CGA8M4C0G2J333J200KE [TDK]
Multilayer Ceramic Chip Capacitors;
| 型号： | CGA8M4C0G2J333J200KE |
| 厂家： | 
TDK ELECTRONICS |
| 描述： | Multilayer Ceramic Chip Capacitors |
| 文件： | 总3页 (文件大小：168K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
1 of 3
Creation Date : November 22, 2017 (GMT)
Multilayer Ceramic Chip Capacitors
CGA8M4C0G2J333J200KE
TDK item description CGA8M4C0G2J333JT***S
Applications
Automotive Grade
Mid Mid Voltage (100 to 630V)
Soft Soft Termination
Feature
AEC-Q200 AEC-Q200
Series
Status
CGA8(4532) [EIA 1812]
Production
Size
4.50mm +0.50,-0.40mm
Length(L)
Width(W)
3.20mm ±0.40mm
2.00mm +0.30,-0.20mm
0.20mm Min.
Thickness(T)
Terminal Width(B)
Terminal Spacing(G)
Recommended Land Pattern (PA)
Recommended Land Pattern (PB)
Recommended Land Pattern (PC)
3.10mm to 3.70mm
1.20mm to 1.40mm
2.40mm to 3.20mm
Electrical Characteristics
Capacitance
33nF ±5%
630VDC
Rated Voltage
Temperature Characteristic
Q (Min.)
C0G(0±30ppm/°C)
1000
Insulation Resistance (Min.)
10000MΩ
Other
Soldering Method
AEC-Q200
Reflow
Yes
Packing
Blister (Plastic)Taping [180mm Reel]
1000pcs
Package Quantity
! Images are for reference only and show exemplary products.
! This PDF document was created based on the data listed on the TDK Corporation website.
! All specifications are subject to change without notice.
Copyright(c) TDK Corporation. All rights reserved.
2 of 3
Creation Date : November 22, 2017 (GMT)
Multilayer Ceramic Chip Capacitors
CGA8M4C0G2J333J200KE
Characteristic Graphs(This is reference data, and does not guarantee the products characteristics.)
Impedance
Capacitance
CGA8M4C0G2J333J200KE
CGA8M4C0G2J333J200KE
DC Bias Characteristic
Temperature Characteristic
CGA8M4C0G2J333J200KE
CGA8M4C0G2J333J200KE(DC Bias =
315V)
CGA8M4C0G2J333J200KE(No Bias)
! Images are for reference only and show exemplary products.
! This PDF document was created based on the data listed on the TDK Corporation website.
! All specifications are subject to change without notice.
Copyright(c) TDK Corporation. All rights reserved.
3 of 3
Creation Date : November 22, 2017 (GMT)
Multilayer Ceramic Chip Capacitors
CGA8M4C0G2J333J200KE
Associated Images
Land Pattern (Terminal Connection)
! Images are for reference only and show exemplary products.
! This PDF document was created based on the data listed on the TDK Corporation website.
! All specifications are subject to change without notice.
Copyright(c) TDK Corporation. All rights reserved.
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