ICS-52000 [TDK]
MEMS麦克风(麦克风);
| 型号： | ICS-52000 |
| 厂家： | 
TDK ELECTRONICS |
| 描述： | MEMS麦克风(麦克风) 商用集成电路 |
| 文件： | 总20页 (文件大小：411K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
ICS-52000
Low-Noise Microphone with TDM Digital Output
GENERAL DESCRIPTION
APPLICATIONS
•
•
•
•
•
•
Speech Recognition Arrays
The ICS-52000 is a digital TDM output bottom port microphone.
The complete ICS-52000 solution consists of a MEMS sensor, signal
conditioning, an analog-to-digital converter, decimation and anti-
aliasing filters, power management, and an industry standard 24-
bit TDM interface. The TDM interface allows an array of up to 16 of
the ICS-52000 microphones to connect directly to digital
processors, such as DSPs and microcontrollers, without the need
for an audio codec in the system. All microphones in an array
sample their acoustic signals synchronously, enabling precise array
processing.
Smart Televisions
Teleconferencing Systems
Gaming Consoles
Security Systems
Microphone Arrays
FEATURES
•
•
Digital TDM Interface with High Precision 24-bit Data
Supports TDM arrays of up to 16 synchronously-
sampled channels
•
•
•
•
•
•
•
•
•
•
High 65 dBA SNR
−26 dB FS Sensitivity
±1 dB Sensitivity Tolerance
Wide Frequency Response from 50 Hz to 20 kHz
Low Current Consumption: 1.0 mA
High Power Supply Rejection: −89 dB FS
117 dB SPL Acoustic Overload Point
Small 4 mm × 3 mm × 1 mm Surface-Mount Package
Compatible with Sn/Pb and Pb-Free Solder Processes
RoHS/WEEE Compliant
The ICS-52000 has a high SNR of 65 dBA and a wideband frequency
response. The sensitivity tolerance of the ICS-52000 is ±1 dB,
which enables high-performance microphone arrays without
the need for system calibration.
The ICS-52000 is available in a small 4 mm × 3 mm × 1 mm
surface-mount package.
FUNCTIONAL BLOCK DIAGRAM
ORDERING INFORMATION
PART
ICS-52000
EV_ICS-52000-FX
TEMP RANGE
−40°C to +85°C
PACKAGING
13” Tape & Reel
ICS-52000
FILTER
ADC
SCK
SD
—
TDM
SERIAL
PORT
WS
WSO
POWER
MANAGEMENT
HARDWARE
CONTROL
InvenSense Inc.
1745 Technology Drive, San Jose, CA 95110 U.S.A
+1(408) 988–7339
InvenSense reserves the right to change the detail
specifications as may be required to permit improvements
in the design of its products.
Document Number: DS-000121
Revision: 1.3
Release Date: 4/14/2017
www.invensense.com
ICS-52000
TABLE OF CONTENTS
General Description ..................................................................................................................................................................... 1
Applications ................................................................................................................................................................................. 1
Features ....................................................................................................................................................................................... 1
Functional Block Diagram ............................................................................................................................................................ 1
Ordering Information................................................................................................................................................................... 1
Table of Contents.................................................................................................................................................................................... 2
Specifications .......................................................................................................................................................................................... 4
Table 1. Electrical Characteristics ................................................................................................................................................ 4
Table 2. TDM Digital INPUT/Output ............................................................................................................................................ 5
Table 3. Serial Data Port Timing Specification ............................................................................................................................. 5
Timing Diagram............................................................................................................................................................................ 5
Absolute Maximum Ratings.................................................................................................................................................................... 6
Table 4. Absolute Maximum Ratings ........................................................................................................................................... 6
ESD Caution ................................................................................................................................................................................. 6
Soldering Profile........................................................................................................................................................................... 7
Table 5. Recommended Soldering Profile.................................................................................................................................... 7
Pin Configurations And Function Descriptions ....................................................................................................................................... 8
Table 6. Pin Function Descriptions............................................................................................................................................... 8
Typical Performance Characteristics....................................................................................................................................................... 9
Theory of Operation ............................................................................................................................................................................. 10
Startup and Power Management .............................................................................................................................................. 10
Startup............................................................................................................................................................................ 10
Table 7. Startup time ...................................................................................................................................................... 10
Standby Mode ................................................................................................................................................................ 10
Soft Unmute ................................................................................................................................................................... 10
Synchronizing Microphones ...................................................................................................................................................... 11
TDM Data Interface ................................................................................................................................................................... 11
Data Output Format ....................................................................................................................................................... 11
Digital Microphone Sensitivity................................................................................................................................................... 13
Digital Filter Characteristics ....................................................................................................................................................... 13
High-Pass Filter ............................................................................................................................................................... 13
Low-Pass Decimation Filter ............................................................................................................................................ 13
Applications Information ...................................................................................................................................................................... 14
SD Output Drive Strength .......................................................................................................................................................... 14
Design Recommendations.............................................................................................................................................. 14
Power Supply Decoupling .......................................................................................................................................................... 14
Supporting Documents ......................................................................................................................................................................... 15
Page 2 of 20
Document Number: DS-000121
Revision: 1.3
ICS-52000
Evaluation Board User Guide..................................................................................................................................................... 15
Application Notes ...................................................................................................................................................................... 15
PCB Design And Land Pattern Layout ................................................................................................................................................... 16
PCB Material And Thickness ...................................................................................................................................................... 16
Handling Instructions............................................................................................................................................................................ 17
Pick And Place Equipment ......................................................................................................................................................... 17
Reflow Solder............................................................................................................................................................................. 17
Board Wash................................................................................................................................................................................ 17
Outline Dimensions............................................................................................................................................................................... 18
Ordering Guide .......................................................................................................................................................................... 18
Revision History ......................................................................................................................................................................... 19
Compliance Declaration Disclaimer ...................................................................................................................................................... 20
Page 3 of 20
Document Number: DS-000121
Revision: 1.3
ICS-52000
SPECIFICATIONS
TABLE 1. ELECTRICAL CHARACTERISTICS
TA = +25°C, VDD = 1.8 to 3.3V, fSCK = 3.072 MHz, CLOAD = 30 pF unless otherwise noted. Typical specifications are not guaranteed.
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNITS
NOTES
PERFORMANCE
Directionality
Sensitivity
Signal-to-Noise Ratio (SNR)
Equivalent Input Noise (EIN)
Omni
−26
65
1 kHz, 94 dB SPL
−27
−25
dB FS
dBA
dBA SPL
29
Derived from EIN and acoustic
overload point
105 dB SPL
Dynamic Range
88
dB
%
Total Harmonic Distortion (THD)
0.3
1
217 Hz, 100 mVp-p square wave
superimposed on VDD = 1.8 V (A-
weighted)
Power-Supply Rejection (PSR)
−89
dB FS
Power-Supply Rejection – Swept Sine
1 kHz sine wave
−98
dB FS
Acoustic Overload Point
Noise Floor
10% THD
20 Hz to 20 kHz, A-weighted, rms
117
−91
dB SPL
dB FS
POWER SUPPLY
Supply Voltage (VDD
)
1.62
3.63
1.4
20
1.5
24
V
Normal Mode
Standby
Normal Mode
Standby
1.0
5
1.1
7
mA
µA
mA
µA
V
DD = 1.8V
Supply Current (IS)
VDD = 3.3V
DIGITAL FILTER
Group Delay
Acoustic input to digital output –
includes filter and TDM serial output
2/fS
sec
Pass Band Ripple
Stop Band Attenuation
±0.3
dB
dB
58
20
Pass Band
kHz
fs = 48 kHz
Page 4 of 20
Document Number: DS-000121
Revision: 1.3
ICS-52000
TABLE 2. TDM DIGITAL INPUT/OUTPUT
–40°C < TA < +85°C, 1.8 V < VDD < 3.3 V, unless otherwise noted.
PARAMETER
CONDITIONS
MIN
MAX
UNITS
NOTES
DIGITAL INPUT
0
0.25 × VDD
VDD
Voltage Input Low (VIL)
V
V
0.7 × VDD
Voltage Input High (VIH)
SD DIGITAL OUTPUT
0
0.25 × VDD
VDD
Voltage Output Low (VOL
)
V
V
0.7 × VDD
Voltage Output High (VOH
)
Maximum Load
CLK = 24.576 MHz
150
pF
TABLE 3. SERIAL DATA PORT TIMING SPECIFICATION
–40°C < TA < +85°C, 1.8 V < VDD < 3.3 V, unless otherwise noted.
PARAMETER
SCK duty cycle
CONDITIONS
MIN
48
MAX
52
UNITS
%
NOTES
SCK period (tSCP
SCK frequency (fSCK
WS setup (tWSS
WS hold (tWSH
)
37
0.460
0
ns
)
27.034
MHz
ns
)
)
10
ns
WS frequency (fS)
SD data valid (tSDV
7.19
52.8
18
kHz
ns
)
From SCK rising to valid SD data
From SCK rising to SD output tristated
15 pF trace load
SD data disable (tSDD
WSO valid (tWSOV
WSO disable (tWSOD
)
18
ns
)
18
ns
)
15 pF trace load
18
ns
TIMING DIAGRAM
tSCP
SCK
tWSH
tWSS
tWSOV
tWSOD
WS
WSO
tSDV
tSDD
SD
Figure 1. Serial Data Port Timing
Page 5 of 20
Document Number: DS-000121
Revision: 1.3
ICS-52000
ABSOLUTE MAXIMUM RATINGS
Stress above those listed as Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only
and functional operation of the device at these conditions is not implied. Exposure to the absolute maximum ratings conditions for
extended periods may affect device reliability.
TABLE 4. ABSOLUTE MAXIMUM RATINGS
PARAMETER
RATING
−0.3V to +3.63V
Supply Voltage (VDD
)
−0.3V to VDD + 0.3V or 3.63V, whichever is less
Digital Pin Input Voltage
Sound Pressure Level
Mechanical Shock
Vibration
160 dB
10,000 g
Per MIL-STD-883 Method 2007, Test Condition B
−40°C to +85°C
Biased
Temperature Range
−55°C to +150°C
Storage
ESD CAUTION
ESD (electrostatic discharge) sensitive device.
Charged devices and circuit boards can
discharge without detection. Although this
product features patented or proprietary
protection circuitry, damage may occur on
devices subjected to high energy ESD.
Therefore proper ESD precautions should be
taken to avoid performance degradation or
loss of functionality.
Page 6 of 20
Document Number: DS-000121
Revision: 1.3
ICS-52000
SOLDERING PROFILE
CRITICAL ZONE
TO T
tP
T
L
P
T
P
RAMP-UP
T
L
tL
T
SMAX
T
SMIN
tS
RAMP-DOWN
PREHEAT
t25°C TO PEAK TEMPERATURE
TIME
Figure 2. Recommended Soldering Profile Limits
TABLE 5. RECOMMENDED SOLDERING PROFILE
PROFILE FEATURE
Sn63/Pb37
Pb-Free
Average Ramp Rate (TL to TP)
1.25°C/sec max
1.25°C/sec max
Minimum Temperature
100°C
150°C
100°C
(TSMIN
Minimum Temperature
(TSMIN
Time (TSMIN to TSMAX), tS
)
Preheat
200°C
)
60 sec to 75 sec
1.25°C/sec
60 sec to 75 sec
1.25°C/sec
~50 sec
Ramp-Up Rate (TSMAX to TL)
Time Maintained Above Liquidous (tL)
45 sec to 75 sec
183°C
Liquidous Temperature (TL)
Peak Temperature (TP)
217°C
215°C ±3°C/−3°C
260°C +0°C/−5°C
Time Within +5°C of Actual Peak
Temperature (tP)
20 sec to 30 sec
20 sec to 30 sec
3°C/sec max
Ramp-Down Rate
3°C/sec max
5 min max
Time +25°C (t25°C) to Peak Temperature
5 min max
*The reflow profile in Table 5 is recommended for board manufacturing with InvenSense MEMS microphones. All microphones are also compatible with the J-STD-020
profile.
Page 7 of 20
Document Number: DS-000121
Revision: 1.3
ICS-52000
PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS
Figure 3. Pin Configuration (Top View, Terminal Side Down)
TABLE 6. PIN FUNCTION DESCRIPTIONS
PIN
NAME
TYPE
Output
Input
FUNCTION
WS output, connect to WS of the next ICS-52000 in the daisy-chain.
Pull to VDD. The state of this pin is used at power-up.
1
WSO
2
CONFIG
VDD
3
Power
Power, 1.62V to 3.63V. This pin should be decoupled to GND with a 0.1 μF capacitor.
4
5
GND
WS
Ground
Input
Ground. Connect to ground on the PCB.
Serial Data-Word Select for TDM Interface
Serial Data Clock for TDM Interface
6
7
SCK
SD
Input
Output
Serial Data Output for TDM Interface. This pin tri-states when not actively driving the appropriate
output channel. The SD trace should have a 100 kΩ pulldown resistor to discharge the line during
the time that all microphones on the bus have tri-stated their outputs.
Page 8 of 20
Document Number: DS-000121
Revision: 1.3
ICS-52000
TYPICAL PERFORMANCE CHARACTERISTICS
30
20
10
0
10
1
-10
-20
-30
0.1
90
95
100
105
110
115
120
125
10
100
1k
10k
INPUT (dB SPL)
FREQUENCY (Hz)
Figure 5. Total Harmonic Distortion + Noise (THD+N) vs. Input SPL
0
Figure 4. Typical Frequency Response (Measured)
0
-5
-10
-15
-20
-25
-30
-35
–20
–40
–60
–80
–100
–120
100
1k
10k
90
95
100
105
110
115
120
125
FREQUENCY (Hz)
INPUT AMPLITUDE (dB SPL)
Figure 6. PSR vs. Frequency, 100 mV p-p Swept Sine Wave
Figure 7. Linearity
Page 9 of 20
Document Number: DS-000121
Revision: 1.3
ICS-52000
THEORY OF OPERATION
STARTUP AND POWER MANAGEMENT
The ICS-52000 has two power states: normal operation, and standby mode.
Startup
At startup of the ICS-52000, the start of the frame sync (WS) signal should be delayed from the start of the serial clock (SCK) by at
least 10 ms. This enables the microphone’s internal circuits to completely initialize before starting the synchronization sequence
with other microphones in the TDM array. This delay can be implemented either by enabling the WS output on the clock master at
least 10 ms after the SCK is enabled, or by externally controlling the signals given to the ICS-52000s.
>10 ms
1/fs
WS (MASTER)
SCK
Figure 8. Clock Startup Sequence
The ICS-52000 will begin to output non-zero data 4462 SCK clock cycles (1.5 ms with fSCK = 3.072 MHz) after initial power-up. The
data is valid to use after the initial 262,144 SCK cycles (85 ms with fSCK = 3.072 MHz). This startup time is applicable any time it is
entering normal operation mode, coming either from power-down or out of standby.
Table 7 shows the startup time for different sampling rates.
Table 7. Startup time
fS (WS frequency)
Time to non-zero data output
Startup time to valid data
48 kHz
1.5 ms
3.0 ms
4.5 ms
9.0 ms
85 ms
171 ms
256 ms
512 ms
24 kHz
16 kHz
8 kHz
Normal Operation
The part is in normal operation mode when SCK and WS are active. Clocks should not be supplied to the microphones until they are
settled and stable.
Standby Mode
The microphone enters standby mode when the frequency of SCK falls below about 1 kHz. It is recommended to enter standby
mode by stopping both the SCK and WS clock signals and pulling those signals to ground to avoid drawing current through the WS
pin’s internal pull-down resistor. The timing for exiting standby mode is the same as normal startup.
Do not supply active clocks (WS and SCK) to the ICS-52000 while there is no power supplied to VDD, doing this continuously turns on
ESD protection diodes, which may affect long-term reliability of the microphone.
Soft Unmute
The ICS-52000 has a soft unmute feature to prevent pops on power-up. From the time that the ICS-52000 starts to output data, the
volume will ramp up to the full-scale output level over 256 WS clock cycles. With a 48 kHz sampling rate, this unmute sequence will
take about 5.3 ms.
Page 10 of 20
Document Number: DS-000121
Revision: 1.3
ICS-52000
SYNCHRONIZING MICROPHONES
ICS-52000 microphones are synchronized by the WS signal, so audio captured from multiple microphones sharing the same clock will
be sampled synchronously.
TDM DATA INTERFACE
The slave serial data port’s format is TDM, 24-bit, twos complement and up to 16 ICS-52000 microphones can be daisy-chained
together on a single data bus. There must be 64, 128, 256 or 512 SCK cycles in each WS frame. Each microphone will output 24-bit
data in subsequent 32-bit slots. Tie the SD pins of all ICS-52000 microphones driving the data bus together as shown in Figure 9. The
ICS-52000 will always be a slave on the TDM bus.
The word select/word clock signals of the microphones in the system will be daisy-chained so that the clock master drives WS of the
first ICS-52000, whose WSO will drive WS of the second ICS-52000, and so on; the last ICS-52000 in the chain can leave WSO
disconnected. See Figure 9 for an illustration of these connections. The ICS-52000’s WS clock input is sampled on the rising edge of
SCK and the falling edge of WS can come anywhere before the start of the next frame. The ICS-52000 connected directly to the
system’s clock master will output its data in the first TDM slot, the next microphone in the chain will output its data in the second
TDM slot, and so on.
The frequency of SCK will depend on the number of microphones in the system. The SCK frequency should be n × 32 × fS, where n is
a power of two (2, 4, 8, or 16) equal to or greater than the number of ICS-52000s on the bus. Table 8 shows the recommended SCK
frequency for a chain of ICS-52000 microphones.
Table 8. SCK Frequency
Number of ICS-52000 Microphones
SCK Frequency, based on WS frequency (fS)
1-2
3-4
5-8
9-16
64 × fS
128 × fS
256 × fS
512 × fS
Figure 10 shows the format of an n-channel TDM data stream. Figure 11 zooms in on a single TDM data slot as output from a single
ICS-52000 microphone.
Data Output Format
The output data word length is 24 bits/channel. The data word format is 2’s complement, MSB-first.
The serial TDM data output bits are triggered on SCK’s rising edge. The receiver (DSP, codec, microcontroller) should sample that
data bit on the next SCK rising edge. This is illustrated in Figure 11; SCK rising edge A triggers the SD output bit and the receiver
should sample the data at its input on SCK rising edge B. The data is formatted in this way to support the internal propagation delay
of the microphone data at high SCK frequencies.
The output data pin (SD) is tri-stated when it is not actively driving TDM output data. SD will immediately tri-state after the LSB is
output so that another microphone can drive the common data line.
The SD trace should have a pull-down resistor to discharge the line during the time that all microphones on the bus have tri-stated
their outputs. A 100 kΩ or smaller resistor is sufficient for this, as shown in Figure 9.
Page 11 of 20
Document Number: DS-000121
Revision: 1.3
ICS-52000
From Voltage
Regulator (1.8-3.3V)
0.1 uF
0.1 uF
0.1 uF
SEE THE STARTUP SECTION
AND FIGURE 8 FOR DETAILS
ON CONNECTING THE SYSTEM
MASTER TO THE MICROPHONE
ARRAY.
CONFIG VDD
CONFIG VDD
CONFIG VDD
WS
WS
WSO
SD
WS
WSO
SD
WSI
WSO
SD
ICS-52000
#1
ICS-52000
#2
ICS-52000
#n
SYSTEM MASTER
(MICROCONTROLLER,
DSP, CODEC)
SCK
SCK
SCK
SCK
GND
GND
GND
SD
100 kΩ
Figure 9. System Block Diagram
WS(MASTER)
WSO(1), WS(2)
WSO(2), WS(3)
WSO(n-1), WS(n)
SCK
SD
SLOT
1
SLOT 1
SLOT
n
SLOT
2
SLOT 3
Figure 10. n-Channel Output TDM Timing Diagram
WS
WSO
1
2
3
23
24
25
31
32
33
34
A
B
SCK (n x 32 x fs)
SD
Output Data
High-Z
High-Z
MSB
LSB
Figure 11. Single TDM Slot Timing Diagram
Page 12 of 20
Document Number: DS-000121
Revision: 1.3
ICS-52000
DIGITAL MICROPHONE SENSITIVITY
The sensitivity of a digital output microphone is specified in units of dB FS (decibels relative to a full-scale digital output). A 0 dB FS
sine wave is defined as a signal whose peak just touches the full-scale code of the digital word (see Figure 5). This measurement
convention means that signals with a different crest factor may have an RMS level higher than 0 dB FS. For example, a full-scale
square wave has an RMS level of 3 dB FS.
1.0
0.8
0.6
0.4
0.2
0
–0.2
–0.4
–0.6
–0.8
–1.0
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
TIME (ms)
Figure 12. 1 kHz, 0 dB FS Sine Wave
The definition of a 0 dB FS signal must be understood when measuring the sensitivity of the ICS-52000. An acoustic input signal of a
1 kHz sine wave at 94 dB SPL applied to the ICS-52000 results in an output signal with a −26 dB FS level. This means that the output
digital word peaks at −26 dB below the digital full-scale level. A common misunderstanding is that the output has an RMS level of
−29 dB FS; however, this is not the case because of the definition of a 0 dB FS sine wave.
There is no commonly accepted unit of measurement to express the instantaneous level of a digital signal output from the
microphone, as opposed to the RMS level of the signal. Some measurement systems express the instantaneous level of an individual
sample in units of D, where 1.0 D is digital full scale (see Figure 12). In this case, a −26 dB FS sine wave has peaks at 0.05 D.
For more information about digital microphone sensitivity, see the AN-1112 Application Note, Microphone Specifications Explained.
DIGITAL FILTER CHARACTERISTICS
The ICS-52000 has an internal digital bandpass filter. A high-pass filter eliminates unwanted low frequency signals. A low-pass
decimation filter scales the pass band with the sampling frequency and performs required out-of-band noise reduction.
High-Pass Filter
The ICS-52000 incorporates a high-pass filter to remove unwanted dc and very low frequency components. With fS = 48 kHz, this high
pass filter has a −3 dB corner frequency of 3.7 Hz. The cutoff frequency scales with changes in sampling rate.
This digital filter response is in addition to the acoustic high-pass response of the ICS-52000 that has a −3 dB corner of 50 Hz.
Low-Pass Decimation Filter
The analog-to-digital converter in the ICS-52000 is a single-bit, high order, sigma-delta (Σ-Δ) running at a high oversampling ratio.
The noise shaping of the converter pushes the majority of the noise well above the audio band and gives the microphone a wide
dynamic range. However, it does require a good quality low-pass decimation filter to eliminate the high frequency noise.
The pass band of the filter extends to 0.417 × fS and, in that band, has only 0.04 dB of ripple. The high frequency cutoff of −3 dB
occurs at 0.5 × fS. A 48 kHz sampling rate results in a pass band of 20.3 kHz and a half amplitude corner at 24 kHz; the stop-band
attenuation of the filter is 58 dB. Note that these filter specifications scale with sampling frequency.
Page 13 of 20
Document Number: DS-000121
Revision: 1.3
ICS-52000
APPLICATIONS INFORMATION
SD OUTPUT DRIVE STRENGTH
The SD data output pin must drive a load that includes the PCB trace and the tri-stated inputs of the other ICS-52000 SD pins
connected to that same trace. The tri-stated load capacitance of the ICS-52000 SD pin is about 6 pF. The ICS-52000 is designed to
drive a load of 150 pF. If 16 ICS-52000 microphones are connected to a common 30” SD trace on a typical PCB, the driver will meet
the timing specs with a 24.576 MHz SCK and 2 ns propagation delay.
Design Recommendations
The SD output driver has an output impedance of about 25-35Ω. A source termination resistor placed close to each microphone’s SD
pin may help to reduce ringing and overshoot on the output signal. A 15-25Ω resistor will help to match the source impedance to a
typical 50Ω transmission line.
The SD signal’s propagation delay is a function of the PCB material and length of the trace. Arrays with a larger number of
microphones will usually have a longer SD trace on the PCB. The worst-case timing conditions specified above (24.576 MHz SCK, 2 ns
propagation delay) were calculated for a 16 microphone array with 2” spacing between each microphone and fS = 48 kHz.
The propagation delay is minimized by reducing the distance between the SD source and the device receiving the data. This is done
by placing the receiver in the layout in the middle of the SD trace, rather than at one of the extremes. That will cut the worst-case
propagation delay in half, compared to if the receiver is placed at one end of a long SD trace.
If the distance between the microphone array and the receiver cannot be minimized, it may be useful to have a buffer between the
two. Place the buffer at the point that minimizes the distance between it and the furthest microphones on the PCB trace. This single
buffer could drive the remaining distance between it and the data receiver. The buffer’s propagation delay may be a critical spec,
especially with higher clock rates.
POWER SUPPLY DECOUPLING
For best performance and to avoid potential parasitic artifacts, placing a 0.1 µF ceramic type X7R or better capacitor between
Pin 3 (VDD) and ground is strongly recommended. The capacitor should be placed as close to Pin 3 as possible.
The connections to each side of the capacitor should be as short as possible, and the trace should stay on a single layer with no vias.
For maximum effectiveness, locate the capacitor equidistant from the power and ground pins or, when equidistant placement is not
possible, slightly closer to the power pin. Thermal connections to the ground planes should be made on the far side of the capacitor,
as shown in Figure 13.
VDD GND
CAPACITOR
TO V
DD
TO GND
Figure 13. Recommended Power Supply Bypass Capacitor Layout
Page 14 of 20
Document Number: DS-000121
Revision: 1.3
ICS-52000
SUPPORTING DOCUMENTS
For additional information, see the following documents.
EVALUATION BOARD USER GUIDE
AN-000001, Bottom-Port I2S/TDM Output MEMS Microphone Evaluation Board
AN-000099, Synchronous Sampling with an Array of ICS-52000 TDM Microphones
APPLICATION NOTES
AN-100, MEMS Microphone Handling and Assembly Guide
AN-1003, Recommendations for Mounting and Connecting the InvenSense Bottom-Ported MEMS Microphones
AN-1112, Microphone Specifications Explained
AN-1124, Recommendations for Sealing InvenSense Bottom-Port MEMS Microphones from Dust and Liquid Ingress
AN-1140, Microphone Array Beamforming
Page 15 of 20
Document Number: DS-000121
Revision: 1.3
ICS-52000
PCB DESIGN AND LAND PATTERN LAYOUT
The recommended PCB land pattern for the ICS-52000 should be laid out to a 1:1 ratio to the solder pads on the microphone
package, as shown in Figure 14. Take care to avoid applying solder paste to the sound hole in the PCB. A suggested solder paste
stencil pattern layout is shown in Figure 15. The diameter of the sound hole in the PCB should be larger than the diameter of the
sound port of the microphone. A minimum diameter of 0.5 mm is recommended.
6X 0.40X0.60
0.65
0.65
1.275
Ø
1.65
1.05
Ø
Figure 14. PCB Land Pattern Layout
Dimensions shown in millimeters
6X 0.30X0.50
Ø
1.65
Ø
1.15
2.15
0.1(4x)
0.65
0.65
1.275
Figure 15. Suggested Solder Paste Stencil Pattern Layout
Dimensions shown in millimeters
PCB MATERIAL AND THICKNESS
The performance of the ICS-52000 is not affected by PCB thickness. The ICS-52000 can be mounted on either a rigid or flexible PCB.
A flexible PCB with the microphone can be attached directly to the device housing with an adhesive layer. This mounting method
offers a reliable seal around the sound port while providing the shortest acoustic path for good sound quality.
Page 16 of 20
Document Number: DS-000121
Revision: 1.3
ICS-52000
HANDLING INSTRUCTIONS
PICK AND PLACE EQUIPMENT
The MEMS microphone can be handled using standard pick-and-place and chip shooting equipment. Take care to avoid damage to the
MEMS microphone structure as follows:
•
•
•
Use a standard pickup tool to handle the microphone. Because the microphone hole is on the bottom of the package, the
pickup tool can make contact with any part of the lid surface.
Do not pick up the microphone with a vacuum tool that makes contact with the bottom side of the microphone.
Do not pull air out of or blow air into the microphone port.
Do not use excessive force to place the microphone on the PCB.
REFLOW SOLDER
For best results, the soldering profile must be in accordance with the recommendations of the manufacturer of the solder paste used to
attach the MEMS microphone to the PCB. It is recommended that the solder reflow profile not exceed the limit conditions specified
in Figure 2 and Table 5.
BOARD WASH
When washing the PCB, ensure that water does not make contact with the microphone port. Do not use blow-off procedures or
ultrasonic cleaning.
Page 17 of 20
Document Number: DS-000121
Revision: 1.3
ICS-52000
OUTLINE DIMENSIONS
f
0.10 C
d
0.10 (4X)
C
A
0.40X0.60 (6x)
(0.266)
4.00±0.10
j
0.10 m C A B
0.25
1.075
REFERENCECORNER
(0.72)
0.07
0.125±0.05
0.125±0.05
Ø1.65
Ø1.05
Ø0.35
B
0.25
1.10
(3.86)
0.125±0.05
4.00
1.0±0.10
TOP VIEW
SIDE VIEW
BOTTOM VIEW
Figure 16. 7-Terminal Chip Array Small Outline No Lead Cavity
4.00 × 3.00 × 1.00 mm Body
Dimensions shown in millimeters
PIN 1 INDIC ATION
PART NUMBER
520
YYXXXX
DATE CODE
LOT TR ACEABILIT Y
Figure 17. Package Marking Specification (Top View)
ORDERING GUIDE
PART
TEMP RANGE
−40°C to +85°C
PACKAGE
7-Terminal LGA_CAV
QUANTITY
5,000
PACKAGING
13” Tape and Reel
ICS-52000
EV_ICS-52000-FX
Flex Evaluation Board
Page 18 of 20
Document Number: DS-000121
Revision: 1.3
ICS-52000
REVISION HISTORY
REVISION DATE
REVISION
DESCRIPTION
8/26/2016
9/14/2016
1/4/2017
4/14/2017
1.0
1.1
1.2
1.3
Initial Version
Fixed typo on Table 8
Updated boilerplate text to reflect Production status.
Updated Table 3, Figure 1, Startup and TDM Data Interface Sections
Page 19 of 20
Document Number: DS-000121
Revision: 1.3
ICS-52000
COMPLIANCE DECLARATION DISCLAIMER
InvenSense believes the environmental and other compliance information given in this document to be correct but cannot
guarantee accuracy or completeness. Conformity documents substantiating the specifications and component characteristics are on
file. InvenSense subcontracts manufacturing, and the information contained herein is based on data received from vendors and
suppliers, which has not been validated by InvenSense.
This information furnished by InvenSense is believed to be accurate and reliable. However, no responsibility is assumed by
InvenSense for its use, or for any infringements of patents or other rights of third parties that may result from its use. Specifications
are subject to change without notice. InvenSense reserves the right to make changes to this product, including its circuits and
software, in order to improve its design and/or performance, without prior notice. InvenSense makes no warranties, neither
expressed nor implied, regarding the information and specifications contained in this document. InvenSense assumes no
responsibility for any claims or damages arising from information contained in this document, or from the use of products and
services detailed therein. This includes, but is not limited to, claims or damages based on the infringement of patents, copyrights,
mask work and/or other intellectual property rights.
Certain intellectual property owned by InvenSense and described in this document is patent protected. No license is granted by
implication or otherwise under any patent or patent rights of InvenSense. This publication supersedes and replaces all information
previously supplied. Trademarks that are registered trademarks are the property of their respective companies. InvenSense sensors
should not be used or sold in the development, storage, production or utilization of any conventional or mass-destructive weapons
or for any other weapons or life threatening applications, as well as in any other life critical applications such as medical equipment,
transportation, aerospace and nuclear instruments, undersea equipment, power plant equipment, disaster prevention and crime
prevention equipment.
©2016-2017 InvenSense, Inc. All rights reserved. InvenSense, MotionTracking, MotionProcessing, MotionProcessor, MotionFusion,
MotionApps, DMP, AAR and the InvenSense logo are trademarks of InvenSense, Inc. Other company and product names may be
trademarks of the respective companies with which they are associated.
©2016-2017 InvenSense, Inc. All rights reserved.
Page 20 of 20
Document Number: DS-000121
Revision: 1.3
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