ITG-3200 [TDK]
陀螺仪;
| 型号： | ITG-3200 |
| 厂家： | 
TDK ELECTRONICS |
| 描述： | 陀螺仪 |
| 文件： | 总34页 (文件大小：1127K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
InvenSense Inc.
Document Number: PS-ITG-3200A-00
Revision: 1.7
Release Date: 08/02/2011
1197 Borregas Ave, Sunnyvale, CA 94089 U.S.A.
Tel: +1 (408) 988-7339 Fax: +1 (408) 988-8104
Website: www.invensense.com
ITG-3200
Product Specification
Revision 1.7
Document Number: PS-ITG-3200A-00
Revision: 1.7
Release Date: 08/02/2011
ITG-3200 Product Specification
CONTENTS
1
DOCUMENT INFORMATION.............................................................................................................................. 3
1.1
REVISION HISTORY ............................................................................................................................................. 3
PURPOSE AND SCOPE........................................................................................................................................... 5
PRODUCT OVERVIEW .......................................................................................................................................... 5
SOFTWARE SOLUTIONS........................................................................................................................................ 5
APPLICATIONS..................................................................................................................................................... 6
1.2
1.3
1.4
1.5
2
3
FEATURES............................................................................................................................................................... 7
ELECTRICAL CHARACTERISTICS.................................................................................................................. 8
3.1
SENSOR SPECIFICATIONS..................................................................................................................................... 8
ELECTRICAL SPECIFICATIONS.............................................................................................................................. 9
ELECTRICAL SPECIFICATIONS, CONTINUED ........................................................................................................10
ELECTRICAL SPECIFICATIONS, CONTINUED ........................................................................................................11
I2C TIMING CHARACTERIZATION........................................................................................................................12
ABSOLUTE MAXIMUM RATINGS.........................................................................................................................13
3.2
3.3
3.4
3.5
3.6
4
5
APPLICATIONS INFORMATION ......................................................................................................................14
4.1
PIN OUT AND SIGNAL DESCRIPTION...................................................................................................................14
TYPICAL OPERATING CIRCUIT............................................................................................................................15
BILL OF MATERIALS FOR EXTERNAL COMPONENTS ...........................................................................................15
RECOMMENDED POWER-ON PROCEDURE...........................................................................................................16
4.2
4.3
4.4
FUNCTIONAL OVERVIEW.................................................................................................................................17
5.1
BLOCK DIAGRAM ...............................................................................................................................................17
OVERVIEW .........................................................................................................................................................17
THREE-AXIS MEMS GYROSCOPE WITH 16-BIT ADCS AND SIGNAL CONDITIONING..........................................17
I2C SERIAL COMMUNICATIONS INTERFACE ........................................................................................................18
CLOCKING ..........................................................................................................................................................18
SENSOR DATA REGISTERS..................................................................................................................................18
INTERRUPTS .......................................................................................................................................................18
DIGITAL-OUTPUT TEMPERATURE SENSOR .........................................................................................................18
BIAS AND LDO...................................................................................................................................................18
5.2
5.3
5.4
5.5
5.6
5.7
5.8
5.9
5.10 CHARGE PUMP ...................................................................................................................................................18
6
7
DIGITAL INTERFACE .........................................................................................................................................19
6.1
ASSEMBLY.............................................................................................................................................................23
I2C SERIAL INTERFACE.......................................................................................................................................19
7.1
ORIENTATION.....................................................................................................................................................23
PACKAGE DIMENSIONS.......................................................................................................................................24
PCB DESIGN GUIDELINES: .................................................................................................................................25
ASSEMBLY PRECAUTIONS ..................................................................................................................................26
PACKAGE MARKING SPECIFICATION ..................................................................................................................29
TAPE & REEL SPECIFICATION.............................................................................................................................30
LABEL ................................................................................................................................................................31
PACKAGING........................................................................................................................................................32
7.2
7.3
7.4
7.5
7.6
7.7
7.8
8
9
RELIABILITY ........................................................................................................................................................33
8.1
8.2
QUALIFICATION TEST POLICY ............................................................................................................................33
QUALIFICATION TEST PLAN ...............................................................................................................................33
ENVIRONMENTAL COMPLIANCE ..................................................................................................................34
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Document Number: PS-ITG-3200A-00
Revision: 1.7
Release Date: 08/02/2011
ITG-3200 Product Specification
1
Document Information
1.1
Revision History
Revision
Date
Revision Description
10/23/09
10/28/09
1.0
1.1
Initial Release
Edits for readability
Changed full-scale range and sensitivity scale factor (Sections 2, 3.1, 5.3, and
8.3)
Changed sensitivity scale factor variation over temperature (Section 3.1)
Changed total RMS noise spec (Section 3.1)
Added range for temperature sensor (Section 3.1)
Updated VDD Power-Supply Ramp Rate specification (Sections 3.2 and 4.4)
Added VLOGIC Voltage Range condition (Section 3.2)
Added VLOGIC Reference Voltage Ramp Rate specification (Sections 3.2 and
4.4)
Updated Start-Up Time for Register Read/Write specification (Section 3.2)
Updated Input logic levels for AD0 and CLKIN (Section 3.2)
Updated Level IOL specifications for the I2C interface (Section 3.3)
Updated Frequency Variation Over Temperature specification for internal clock
source (Section 3.4)
Updated VLOGIC conditions for I2C Characterization (Section 3.5)
Updated ESD specification (Section 3.6)
Added termination requirements for CLKIN if unused (Section 4.1)
Added recommended power-on procedure diagram (Section 4.4)
Changed DLPF_CFG setting 7 to reserved (Section 8.3)
Changed Reflow Specification description (Section 9.12)
Removed errata specifications
02/12/2010
1.2
Updated temperature sensor linearity spec (Section 3.1)
Updated VDD Power-Supply Ramp Rate timing figure (Sections 3.2 and 4.4)
Updated VLOGIC Reference Voltage timing figure (Section 4.4)
Added default values to registers (all of Section 8)
Updated FS_SEL description (Section 8.3)
Updated package outline drawing and dimensions (Section 9.2)
Updated Reliability (Section 10.1 and 10.2)
03/05/2010
03/30/2010
07/27/2010
1.3
1.4
1.5
Removed Environmental Compliance (Section 11)
Removed confidentiality mark
Changed Clock Frequency Initial Tolerance for CLKSEL=0, 25°C (Section 3.4)
Created separate document for Register Map and Register Descriptions
Added section describing InvenSense software solutions (Section 1.4)
Added specification for CLKOUT Digital Output (Section 3.2)
Updated specifications for CI (Sections 3.2-3.3)
Updated specifications for Cb (Section 3.5)
Updated Digital Input values and pins
Clarified TVLG-VDD value (Section 4.4)
Documented inoperable I2C bus when VDD is low and interface pins are low
impedance (Section 5.4)
Modified Assembly Rules, packaging images and Moisture Sensitivity Level
(MSL) label (Section 7)
06/06/2011
1.6
3 of 34
Document Number: PS-ITG-3200A-00
Revision: 1.7
Release Date: 08/02/2011
ITG-3200 Product Specification
Modified diagram for clarify (Section 7.3)
Updated Reliability Testing Policy (Section 8)
Added Environment Compliance Section (Section 9)
08/02/2011
1.7
Removed Temperature Sensor Initial Accuracy of “TBD” (Section 3.1)
4 of 34
Document Number: PS-ITG-3200A-00
Revision: 1.7
Release Date: 08/02/2011
ITG-3200 Product Specification
1.2 Purpose and Scope
This document is a preliminary product specification, providing a description, specifications, and design
related information for the ITG-3200TM
Electrical characteristics are based upon simulation results and
.
limited characterization data of advanced samples only. Specifications are subject to change without notice.
Final specifications will be updated based upon characterization of final silicon.
1.3 Product Overview
The ITG-3200 is the world’s first single-chip, digital-output, 3-axis MEMS gyro IC optimized for gaming, 3D
mice, and 3D remote control applications. The part features enhanced bias and sensitivity temperature
stability, reducing the need for user calibration. Low frequency noise is lower than previous generation
devices, simplifying application development and making for more-responsive remote controls.
The ITG-3200 features three 16-bit analog-to-digital converters (ADCs) for digitizing the gyro outputs, a user-
selectable internal low-pass filter bandwidth, and a Fast-Mode I2C (400kHz) interface. Additional features
include an embedded temperature sensor and a 2% accurate internal oscillator. This breakthrough in
gyroscope technology provides a dramatic 67% package size reduction, delivers a 50% power reduction,
and has inherent cost advantages compared to competing multi-chip gyro solutions.
By leveraging its patented and volume-proven Nasiri-Fabrication platform, which integrates MEMS wafers
with companion CMOS electronics through wafer-level bonding, InvenSense has driven the ITG-3200
package size down to a revolutionary footprint of 4x4x0.9mm (QFN), while providing the highest
performance, lowest noise, and the lowest cost semiconductor packaging required for handheld consumer
electronic devices. The part features a robust 10,000g shock tolerance, as required by portable consumer
equipment.
For power supply flexibility, the ITG-3200 has a separate VLOGIC reference pin, in addition to its analog
supply pin, VDD, which sets the logic levels of its I2C interface. The VLOGIC voltage may be anywhere from
1.71V min to VDD max.
1.4 Software Solutions
This section describes the MotionApps™ software solutions included with the InvenSense MPU™
(MotionProcessing Unit™) and IMU (Inertial Measurement Unit) product families. Please note that the
products within the IDG, IXZ, and ITG families do not include these software solutions.
The MotionApps Platform is a complete software solution that in combination with the InvenSense IMU and
MPU MotionProcessor™ families delivers robust, well-calibrated 6-axis and/or 9-axis sensor fusion data
using its field proven and proprietary MotionFusion™ engine. Solution packages are available for
smartphones and tablets as well as for embedded microcontroller-based devices.
The MotionApps Platform provides a turn-key solution for developers and accelerates time-to-market. It
consists of complex 6/9-axis sensor fusion algorithms, robust multi-sensor calibration, a proven software
architecture for Android and other leading operating systems, and a flexible power management scheme.
The MotionApps Platform is integrated within the middleware of the target OS (the sensor framework), and
also provides a kernel device driver to interface with the physical device. This directly benefits application
developers by providing a cohesive set of APIs and a well-defined sensor data path in the user-space.
5 of 34
Document Number: PS-ITG-3200A-00
Revision: 1.7
Release Date: 08/02/2011
ITG-3200 Product Specification
The table below describes the MotionApps software solutions included with the InvenSense MPU and IMU
product families.
InvenSense MotionProcessor Devices and Included MotionApps Software
Included Software
Embedded
Embedded
MotionApps
MotionApps
Lite
Feature
MotionApps
MotionApps
Lite
Notes
MPU-3050™
MPU-6050™
Part Number
Processor Type
IMU-3000™
Mobile
Application
Processor
Mobile
8/16/32-bit
8/16/32-bit
Application
Processor
Microcontroller
Microcontroller
TV remotes,
health/fitness,
toys, other
TV remotes,
health/fitness,
toys, other
Smartphones,
tablets
Smartphones,
tablets
Applications
embedded
embedded
< 2% Application Processor
load using on-chip Digital
Motion Processor (DMP).
6-Axis MotionFusion
Yes
Yes
Reduces processing
requirements for embedded
applications
9-Axis MotionFusion
Gyro Bias Calibration
Yes
No
No-Motion calibration and
temperature calibration
Integrates 3rd party compass
libraries
Yes
Yes
Yes
Yes
No
3rd Party Compass Cal
API
Gyro-Assisted Compass
Calibration (Fast Heading)
Quick compass calibration
using gyroscope
No
Magnetic Anomaly
Rejection
(Improved Heading)
Uses gyro heading data
when magnetic anomaly is
detected
Yes
No
The table below lists recommended documentation for the MotionApps software solutions.
Software Documentation
Platform
MotionApps and MotionApps Lite
Embedded MotionApps and
Embedded MotionApps Lite
Installation Guide for Linux and Android
MotionApps Platform, v1.9 or later
Embedded MotionApps Platform
User Guide, v3.0 or later
Software
Documentation
MPL Functional Specifications
Embedded MPL Functional
Specifications
For more information about the InvenSense MotionApps Platform, please visit the Developer’s Corner or
consult your local InvenSense Sales Representative.
1.5
Applications
Motion-enabled game controllers
Motion-based portable gaming
Motion-based 3D mice and 3D remote controls
“No Touch” UI
Health and sports monitoring
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Document Number: PS-ITG-3200A-00
Revision: 1.7
Release Date: 08/02/2011
ITG-3200 Product Specification
2
Features
The ITG-3200 triple-axis MEMS gyroscope includes a wide range of features:
Digital-output X-, Y-, and Z-Axis angular rate sensors (gyros) on one integrated circuit with a
sensitivity of 14.375 LSBs per °/sec and a full-scale range of ±2000°/sec
Three integrated 16-bit ADCs provide simultaneous sampling of gyros while requiring no external
multiplexer
Enhanced bias and sensitivity temperature stability reduces the need for user calibration
Low frequency noise lower than previous generation devices, simplifying application development
and making for more-responsive motion processing
Digitally-programmable low-pass filter
Low 6.5mA operating current consumption for long battery life
Wide VDD supply voltage range of 2.1V to 3.6V
Flexible VLOGIC reference voltage allows for I2C interface voltages from 1.71V to VDD
Standby current: 5µA
Smallest and thinnest package for portable devices (4x4x0.9mm QFN)
No high pass filter needed
Turn on time: 50ms
Digital-output temperature sensor
Factory calibrated scale factor
10,000 g shock tolerant
Fast Mode I2C (400kHz) serial interface
On-chip timing generator clock frequency is accurate to +/-2% over full temperature range
Optional external clock inputs of 32.768kHz or 19.2MHz to synchronize with system clock
MEMS structure hermetically sealed and bonded at wafer level
RoHS and Green compliant
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Document Number: PS-ITG-3200A-00
Revision: 1.7
Release Date: 08/02/2011
ITG-3200 Product Specification
3
Electrical Characteristics
3.1
Sensor Specifications
Typical Operating Circuit of Section 4.2, VDD = 2.5V, VLOGIC = 1.71V to VDD, TA=25°C.
Parameter
Conditions
Min
Typical
Max
Unit
Note
GYRO SENSITIVITY
Full-Scale Range
FS_SEL=3
±2000
16
º/s
Bits
4
3
3
1
2
Gyro ADC Word Length
Sensitivity Scale Factor
Sensitivity Scale Factor Tolerance
FS_SEL=3
25°C
14.375
LSB/(º/s)
%
-6
+6
Sensitivity Scale Factor Variation Over
Temperature
±10
%
Nonlinearity
Best fit straight line; 25°C
0.2
2
%
%
6
6
Cross-Axis Sensitivity
GYRO ZERO-RATE OUTPUT (ZRO)
Initial ZRO Tolerance
ZRO Variation Over Temperature
±40
±40
0.2
0.2
4
º/s
º/s
º/s
º/s
º/s
1
2
5
5
5
-40°C to +85°C
Power-Supply Sensitivity (1-10Hz)
Sine wave, 100mVpp; VDD=2.2V
Sine wave, 100mVpp; VDD=2.2V
Sine wave, 100mVpp; VDD=2.2V
Power-Supply Sensitivity (10 - 250Hz)
Power-Supply Sensitivity (250Hz -
100kHz)
Linear Acceleration Sensitivity
GYRO NOISE PERFORMANCE
Total RMS noise
Static
0.1
º/s/g
6
FS_SEL=3
1
2
100Hz LPF (DLPFCFG=2)
At 10Hz
0.38
0.03
º/s-rms
Rate Noise Spectral Density
GYRO MECHANICAL FREQUENCIES
X-Axis
º/s/√Hz
30
27
24
1.7
33
30
27
36
33
30
kHz
kHz
kHz
kHz
1
1
1
1
Y-Axis
Z-Axis
Frequency Separation
GYRO START-UP TIME
ZRO Settling
Between any two axes
DLPFCFG=0
to ±1º/s of Final
50
ms
ºC
6
2
TEMPERATURE SENSOR
Range
-30 to
+85
Sensitivity
280
-13,200
±1
LSB/ºC
LSB
2
1
Temperature Offset
Linearity
35oC
Best fit straight line (-30°C to
+85°C)
°C
2, 5
TEMPERATURE RANGE
Specified Temperature Range
-40
85
ºC
Notes:
1. Tested in production
2. Based on characterization of 30 pieces over temperature on evaluation board or in socket
3. Based on design, through modeling and simulation across PVT
4. Typical. Randomly selected part measured at room temperature on evaluation board or in socket
5. Based on characterization of 5 pieces over temperature
6. Tested on 5 parts at room temperature
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Document Number: PS-ITG-3200A-00
Revision: 1.7
Release Date: 08/02/2011
ITG-3200 Product Specification
3.2
Electrical Specifications
Typical Operating Circuit of Section 4.2, VDD = 2.5V, VLOGIC = 1.71V to VDD, TA=25°C.
Parameters
Conditions
Min
Typical
Max
Units
Notes
VDD POWER SUPPLY
Operating Voltage Range
Power-Supply Ramp Rate
2.1
0
3.6
5
V
2
2
Monotonic ramp. Ramp
rate is 10% to 90% of the
final value (see Figure in
Section 4.4)
ms
Normal Operating Current
Sleep Mode Current
6.5
5
mA
µA
1
5
VLOGIC REFERENCE
VOLTAGE
Voltage Range
VLOGIC must be ≤VDD at
all times
1.71
VDD
1
V
VLOGIC Ramp Rate
Monotonic ramp. Ramp rate
is 10% to 90% of the final
value (see Figure in Section
4.4)
ms
6
Normal Operating Current
100
20
µA
ms
START-UP TIME FOR
REGISTER READ/WRITE
I2C ADDRESS
5
AD0 = 0
AD0 = 1
1101000
1101001
6
6
DIGITAL INPUTS (SDA,
SCL, AD0, CLKIN)
VIH, High Level Input Voltage
VIL, Low Level Input Voltage
CI, Input Capacitance
0.7*VLOGIC
0.9*VLOGIC
V
V
5
5
7
0.3*VLOGIC
< 5
pF
DIGITAL OUTPUT (INT)
VOH, High Level Output
Voltage
2
OPEN=0, Rload=1MΩ
OPEN=0, Rload=1MΩ
V
V
V
VOL, Low Level Output Voltage
0.1*VLOGIC
0.1
2
2
VOL.INT1, INT Low-Level Output
Voltage
OPEN=1, 0.3mA sink
current
Output Leakage Current
tINT, INT Pulse Width
OPEN=1
100
50
nA
µs
4
4
LATCH_INT_EN=0
DIGITAL OUTPUT (CLKOUT)
VOH, High Level Output
Voltage
VOL1, LOW-Level Output
Voltage
RLOAD=1MΩ
RLOAD=1MΩ
0.9*VDD
V
V
2
2
0.1*VDD
Notes:
1. Tested in production
2. Based on characterization of 30 pieces over temperature on evaluation board or in socket
4. Typical. Randomly selected part measured at room temperature on evaluation board or in socket
5. Based on characterization of 5 pieces over temperature
6. Guaranteed by design
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Document Number: PS-ITG-3200A-00
Revision: 1.7
Release Date: 08/02/2011
ITG-3200 Product Specification
3.3
Electrical Specifications, continued
Typical Operating Circuit of Section 4.2, VDD = 2.5V, VLOGIC = 1.71V to VDD, TA=25°C.
Parameters
I2C I/O (SCL, SDA)
Conditions
Typical
Units
Notes
VIL, LOW-Level Input Voltage
-0.5 to 0.3*VLOGIC
V
V
2
2
0.7*VLOGIC to VLOGIC +
0.5V
VIH, HIGH-Level Input Voltage
Vhys, Hysteresis
0.1*VLOGIC
0 to 0.4
V
V
2
2
2
2
4
VOL1, LOW-Level Output Voltage
IOL, LOW-Level Output Current
3mA sink current
VOL = 0.4V
VOL = 0.6V
3
6
mA
mA
Output Leakage Current
100
20+0.1Cb to 250
< 10
nA
ns
pF
tof, Output Fall Time from VIHmax to
VILmax
Cb bus cap. in pF
2
5
CI, Capacitance for Each I/O pin
Notes:
2. Based on characterization of 5 pieces over temperature.
4. Typical. Randomly selected part measured at room temperature on evaluation board or in socket
5. Guaranteed by design
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Document Number: PS-ITG-3200A-00
Revision: 1.7
Release Date: 08/02/2011
ITG-3200 Product Specification
3.4
Electrical Specifications, continued
Typical Operating Circuit of Section 4.2, VDD = 2.5V, VLOGIC = 1.71V to VDD, TA=25°C.
Parameters
Conditions
Min
Typical
Max
Units
Notes
INTERNAL CLOCK SOURCE
CLKSEL=0, 1, 2, or 3
Sample Rate, Fast
DLPFCFG=0
SAMPLERATEDIV = 0
8
1
kHz
kHz
4
4
Sample Rate, Slow
DLPFCFG=1,2,3,4,5, or 6
SAMPLERATEDIV = 0
Clock Frequency Initial Tolerance
Frequency Variation over Temperature
CLKSEL=0, 25°C
CLKSEL=1,2,3; 25°C
CLKSEL=0
-5
-1
+5
+1
%
%
%
1
1
2
-15 to
+10
CLKSEL=1,2,3
CLKSEL=1,2,3
+/-1
%
2
3
PLL Settling Time
1
ms
EXTERNAL 32.768kHz CLOCK
External Clock Frequency
External Clock Jitter
CLKSEL=4
32.768
1 to 2
8.192
kHz
µs
3
3
3
Cycle-to-cycle rms
Sample Rate, Fast
DLPFCFG=0
kHz
SAMPLERATEDIV = 0
Sample Rate, Slow
DLPFCFG=1,2,3,4,5, or 6
SAMPLERATEDIV = 0
1.024
1
kHz
ms
3
3
PLL Settling Time
EXTERNAL 19.2MHz CLOCK
External Clock Frequency
Sample Rate, Fast
CLKSEL=5
19.2
8
MHz
kHz
3
3
DLPFCFG=0
SAMPLERATEDIV = 0
Sample Rate, Slow
PLL Settling Time
DLPFCFG=1,2,3,4,5, or 6
SAMPLERATEDIV = 0
1
1
kHz
ms
3
3
Charge Pump Clock Frequency
Frequency
1st Stage, 25°C
2nd Stage, 25°C
Over temperature
8.5
68
MHz
MHz
%
5
5
5
+/-15
Notes:
1. Tested in production
2. Based on characterization of 30 pieces over temperature on evaluation board or in socket
3. Based on design, through modeling and simulation across PVT
4. Typical. Randomly selected part measured at room temperature on evaluation board or in socket
5. Based on characterization of 5 pieces over temperature.
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Document Number: PS-ITG-3200A-00
Revision: 1.7
Release Date: 08/02/2011
ITG-3200 Product Specification
3.5
I2C Timing Characterization
Typical Operating Circuit of Section 4.2, VDD = 2.5V, VLOGIC = 1.8V±5%, 2.5V±5%, 3.0V±5%, or 3.3V±5%,
TA=25°C.
Parameters
I2C TIMING
Conditions
I2C FAST-MODE
Min
Typical
Max
Units
Notes
fSCL, SCL Clock Frequency
0
400
kHz
us
1
1
tHD.STA, (Repeated) START Condition Hold
Time
0.6
tLOW, SCL Low Period
tHIGH, SCL High Period
1.3
0.6
0.6
us
us
us
1
1
1
tSU.STA, Repeated START Condition Setup
Time
tHD.DAT, SDA Data Hold Time
tSU.DAT, SDA Data Setup Time
tr, SDA and SCL Rise Time
0
us
ns
ns
1
1
1
100
Cb bus cap. from 10 to
400pF
Cb bus cap. from 10 to
400pF
20+0.1Cb
300
300
tf, SDA and SCL Fall Time
20+0.1Cb
ns
1
tSU.STO, STOP Condition Setup Time
0.6
1.3
us
us
1
1
tBUF, Bus Free Time Between STOP and
START Condition
Cb, Capacitive Load for each Bus Line
tVD.DAT, Data Valid Time
< 400
pF
us
us
2
1
1
0.9
0.9
tVD.ACK, Data Valid Acknowledge Time
Notes:
1. Based on characterization of 5 pieces over temperature on evaluation board or in socket
2. Guaranteed by design
I2C Bus Timing Diagram
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Document Number: PS-ITG-3200A-00
Revision: 1.7
Release Date: 08/02/2011
ITG-3200 Product Specification
3.6
Absolute Maximum Ratings
Stresses above those listed as “Absolute Maximum Ratings” may cause permanent damage to the device.
These are stress ratings only and functional operation of the device at these conditions is not implied.
Exposure to the absolute maximum ratings conditions for extended periods may affect device reliability.
Absolute Maximum Ratings
Parameter
Rating
Supply Voltage, VDD
-0.5V to +6V
VLOGIC Input Voltage Level
REGOUT
-0.5V to VDD + 0.5V
-0.5V to 2V
Input Voltage Level (CLKIN, AD0)
SCL, SDA, INT
-0.5V to VDD + 0.5V
-0.5V to VLOGIC + 0.5V
-0.5V to 30V
CPOUT (2.1V ≤ VDD ≤ 3.6V )
Acceleration (Any Axis, unpowered)
Operating Temperature Range
Storage Temperature Range
10,000g for 0.3ms
-40°C to +105°C
-40°C to +125°C
Electrostatic Discharge (ESD)
Protection
1.5kV (HBM); 200V
(MM)
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Document Number: PS-ITG-3200A-00
Revision: 1.7
Release Date: 08/02/2011
ITG-3200 Product Specification
4
Applications Information
4.1
Pin Out and Signal Description
Number
Pin
CLKIN
VLOGIC
AD0
Pin Description
1
Optional external reference clock input. Connect to GND if unused.
Digital IO supply voltage. VLOGIC must be ≤ VDD at all times.
I2C Slave Address LSB
8
9
10
REGOUT
INT
Regulator filter capacitor connection
Interrupt digital output (totem pole or open-drain)
Power supply voltage
12
13
VDD
18
GND
Power supply ground
11
RESV-G
RESV
CPOUT
SCL
Reserved - Connect to ground.
6, 7, 19, 21, 22
Reserved. Do not connect.
20
23
24
Charge pump capacitor connection
I2C serial clock
I2C serial data
SDA
2, 3, 4, 5, 14, 15, 16, 17
NC
Not internally connected. May be used for PCB trace routing.
Top View
24 23 22 21 20 19
CLKIN
NC
1
2
3
4
5
6
18 GND
17 NC
16 NC
15 NC
14 NC
13 VDD
+Z
+Y
I
T
NC
G
-
3
2
0
ITG-3200
0
NC
NC
+X
RESV
7
8
9
10 11 12
QFN Package
24-pin, 4mm x 4mm x 0.9mm
Orientation of Axes of Sensitivity
and Polarity of Rotation
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Document Number: PS-ITG-3200A-00
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Release Date: 08/02/2011
ITG-3200 Product Specification
4.2
Typical Operating Circuit
GND
C1
2.2nF
24 23 22 21 20 19
1
2
3
4
5
6
18
CLKIN
17
16
15
14
13
GND
ITG-3200
VDD
7
8
9
10 11 12
GND
C2
0.1µF
VLOGIC
GND
C4
10nF
C3
0.1µF
GND
GND
Typical Operating Circuit
Bill of Materials for External Components
4.3
Component
Label Specification
Quantity
Charge Pump Capacitor
VDD Bypass Capacitor
Regulator Filter Capacitor
VLOGIC Bypass Capacitor
C1
C2
C3
C4
Ceramic, X7R, 2.2nF ±10%, 50V
Ceramic, X7R, 0.1µF ±10%, 4V
Ceramic, X7R, 0.1µF ±10%, 2V
Ceramic, X7R, 10nF ±10%, 4V
1
1
1
1
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Document Number: PS-ITG-3200A-00
Revision: 1.7
Release Date: 08/02/2011
ITG-3200 Product Specification
4.4
Recommended Power-On Procedure
Power-Up Sequencing
1. TVDDR is VDD rise time: Time for VDD to
rise from 10% to 90% of its final value
TVDDR
2. TVDDR is ≤5msec
90%
10%
3. TVLGR is VLOGIC rise time: Time for
VLOGIC to rise from 10% to 90% of its
final value
10%
VDD
TVLGR
90%
4. TVLGR is ≤1msec
5. TVLG-VDD is the delay from the start of
VDD ramp to the start of VLOGIC rise
6. TVLG-VDD is ≥0; VLOGIC amplitude must
VLOGIC
always be ≤VDD amplitude
7. VDD and VLOGIC must be monotonic
ramps
TVLG - VDD
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Document Number: PS-ITG-3200A-00
Revision: 1.7
Release Date: 08/02/2011
ITG-3200 Product Specification
5
Functional Overview
5.1
Block Diagram
Optional
ITG-3200
1
Clock
CLKIN
CLOCK
X Gyro
Y Gyro
Interrupt
Status
Register
12
Interrupt
INT
Signal
Conditioning
ADC
ADC
9
23
24
Config
Register
AD0
SCL
SDA
I2C Serial
Interface
Signal
Conditioning
Sensor
Register
Signal
Conditioning
Z Gyro
ADC
FIFO
Temp
Sensor
ADC
Factory Cal
Charge
Pump
Bias & LDO
18
VLOGIC GND
20
13
VDD
8
10
CPOUT
REGOUT
5.2
Overview
The ITG-3200 consists of the following key blocks and functions:
Three-axis MEMS rate gyroscope sensors with individual 16-bit ADCs and signal conditioning
I2C serial communications interface
Clocking
Sensor Data Registers
Interrupts
Digital-Output Temperature Sensor
Bias and LDO
Charge Pump
5.3
Three-Axis MEMS Gyroscope with 16-bit ADCs and Signal Conditioning
The ITG-3200 consists of three independent vibratory MEMS gyroscopes, which detect rotational rate about
the X (roll), Y (pitch), and Z (yaw) axes. When the gyros are rotated about any of the sense axes, the
Coriolis Effect causes a deflection that is detected by a capacitive pickoff. The resulting signal is amplified,
demodulated, and filtered to produce a voltage that is proportional to the angular rate. This voltage is
digitized using individual on-chip 16-bit Analog-to-Digital Converters (ADCs) to sample each axis.
The full-scale range of the gyro sensors is preset to ±2000 degrees per second (°/s). The ADC output rate is
programmable up to a maximum of 8,000 samples per second down to 3.9 samples per second, and user-
selectable low-pass filters enable a wide range of cut-off frequencies.
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Document Number: PS-ITG-3200A-00
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ITG-3200 Product Specification
5.4
I2C Serial Communications Interface
The ITG-3200 communicates to a system processor using the I2C serial interface, and the device always
acts as a slave when communicating to the system processor. The logic level for communications to the
master is set by the voltage on the VLOGIC pin. The LSB of the of the I2C slave address is set by pin 9
(AD0).
Note: When VDD is low, the I2C interface pins become low impedance and thus can load the serial bus. This
is a concern if other devices are active on the bus during this time.
5.5
Clocking
The ITG-3200 has a flexible clocking scheme, allowing for a variety of internal or external clock sources for
the internal synchronous circuitry. This synchronous circuitry includes the signal conditioning, ADCs, and
various control circuits and registers. An on-chip PLL provides flexibility in the allowable inputs for
generating this clock.
Allowable internal sources for generating the internal clock are:
An internal relaxation oscillator (less accurate)
Any of the X, Y, or Z gyros’ MEMS oscillators (with an accuracy of ±2% over temperature)
Allowable external clocking sources are:
32.768kHz square wave
19.2MHz square wave
Which source to select for generating the internal synchronous clock depends on the availability of external
sources and the requirements for clock accuracy. There are also start-up conditions to consider. When the
ITG-3200 first starts up, the device operates off of its internal clock until programmed to operate from another
source. This allows the user, for example, to wait for the MEMS oscillators to stabilize before they are
selected as the clock source.
5.6
Sensor Data Registers
The sensor data registers contain the latest gyro and temperature data. They are read-only registers, and
are accessed via the Serial Interface. Data from these registers may be read at any time, however, the
interrupt function may be used to determine when new data is available.
5.7
Interrupts
Interrupt functionality is configured via the Interrupt Configuration register. Items that are configurable
include the INT pin configuration, the interrupt latching and clearing method, and triggers for the interrupt.
Items that can trigger an interrupt are (1) Clock generator locked to new reference oscillator (used when
switching clock sources); and (2) new data is available to be read from the Data registers. The interrupt
status can be read from the Interrupt Status register.
5.8
Digital-Output Temperature Sensor
An on-chip temperature sensor and ADC are used to measure the ITG-3200 die temperature. The readings
from the ADC can be read from the Sensor Data registers.
5.9
Bias and LDO
The bias and LDO sections take in an unregulated VDD supply from 2.1V to 3.6V and generate the internal
supply and the references voltages and currents required by the ITG-3200. The LDO output is bypassed by
a capacitor at REGOUT. Additionally, the part has a VLOGIC reference voltage which sets the logic levels
for its I2C interface.
5.10 Charge Pump
An on-board charge pump generates the high voltage (25V) required to drive the MEMS oscillators. Its
output is bypassed by a capacitor at CPOUT.
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Document Number: PS-ITG-3200A-00
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Release Date: 08/02/2011
ITG-3200 Product Specification
6
Digital Interface
I2C Serial Interface
6.1
The internal registers and memory of the ITG-3200 can be accessed using I2C at up to 400kHz.
Serial Interface
Pin Number
Pin Name
VLOGIC
AD0
Pin Description
8
9
Digital IO supply voltage. VLOGIC must be ≤ VDD at all times.
I2C Slave Address LSB
I2C serial clock
I2C serial data
23
24
SCL
SDA
6.1.1 I2C Interface
I2C is a two wire interface comprised of the signals serial data (SDA) and serial clock (SCL). In general, the
lines are open-drain and bi-directional. In a generalized I2C interface implementation, attached devices can
be a master or a slave. The master device puts the slave address on the bus, and the slave device with the
matching address acknowledges the master.
The ITG-3200 always operates as a slave device when communicating to the system processor, which thus
acts as the master. SDA and SCL lines typically need pull-up resistors to VDD. The maximum bus speed is
400kHz.
The slave address of the ITG-3200 devices is b110100X which is 7 bits long. The LSB bit of the 7 bit address
is determined by the logic level on pin 9. This allows two ITG-3200 devices to be connected to the same I2C
bus. When used in this configuration, the address of the one of the devices should be b1101000 (pin 9 is
logic low) and the address of the other should be b1101001 (pin 9 is logic high). The I2C address is stored in
register 0 (WHO_AM_I register).
I2C Communications Protocol
START (S) and STOP (P) Conditions
Communication on the I2C bus starts when the master puts the START condition (S) on the bus, which is
defined as a HIGH-to-LOW transition of the SDA line while SCL line is HIGH (see figure below). The bus is
considered to be busy until the master puts a STOP condition (P) on the bus, which is defined as a LOW to
HIGH transition on the SDA line while SCL is HIGH (see figure below).
Additionally, the bus remains busy if a repeated START (Sr) is generated instead of a STOP condition.
SDA
SCL
S
P
START condition
STOP condition
START and STOP Conditions
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Document Number: PS-ITG-3200A-00
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Release Date: 08/02/2011
ITG-3200 Product Specification
Data Format / Acknowledge
I2C data bytes are defined to be 8 bits long. There is no restriction to the number of bytes transmitted per
data transfer. Each byte transferred must be followed by an acknowledge (ACK) signal. The clock for the
acknowledge signal is generated by the master, while the receiver generates the actual acknowledge signal
by pulling down SDA and holding it low during the HIGH portion of the acknowledge clock pulse.
If a slave is busy and cannot transmit or receive another byte of data until some other task has been
performed, it can hold SCL LOW, thus forcing the master into a wait state. Normal data transfer resumes
when the slave is ready, and releases the clock line (see figure below).
DATA OUTPUT BY
TRANSMITTER (SDA)
not acknowledge
DATA OUTPUT BY
RECEIVER (SDA)
acknowledge
SCL FROM
MASTER
1
2
8
9
clock pulse for
acknowledgement
START
condition
Acknowledge on the I2C Bus
Communications
After beginning communications with the START condition (S), the master sends a 7-bit slave address
followed by an 8th bit, the read/write bit. The read/write bit indicates whether the master is receiving data from
or is writing to the slave device. Then, the master releases the SDA line and waits for the acknowledge
signal (ACK) from the slave device. Each byte transferred must be followed by an acknowledge bit. To
acknowledge, the slave device pulls the SDA line LOW and keeps it LOW for the high period of the SCL line.
Data transmission is always terminated by the master with a STOP condition (P), thus freeing the
communications line. However, the master can generate a repeated START condition (Sr), and address
another slave without first generating a STOP condition (P). A LOW to HIGH transition on the SDA line while
SCL is HIGH defines the stop condition. All SDA changes should take place when SCL is low, with the
exception of start and stop conditions.
SDA
SCL
1 – 7
8
9
1 – 7
8
9
1 – 7
8
9
S
P
START
STOP
ADDRESS
R/W
ACK
DATA
ACK
DATA
ACK
condition
condition
Complete I2C Data Transfer
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Document Number: PS-ITG-3200A-00
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ITG-3200 Product Specification
To write the internal ITG-3200 device registers, the master transmits the start condition (S), followed by the
I2C address and the write bit (0). At the 9th clock cycle (when the clock is high), the ITG-3200 device
acknowledges the transfer. Then the master puts the register address (RA) on the bus. After the ITG-3200
acknowledges the reception of the register address, the master puts the register data onto the bus. This is
followed by the ACK signal, and data transfer may be concluded by the stop condition (P). To write multiple
bytes after the last ACK signal, the master can continue outputting data rather than transmitting a stop
signal. In this case, the ITG-3200 device automatically increments the register address and loads the data to
the appropriate register. The following figures show single and two-byte write sequences.
Single-Byte Write Sequence
Master
Slave
S
AD+W
RA
RA
DATA
DATA
P
ACK
ACK
ACK
Burst Write Sequence
Master
Slave
S
AD+W
DATA
P
ACK
ACK
ACK
ACK
To read the internal ITG-3200 device registers, the master first transmits the start condition (S), followed by
the I2C address and the write bit (0). At the 9th clock cycle (when clock is high), the ITG acknowledges the
transfer. The master then writes the register address that is going to be read. Upon receiving the ACK signal
from the ITG-3200, the master transmits a start signal followed by the slave address and read bit. As a
result, the ITG-3200 sends an ACK signal and the data. The communication ends with a not acknowledge
(NACK) signal and a stop bit from master. The NACK condition is defined such that the SDA line remains
high at the 9th clock cycle. To read multiple bytes of data, the master can output an acknowledge signal
(ACK) instead of a not acknowledge (NACK) signal. In this case, the ITG-3200 automatically increments the
register address and outputs data from the appropriate register. The following figures show single and two-
byte read sequences.
Single-Byte Read Sequence
Master
Slave
S
AD+W
RA
RA
S
S
AD+R
AD+R
NACK
ACK
P
ACK
ACK
ACK
ACK DATA
ACK DATA
Burst Read Sequence
Master
Slave
S
AD+W
NACK
P
ACK
DATA
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Document Number: PS-ITG-3200A-00
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Release Date: 08/02/2011
ITG-3200 Product Specification
I2C Terms
Signal
S
Description
Start Condition: SDA goes from high to low while SCL is high
AD
Slave I2C address
W
Write bit (0)
R
Read bit (1)
ACK
NACK
RA
Acknowledge: SDA line is low while the SCL line is high at the 9th clock cycle
Not-Acknowledge: SDA line stays high at the 9th clock cycle
ITG-3200 internal register address
DATA
P
Transmit or received data
Stop condition: SDA going from low to high while SCL is high
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Document Number: PS-ITG-3200A-00
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Release Date: 08/02/2011
ITG-3200 Product Specification
7
Assembly
This section provides general guidelines for assembling InvenSense Micro Electro-Mechanical Systems
(MEMS) gyros packaged in Quad Flat No leads package (QFN) surface mount integrated circuits.
7.1
Orientation
The diagram below shows the orientation of the axes of sensitivity and the polarity of rotation. Note the pin 1
identifier (•) in the figure.
+Z
I
T
G
-
3
2
0
0
+Y
+X
Orientation of Axes of Sensitivity and Polarity of Rotation
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Document Number: PS-ITG-3200A-00
Revision: 1.7
Release Date: 08/02/2011
ITG-3200 Product Specification
7.2
Package Dimensions
I
PIN 1 IDENTIFIER IS A LASER
MARKED FEATURE ON TOP
c
PIN 1 IDENTIFIER
S1
24
19
19
24
1
18
I
18
1
S1
C 0.16
f
b
E
E2
e
13
6
6
13
L1 (12x)
12
7
7
12
A1
D
D2
L(12x)
A
On 4 corner lead dim.
SYMBOLS
DIMENSIONS IN MILLIMETERS
MIN
NOM
MAX
A
A1
b
c
D
D2
E
E2
e
f (e-b)
L
L1
I
0.85
0.00
0.18
---
3.90
2.95
3.90
2.75
---
0.20
0.30
0.35
0.20
0.05
0.05
0.15
0.90
0.02
0.25
0.20 REF.
4.00
3.00
4.00
2.80
0.50
0.25
0.35
0.40
0.25
---
0.95
0.05
0.30
---
4.10
3.05
4.10
2.85
---
0.32
0.40
0.45
0.30
0.10
0.15
0.25
S
S
R
R
s
S1
---
0.20
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Document Number: PS-ITG-3200A-00
Revision: 1.7
Release Date: 08/02/2011
ITG-3200 Product Specification
7.3
PCB Design Guidelines:
The Pad Diagram using a JEDEC type extension with solder rising on the outer edge is shown below. The
Pad Dimensions Table shows pad sizing (mean dimensions) recommended for the MPU-30X0 product.
JEDEC type extension with solder rising on outer edge
PCB Lay-out Diagram
SYMBOLS
DIMENSIONS IN MILLIMETERS
NOM
Nominal Package I/O Pad Dimensions
e
b
L
L1
D
E
Pad Pitch
Pad Width
Pad Length
Pad Length
0.50
0.25
0.35
0.40
4.00
4.00
3.00
2.80
Package Width
Package Length
Exposed Pad Width
Exposed Pad Length
I/O Land Design Dimensions (Guidelines )
I/O Pad Extent Width
I/O Pad Extent Length
Land Width
Outward Extension
Inward Extension
Land Length
D2
E2
D3
E3
c
Tout
Tin
L2
4.80
4.80
0.35
0.40
0.05
0.80
0.85
L3
Land Length
PCB Dimensions Table (for PCB Lay-out Diagram)
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Document Number: PS-ITG-3200A-00
Revision: 1.7
Release Date: 08/02/2011
ITG-3200 Product Specification
7.4
Assembly Precautions
7.4.1 Gyroscope Surface Mount Guidelines
InvenSense MEMS Gyros sense rate of rotation. In addition, gyroscopes sense mechanical stress coming
from the printed circuit board (PCB). This PCB stress can be minimized by adhering to certain design rules:
When using MEMS gyroscope components in plastic packages, PCB mounting and assembly can cause
package stress. This package stress in turn can affect the output offset and its value over a wide range of
temperatures. This stress is caused by the mismatch between the Coefficient of Linear Thermal Expansion
(CTE) of the package material and the PCB. Care must be taken to avoid package stress due to mounting.
Traces connected to pads should be as symmetric as possible. Maximizing symmetry and balance for pad
connection will help component self alignment and will lead to better control of solder paste reduction after
reflow.
Any material used in the surface mount assembly process of the MEMS gyroscope should be free of
restricted RoHS elements or compounds. Pb-free solders should be used for assembly.
7.4.2 Exposed Die Pad Precautions
The ITG-3200 has very low active and standby current consumption. The exposed die pad is not required for
heat sinking, and should not be soldered to the PCB. Failure to adhere to this rule can induce performance
changes due to package thermo-mechanical stress. There is no electrical connection between the pad and
the CMOS.
7.4.3 Trace Routing
Routing traces or vias under the gyro package such that they run under the exposed die pad is prohibited.
Routed active signals may harmonically couple with the gyro MEMS devices, compromising gyro response.
These devices are designed with the drive frequencies as follows: X = 33±3kHz, Y = 30±3kHz, and
Z=27±3kHz. To avoid harmonic coupling don’t route active signals in non-shielded signal planes directly
below, or above the gyro package. Note: For best performance, design a ground plane under the e-pad to
reduce PCB signal noise from the board on which the gyro device is mounted. If the gyro device is stacked
under an adjacent PCB board, design a ground plane directly above the gyro device to shield active signals
from the adjacent PCB board.
7.4.4 Component Placement
Do not place large insertion components such as keyboard or similar buttons, connectors, or shielding boxes
at a distance of less than 6 mm from the MEMS gyro. Maintain generally accepted industry design practices
for component placement near the ITG-3200 to prevent noise coupling and thermo-mechanical stress.
7.4.5 PCB Mounting and Cross-Axis Sensitivity
Orientation errors of the gyroscope mounted to the printed circuit board can cause cross-axis sensitivity in
which one gyro responds to rotation about another axis. For example, the X-axis gyroscope may respond to
rotation about the Y or Z axes. The orientation mounting errors are illustrated in the figure below.
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Document Number: PS-ITG-3200A-00
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Release Date: 08/02/2011
ITG-3200 Product Specification
Z
Φ
Y
M
P
M
U
-
P
3
U
0
0
0
-
3
0
0
5
X
Θ
Package Gyro Axes (
) Relative to PCB Axes (
) with Orientation Errors (Θ and Φ)
The table below shows the cross-axis sensitivity of the gyroscope for a given orientation error.
Cross-Axis Sensitivity vs. Orientation Error
Orientation Error
Cross-Axis Sensitivity
(θ or Φ)
(sinθ or sinΦ)
0º
0.5º
1º
0%
0.87%
1.75%
The specification for cross-axis sensitivity in Section Error! Reference source not found. includes the effect
f the die orientation error with respect to the package.
7.4.6 MEMS Handling Instructions
MEMS (Micro Electro-Mechanical Systems) are a time-proven, robust technology used in hundreds of
millions of consumer, automotive and industrial products. MEMS devices consist of microscopic moving
mechanical structures. They differ from conventional IC products, even though they can be found in similar
packages. Therefore, MEMS devices require different handling precautions than conventional ICs prior to
mounting onto printed circuit boards (PCBs).
The ITG-3200 gyroscope has been qualified to a shock tolerance of 10,000g. InvenSense packages its
gyroscopes as it deems proper for protection against normal handling and shipping. It recommends the
following handling precautions to prevent potential damage.
Do not drop individually packaged gyroscopes, or trays of gyroscopes onto hard surfaces. Components
placed in trays could be subject to g-forces in excess of 10,000g if dropped.
Printed circuit boards that incorporate mounted gyroscopes should not be separated by manually
snapping apart. This could also create g-forces in excess of 10,000g.
7.4.7 ESD Considerations
Establish and use ESD-safe handling precautions when unpacking and handling ESD-sensitive devices.
Store ESD sensitive devices in ESD safe containers until ready for use. The Tape-and-Reel moisture-
sealed bag is an ESD approved barrier. The best practice is to keep the units in the original moisture
sealed bags until ready for assembly.
Restrict all device handling to ESD protected work areas that measure less than 200V static charge.
Ensure that all workstations and personnel are properly grounded to prevent ESD.
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Document Number: PS-ITG-3200A-00
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Release Date: 08/02/2011
ITG-3200 Product Specification
7.4.8 Reflow Specification
Qualification Reflow: The ITG-3200 gyroscope was qualified in accordance with IPC/JEDEC J-STD-020D.01.
This standard classifies proper packaging, storage and handling in order to avoid subsequent thermal and
mechanical damage during the solder reflow attachment phase of assembly. The classification specifies a
sequence consisting of a bake cycle, a moisture soak cycle in a temperature humidity oven, followed by
three solder reflow cycles and functional testing for qualification. All temperatures refer to the topside of the
QFN package, as measured on the package body surface. The peak solder reflow classification temperature
requirement is (260 +5/-0°C) for lead-free soldering of components measuring less than 1.6 mm in thickness.
Production Reflow: Check the recommendations of your solder manufacturer. For optimum results,
production solder reflow processes should reduce exposure to high temperatures, and use lower ramp-up
and ramp-down rates than those used in the component qualification profile shown for reference below.
Production reflow should never exceed the maximum constraints listed in the table and shown in the figure
below. These constraints were used for the qualification profile, and represent the maximum tolerable ratings
for the device.
Maximum Temperature IR / Convection Solder Reflow Curve Used for Qualification
Temperature Set Points for IR / Convection Reflow Corresponding to Figure Above
CONSTRAINTS
Step Setting
Temp (°C) Time (sec) Rate (°C/sec)
A
B
C
D
E
F
G
H
I
Troom
25
TSmin
150
200
217
255
260
255
217
25
TSmax
TLiquidus
TPmin
60 < tBC < 120
r(TLiquidus-TPmax) < 3
r(TLiquidus-TPmax) < 3
r(TLiquidus-TPmax) < 3
r(TPmax-TLiquidus) < 4
[255°C, 260°C]
TPmax
TPmin
tAF < 480
[ 260°C, 265°C]
10< tEG < 30
60 < tDH < 120
[255°C, 260°C]
TLiquidus
Troom
Note: For users TPmax must not exceed the classification temperature (260°C).
For suppliers TPmax must equal or exceed the classification temperature.
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Document Number: PS-ITG-3200A-00
Revision: 1.7
Release Date: 08/02/2011
ITG-3200 Product Specification
7.4.9 Storage Specifications
The storage specification of the ITG-3200 gyroscope conforms to IPC/JEDEC J-STD-020D.01 Moisture
Sensitivity Level (MSL) 3.
Calculated shelf-life in moisture-sealed bag 12 months -- Storage conditions: <40°C and <90% RH
After opening moisture-sealed bag
168hours -- Storage conditions: ambient ≤30°C at 60%RH
7.5
Package Marking Specification
TOP VIEW
InvenSense
ITG-3200
Lot traceability code
XXXXXX-XX
XX YYWW X
Foundry code
Rev Code
YY = Year Code
Package Vendor Code
WW = Work Week
Package Marking Specification
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Document Number: PS-ITG-3200A-00
Revision: 1.7
Release Date: 08/02/2011
ITG-3200 Product Specification
7.6
Tape & Reel Specification
Tape Dimensions
Reel Outline Drawing
Reel Dimensions and Package Size
REEL (mm)
PKG
SIZE
L
V
W
Z
4x4
330
100
13.2
2.2
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Document Number: PS-ITG-3200A-00
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Release Date: 08/02/2011
ITG-3200 Product Specification
User Direction of
Feed
Package Orientation
Cover Tape
(Anti-Static)
Carrier Tape
(Anti-Static)
Label
Pin 1
Terminal Tape
Reel
Tape and Reel Specification
Reel Specifications
Quantity Per Reel
5,000
1
Reels per Box
Boxes Per Carton (max)
3 full pizza boxes packed in the center of the
carton, buffered by two empty pizza boxes (front
and back).
Pcs/Carton (max)
15,000
7.7
Label
Location of Label
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Document Number: PS-ITG-3200A-00
Revision: 1.7
Release Date: 08/02/2011
ITG-3200 Product Specification
7.8
Packaging
ESD Anti-static Label
Moisture-Sensitivity
Caution Label
Tape & Reel
Barcode Label
Moisture Barrier Bag
With Labels
Moisture-Sensitive Caution Label
Reel in Box
Box with Tape & Reel Label
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Document Number: PS-ITG-3200A-00
Revision: 1.7
Release Date: 08/02/2011
ITG-3200 Product Specification
8
Reliability
8.1
Qualification Test Policy
Before InvenSense products are released for production, they complete a series of qualification tests. The
Qualification Test Plan for the ITG-3200 followed the JEDEC JESD47G.01 Standard, “Stress-Test-Driven
Qualification of Integrated Circuits.” The individual tests are described below.
8.2
Qualification Test Plan
Accelerated Life Tests
Method/Condition
TEST
Lot
Quantity
Sample
/ Lot
Acc /
Reject
Criteria
High Temperature
Operating Life (HTOL/LFR)
JEDEC JESD22-A108C, Dynamic,
3.63V biased, Tj>125°C
[read-points 168, 500, 1000 hours]
3
3
77
77
(0/1)
Highly Accelerated Stress
Test (1) (HAST)
(0/1)
JEDEC JESD22-A118
Condition A, 130°C, 85%RH, 33.3 psia.,
unbiased, [read-point 96 hours]
High Temperature Storage
Life (HTS)
JEDEC JESD22-A103C, Cond. A, 125°C,
Non-Biased Bake
3
77
(0/1)
[read-points 168, 500, 1000 hours]
Device Component Level Tests
Method/Condition
TEST
Lot
Quantity
Sample
/ Lot
Acc /
Reject
Criteria
ESD-HBM
ESD-MM
JEDEC JESD22-A114F, (1.5KV)
JEDEC JESD22-A115-A, (200V)
1
1
3
3
(0/1)
(0/1)
Latch Up
JEDEC JESD78B Class II (2), 125°C;
Level B ±60mA
1
3
6
(0/1)
(0/1)
Mechanical Shock
JEDEC JESD22-B104C,
30
Mil-Std-883H, method 2002.5,
Cond. E, 10,000g’s, 0.2ms,
±X, Y, Z – 6 directions, 5 times/direction
Vibration
JEDEC JESD22-B103B, Variable Frequency
(random), Cond. B, 5-500Hz,
X, Y, Z – 4 times/direction
3
3
5
(0/1)
(0/1)
Temperature Cycling (TC) (1)
JEDEC JESD22-A104D Condition N,
77
[-40°C to +85°C], Soak Mode 2 [5’], 100 cycles
Board Level Tests
Method/Condition
TEST
Lot
Quantity
Sample
/ Lot
Acc /
Reject
Criteria
Board Mechanical Shock
JEDEC JESD22-B104C,
Mil-Std-883H, method 2002.5,
Cond. E, 10000g’s, 0.2ms,
1
1
5
(0/1)
+-X, Y, Z – 6 directions, 5 times/direction
Board
JEDEC JESD22-A104D Condition N,
[ -40°C to +85°C], Soak Mode 2 [5’], 100 cycles
40
(0/1)
Temperature Cycling (TC) (1)
(1) Tests are preceded by MSL3 Preconditioning in accordance with JEDEC JESD22-A113F
33 of 34
Document Number: PS-ITG-3200A-00
Revision: 1.7
Release Date: 08/02/2011
ITG-3200 Product Specification
9
Environmental Compliance
The ITG-3200 is RoHS and Green Compliant.
The ITG-3200 is in full environmental compliance as evidenced in report HS-ITG-3200A, Materials
Declaration Data Sheet.
Environmental Declaration Disclaimer:
InvenSense believes this environmental information to be correct but cannot guarantee accuracy or completeness. Conformity
documents for the above component constitutes are on file. InvenSense subcontracts manufacturing and the information contained
herein is based on data received from vendors and suppliers, which has not been validated by InvenSense.
This information furnished by InvenSense is believed to be accurate and reliable. However, no responsibility is assumed by InvenSense
for its use, or for any infringements of patents or other rights of third parties that may result from its use. Specifications are subject to
change without notice. InvenSense reserves the right to make changes to this product, including its circuits and software, in order to
improve its design and/or performance, without prior notice. InvenSense makes no warranties, neither expressed nor implied, regarding
the information and specifications contained in this document. InvenSense assumes no responsibility for any claims or damages arising
from information contained in this document, or from the use of products and services detailed therein. This includes, but is not limited
to, claims or damages based on the infringement of patents, copyrights, mask work and/or other intellectual property rights.
Certain intellectual property owned by InvenSense and described in this document is patent protected. No license is granted by
implication or otherwise under any patent or patent rights of InvenSense. This publication supersedes and replaces all information
previously supplied. Trademarks that are registered trademarks are the property of their respective companies. InvenSense sensors
should not be used or sold in the development, storage, production or utilization of any conventional or mass-destructive weapons or for
any other weapons or life threatening applications, as well as in any other life critical applications such as medical equipment,
transportation, aerospace and nuclear instruments, undersea equipment, power plant equipment, disaster prevention and crime
prevention equipment.
InvenSense® is a registered trademark of InvenSense, Inc. ITG™, ITG-3200™, MotionApps™, MPU™, MotionProcessing Unit™,
MotionProcessor™, MotionProcessing™, MotionFusion™, MPU-3050™, MPU-6050™, IMU-3000™ are trademarks of InvenSense,
Inc.
©2011 InvenSense, Inc. All rights reserved.
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