GYPRO3300 [TDK]
陀螺仪;型号: | GYPRO3300 |
厂家: | TDK ELECTRONICS |
描述: | 陀螺仪 CD |
文件: | 总23页 (文件大小:2125K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
Tronic’s Microsystems S.A.
98 rue du Pré de l’Horme, 38920 Crolles, France
Phone: +33 (0)4 76 97 29 50
www.tronicsgroup.com
GYPRO3300 Datasheet
Features
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Digital angular rate sensor with SPI interface
Angular rate measurement around Z-axis (yaw)
±300°/sec input range
Ultra low noise
Excellent bias instability
Low latency
24 bit angular rate output
Embedded temperature sensor for on-chip or
external temperature compensation
Built-in Self-Test
General Description
GYPRO® product line is an established family of Micro-Electro-
Mechanical Systems (MEMS) angular rate sensor specifically
designed for demanding applications.
•
•
•
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5V single supply voltage
Low operating current consumption: 25mA
CLCC 30 package: 19.6 mm x 11.5 mm x 3.7 mm
Weight : 2 grams
The MEMS transducer is manufactured using Tronics
proprietary vacuum wafer-level packaging technology based on
micro-machined thick single crystal silicon.
REACH and RoHS compatible
The integrated circuit (IC) provides a stable primary anti-
phase vibration of the ‘drive’ proof masses, thanks to
electrostatic comb drives. When the sensor is subjected to a
rotation, the Coriolis force acts on the ‘sense’ proof masses and
Applications
Precision instrumentation
Platform stabilization
GPS assistance
Guidance and control
IMU, AHRS and navigation systems
Unmanned vehicles and Autonomous systems
3D mapping
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forces them into
a secondary anti-phase movement
perpendicular to the direction of drive vibration, which is itself
counter-balanced by electrostatic forces. The sense closed loop
operates as an electromechanical ΣΔ modulator providing a
digital output. This output is finally demodulated using the
drive reference signal.
The sensor is factory calibrated and compensated for
temperature effects to provide high-accuracy digital output
over a broad temperature range.
Marine electronics
Robotics
Raw data output can be also chosen to enable customer-made
compensations.
GYPRO® Product references
Part Number
G2300
G2310
G3300
Improved vibration
tolerance & ultra-low
delay configuration
1ms
G4300
Improved bias thermal
stability & reduced
dimensions
1ms
Low delay
configuration
Description
Standard configuration
Latency
Vibration range
Bandwidth
40ms
4g rms
100Hz
2ms
4g rms
>200Hz
8g rms
>200Hz
8g rms
>200Hz
Datarate
200Hz
1700Hz
1800Hz
1800Hz
Angular Random Walk
Size (L x l x h)
Package
0.14°/√hr
19 x 11 x 3mm
CLCC 30
0.14°/√hr
19 x 11 x 3mm
CLCC 30
0.15°/√hr
19 x 11 x 4mm
CLCC 30
0.10°/√hr
12 x 12 x 6mm
28 pins J-Lead
Disclaimer
Information furnished by Tronics is believed to be accurate and reliable. However, no responsibility is assumed by Tronics for its
use, nor for any infringements of patents or other rights of third parties that may result from its use.
Specification subject to change without notice.
Copyright 2021 Tronic’s Microsystems S.A.. All rights reserved.
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Specification subject to change without notice.
Tronic’s Microsystems S.A.
98 rue du Pré de l’Horme, 38920 Crolles, France
Phone: +33 (0)4 76 97 29 50
www.tronicsgroup.com
GYPRO3300 Datasheet
No license is granted by implication or otherwise under any patent or patent rights of Tronics. Trademarks and registered
trademarks are the property of their respective owners.
Contents
Features ................................................................................................................................................................................... 1
Applications ............................................................................................................................................................................. 1
General Description ................................................................................................................................................................. 1
GYPRO® Product references..................................................................................................................................................... 1
Disclaimer ................................................................................................................................................................................ 1
Block diagram ............................................................................................................................................................................... 3
Overall Dimensions....................................................................................................................................................................... 3
1.
2.
3.
4.
Specifications................................................................................................................................................................. 4
Maximum Ratings.......................................................................................................................................................... 6
Typical performances..................................................................................................................................................... 7
Interface ........................................................................................................................................................................ 9
4.1. Pinout, sensitive axis identification................................................................................................................................... 9
4.2. Application circuit.............................................................................................................................................................. 9
4.3. Input/Output Pin Definitions........................................................................................................................................... 10
Recommendations....................................................................................................................................................... 11
5.1. Soldering.......................................................................................................................................................................... 11
5.2. Multi-sensor integration.................................................................................................................................................. 12
Digital SPI interface...................................................................................................................................................... 13
6.1. Electrical and Timing Characteristics............................................................................................................................... 13
6.2. SPI frames description..................................................................................................................................................... 14
6.3. Angular rate readings ...................................................................................................................................................... 14
6.4. Temperature readings..................................................................................................................................................... 14
6.5. Advanced use of SPI registers.......................................................................................................................................... 15
Angular rate calibration procedure.............................................................................................................................. 17
7.1. Algorithm overview ......................................................................................................................................................... 17
7.2. Programming of the new coefficients ............................................................................................................................. 18
7.3. Switch to uncompensated data output........................................................................................................................... 19
Temperature Sensor Calibration Procedure ................................................................................................................. 20
8.1. Temperature sensor calibration model........................................................................................................................... 20
8.2. Recommended Procedure............................................................................................................................................... 20
Device Identification / Ordering information............................................................................................................... 21
9.1. Device identification........................................................................................................................................................ 21
9.2. Ordering information ...................................................................................................................................................... 21
5.
6.
7.
8.
9.
10. Internal construction and Theory of Operation............................................................................................................ 22
11. Available Tools and Resources..................................................................................................................................... 23
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Tronic’s Microsystems S.A.
98 rue du Pré de l’Horme, 38920 Crolles, France
Phone: +33 (0)4 76 97 29 50
www.tronicsgroup.com
GYPRO3300 Datasheet
Block diagram
Overall Dimensions
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Specification subject to change without notice.
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Tronic’s Microsystems S.A.
98 rue du Pré de l’Horme, 38920 Crolles, France
Phone: +33 (0)4 76 97 29 50
www.tronicsgroup.com
GYPRO3300 Datasheet
1. Specifications
Parameter
Unit
Typ.
Max
Notes
Measurement Ranges
Input range*
Electronic clamping is applied and sensors will saturate before
±500°/s.
°/s
°C
±300
±450
Temperature range *
Bias
-40 to +85
Bias instability
°/h
°/h
0.8
10
3**
Lowest point of Allan variance curve at room temperature.
Bias in-run (short term)
stability
30**
Standard deviation of the 1 second filtered output over 1 hour
at room temperature, after 30 min of stabilization.
Bias temperature variations
(1σ), calibrated *
°/s
0.02
0.05
Standard deviation of the bias over the specified temperature
range. Factory calibration is performed in test socket. As printed
circuit board reflow soldering may cause shifts in bias
temperature variations, it may be necessary to do an on-board
calibration after soldering, depending on applications
requirements.
Bias run to run repeatability
°/h
10
Standard deviation of 7 bias measurements at 30°C that occurs
between seven runs of operation with 30 minutes power off
between each run.
Vibration rectification
coefficient
°/h/g²
0.5
Bias rectification under operating vibration, overall level 7.3 g
rms, test condition B, method 2026, MIL-STD-883F.
Scale Factor (tested on ±300°/s range)
Scale Factor *
LSB/°/s
%
10 000
0.04
Nominal scale factor.
Scale Factor temperature
variations (1σ), calibrated *
0.15
500
Standard deviation of the scale factor over the specified
temperature range.
Scale Factor run to run
repeatability
ppm
ppm
25
Standard deviation of 7 scale factor measurements at 30°C that
occurs between seven runs of operation with 30 minutes power
off between each run.
Scale factor non linearity*
100
Maximum deviation of the output from the expected value using
a best fit straight line, at room temperature.
Noise
RMS Noise [1-100Hz] *
°/s
0.03
0.05
RMS noise level in the band [1-100Hz], obtained by integrating
the power spectral density of the sensor output between 1 and
100Hz at zero rate and room temperature.
Angular random walk
Frequency response
Bandwidth
°/√h
0.15
0.3**
-1/2 slope of Allan variance curve at room temperature.
Hz
Hz
Hz
ms
>200Hz
Defined as the frequency for which attenuation is equal to -3dB
Drive resonant frequency of the sensor, at room temperature
Refresh rate of the output data at room temperature.
Resonant frequency
Data Rate
10 700 to 12 100
1700 to 1900
0.92
Latency
Time interval between the implementation of a rate signal on
the input and the availability of the corresponding data on the
output.
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Tronic’s Microsystems S.A.
98 rue du Pré de l’Horme, 38920 Crolles, France
Phone: +33 (0)4 76 97 29 50
www.tronicsgroup.com
GYPRO3300 Datasheet
Parameter
Unit
Typ.
Max
Notes
Start-up Time
s
0.5
1**
Time interval between application of power on and the
availability of an output signal (at least 90% of the input rate), at
room temperature.
Linear acceleration
G sensitivity
°/h/g
ms
15
10
40**
16
Mean value on all axis of output variation under 1 g.
Recovery time
Time interval between an impact (half sine 50 g, 6 ms) and the
presence of a usable output of the sensor.
Axis alignment
Rate axis misalignment
mrad
Misalignment between the sensitive axis and the normal to the
package bottom plane, by design.
Environmental
Storage temperature range
Humidity at 45°C
°C
%
--
-55 to +100
<98
1
Moisture Sensitivity Level
(MSL)
Unlimited floor life out of the bag (hermetic package).
Half sine.
Shock (operating)
Shock (survival)
g | ms
g | ms
grms
50 | 6
2000 | 0.3
Vibrations (operating)
Vibrations (survival)
Electrical
7.3
20
test condition B, method 2026, MIL-STD-883F.
grms
Power Supply Voltage
V
4.75 to 5.25
25
Current consumption
(normal mode)
mA
Current consumption
(power down mode)
µA
1
<5
Power down mode is activated by switching EN pin to GND.
Power supply rejection ratio
Temperature sensor
°/h/V
40
Scale Factor (raw data)
LSB/°C
LSB
85
Temperature sensor is not factory-calibrated.
Temperature sensor is not factory-calibrated.
25°C typical output (raw
data)
8000
Refresh rate
Reliability
MTBF
Hz
Hr
6
270 000
Predictive elapsed time between inherent failures of the sensor
during normal system operation.
Table 1 Specifications
* 100% tested in production.
** Unless otherwise specified, max values are ±3 sigma variation limits from validation test population.
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Tronic’s Microsystems S.A.
98 rue du Pré de l’Horme, 38920 Crolles, France
Phone: +33 (0)4 76 97 29 50
www.tronicsgroup.com
GYPRO3300 Datasheet
2. Maximum Ratings
Stresses higher than the maximum ratings listed below may cause permanent damage to the device, or affect its reliability.
Functional operation is not guaranteed once stresses higher than the maximum ratings have been applied.
Exposure to maximum ratings conditions for extended periods may also affect device reliability.
Parameter
Unit
V
Min
Max
Supply Voltage
-0.5
+7
±2
Electrostatic Discharge (ESD) protection, any pin, Human Body Model
Storage temperature range
Shock survival
kV
°C
--
-55
+100
2000
20
g
--
--
Vibrations survival, 20-2000Hz
Ultrasonic cleaning
grms
Not allowed
Table 2 Maximum ratings
Caution!
The product may be damaged by ESD, which can cause performance degradation or device failure! We
recommend handling the device only on a static safe work station. Precaution for the storage should also
be taken.
The sensor MUST be powered-on before any SPI operation, as shown in Figure 1 below. Having the SPI
pads, VDDIO or EN at a high level while VDD is at a low level could damage the sensor, due to ESD
protection diodes and buffers.
Sensor product stresses at or above those listed under Table 2 Maximum ratings, may cause permanent
damage and may affect product reliability.
Figure 1: Recommended voltage sequence.
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Tronic’s Microsystems S.A.
98 rue du Pré de l’Horme, 38920 Crolles, France
Phone: +33 (0)4 76 97 29 50
www.tronicsgroup.com
GYPRO3300 Datasheet
3. Typical performances
Figure 2 Distribution of bias over temperature
Figure 5 Bias variation over temperature (4 samples)
Figure 3 Distribution of scale factor over temperature
Figure 6 Scale factor variation over temperature (4 samples)
Figure 4 Distribution of scale factor non linearity (RT)
Figure 7 Scale factor non linearity over temperature (5 samples)
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Tronic’s Microsystems S.A.
98 rue du Pré de l’Horme, 38920 Crolles, France
Phone: +33 (0)4 76 97 29 50
www.tronicsgroup.com
GYPRO3300 Datasheet
Figure 11 Noise density (RT)
Figure 12 Start-up time variation over temperature
Figure 13 Allan variance (RT)
Figure 8 Distribution of RMS Noise (RT)
Figure 9 Distribution of Start-Up time (RT)
Figure 10 Run to run bias repeatability (30°C)
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98 rue du Pré de l’Horme, 38920 Crolles, France
Phone: +33 (0)4 76 97 29 50
www.tronicsgroup.com
GYPRO3300 Datasheet
4.2. Application circuit
4. Interface
4.1. Pinout, sensitive axis identification
Figure 16: Recommended Application Schematic (top view)
Notes:
•
All capacitances of Figure 16 should be placed as
close as possible to their corresponding pins, except
the 100nF capacitance between VDD and GND,
which should be as close as possible to the board’s
supply input.
•
•
The 100µF filtering capacitance between GREF and
GND should have low Equivalent Series Resistance
(ESR < 1Ω) and low leakage current (< 6µA). A
tantalum capacitor is recommended.
5.6µF and 330nF filtering capacitance between PLLF
and GND should have a low leakage current (<1µA).
Figure 14: How to locate Pin 1
Figure 15: GYPRO3300 Sensors Pinout (bottom view)
Figure 17: Recommended Pad Layout in mm (top view)
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98 rue du Pré de l’Horme, 38920 Crolles, France
Phone: +33 (0)4 76 97 29 50
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GYPRO3300 Datasheet
4.3. Input/Output Pin Definitions
Pin name
Pin number
Pin type
Pin
direction
Pin levels
Function
1, 2, 3, 9, 26 ,
28, 29, 30
8, 10, 25
GND
VDD
Supply
Supply
n/a
n/a
0V
Power Ground
+5V
Power Supply
External decoupling pad. MUST be
connected to the board’s VSS
through a 100µF external capacitor,
in order to ensure low noise.
GREF
4
Analog
n/a
4.4V
VDD with pull up
of 100kΩ
EN
6
Digital
Analog
Input
Enable command. Active high.
External filtering pad. MUST be
connected to a filtering stage,
described in Figure 16.
PLLF
11
Output
0.8V
Self-test status. Logic “1” when the
sensor is OK.
ST
15
16
Digital
Digital
Output
Input
VDD
VDD with pull-
up of 100kΩ
Reset. Reloads the internal
calibration data. Active low
Data Ready flag. Generates a pulse
when a new angular rate data is
available.
RSTB
DRY
19
Digital
Output
VDD
SSB
20
21
22
23
Digital
Digital
Digital
Digital
Input
Input
Input
Output
VDD
VDD
VDD
VDD
Slave Selection signal. Active low
SPI clock signal
Master Output Slave Input signal
Master Input Slave Output signal
Do Not electrically Connect.
These pins provide additional
mechanical fixing to the board and
should be soldered to an
SCLK
MOSI
MISO
5, 7, 12, 13,
14, 17, 18, 24, --
27
DNC
--
--
unconnected pad.
Table 3: Pin Functions
Note: The digital pads maximum ratings are GND-0.3V and VDD+0.3V.
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98 rue du Pré de l’Horme, 38920 Crolles, France
Phone: +33 (0)4 76 97 29 50
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GYPRO3300 Datasheet
5. Recommendations
5.1. Soldering
Please note that the reflow profile to be used does not depend only on the sensor. The whole populated board characteristics
shall be taken into account.
MEMS components are sensitive to mechanical stress coming from the Printed Circuit Board (PCB) during the soldering reflow.
This stress is caused by the mismatch between the Coefficient of Thermal Expansion (CTE) of the ceramic package and the PCB
and can affect the Bias temperature variations. In order to achieve the best performance, it is recommended to do an on-board
calibration after the soldering of the sensor.
For a better reliability of the soldering, Tronics recommends using Copper-Invar-Copper or ceramic boards. These types of boards
have a coefficient of thermal expansion (CTE) close to the CTE of GYPRO3300 package (6.8 ppm/°C).
Figure 18: Reflow Profile, according to IPC/JEDEC J-STD-020D.1
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98 rue du Pré de l’Horme, 38920 Crolles, France
Phone: +33 (0)4 76 97 29 50
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GYPRO3300 Datasheet
Profile Feature
Time maintained above
Temperature (TL)
Time (tL)
Peak Temperature (Tp)
Time within 5°C of Actual Peak Temperature (tp)
183°C
60-150 sec
240°C (+/-5°C)
10-30 sec
Table 4: Reflow Profile Details, according to IPC/JEDEC J-STD-020D.1
5.2. Multi-sensor integration
Mechanical coupling between drive frequencies of several sensors can affect performance at system level, for example within
Inertial Measurement Units. Customer has to take care of such coupling during system design and validation.
5.3. Traceability
Label integrity has been validated with Vigon® and IPA. For other chemical treatment, the label integrity is not guaranteed.
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98 rue du Pré de l’Horme, 38920 Crolles, France
Phone: +33 (0)4 76 97 29 50
www.tronicsgroup.com
GYPRO3300 Datasheet
6. Digital SPI interface
6.1. Electrical and Timing Characteristics
The device acts as a slave supporting only SPI “mode 0” (clock polarity CPOL=0, clock phase CPHA=0).
Figure 19: SPI timing diagram
Symbol
Parameter
Condition
Unit
Min
Typ
Max
Electrical characteristics
VIL
Low level input voltage
VDD
VDD
V
0
0.1
1
VIH
High level input voltage
Low level output voltage
High level output voltage
Pull-up resistor
0.8
VOL
ioL=0mA (Capacitive Load)
GND
VDD
100
-
VOH
Rpull_up
ioH=0mA (Capacitive Load)
V
Internal pull-up resistance to VDD
Internal pull-down resistance to GND
kΩ
kΩ
Rpull_down
Pull-down resistor
Timing parameters
Fspi
SPI clock input frequency
SCLK low pulse
Maximal load 25pF on MOSI or MISO
MHz
ns
0.2
8
T_low_sclk
T_high_sclk
T_setup_mosi
T_hold_mosi
T_delay_miso
T_setup_ssb
T_hold_ssb
62.5
62.5
10
SCLK high pulse
MOSI setup time
MOSI hold time
MISO output delay
SSB setup time
ns
ns
ns
5
Load 25pF
ns
40
Tsclk
1
1
Tsclk
SSB hold time
Table 5: SPI timing parameters
The MISO pin is kept in high impedance when the SSB level is high, which allows sharing the SPI bus with other components.
IMPORTANT NOTE: It is forbidden to keep SPI pads at a high level while VDD is at 0V due to ESD protection diodes and buffers.
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Phone: +33 (0)4 76 97 29 50
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GYPRO3300 Datasheet
6.2. SPI frames description
-450.0000 °/s
…
-300.0000 °/s
…
-0.0002 °/s
-0.0001 °/s
0.0000 °/s
+0.0001 °/s
+0.0002 °/s
…
1011 1011 0101 0101 1110 0000
1101 0010 0011 1001 0100 0000
The SPI frames used for the communication through the SPI
Register are composed of an instruction followed by
arguments. The SPI instruction is composed of 1 byte, and the
arguments are composed of 2, 4 or 8 bytes, depending on the
cases, as can be seen in Table 6 below.
1111 1111 1111 1111 1111 1110
1111 1111 1111 1111 1111 1111
0000 0000 0000 0000 0000 0000
0000 0000 0000 0000 0000 0001
0000 0000 0000 0000 0000 0010
+300.0000 °/s
…
+450.0000 °/s
0010 1101 1100 0110 1100 0000
0100 0100 1010 1010 0010 0000
Figure 20: SPI Message Structure
Table 7: Conversion table for calibrated angular rate output
Instruction Argument
Meaning
0x50
0x54
0x58
0x78
0x7C
0x00000000 (n=4) Read Angular Rate
6.3.2.
Data Ready (DRY) bit
0x0000 (n=2)
Read Temperature
The Data Ready bit is a flag which is raised when a new angular
rate data is available. The flag stays raised until the new data is
read.
0x00000000 (n=4)
Advanced commands.
0xXXXXXXXX (n=8) See Section 6.5 for more
Similarly to the Data Ready pin, the Data Ready bit signal can
be used as an interrupt signal to optimize the delays between
newly available data and their readings.
details.
0xXXXX (n=2)
Table 6: Authorized SPI commands
6.3.3.
Self-Test (ST) bit
6.3. Angular rate readings
The ST bit raises a flag (1 logic) at the same frequency as the
angular rate output data rate indicating whether the sensor is
properly operating (i.e. whether the drive loop control provides
stable drive oscillations amplitude).
From the 32-bits (4 bytes) frame obtained after the “Read
Angular Rate” instruction, the 24-bits word of angular rate data
(RATE) must be extracted as shown below in Figure 21.
DRY and ST are respectively the “data ready” and “self-test”
bits, also directly available on Pins 19 and 16 of the sensor.
The self-test procedure is running in parallel to the main
functions of the sensor.
The ST data is also available on the pin 15. This pin is set to
VDD when the sensor is working properly.
6.4. Temperature readings
Figure 21: Angular rate reading frames and data organization
The temperature data is an unsigned integer, 14-bits word
(TEMP). It must be extracted from the 2 bytes of read data, as
shown below in Figure 22.
6.3.1.
Angular rate (RATE) output
The 24-bit gyro output is coded in two’s complement
(Table 7).
•
If the temperature compensation is not enabled
(GOUT_SEL=0), then the user should perform scale
factor measurements.
Figure 22: Temperature reading frames and data organization
•
If the temperature compensation of the angular
rate output is enabled (default case), dividing the
24-bit value by a factor 10 000 results in the angular
rate in °/s, as shown in Table 7.
By default the temperature sensor is not factory-calibrated
(TOUTSEL=0).
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GYPRO3300 Datasheet
6.5. Advanced use of SPI registers
SPI registers can also be used to access the System register or the MTP (Multi-Time-Programmable memory).
6.5.1.
R/W access to the System Registers
IMPORTANT NOTE: Modifications to the system registers are reversible. Modified registers will not be restored after a RESET.
There is no limitation to the number of times the system registers can be modified.
Figure 23: Sequence of instructions to READ address 0xMM of the system registers
Figure 24: Sequence of instructions to WRITE ‘0xXXXXXXXX’ to address ‘0xMM’ of the system registers
6.5.2.
R/W access to the MTP
IMPORTANT NOTE: Modifications to the MTP are non-reversible. Modified parameters will be restored, even after a RESET, and
previous values of the MTP cannot be accessed anymore. The maximum number of times the MTP can be written depends on the
address:
•
5 times for the angular rate calibration coefficients (see Section 7 for more details)
•
Only 1 time for all the other coefficients, including the temperature sensor calibration coefficients.
Figure 25 : Sequence of instructions to READ address 0xMM of the MTP
Figure 26: Sequence of instructions to WRITE data ‘0xXXXXXXXX’ to address ‘0xMM’ of the MTP
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Phone: +33 (0)4 76 97 29 50
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GYPRO3300 Datasheet
6.5.3.
Useful Sensor Parameters
The instructions given in Sections 6.5.1 and 6.5.2 can be used to read and/or to modify the sensor’s useful parameters given in
Table 8 below.
Parameter
Address M
(System
Bits
Encoding
Meaning
Register &
MTP)
Sensor Identification
UID 0x03
[31:0]
Tronics reserved Sensor ‘Unique Identification’ number
Temperature output compensation
TOUT_SEL
0x04
0x04
0x04
3 *
0 **
1
0x0000 **
See section 8
0x0800 **
See section 8
Disable the calibrated temperature output
Enable the calibrated temperature output
Offset calibration of temperature sensor
O
G
[31:18] *
[17:4] *
Gain calibration of temperature sensor
Angular rate output compensation
GOUT_SEL
0x3D
31 *
0
1 **
Disable the calibrated angular rate output
Enable the calibrated angular rate output
MTPSLOTNB
0x3D
[12:8] *
0b00000
Unprogrammed part
0b00001 **
0b00011
0b00111
Programmed once, 4 slots remaining
Programmed twice, 3 slots remaining
Programmed 3 times, 2 slots remaining
0b01111
Programmed 4 times, 1 slot remaining
0b11111
Programmed 5 times, no slot remaining
SF4
SF3
SF2
SF1
SF0
B4
B3
B2
B1
B0
0x48
0x46
0x44
0x42
0x3F
0x47
0x45
0x43
0x41
0x3E
0x40
[18:0] *
[19:0] *
[20:0] *
[29:0] *
[30:0] *
[18:0] *
[19:0] *
[19:0] *
[29:0] *
[23:0] *
[19:0] *
See Table 9
See Table 9
See Table 9
See Table 9
See Table 9
See Table 9
See Table 9
See Table 9
See Table 9
See Table 9
See Table 9
Scale Factor 4th order coefficient (calibrated angular rate)
Scale Factor 3rd order coefficient (calibrated angular rate)
Scale Factor 2nd order coefficient (calibrated angular rate)
Scale Factor 1st order coefficient (calibrated angular rate)
Scale Factor constant coefficient (calibrated angular rate)
Bias 4th order coefficient (calibrated angular rate)
Bias 3rd order coefficient (calibrated angular rate)
Bias 2nd order coefficient (calibrated angular rate)
Bias 1st order coefficient (calibrated angular rate)
Bias constant coefficient (calibrated angular rate)
Mid-temperature calibration point
TMID
Table 8: Useful parameters information
Notes:
* The other bits at those addresses shall remain unchanged. Please make sure that you write them without modification!
** Default Value
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98 rue du Pré de l’Horme, 38920 Crolles, France
Phone: +33 (0)4 76 97 29 50
www.tronicsgroup.com
GYPRO3300 Datasheet
7. Angular rate calibration procedure
7.1. Algorithm overview
After filtering, the raw angular rate sensor output is temperature compensated based on the on-chip temperature sensor output
and the stored temperature compensation parameters.
7.1.1.
Angular rate output calibration model
7.1.2.
Recommended procedure
The formula below models the link between raw and 1. Set GOUT_SEL to 0 in the System Registers (disable the
compensated angular rate outputs:
calibration)
2. Place the sensor on a rate table in a thermal chamber and
implement temperature profile according to Figure 271
[ ]
RATEꢁꢂW LSB − 퐁퐈퐀퐒[LSB]
RATECOMP[LSB]
[
]
RATE °/s =
=
⁄
⁄
퐒퐅[LSB °/s]
SFꢀetting[LSB °/푠]
3. Perform continuous acquisition of the angular rate output
with the following pattern:
where:
•
Rest position (0°/s input) to evaluate the BIAS
parameter
•
•
•
RATE is the angular rate output converted in °/s;
RATECOMP is the calibrated angular rate output;
SFsetting is the constant conversion factor from LSB to
°/s for the calibrated angular rate output. Default
value for this parameter is SFsetting = 10 000;
RATERAW is the raw data angular rate output;
BIAS is a polynomial (4th degree) temperature-
varying coefficient to model the sensor’s bias
temperature variations;
•
+ 300°/s input then -300°/s input to evaluate the SF
parameter2
4. Calculate the coefficients of BIAS and SF polynomials:
•
•
4
푖
(
)
BIAS = ∑ b푖 TꢁꢂW − TMꢃD
푖ꢄ0
•
SF is a polynomial (4th degree) temperature-varying
coefficient to model the sensor’s Scale Factor
temperature variations.
4
푖
(
)
푆퐹 = ∑ sf푖 TꢁꢂW − TMꢃD
푖ꢄ0
where
•
TRAW is the raw output of the temperature sensor
multiplied by 64;
TMID is the mid-value of TRAW;
b0 to b4 are the 5 coefficients of BIAS polynomial;
sf0 to sf4 are the 5 coefficients of SF polynomial.
•
•
•
5. Convert TMID, bi and sfi parameters to their binary values
according to Table 9 below:
Parameter Value (decimal)
Format
SF4
SF3
SF2
SF1
SF0
B4
B3
B2
B1
B0
sf4 . 292 / SFsetting
s32 . 272 / SFsetting
sf2 . 255 / SFsetting
sf1 . 246 / SFsetting
sf0 . 227 / SFsetting
b4 . 273
signed 2’s comp
signed 2’s comp
signed 2’s comp
signed 2’s comp
signed 2’s comp
signed 2’s comp
signed 2’s comp
signed 2’s comp
signed 2’s comp
signed 2’s comp
unsigned
Figure 27: Recommended Temperature profile for calibration
b3 . 253
_________________________________________________
b2 . 232
b1 . 220
b0
TMID
1
Temperature profile can be adapted to be in line with
customer applications.
Rate applied can be adapted to be in line with customer
applications.
2
TMID
Table 9: Angular rate calibration parameters
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98 rue du Pré de l’Horme, 38920 Crolles, France
Phone: +33 (0)4 76 97 29 50
www.tronicsgroup.com
GYPRO3300 Datasheet
12. Program B4 in the MTP
13. Write B3 in the system register
14. Program B3 in the MTP
15. Write B2 in the system register
16. Program B2 in the MTP
17. Write B1 in the system register
18. Program B1 in the MTP
19. Write B0 in the system register
20. Program B0 in the MTP
21. Write TMID in the system register
22. Program TMID
7.2. Programming of the new coefficients
IMPORTANT NOTE: The following steps are non-reversible.
The previous values of the coefficients will not be accessible
anymore. The temperature compensation coefficients can be
re-programmed up to 4 additional times on the IC.
The programming procedure consists in three major steps:
•
•
•
Checking the available MTP slot status
Programming the coefficients
Updating the available MTP slot status
An overview of the procedure is given in Figure 28.
The detailed SPI commands are given in section 6.5. The
detailed information about each coefficient is given in Table 8.
7.2.1.
Checking the MTP slot status
The first step is to check the number of remaining MTP slots
(MTPSLOTNB), in other words, checking how many times the
chip has been programmed before.
The detailed information of MTPSLOTNB register content is
given in Table 8. The sequence of instructions to read the
register is given in Figure 25.
The MTP slot number (MTPSLOTNB) re-programming
iteration is given in the following table:
Iteration
Correspondence
MTP number
Value
Binary
00000
00001
00011
00111
01111
11111
0
1
2
3
4
5
Unprogrammed part
Programmed once
Programmed twice
…
0
1*
3
7
15
31
Cannot be further
programmed
Table 10 MTPSLOTNB iterations
* Default value
7.2.2.
Figure 28 Procedure to program new calibration parameters
Programming the coefficients
This step describes the procedure for programming the
calculated coefficients (temperature compensation of angular
rate output). The programming procedure is:
7.2.3.
Updating MTP slot status
This section describes the procedure for programming the
updated status of the MTP slots.
1. Write SF4 in the system register
2. Program SF4 in the MTP
3. Write SF3 in the system register
4. Program SF3 in the MTP
5. Write SF2 in the system register
6. Program SF2 in the MTP
7. Write SF1 in the system register
8. Program SF1 in the MTP
If this step is not performed properly, the new compensation
coefficients will not be effective.
1. Read the MTPSLOTNB as described in section 6.5.2
2. Increment MTPSLOTNB according Table 10.
3. Write the updated MTPSLOTNB in the system register.
4. Program the updated MTPSLOTNB in the MTP.
5. After a reset, the new coefficients will be available.
9. Write SF0 in the system register
10. Program SF0 in the MTP
11. Write B4 in the system register
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98 rue du Pré de l’Horme, 38920 Crolles, France
Phone: +33 (0)4 76 97 29 50
www.tronicsgroup.com
GYPRO3300 Datasheet
7.3. Switch to uncompensated data output
To optimize the thermal compensation of the angular rate output, it is possible to disable the on-chip compensation and use the
uncompensated (raw) output to perform an external thermal compensation.
IMPORTANT NOTE: This step is non-reversible. The previous values of the coefficients will not be accessible anymore.
To switch the angular rate output to uncompensated data, the procedure is exactly the same as describe in section 7.2, but the
coefficients given in Table 9 must be replaced by the coefficients given below in Table 11.
Parameter Value (hexadecimal)
SF4
SF3
SF2
SF1
SF0
B4
0x0
0x0
0x0
0x0
0x0800 0000
0x0
B3
0x0
B2
0x0
B1
0x0
B0
0x0
TMID
0x0
Table 11 Angular rate compensation coefficients to obtain raw data
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98 rue du Pré de l’Horme, 38920 Crolles, France
Phone: +33 (0)4 76 97 29 50
www.tronicsgroup.com
GYPRO3300 Datasheet
8. Temperature Sensor Calibration Procedure
The temperature output of GYPRO3300 sensors is not factory-calibrated, since only the relative temperature output is needed
to perform temperature compensation of the angular rate output. However, it is possible to perform a first-order polynomial
calibration of the temperature sensor, in order to output the absolute temperature information.
This section shows how to get and store temperature calibration parameters for the temperature output.
8.1. Temperature sensor calibration model
3. Calculate the GAIN and OFFSET coefficients according to
The formula below models the link between raw and calib-
formula above
rated temperature output:
T1퐴퐵ꢇ[°ꢅ] − T2퐴퐵ꢇ[°ꢅ]
GAIN = GAINꢆ푒푡푡푖푛푔
.
[
]
T1푅퐴푊 LSB − 푇2푅퐴푊[LSB]
[ ]
퐆퐀퐈퐍 . TꢁꢂW LSB − 퐎퐅퐅퐒퐄퐓[LSB]
TCOMP[LSB]
[
]
T °ꢅ =
=
[
]
[
]
ꢈFFSET = GAINꢆ푒푡푡푖푛푔 . T1퐴퐵ꢇ °ꢅ − GAIN . T1푅퐴푊 LSB
⁄
⁄
GAINꢀetting[LSB °ꢅ]
GAINꢀetting[LSB °ꢅ]
where:
where:
•
•
•
•
T1ABS is the absolute temperature of T1 in °C;
T2ABS is the absolute temperature of T2 in °C;
T1RAW is the raw output temperature of T1 in LSB;
T2RAW is the raw output temperature of T2 in LSB;
•
•
•
T is the output temperature converted in °C;
TCOMP is the calibrated temperature output;
GAINsetting is the constant conversion factor from LSB
to °C for the calibrated temperature output. This gain
is set to 20LSB/°C to provide an output resolution of
0,1°C;
TRAW is the raw data temperature output;
OFFSET is a constant coefficient to tune the offset;
GAIN is a constant coefficient to tune gain.
4. Convert GAIN and OFFSET to their binary values according
to Table 12 below:
•
•
•
Parameter Value (decimal)
G
O
Format
Unsigned
Unsigned
GAIN . 211
OFFSET
The OFFSET and GAIN parameters will be computed and
written in the ASIC as per the following calibration procedure.
Table 12: Temperature calibration parameters
5. [Optional step: Write GAIN and OFFSET into the System
Registers and repeat step 2. to check the accuracy of the
new calibration.]
8.2. Recommended Procedure
1. Check that TOUT_SEL = 0. If not, set it to 0 in the System
Registers.
6. Write GAIN and OFFSET into the MTP according to
instructions of Section 6.5.2. Meanwhile, set TOUT_SEL to
1 during this step, so that the new calibration parameters
are effective after a RESET.
2. Measure the temperature output with at least
temperature points T1 and T2.
2
Copyright 2021 Tronic’s Microsystems S.A.. All rights reserved.
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Tronic’s Microsystems S.A.
98 rue du Pré de l’Horme, 38920 Crolles, France
Phone: +33 (0)4 76 97 29 50
www.tronicsgroup.com
GYPRO3300 Datasheet
9. Device Identification / Ordering information
9.1. Device identification
GYPRO3300 tracking information is accessible on the label, as shown in the next figure.
Figure 29: GYPRO3300 label.
9.2. Ordering information
Figure 30 Ordering information
*For second 2nd generation only
Product
Ordering code
GYPRO2300
GYPRO2300LD
GYPRO3300
GYPRO2300-EVB2
GYPRO2300LD-EVB2
GYPRO3300-EVB2
3-G2300-A0
3-G2310-A0
3-G3300-A0
4-G2300-A0
4-G2310-A0
4-G3300-A0
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98 rue du Pré de l’Horme, 38920 Crolles, France
Phone: +33 (0)4 76 97 29 50
www.tronicsgroup.com
GYPRO3300 Datasheet
10.Internal construction and Theory of Operation
2)
Simplicity of hardware implementation. Oversampling
concept allows significant design relaxation of the analog
detection chain signal resolution. Additionally the voltage
reference used for actuation force feedback is also of simple
implementation as it is a 1-bit D/A converter, thus simplifying
its design.
3)
Linearization of the electrostatic forces thanks to the
Sigma-delta principle (through force averaging) furthermore
reduces non-linearity overall and more importantly its even-
order terms, which result in rectification error.
Figure 31 : Inner view of the package, showing the MEMS and IC
4)
Sigma-Delta signal output is inherently a digital signal,
GYPRO series is using the dominant architecture for high
performance MEMS gyro, namely the “Tunning fork or dual
mass” design.
thus suppressing the need for costly high resolution A/D
converter.
The digital part implements digital drive and sense loops,
demodulates, decimates and processes the gyro output based
on the on-chip temperature sensor output. The system
controller manages the interface between the SPI registers, the
system register and the non-volatile memory (OTP). The non-
volatile memory provides the gyro settings, in particular the
coefficients for angular rate sensor temperature
compensation. On power up, the gyro settings are transferred
from the OTP to the system registers and output data are
available in the SPI registers. The angular rate sensor output
and the temperature sensor output are available in the SPI
registers. The SPI registers are available through the SPI
interface (SSB, SCLK, MOSI, MISO). The self-test and the data
ready are available respectively on the external pins ST and
DRDY.
In details, each sensor consists in a MEMS transducer and an
integrated circuit (IC) packaged in a 30-pins Ceramic Leadless
Chip Carrier Package.
The sensing element (MEMS die), which is located on the left
part of the Figure 31, is manufactured using Tronics’ wafer-
level packaging technology based on micro-machined thick
single crystal silicon. The MEMS consists of two coupled sub-
structures subjected to linear anti-phase vibrations. The
structures are vacuumed at the wafer-level providing high Q-
factor in the drive mode. The drive system is decoupled from
the sense system in order to reduce feedback from sense
motion to drive electrodes. The drive anti phase vibration is
sustained by electrostatic comb drives. The sense anti phase
vibration resulting from Coriolis forces is counter balanced by
electrostatic forces. Differential detection and actuation are
used for both drive and sense systems and for each sub-
structure, keeping two identical structures for efficient
common mode rejection.
The “References” block generates the required biasing
currents and voltages for all blocks as well as the low-noise
reference voltage for critical blocks.
The “Power Management” block manages the power supply
of the sensor from a single 5V supply between the VDD and
GND pins. It includes a power on reset as well as an external
reset pin (RSTB) to start or restart operation using default
configuration. An enable pin (EN) with power-down capability
is also available.
The integrated circuit (IC), which is located on the right part
of the Figure 31, is designed to interface the MEMS sensing
element. It includes ultra-low noise capacitive to voltage
converters (C2V) followed by high resolution voltage
digitization (ADC) for both drive and sense paths. Excitation
voltage required for capacitance sensing circuits is generated
on the common electrode node. 1-bit force feedbacks (DAC)
are used for both drive and sense system actuation.
The sensor is powered with a single 5V DC power supply
through pins VDD and GND. Although the sensor contains three
separate VDD pins, the sensor is supplied by a single 5V voltage
source. It is recommended to supply the three VDD pins in a
star connection with appropriate decoupling capacitors.
Regarding the sensor grounds, all the GND pins are internally
shorted. The GND pins redundancy is used for multiple bonds
in order to reduce the total ground inductance. It is therefore
recommended to connect all the GND pins to the ground.
The choice for the implemented close-loop architecture based
on a Sigma-Delta principle is particularly well adapted as it
brings the following key advantages:
1)
Sigma-Delta is well suited for low-frequency signals.
Noise shaping principle rejects quantization noise in high
frequency bands.
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98 rue du Pré de l’Horme, 38920 Crolles, France
Phone: +33 (0)4 76 97 29 50
www.tronicsgroup.com
GYPRO3300 Datasheet
11.Available Tools and Resources
The following tools and resources are available on website or upon request.
Item
Description
Documentation & technical notes
GYPRO® product line - Flyer
GYPRO® product – Technical note
External filtering for Gypro2300LD and Gypro3300
GYPRO® product – Technical note
GYPRO MTBF Methodology
Mechanical tools
Evaluation kit
GYPRO3300 – 3D model
GYPRO3300-EVB2 – Evaluation board
Evaluation board for GYPRO3300, compatible with Arduino Yun rev2
GYPRO® Evaluation Board – User manual
GYPRO® Evaluation Kit – Quick start guide
GYPRO® Evaluation Tool – Software user manual
GYPRO® Evaluation Tool – Tutorial
Installation and programming of the Evaluation kit
GYPRO® Evaluation Tool – Tutorial
Software
GYPRO® Evaluation Tool – Software
GYPRO® Evaluation Tool – Arduino Firmware
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