c
100 mm
c
100 mm
Copper
Solder Resist
Slit
Solder Resist
Copper
Appendix - 2
P.C. Board for bending test
100 mm
b
a
Copper
Solder Resist
Material : Glass Epoxy ( As per JIS C6484 GE4 )
P.C. Board thickness: 1.6mm
Case Code
Dimensions (mm)
JIS
EIA
a
b
c
C2012
C3216
C3225
C4532
C5750
CC0805
CC1206
CC1210
CC1812
CC2220
1.2
2.2
2.2
3.5
4.5
4.0
5.0
5.0
7.0
8.0
1.65
2.0
2.9
3.7
5.6
Copper ( thickness 0.035mm )
Solder resist
TDK MLCC US Catalog
Page 191
Version B11
Soldering
Information
C Series – Open Mode Design
• Recommended Soldering Land Pattern
• Recommended Soldering Profile
Chip capacitor
Wave Soldering
Reflow Soldering
Solder land
Soldering
Natural
Natural
cooling
Soldering
Preheating
Preheating
cooling
Peak
Temp
Peak
Temp
C
∆ T
∆T
A
B
Solder resist
0
0
Wave Soldering
Type
Unit: mm
C3216
Over 60 sec.
Over 60 sec.
Over 60 sec.
C2012
Peak Temp time
Peak Temp time
[CC0805]
1.0 - 1.3
1.0 - 1.2
0.8 - 1.1
[CC1206]
2.1 - 2.5
1.1 - 1.3
1.0 - 1.3
Symbol
Manual soldering
(Solder iron)
A
B
C
300
Reflow Soldering
C2012
Unit: mm
C3216
∆T
Type
[CC0805]
0.9 - 1.2
0.7 - 0.9
0.9 - 1.2
[CC1206]
2.0 - 2.4
Symbol
A
Preheating
3sec. (As short as possible)
0
B
C
1.0 - 1.2
1.1 - 1.6
Recommended soldering duration
Reflow Soldering
C3225
Unit: mm
C5750
Wave Soldering
Reflow Soldering
Temp./
Dura.
C4532
[CC1812]
3.1 - 3.7
1.2 - 1.4
2.4 - 3.2
Type
Peak temp
Duration
(sec.)
Peak temp
Duration
[CC1210]
2.0 - 2.4
1.0 - 1.2
1.9 - 2.5
[CC2220]
4.1 - 4.8
1.2 - 1.4
4.0 - 5.0
Symbol
Solder
(°C)
(°C)
(sec.)
A
B
C
Sn-Pb
Solder
250 max.
3 max.
5 max.
230 max.
20 max.
Lead-Free
Solder
260 max.
260 max.
10 max.
• Recommended Solder Amount
Recommended solder compositions
Sn-37Pb (Sn-Pb solder)
Higher tensile
force on the chip
capacitor may
Sn-3.0Ag-0.5Cu (Lead Free Solder)
Excessive
solder
Preheating Condition
cause cracking.
Soldering
Case Size - JIS (EIA)
C2012(CC0805), C3216(CC1206)
Temp. (ºC)
∆T ≤ 150
∆T ≤ 150
∆T ≤ 130
∆T ≤ 150
∆T ≤ 130
Wave
soldering
Maximum amount
Minimum amount
Adequate
solder
C2012(CC0805), C3216(CC1206)
Reflow
soldering
C3225(CC1210), C4532(CC1812),
C5750(CC2220)
Small solder fillet
may cause
C2012(CC0805), C3216(CC1206)
Manual
soldering
Insufficient
solder
contact failure or
failure to hold the
chip capacitor to
the P.C. board.
C3225(CC1210), C4532(CC1812),
C5750(CC2220)
TDK MLCC US Catalog
Page 192
Version B11
Packaging
Information
C Series – Open Mode Design
• Carrier Tape Configuration
Bulk
Bulk
Chips
160mm min
160mm min.
Leader
Drawing direction
400mm min
• Peel Back Force (Top Tape)
• Carrier tape shall be flexible enough to be
wound around a minimum radius of 30mm with
components in tape.
• The missing of components shall be less than
0.1%
Direction & angle of pull
Top cover tape
0.05 – 0.7 N
Carrier tape
• Components shall not stick to the cover tape.
• The cover tape shall not protrude beyond the
edges of the carrier tape and shall not cover the
sprocket holes.
0~15°
• Chip Quantity Per Reel and Structure of Reel (Paper & Plastic)
Paper Carrier Tape & Reel
Plastic Carrier Tape & Reel
Top cover tape
Top cover tape
Pitch hole
Pitch hole
Plastic carrier tape
Paper carrier tape
Bottom cover tape
Case Code
Chip quantity (pcs.)
Chip
Taping Material
Thickness
0.85 mm
1.25 mm
1.15 mm
1.30 mm
1.60 mm
1.15 mm
1.60 mm
2.00 mm
2.30 mm
2.50 mm
1.60 mm
2.00 mm
2.30 mm
1.60 mm
2.00 mm
2.30 mm
2.80 mm
JIS
EIA
φ178mm (7”) reel φ330mm (13”) reel
Paper/Plastic
Plastic
4,000
10,000
2,000
C2012
CC0805
10,000
2,000
C3216
C3225
CC1206
CC1210
Plastic
8,000
10,000
2,000
8,000
Plastic
1,000
5,000
3,000
1,000
C4532
C5750
CC1812
CC2220
Plastic
Plastic
500
1,000
3,000
2,000
500
TDK MLCC US Catalog
Page 193
Version B11
Additional
Information
C Series – Open Mode Design
• Shape & Dimensions
• Environmental Information
TDK Corporation established internal product environmental
assurance standards that include the six hazardous
substances banned by the EU RoHS Directive1 enforced on
July 1, 2006 along with additional substances independently
banned by TDK and has successfully completed making
general purpose electronic components conform to the
RoHS Directive2.
Terminal electrode
W
B
L
G
B
T
1.
Abbreviation for Restriction on Hazardous
Substances, which refers to the regulation EU
Directive 2002/95/EC on hazardous substances by
the European Union (EU) effective from July 1, 2006.
The Directive bans the use of six specific hazardous
substances in electric and electronic devices and
products handled within the EU. The six substances
are lead, mercury, cadmium, hexavalent chromium,
PBB (polybrominated biphenyls), and PBDE
(polybrominated diphenyl ethers).
Internal electrode
Ceramic dielectric
Case Code
JIS EIA
Dimensions (mm)
L
W
T
B
G
0.85
1.25
1.15
1.30
1.60
1.15
1.60
2.00
2.30
2.50
1.60
2.00
2.30
1.60
2.00
2.30
2.80
C2012 CC0805
2.00
1.20
0.20 min. 0.50 min.
2.
This means that, in conformity with the EU Directive
2002/95/EC, lead, cadmium, mercury, hexavalent
chromium, and specific bromine-based flame
retardants, PBB and PBDE, have not been used,
except for exempted applications.
C3216 CC1206
3.20
3.20
1.60
2.50
0.20 min. 1.00 min.
0.20 min.
1.00 min.
For REACH (SVHC : 15 substances according to ECHA /
October 2008) : All TDK MLCC do not contain these
15 substances.
For European Directive 2000/53/CE and 2005/673/CE :
Cadmium, Hexavalent Chromium, Mercury, Lead are
not contained in all TDK MLCC.
For European Directive 2003/11/CE : Pentabromodiphenyl-
ether, Octabromodiphenyl-ether are not contained in
all TDK MLCC.
C3225 CC1210
0.30 min.
C4532 CC1812
C5750 CC2220
4.50
5.70
3.20
5.00
0.20 min. 2.00 min.
0.20 min. 2.00 min.
• Inside Structure & Material System
3
4
5
2
1
No.
NAME
MATERIAL
Class 1
CaZrO3
Class 2
(1)
(2)
(3)
(4)
(5)
Ceramic Dielectric
Internal Electrode
BaTiO3
Nickel (Ni)
Copper (Cu)
Nickel (Ni)
Tin (Sn)
Termination
TDK MLCC US Catalog
Page 194
Version B11
相关型号:
C5750X7R2J224MT
Ceramic Capacitor, Multilayer, Ceramic, 630V, 20% +Tol, 20% -Tol, X7R, 15% TC, 0.22uF, Surface Mount, 2220, CHIP, ROHS COMPLIANT
TDK
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