ICS-40300 [TDK]
MEMS麦克风(麦克风);
| 型号： | ICS-40300 |
| 厂家： | 
TDK ELECTRONICS |
| 描述： | MEMS麦克风(麦克风) |
| 文件： | 总15页 (文件大小：376K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
ICS-40300
High SPL Analog Microphone with Extended Low Frequency Response
APPLICATIONS
GENERAL DESCRIPTION
•
•
•
•
•
•
Active Noise-Cancelling Headsets
Teleconferencing Systems
Studio Microphones
The ICS-40300* is a low-noise, high SPL MEMS microphone
with extended low frequency response. The ICS-40300
consists of a MEMS microphone element and an impedance
converter amplifier. The ICS-40300 low frequency response
makes it an excellent choice for applications requiring precise
phase matching. The ICS-40300 is pin compatible with the
INMP401 and INMP411 microphones, providing an easy
upgrade path.
Live Microphones
Security and Surveillance
Photoacoustic Gas Sensing
FEATURES
•
•
•
•
•
•
•
•
•
•
•
•
4.72 × 3.76 × 3.5 mm Surface-Mount Package
The ICS-40300 has a linear response up to 130 dB SPL. It
offers low frequency extension down to 6 Hz, resulting in
excellent phase characteristics in the audio range. Low
current consumption enables long battery life for portable
applications.
Extended Frequency Response from 6 Hz to 20 kHz
130 dB SPL Acoustic Overload Point
Sensitivity of −45 dBV
±2 dB Sensitivity Tolerance
Omnidirectional Response
High SNR of 63 dBA
The ICS-40300 is available in a 4.72 mm × 3.76 mm × 3.5 mm
surface-mount package. It is reflow solder compatible with no
sensitivity degradation.
Low Current Consumption: <220 µA
Single-Ended Analog Output
High PSR of −80 dBV
Compatible with Sn/Pb and Pb-Free Solder Processes
RoHS/WEEE Compliant
*Protected by U.S. Patents 7,449,356; 7,825,484; 7,885,423; and 7,961,897.
Other patents are pending.
FUNCTIONAL BLOCK DIAGRAM
ORDERING INFORMATION
PART
ICS-40300
EV_ICS-40300-FX
TEMP RANGE
−40°C to +85°C
PACKAGING
13” Tape and Reel
—
—
OUTPUT
AMPLIFIER
OUTPUT
POWER
ICS-40300
VDD GND
InvenSense Inc.
1745 Technology Drive, San Jose, CA 95110 U.S.A
+1(408) 988–7339
InvenSense reserves the right to change the detail
specifications as may be required to permit improvements
in the design of its products.
Document Number: DS-ICS-40300-00
Revision: 1.3
Revision Date: 7/17/2018
www.invensense.com
ICS-40300
TABLE OF CONTENTS
General Description ..................................................................................................................................................................... 1
Applications ................................................................................................................................................................................. 1
Features ....................................................................................................................................................................................... 1
Functional Block Diagram ............................................................................................................................................................ 1
Ordering Information................................................................................................................................................................... 1
Table of Contents.................................................................................................................................................................................... 2
Specifications .......................................................................................................................................................................................... 3
Table 1. Electrical Characteristics ................................................................................................................................................ 3
Absolute Maximum Ratings.................................................................................................................................................................... 4
Table 2. Absolute Maximum Ratings ........................................................................................................................................... 4
ESD CAUTION............................................................................................................................................................................... 4
Soldering Profile........................................................................................................................................................................... 5
Table 3. Recommended Soldering Profile*.................................................................................................................................. 5
Pin Configurations And Function Descriptions ....................................................................................................................................... 6
Table 4. Pin Function Descriptions............................................................................................................................................... 6
Typical Performance Characteristics....................................................................................................................................................... 7
Applications Information ........................................................................................................................................................................ 9
Connecting To Audio Codecs ....................................................................................................................................................... 9
Dynamic Range Considerations ................................................................................................................................................... 9
Supporting Documents ......................................................................................................................................................................... 10
Evaluation Board User Guide..................................................................................................................................................... 10
Application Notes (General) ...................................................................................................................................................... 10
Application Note (Product-Specific) .......................................................................................................................................... 10
PCB Design And Land Pattern Layout ................................................................................................................................................... 11
PCB Material And Thickness ...................................................................................................................................................... 11
Handling Instructions............................................................................................................................................................................ 12
Pick And Place Equipment ......................................................................................................................................................... 12
Reflow Solder............................................................................................................................................................................. 12
Board Wash................................................................................................................................................................................ 12
Outline Dimensions............................................................................................................................................................................... 13
Ordering Guide .......................................................................................................................................................................... 14
Revision History ......................................................................................................................................................................... 14
Compliance Declaration Disclaimer ...................................................................................................................................................... 15
Page 2 of 15
Document Number: DS-ICS-40300-00
Revision: 1.3
ICS-40300
SPECIFICATIONS
TABLE 1. ELECTRICAL CHARACTERISTICS
TA = −40 to 85°C, VDD = 1.5 to 3.63 V, unless otherwise noted. All minimum and maximum specifications are guaranteed across
temperature and voltage specified in Table 1, unless otherwise noted. Typical specifications are not guaranteed.
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNITS
NOTES
PERFORMANCE
Directionality
Omni
−45
63
Sensitivity
1 kHz, 94 dB SPL
−47
−43
dBV
dBA
Signal-to-Noise Ratio (SNR)
Equivalent Input Noise (EIN)
31
dBA SPL
Derived from EIN and maximum
acoustic input
Dynamic Range
99
dB
Low frequency −3 dB point
High frequency −3 dB point
6
>20
Hz
kHz
Frequency Response
1
Total Harmonic Distortion (THD)
Power-Supply Rejection (PSR)
105 dB SPL
0.2
1
%
217 Hz, 100 mVP-P square wave
superimposed on VDD = 1.8 V
1 kHz, 100 mVP-P sine wave
superimposed on VDD = 1.8 V
10% THD
−80
dBV
Power-Supply Rejection Ratio (PSRR)
−55
dB
Acoustic Overload Point
130
dB SPL
POWER SUPPLY
Supply Voltage (VDD
Supply Current (IS)
)
1.5
3.63
V
VDD = 1.8 V
VDD = 3.3 V
180
210
220
250
µA
µA
OUTPUT CHARACTERISTICS
Output Impedance (ZOUT
)
200
0.8
Ω
Output DC Offset
V
V rms
Maximum Output Voltage
130 dB SPL input
0.355
−108
dBV
Noise Floor
20 Hz to 20 kHz, A-weighted, rms
Note 1: See Figure 3 and Figure 4.
Page 3 of 15
Document Number: DS-ICS-40300-00
Revision: 1.3
ICS-40300
ABSOLUTE MAXIMUM RATINGS
Stress above those listed as Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only
and functional operation of the device at these conditions is not implied. Exposure to the absolute maximum ratings conditions for
extended periods may affect device reliability.
TABLE 2. ABSOLUTE MAXIMUM RATINGS
PARAMETER
RATING
−0.3 V to +3.63 V
Supply Voltage (VDD
)
160 dB
Sound Pressure Level
Mechanical Shock
Vibration
10,000 g
Per MIL-STD-883 Method 2007, Test Condition B
Temperature Range
Biased*
Storage
−40°C to +85°C
−55°C to +150°C
* ICS-40300 is able to operate at 105C without permanent damage to the device, but device specifications are not guaranteed.
ESD CAUTION
ESD (electrostatic discharge) sensitive device.
Charged devices and circuit boards can
discharge without detection. Although this
product features patented or proprietary
protection circuitry, damage may occur on
devices subjected to high energy ESD.
Therefore proper ESD precautions should be
taken to avoid performance degradation or
loss of functionality.
Page 4 of 15
Document Number: DS-ICS-40300-00
Revision: 1.3
ICS-40300
SOLDERING PROFILE
CRITICAL ZONE
TO T
tP
T
L
P
T
P
RAMP-UP
T
L
tL
T
SMAX
T
SMIN
tS
RAMP-DOWN
PREHEAT
t25°C TO PEAK TEMPERATURE
TIME
Figure 1. Recommended Soldering Profile Limits
TABLE 3. RECOMMENDED SOLDERING PROFILE*
PROFILE FEATURE
Sn63/Pb37
Pb-Free
Average Ramp Rate (TL to TP)
1.25°C/sec max
1.25°C/sec max
Minimum Temperature
(TSMIN
Minimum Temperature
(TSMIN
100°C
100°C
)
Preheat
150°C
200°C
)
Time (TSMIN to TSMAX), tS 60 sec to 75 sec
60 sec to 75 sec
1.25°C/sec
~50 sec
Ramp-Up Rate (TSMAX to TL)
Time Maintained Above Liquidous (tL)
Liquidous Temperature (TL)
Peak Temperature (TP)
1.25°C/sec
45 sec to 75 sec
183°C
217°C
215°C +3°C/−3°C
20 sec to 30 sec
3°C/sec max
260°C +0°C/−5°C
Time Within +5°C of Actual Peak
20 sec to 30 sec
Temperature (tP)
3°C/sec max
Ramp-Down Rate
5 min max
Time +25°C (t25°C) to Peak Temperature 5 min max
*Note: The reflow profile in Table 3 is recommended for board manufacturing with InvenSense MEMS microphones. All
microphones are also compatible with the J-STD-020 profile
Page 5 of 15
Document Number: DS-ICS-40300-00
Revision: 1.3
ICS-40300
PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS
OUTPUT
GND
2
1
GND
3
GND
6
VDD
5
4
GND
BOTTOM VIEW
Not to Scale
Figure 2. Pin Configuration
TABLE 4. PIN FUNCTION DESCRIPTIONS
PIN NAME
FUNCTION
Analog Output Signal
Ground
1
2
OUTPUT
GND
Ground
3
4
5
6
GND
GND
VDD
GND
Ground
Power Supply
Ground
Page 6 of 15
Document Number: DS-ICS-40300-00
Revision: 1.3
ICS-40300
TYPICAL PERFORMANCE CHARACTERISTICS
20
20
15
15
10
5
10
5
0
0
-5
-5
-10
1
10
100
1k
10k
1
10
100
1k
10k
FREQUENCY (Hz)
FREQUENCY (Hz)
Figure 4. Frequency Response (Measured)
Figure 3. Frequency Response Mask
0
-5
10
-10
-15
-20
-25
1
-30
-35
-40
-45
-50
0.1
90
100
110
120
130
140
90
100
110
120
130
140
INPUT AMPLITUDE (dB SPL)
INPUT LEVEL (dB SPL)
Figure 5. THD + N vs. Input Level
Figure 6. Linearity
1.4
1.2
1.0
0
-10
-20
124 dB SPL
128 dB SPL
132dB SPL
136 dB SPL
140 dB SPL
0.8
-30
-40
0.6
0.4
-50
-60
0.2
0.0
10
100
1k
10k
0
0.5
TIME (ms)
1.0
FREQUENCY (Hz)
Figure 8. Power Supply Rejection Ratio vs. Frequency
Figure 7. Clipping Characteristics
Page 7 of 15
Document Number: DS-ICS-40300-00
Revision: 1.3
ICS-40300
30
15
0
60
45
30
15
0
-15
-30
-15
10
100
1k
FREQUENCY (Hz)
10k
10
100
1k
10k
FREQUENCY (Hz)
Figure 10. Phase Variation From Typical Response
Figure 9. Phase Response (Measured)
-60
-80
-100
-120
-160
1
10
100
1k
10k
FREQUENCY (Hz)
Figure 11. Noise Spectrum Amplitude Spectral Density
Page 8 of 15
Document Number: DS-ICS-40300-00
Revision: 1.3
ICS-40300
APPLICATIONS INFORMATION
CONNECTING TO AUDIO CODECS
The ICS-40300 output can be connected to a dedicated codec microphone input (see Figure 12) or to a high input impedance gain
stage (see Figure 13.) A 0.1 µF ceramic capacitor placed close to the ICS-40300 supply pin is used for testing and is recommended to
adequately decouple the microphone from noise on the power supply. A DC-blocking capacitor is required at the output of the
microphone. This capacitor creates a high-pass filter with a corner frequency at
fC = 1/(2π × C × R)
where R is the input impedance of the codec.
A minimum value of 22 µF is recommended in Figure 12 because the input impedance of some codecs can be as low as 2 kΩ at their
highest PGA gain setting, which results in a high-pass filter corner frequency at 3.6 Hz. At lower gain settings, where the codec input
impedance is also lower, a smaller AC-coupling capacitor can be used. Figure 13 shows the ICS-40300 connected to an op amp
configured as a non-inverting preamplifier.
MICBIAS
0.1 µF
ADC
OR
CODEC
VDD
22 µF
MINIMUM
ICS-40300
INPUT
OUTPUT
GND
Figure 12. ICS-40300 Connected to a Codec
1.8-3.3 V
GAIN = (R1 + R2)/R1
R1 R2
V
REF
0.1 µF
VDD
V
OUT
AMP
1 µF
ICS-40300
MINIMUM
OUTPUT
GND
47 kΩ
V
REF
Figure 13. ICS-40300 Connected to an Op Amp
DYNAMIC RANGE CONSIDERATIONS
To fully utilize the 99 dB dynamic range of the ICS-40300 in a design, the preamp, ADC, or codec circuit following it must be chosen
carefully. A typical codec may have a 100 dB dynamic range with VDD = 3.3 V. To match the dynamic ranges between the microphone
and the ADC input of the codec, some gain must be added to the ICS-40300 output. For example, at the 130 dB SPL maximum acoustic
input, the ICS-40300 outputs a −9 dBV rms signal. The full-scale input voltage of a codec may be 0 dBV; therefore, 9 dB of gain must be
added to the signal to match the dynamic range of the microphone with the dynamic range of the codec.
Page 9 of 15
Document Number: DS-ICS-40300-00
Revision: 1.3
ICS-40300
SUPPORTING DOCUMENTS
For additional information, see the following documents.
EVALUATION BOARD USER GUIDE
UG-445, Analog Output MEMS Microphone Flex Evaluation Board
APPLICATION NOTES (GENERAL)
AN-1003, Recommendations for Mounting and Connecting the InvenSense Bottom-Ported MEMS Microphones
AN-1068, Reflow Soldering of the MEMS Microphone
AN-1112, Microphone Specifications Explained
AN-1124, Recommendations for Sealing InvenSense Bottom-Port MEMS Microphones from Dust and Liquid Ingress
AN-1140, Microphone Array Beamforming
AN-1165, Op Amps for Microphone Preamp Circuits
AN-1181, Using a MEMS Microphone in a 2-Wire Microphone Circuit
APPLICATION NOTE (PRODUCT-SPECIFIC)
AN-0284 Low-Noise Directional Studio Microphone Reference Design
Page 10 of 15
Document Number: DS-ICS-40300-00
Revision: 1.3
ICS-40300
PCB DESIGN AND LAND PATTERN LAYOUT
The recommended PCB land pattern for the ICS-40300 should be laid out to a 1:1 ratio to the solder pads on the microphone
package, as shown in Figure 14. Take care to avoid applying solder paste to the sound hole in the PCB. A suggested solder paste
stencil pattern layout is shown in Figure 15. The diameter of the sound hole in the PCB should be larger than the diameter of the
sound port of the microphone. A minimum diameter of 0.5 mm is recommended.
2.62
ø0.90 (3×)
ø1.10
ø1.68
2.54
2.40
1.20
1.27
ø0.70 (2×)
0.79
Figure 14. PCB Land Pattern Layout
Dimensions shown in millimeters
Figure 15. Suggested Solder Paste Stencil Pattern Layout
Dimensions shown in millimeters
PCB MATERIAL AND THICKNESS
The performance of the ICS-40300 is not affected by PCB thickness. The ICS-40300 can be mounted on either a rigid or flexible PCB.
A flexible PCB with the microphone can be attached directly to the device housing with an adhesive layer. This mounting method
offers a reliable seal around the sound port while providing the shortest acoustic path for good sound quality.
Page 11 of 15
Document Number: DS-ICS-40300-00
Revision: 1.3
ICS-40300
HANDLING INSTRUCTIONS
PICK AND PLACE EQUIPMENT
The MEMS microphone can be handled using standard pick-and-place and chip shooting equipment. Take care to avoid damage to the
MEMS microphone structure as follows:
•
•
•
Use a standard pickup tool to handle the microphone. Because the microphone hole is on the bottom of the package, the
pickup tool can make contact with any part of the lid surface.
Do not pick up the microphone with a vacuum tool that makes contact with the bottom side of the microphone.
Do not pull air out of or blow air into the microphone port.
Do not use excessive force to place the microphone on the PCB.
REFLOW SOLDER
For best results, the soldering profile must be in accordance with the recommendations of the manufacturer of the solder paste used to
attach the MEMS microphone to the PCB. It is recommended that the solder reflow profile not exceed the limit conditions specified
in Figure 1 and Table 3.
BOARD WASH
When washing the PCB, ensure that water does not make contact with the microphone port. Do not use blow-off procedures or
ultrasonic cleaning.
Page 12 of 15
Document Number: DS-ICS-40300-00
Revision: 1.3
ICS-40300
OUTLINE DIMENSIONS
4.82
4.72
4.62
3.30 REF
REFERENCE
CORNER
0.79 BSC
4.42 REF
2.62 BSC
0.90 DIA.
(PINS 1, 5, 6)
1
6
2
1.68 DIA.
1.10 DIA.
3.86
3.76
3.66
3
2.54
BSC
2.40 BSC
3.46
REF
1.27 BSC
1.20 BSC
0.25 DIA.
(THRU HOLE)
5
4
0.61 REF
0.68 REF
TOP VIEW
BOT TOM VIEW
0.70 DIA.
(PINS 2, 4)
3.60
3.50
3.40
3.23 REF
SIDE VIEW
0.24 REF
Figure 16. 4-Terminal Chip Array Small Outline No Lead Cavity
4.72 × 3.76 × 3.50 mm Body
Dimensions shown in millimeters
PART NUMBER
PIN 1 INDICATION
300
YYXXXX
DATECODE
LOT TRACEABILITY CODE
Figure 17. Package Marking Specification (Top View)
Page 13 of 15
Document Number: DS-ICS-40300-00
Revision: 1.3
ICS-40300
PACKAGING
13” Tape and Reel
ORDERING GUIDE
PART
ICS-40300
TEMP RANGE
−40°C to +85°C
PACKAGE
6-Terminal LGA_CAV
QUANTITY
2,000
EV_ICS-40300-FX
Flex Evaluation Board
REVISION HISTORY
REVISION DATE
REVISION
1.0
DESCRIPTION
5/15/2014
08/18/2015
5/9/2018
Initial Release
1.1
1.2
1.3
Updated reel quantity in Ordering Guide
Updated Stencil Mask
7/17/2018
Enviromental Performance
Page 14 of 15
Document Number: DS-ICS-40300-00
Revision: 1.3
ICS-40300
COMPLIANCE DECLARATION DISCLAIMER
InvenSense believes the environmental and other compliance information given in this document to be correct but cannot
guarantee accuracy or completeness. Conformity documents substantiating the specifications and component characteristics are on
file. InvenSense subcontracts manufacturing, and the information contained herein is based on data received from vendors and
suppliers, which has not been validated by InvenSense.
This information furnished by InvenSense, Inc. (“InvenSense”) is believed to be accurate and reliable. However, no responsibility is assumed by InvenSense for its use,
or for any infringements of patents or other rights of third parties that may result from its use. Specifications are subject to change without notice. InvenSense
reserves the right to make changes to this product, including its circuits and software, in order to improve its design and/or performance, without prior notice.
InvenSense makes no warranties, neither expressed nor implied, regarding the information and specifications contained in this document. InvenSense assumes no
responsibility for any claims or damages arising from information contained in this document, or from the use of products and services detailed therein. This includes,
but is not limited to, claims or damages based on the infringement of patents, copyrights, mask work and/or other intellectual property rights.
Certain intellectual property owned by InvenSense and described in this document is patent protected. No license is granted by implication or otherwise under any
patent or patent rights of InvenSense. This publication supersedes and replaces all information previously supplied. Trademarks that are registered trademarks are
the property of their respective companies. InvenSense sensors should not be used or sold in the development, storage, production or utilization of any conventional
or mass-destructive weapons or for any other weapons or life threatening applications, as well as in any other life critical applications such as medical equipment,
transportation, aerospace and nuclear instruments, undersea equipment, power plant equipment, disaster prevention and crime prevention equipment.
©2018 InvenSense. All rights reserved. InvenSense, MotionTracking, MotionProcessing, MotionProcessor, MotionFusion, MotionApps, DMP, AAR, and the InvenSense
logo are trademarks of InvenSense, Inc.
©2018 InvenSense. All rights reserved.
Page 15 of 15
Document Number: DS-ICS-40300-00
Revision: 1.3
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