FFE1070MS10SGL [TDK]
Ceramic BPF, 10.7MHz, ROHS COMPLIANT, CERAMIC PACKAGE-3;
| 型号： | FFE1070MS10SGL |
| 厂家： | 
TDK ELECTRONICS |
| 描述： | Ceramic BPF, 10.7MHz, ROHS COMPLIANT, CERAMIC PACKAGE-3 |
| 文件： | 总3页 (文件大小：53K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Piezoelectronic Ceramic Filters
Lead type
10.7MHz
FFE series
Issue date:
August 2007
• All specifications are subject to change without notice.
• Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific
bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications.
(1/2)
Conformity to RoHS Directive
Ceramic Filters
FFE Series(Lead)
FEATURES
PRODUCT IDENTIFICATIONS
FFE 1070 MA 11
(1) (2) (3) (4) (5) (6) (7)
• To small dispersion of center frequency in our products, devices
in a single rank can be supplied. Consequently, adjustment-free
IC circuits are easy produced.
U
X
L
(1) Series name
FFE
• Because of the small characteristic dependence on temperature,
IF circuit can be made to have a highly stabilized
temperature(Temperature coefficient of center frequency :
50ppm/°C).
Ceramic filter
(2) Center frequency
1060
1070
1080
10.600MHz
10.700MHz
10.800MHz
• The size and weight are small and light.
• Because of the small loss dispersion as well as the low loss
characteristics, a product of high sensitivity can be
manufactured in the form of set.
(3) 3dB band width(BW3)
• Ammo packing is available for various automatic insert machine
(1800pieces/box). Short lead type and L-bend lead type are also
available, please contact TDK.
MA
NA
MS
MJ
280 50kHz
230 50kHz
180 40kHz
150 40kHz
• The products do not contain lead at solder of internal joint and
solder plating of lead wire. You can use both Pb free solder (Sn-
3Ag-0.5Cu) and Sn-Pb eutectic solder on your production.
(4) Center frequency tolerance
10
11
20kHz
30kHz
SHAPES AND DIMENSIONS
.
8.0max.
4 0max.
Color code
(5) Packaging style for product type
Shapes dimensions
Date code
BW3 symbol
Packaging
(mm)max.
Width
7.0
Symbol
107MS
TDK
style
Height
7.0
MA NA MS MJ
U
S
F
Bulk
3
3
8.0
7.0
Bulk
3
3
8.0
7.0
Bulk
3
3
H
R
T
7.0
8.0
8.0
7.0
7.0
7.5
Ammo pack
Ammo pack
Ammo pack
3
3
3
2
1
(
)
(
)
(
)
Out GND In
2.5 0.3
2.5 0.3
ø0.55 0.1
Dimensions in mm
(6) Electrical characteristics
BW3 symbol
Symbol
Classification
CIRCUIT DIAGRAM
MA
3
NA
3
MS
MJ
A
Low loss
3
3
1
3
B
Standard
3
3
X
Standard
3
3
Others
Custom made
(7) Lead length
2
L
5.0+0.5, –1.0mm Taping (Ammo pack)
3.0 0.5mm
M
Others
Custom made
MEASUREMENT CIRCUIT
R1
1
3
R2
NWA
NWA
DUT
2
50Ω
V
R1=R2=280Ω
Reference Level: Short condition between 1 and 3 without DUT.
• Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific
bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications.
• All specifications are subject to change without notice.
002-01 / 20070815 / ef12_ffe.
(2/2)
ELECTRICAL CHARACTERISTICS
3dB band width
(kHz)
20dB band width
(kHz)max.
Insertion loss
(dB)max.
SPR attenuation
(dB)min.
Part No.
Standard type
FFE1070MA11UXL
FFE1070NA11UXL
FFE1070MS11SBL
FFE1070MJ11FBL
Low loss type
280 50
230 50
180 40
150 40
600
570
520
400
6.0
6.0
7.0
35
35
35
35
10.0
FFE1070MA11UAL
FFE1070NA11UAL
FFE1070MS11SAL
FFE1070MJ11FAL
Group delay time control type
FFE1070NA10UGL∗
FFE1070MS10SGL∗
280 50
230 50
180 40
150 40
600
570
520
400
5.0
4.5
5.0
7.0
35
35
35
35
230 50
180 40
570
520
6.0
7.0
35
35
∗ Group delay time: 0.50max.
RELIABILITY AND TEST CONDITIONS
The following test items are satisfied.
(1) Center frequency: Within 30kHz
(2) 3dB band width: Within 20kHz
(3) 20dB band width: Within 30kHz
(4) Insertion loss: Within 2dB
SOLDERABILITY
The lead wires are adopted Pb free plating wire to apply Pb free
soldering. You can also use current Sn-Pb eutectic solder.
Test conditions
Test result
With Rosin-methanol 25% by weight, dip in Sn-Pb 95% minimum of
eutectic solder bath at 230 5°C for 3 0.5sec. or surface should be
Pb free solder(Sn-3Ag-0.5Cu) bath at 245 2°C
for 3 0.2sec.
covered by new solder.
(5) Attenuation: 25dB min.
Test items
Test conditions
Low temperature
storage characteristics
High temperature
storage characteristics
Temperature: –40 3°C
Time: 100h
Temperature: +85 2°C
Time: 100h
RECOMMENDED SOLDERING CONDITIONS
This is the fit product for flow soldering.
Loading: DC.5V(between in/out and
ground terminal)
Humidity: 90 to 95(%)RH
Temperature: 60 2°C
FLOW SOLDERING CONDITION
Heat-resistant temperature
Heat-resistant time
Number of times
260 5°C
10 1sec.
1time
Humidity resistance
Time: 100h
Thermal shock
Soldering heat resistance
–40°C (30min), 85°C (30min) x 5 cycles
Solder temperature: peak 260°C, 10s flow
Drop 3 times onto a hard wooden board
from a height of 1m
Drop
Frequency: 10 ⇔55 ⇔10Hz/Ampli-
Vibration
tude: 1.5mm
X, Y and Z directions for 2h each
• All specifications are subject to change without notice.
002-01 / 20070815 / ef12_ffe.
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