CGA3E3X5R1V334M080AB_17 [TDK]
Multilayer Ceramic Chip Capacitors;
| 型号： | CGA3E3X5R1V334M080AB_17 |
| 厂家： | 
TDK ELECTRONICS |
| 描述： | Multilayer Ceramic Chip Capacitors |
| 文件： | 总3页 (文件大小：234K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
1 of 3
Creation Date : June 26, 2017 (GMT)
Multilayer Ceramic Chip Capacitors
CGA3E3X5R1V334K080AB
TDK item description CGA3E3X5R1V334KT****
Applications
Feature
Automotive Grade
General General (Up to 50V)
AEC-Q200 AEC-Q200
Series
Status
CGA3(1608) [EIA 0603]
Production
Size
1.60mm ±0.10mm
Length(L)
Width(W)
0.80mm ±0.10mm
0.80mm ±0.10mm
0.20mm Min.
Thickness(T)
Terminal Width(B)
Terminal Spacing(G)
0.30mm Min.
0.70mm to 1.00mm(Flow Soldering)
0.60mm to 0.80mm(Reflow Soldering)
Recommended Land Pattern (PA)
Recommended Land Pattern (PB)
Recommended Land Pattern (PC)
0.80mm to 1.00mm(Flow Soldering)
0.60mm to 0.80mm(Reflow Soldering)
0.60mm to 0.80mm(Flow Soldering)
0.60mm to 0.80mm(Reflow Soldering)
Electrical Characteristics
Capacitance
330nF ±10%
35VDC
Rated Voltage
Temperature Characteristic
Dissipation Factor (Max.)
Insulation Resistance (Min.)
X5R(±15%)
5%
1515MΩ
Other
Wave (Flow)
Reflow
Soldering Method
AEC-Q200
Yes
Packing
Punched (Paper)Taping [180mm Reel]
4000pcs
Package Quantity
! Images are for reference only and show exemplary products.
! This PDF document was created based on the data listed on the TDK Corporation website.
! All specifications are subject to change without notice.
Copyright(c) TDK Corporation. All rights reserved.
2 of 3
Creation Date : June 26, 2017 (GMT)
Multilayer Ceramic Chip Capacitors
CGA3E3X5R1V334K080AB
Characteristic Graphs(This is reference data, and does not guarantee the products characteristics.)
Impedance
ESR
CGA3E3X5R1V334K080AB
CGA3E3X5R1V334K080AB
Capacitance
DC Bias Characteristic
CGA3E3X5R1V334K080AB
CGA3E3X5R1V334K080AB
Temperature Characteristic
Ripple Temperature Rising
CGA3E3X5R1V334K080AB(100kHz) CGA3E3X5R1V334K080AB(500kHz) CGA3E3X5R1V334K080AB(1MHz)
CGA3E3X5R1V334K080AB(No
Bias)
CGA3E3X5R1V334K080AB(DC Bias
= 17.5V )
! Images are for reference only and show exemplary products.
! This PDF document was created based on the data listed on the TDK Corporation website.
! All specifications are subject to change without notice.
Copyright(c) TDK Corporation. All rights reserved.
3 of 3
Creation Date : June 26, 2017 (GMT)
Multilayer Ceramic Chip Capacitors
CGA3E3X5R1V334K080AB
Associated Images
Land Pattern (Terminal Connection)
! Images are for reference only and show exemplary products.
! This PDF document was created based on the data listed on the TDK Corporation website.
! All specifications are subject to change without notice.
Copyright(c) TDK Corporation. All rights reserved.
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