CGJ3E2C0G2A181J080AA_17 [TDK]
Multilayer Ceramic Chip Capacitors;
| 型号： | CGJ3E2C0G2A181J080AA_17 |
| 厂家： | 
TDK ELECTRONICS |
| 描述： | Multilayer Ceramic Chip Capacitors |
| 文件： | 总3页 (文件大小：181K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
1 of 3
Creation Date : December 12, 2017 (GMT)
Multilayer Ceramic Chip Capacitors
CGJ3E2C0G2A181J080AA
TDK item description CGJ3E2C0G2A181JT****
Applications
Feature
High Reliability Grade
Mid Mid Voltage (100 to 630V)
AEC-Q200 AEC-Q200
Series
Status
CGJ3(1608) [EIA 0603]
Production (Not Recommended for New Design)
Size
Length(L)
1.60mm ±0.10mm
Width(W)
0.80mm ±0.10mm
0.80mm ±0.10mm
0.20mm Min.
Thickness(T)
Terminal Width(B)
Terminal Spacing(G)
0.30mm Min.
0.70mm to 1.00mm(Flow Soldering)
0.60mm to 0.80mm(Reflow Soldering)
Recommended Land Pattern (PA)
Recommended Land Pattern (PB)
Recommended Land Pattern (PC)
0.80mm to 1.00mm(Flow Soldering)
0.60mm to 0.80mm(Reflow Soldering)
0.60mm to 0.80mm(Flow Soldering)
0.60mm to 0.80mm(Reflow Soldering)
Electrical Characteristics
Capacitance
180pF ±5%
100VDC
Rated Voltage
Temperature Characteristic
Q (Min.)
C0G(0±30ppm/°C)
1000
Insulation Resistance (Min.)
10000MΩ
Other
Wave (Flow)
Reflow
Soldering Method
AEC-Q200
Yes
Packing
Punched (Paper)Taping [180mm Reel]
4000pcs
Package Quantity
! Images are for reference only and show exemplary products.
! This PDF document was created based on the data listed on the TDK Corporation website.
! All specifications are subject to change without notice.
Copyright(c) TDK Corporation. All rights reserved.
2 of 3
Creation Date : December 12, 2017 (GMT)
Multilayer Ceramic Chip Capacitors
CGJ3E2C0G2A181J080AA
Characteristic Graphs(This is reference data, and does not guarantee the products characteristics.)
Impedance
ESR
CGJ3E2C0G2A181J080AA
CGJ3E2C0G2A181J080AA
Capacitance
DC Bias Characteristic
CGJ3E2C0G2A181J080AA
CGJ3E2C0G2A181J080AA
Temperature Characteristic
CGJ3E2C0G2A181J080AA(DC Bias =
50V )
CGJ3E2C0G2A181J080AA(No Bias)
! Images are for reference only and show exemplary products.
! This PDF document was created based on the data listed on the TDK Corporation website.
! All specifications are subject to change without notice.
Copyright(c) TDK Corporation. All rights reserved.
3 of 3
Creation Date : December 12, 2017 (GMT)
Multilayer Ceramic Chip Capacitors
CGJ3E2C0G2A181J080AA
Associated Images
Land Pattern (Terminal Connection)
! Images are for reference only and show exemplary products.
! This PDF document was created based on the data listed on the TDK Corporation website.
! All specifications are subject to change without notice.
Copyright(c) TDK Corporation. All rights reserved.
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