CGA4F2C0G1H153J085AE [TDK]

Multilayer Ceramic Chip Capacitors;
CGA4F2C0G1H153J085AE
型号: CGA4F2C0G1H153J085AE
厂家: TDK ELECTRONICS    TDK ELECTRONICS
描述:

Multilayer Ceramic Chip Capacitors

文件: 总3页 (文件大小:168K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
1 of 3  
Creation Date : November 16, 2017 (GMT)  
Multilayer Ceramic Chip Capacitors  
CGA4F2C0G1H153J085AE  
TDK item description CGA4F2C0G1H153JT***S  
Applications  
Feature  
Automotive Grade  
Soft Soft Termination  
AEC-Q200 AEC-Q200  
CGA4(2012) [EIA 0805]  
Production  
Series  
Status  
Size  
2.00mm +0.45,-0.20mm  
Length(L)  
Width(W)  
1.25mm +0.25,-0.20mm  
0.85mm ±0.15mm  
0.20mm Min.  
Thickness(T)  
Terminal Width(B)  
Terminal Spacing(G)  
0.50mm Min.  
1.00mm to 1.30mm(Flow Soldering)  
0.90mm to 1.20mm(Reflow Soldering)  
Recommended Land Pattern (PA)  
Recommended Land Pattern (PB)  
Recommended Land Pattern (PC)  
1.00mm to 1.20mm(Flow Soldering)  
0.70mm to 0.90mm(Reflow Soldering)  
0.80mm to 1.10mm(Flow Soldering)  
0.90mm to 1.20mm(Reflow Soldering)  
Electrical Characteristics  
Capacitance  
15nF ±5%  
50VDC  
Rated Voltage  
Temperature Characteristic  
Q (Min.)  
C0G(0±30ppm/°C)  
1000  
Insulation Resistance (Min.)  
10000MΩ  
Other  
Wave (Flow)  
Reflow  
Soldering Method  
AEC-Q200  
Yes  
Packing  
Punched (Paper)Taping [180mm Reel]  
4000pcs  
Package Quantity  
! Images are for reference only and show exemplary products.  
! This PDF document was created based on the data listed on the TDK Corporation website.  
! All specifications are subject to change without notice.  
Copyright(c) TDK Corporation. All rights reserved.  
2 of 3  
Creation Date : November 16, 2017 (GMT)  
Multilayer Ceramic Chip Capacitors  
CGA4F2C0G1H153J085AE  
Characteristic Graphs(This is reference data, and does not guarantee the products characteristics.)  
Impedance  
Capacitance  
CGA4F2C0G1H153J085AE  
CGA4F2C0G1H153J085AE  
DC Bias Characteristic  
Temperature Characteristic  
CGA4F2C0G1H153J085AE(DC Bias =  
25V)  
CGA4F2C0G1H153J085AE  
CGA4F2C0G1H153J085AE(No Bias)  
! Images are for reference only and show exemplary products.  
! This PDF document was created based on the data listed on the TDK Corporation website.  
! All specifications are subject to change without notice.  
Copyright(c) TDK Corporation. All rights reserved.  
3 of 3  
Creation Date : November 16, 2017 (GMT)  
Multilayer Ceramic Chip Capacitors  
CGA4F2C0G1H153J085AE  
Associated Images  
Land Pattern (Terminal Connection)  
! Images are for reference only and show exemplary products.  
! This PDF document was created based on the data listed on the TDK Corporation website.  
! All specifications are subject to change without notice.  
Copyright(c) TDK Corporation. All rights reserved.  

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