CGJ4C2C0G1H181J060AA_17 [TDK]
Multilayer Ceramic Chip Capacitors;型号: | CGJ4C2C0G1H181J060AA_17 |
厂家: | TDK ELECTRONICS |
描述: | Multilayer Ceramic Chip Capacitors |
文件: | 总3页 (文件大小:183K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
1 of 3
Creation Date : December 11, 2017 (GMT)
Multilayer Ceramic Chip Capacitors
CGJ4C2C0G1H181J060AA
TDK item description CGJ4C2C0G1H181JT****
Applications
Feature
High Reliability Grade
General General (Up to 50V)
AEC-Q200 AEC-Q200
Series
Status
CGJ4(2012) [EIA 0805]
Production (Not Recommended for New Design)
Size
Length(L)
2.00mm ±0.20mm
Width(W)
1.25mm ±0.20mm
0.60mm ±0.15mm
0.20mm Min.
Thickness(T)
Terminal Width(B)
Terminal Spacing(G)
1.00mm Min.
1.00mm to 1.30mm(Flow Soldering)
0.90mm to 1.20mm(Reflow Soldering)
Recommended Land Pattern (PA)
Recommended Land Pattern (PB)
Recommended Land Pattern (PC)
1.00mm to 1.20mm(Flow Soldering)
0.70mm to 0.90mm(Reflow Soldering)
0.80mm to 1.10mm(Flow Soldering)
0.90mm to 1.20mm(Reflow Soldering)
Electrical Characteristics
Capacitance
180pF ±5%
50VDC
Rated Voltage
Temperature Characteristic
Q (Min.)
C0G(0±30ppm/°C)
1000
Insulation Resistance (Min.)
10000MΩ
Other
Wave (Flow)
Reflow
Soldering Method
AEC-Q200
Yes
Packing
Punched (Paper)Taping [180mm Reel]
4000pcs
Package Quantity
! Images are for reference only and show exemplary products.
! This PDF document was created based on the data listed on the TDK Corporation website.
! All specifications are subject to change without notice.
Copyright(c) TDK Corporation. All rights reserved.
2 of 3
Creation Date : December 11, 2017 (GMT)
Multilayer Ceramic Chip Capacitors
CGJ4C2C0G1H181J060AA
Characteristic Graphs(This is reference data, and does not guarantee the products characteristics.)
Impedance
ESR
CGJ4C2C0G1H181J060AA
CGJ4C2C0G1H181J060AA
Capacitance
DC Bias Characteristic
CGJ4C2C0G1H181J060AA
CGJ4C2C0G1H181J060AA
Temperature Characteristic
CGJ4C2C0G1H181J060AA(DC Bias =
25V )
CGJ4C2C0G1H181J060AA(No Bias)
! Images are for reference only and show exemplary products.
! This PDF document was created based on the data listed on the TDK Corporation website.
! All specifications are subject to change without notice.
Copyright(c) TDK Corporation. All rights reserved.
3 of 3
Creation Date : December 11, 2017 (GMT)
Multilayer Ceramic Chip Capacitors
CGJ4C2C0G1H181J060AA
Associated Images
Land Pattern (Terminal Connection)
! Images are for reference only and show exemplary products.
! This PDF document was created based on the data listed on the TDK Corporation website.
! All specifications are subject to change without notice.
Copyright(c) TDK Corporation. All rights reserved.
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