CGA2B2C0G1H331J050BE [TDK]

Multilayer Ceramic Chip Capacitors;
CGA2B2C0G1H331J050BE
型号: CGA2B2C0G1H331J050BE
厂家: TDK ELECTRONICS    TDK ELECTRONICS
描述:

Multilayer Ceramic Chip Capacitors

文件: 总3页 (文件大小:167K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
1 of 3  
Creation Date : November 09, 2017 (GMT)  
Multilayer Ceramic Chip Capacitors  
CGA2B2C0G1H331J050BE  
TDK item description CGA2B2C0G1H331JT***S  
Applications  
Feature  
Automotive Grade  
Soft Soft Termination  
AEC-Q200 AEC-Q200  
CGA2(1005) [EIA 0402]  
Production  
Series  
Status  
Size  
1.00mm +0.15,-0.05mm  
Length(L)  
Width(W)  
0.50mm +0.10,-0.05mm  
0.50mm +0.10,-0.05mm  
0.10mm Min.  
Thickness(T)  
Terminal Width(B)  
Terminal Spacing(G)  
0.30mm Min.  
Recommended Land Pattern (PA)  
Recommended Land Pattern (PB)  
Recommended Land Pattern (PC)  
0.30mm to 0.50mm  
0.35mm to 0.45mm  
0.40mm to 0.60mm  
Electrical Characteristics  
Capacitance  
330pF ±5%  
50VDC  
Rated Voltage  
Temperature Characteristic  
Q (Min.)  
C0G(0±30ppm/°C)  
1000  
Insulation Resistance (Min.)  
10000MΩ  
Other  
Soldering Method  
AEC-Q200  
Reflow  
Yes  
Packing  
Punched (Paper)Taping [180mm Reel]  
10000pcs  
Package Quantity  
! Images are for reference only and show exemplary products.  
! This PDF document was created based on the data listed on the TDK Corporation website.  
! All specifications are subject to change without notice.  
Copyright(c) TDK Corporation. All rights reserved.  
2 of 3  
Creation Date : November 09, 2017 (GMT)  
Multilayer Ceramic Chip Capacitors  
CGA2B2C0G1H331J050BE  
Characteristic Graphs(This is reference data, and does not guarantee the products characteristics.)  
Impedance  
Capacitance  
CGA2B2C0G1H331J050BE  
CGA2B2C0G1H331J050BE  
DC Bias Characteristic  
Temperature Characteristic  
CGA2B2C0G1H331J050BE(DC Bias  
= 25V)  
CGA2B2C0G1H331J050BE  
CGA2B2C0G1H331J050BE(No Bias)  
! Images are for reference only and show exemplary products.  
! This PDF document was created based on the data listed on the TDK Corporation website.  
! All specifications are subject to change without notice.  
Copyright(c) TDK Corporation. All rights reserved.  
3 of 3  
Creation Date : November 09, 2017 (GMT)  
Multilayer Ceramic Chip Capacitors  
CGA2B2C0G1H331J050BE  
Associated Images  
Land Pattern (Terminal Connection)  
! Images are for reference only and show exemplary products.  
! This PDF document was created based on the data listed on the TDK Corporation website.  
! All specifications are subject to change without notice.  
Copyright(c) TDK Corporation. All rights reserved.  

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