MLF2012A3R3MB [TDK]
General Purpose Inductor, 3.3uH, 20%, 1 Element, Ferrite-Core, SMD,;型号: | MLF2012A3R3MB |
厂家: | TDK ELECTRONICS |
描述: | General Purpose Inductor, 3.3uH, 20%, 1 Element, Ferrite-Core, SMD, 电感器 固定电感器 测试 射频感应器 |
文件: | 总10页 (文件大小:123K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
Inductors for Standard Circuits
Multilayer/STD • magnetic shielded
MLF series
Type:
MLF1005L
MLF1608
MLF2012
1005[0402 inch]*
1608[0603 inch]
2012[0805 inch]
* Dimensions Code JIS[EIA]
Issue date:
November 2011
• All specifications are subject to change without notice.
• Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific
bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications.
(1/9)
Conformity to RoHS Directive
Inductors for Standard Circuits
Multilayer/STD • Magnetic Shielded
MLF Series MLF1005L
Various digital devices are required to be further downsized yet
remain highly functional, and to excel in low power consumption,
and parts mounted on the devices are also required to have lower
resistance.
PRODUCT IDENTIFICATION
MLF 1005 R10
(1) (2) (3) (4) (5) (6)
L
K
T
(7)
(1) Series name
The MLF1005L type is a new line of inductors that have been
developed to meet such requirements: their resistance has been
lowered by up to 35% in comparison with that of the existing
MLF1005 type.
(2) Dimensions L×W
1005
1.0×0.5×0.5
In addition, the new inductors use similar magnetic shielding,
which enables their high-density mounting.
(3) Type name
L
Low-resistance type
FEATURES
(4) Inductance
• The resistance of the MLF1005L type has been lowered by up to
35% in comparison with that of the existing MLF1005 type.
• Magnetically shielded configuration allowing for high-density
mounting.
R10
1R0
0.1µH
1.0µH
(5) Tolerance
K
• Does not contain lead and is compatible with lead-free
soldering.
10%
• It is a product conforming to RoHS directive.
(6) Packaging style
T
Taping [reel]
APPLICATIONS
Signal processing modules such as cellular phones and tuners
(7) TDK internal code
SPECIFICATIONS
PACKAGING STYLE AND QUANTITIES
Operating temperature range
Storage temperature range
–40 to +85°C
–40 to +85°C(After mount)
Packaging style
Taping
Quantity
10000 pieces/reel
RECOMMENDED SOLDERING CONDITION
REFLOW SOLDERING
HANDLING AND PRECAUTIONS
• Before soldering, be sure to preheat components.
The preheating temperature should be set so that the tempera-
ture difference between the solder temperature and product
temperature does not exceed 150°C.
10s max.
250 to 260˚C
230˚C
Natural
cooling
• After mounting components onto the printed circuit board, do not
apply stress through board bending or mishandling.
• The inductance value may change due to magnetic saturation if
the current exceeds the rated maximum.
180˚C
150˚C
• Do not expose the inductors to stray magnetic fields.
• Avoid static electricity discharge during handling.
• When hand soldering, apply the soldering iron to the printed cir-
cuit board only. Temperature of the iron tip should not exceed
350°C. Soldering time should not exceed 3 seconds.
Preheating
60 to 120s
Soldering
30 to 60s
Time(s)
• Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific
bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications.
• Please contact our Sales office when your application is considered the following:
The device’s failure or malfunction may directly endanger human life (e.g. application for automobile/aircraft/medical/nuclear power devices, etc.)
• All specifications are subject to change without notice.
001-05 / 20111129 / e511_mlf_02
(2/9)
SHAPES AND DIMENSIONS/RECOMMENDED PC BOARD PATTERN
1.0 0.05
0.5 0.4 0.5
0.1min.
0.1min.
Weight : 1.2mg
Dimensions in mm
ELECTRICAL CHARACTERISTICS
Test
frequency
L, Q (MHz)
Test
current
L, Q (mA)
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
Self-resonant
Inductance
(µH)
Inductance
tolerance
DC resistance
(Ω)max.
Rated current
(mA)max.
Q min.
frequency
(MHz)min.
450
400
350
320
290
260
230
210
190
170
150
130
120
110
100
Part No.
0.1
10%
10%
10%
10%
10%
10%
10%
10%
10%
10%
10%
10%
10%
10%
10%
10%
10%
25
25
25
25
25
25
25
10
10
10
10
10
10
10
10
10
10
10
10
10
10
10
10
10
25
25
25
25
25
25
25
25
25
25
0.51
0.59
0.63
0.76
0.79
0.91
1.05
0.41
0.42
0.47
0.55
0.59
0.64
0.79
0.95
1.05
1.15
150
140
130
120
110
100
90
50
50
45
40
35
35
35
30
20
15
MLF1005LR10KT
MLF1005LR12KT
MLF1005LR15KT
MLF1005LR18KT
MLF1005LR22KT
MLF1005LR27KT
MLF1005LR33KT
MLF1005LR39KT
MLF1005LR47KT
MLF1005LR56KT
MLF1005LR68KT
MLF1005LR82KT
MLF1005L1R0KT
MLF1005L1R2KT
MLF1005L1R5KT
MLF1005L1R8KT
MLF1005L2R2KT
0.12
0.15
0.18
0.22
0.27
0.33
0.39
0.47
0.56
0.68
0.82
1.0
1.2
1.5
1.8
2.2
1.0
1.0
90
80
TYPICAL ELECTRICAL CHARACTERISTICS
INDUCTANCE vs. FREQUENCY CHARACTERISTICS
IMPEDANCE vs. FREQUENCY CHARACTERISTICS
10
10000
1000
2.2µH
2.2µH
1
1.0µH
1.0µH
0.1µH
100
0.33µH
0.33µH
0.1
0.1µH
10
1
0.01
1
10
100
1000
1
10
100
1000
(
)
(
)
Frequency MHz
Frequency MHz
Q vs. FREQUENCY CHARACTERISTICS
70
2.2µH
60
50
1.0µH
0.1µH
40
0.33µH
30
20
10
0
1
10
100
1000
(
)
Frequency MHz
• All specifications are subject to change without notice.
001-05 / 20111129 / e511_mlf_02
(3/9)
PACKAGING STYLES
REEL DIMENSIONS
1.0
+2.0
8.4
–0.0
2.0 0.5
ø13 0.2
ø21 0.8
14.4max.
ø180 2.0
Dimensions in mm
TAPE DIMENSIONS
+0.1
–0.0
1.5
Sprocket hole
Cavity
0.8max.
0.65 0.1
4.0 0.1
2.0 0.05
2.0 0.05
160min.
Taping
200min.
300min.
Drawing direction
Dimensions in mm
• All specifications are subject to change without notice.
001-05 / 20111129 / e511_mlf_02
(4/9)
Conformity to RoHS Directive
Inductors for Standard Circuits
Multilayer/STD • Magnetic Shielded
MLF Series MLF1608
FEATURES
PRODUCT IDENTIFICATION
MLF 1608 1R0
(1) (2) (3) (4) (5) (6)
• High-reliability monolithic structure.
• Ferrite core and magnetic shielding enables the design of com-
pact circuits with high density mounting.
• Excellent solderability and high heat resistance permits either
flow or reflow soldering.
A
K
T
(7)
(1) Series name
(2) Dimensions L×W
• The products contain no lead and also support lead-free
soldering.
1608
1.6×0.8mm
• It is a product conforming to RoHS directive.
(3) Type name
(4) Inductance
APPLICATIONS
Digital cellular phone, tuner, personal computers, audio, or various
electronic appliances
47N
R15
1R0
47nH[0.047µH]
0.15µH
1µH
SPECIFICATIONS
Operating temperature range
Storage temperature range
–40 to +85°C
–40 to +85°C(After mount)
(5) Tolerance
K
M
10%
20%
RECOMMENDED SOLDERING CONDITION
REFLOW SOLDERING
(6) Packaging style
T
Taping [reel]
10s max.
250 to 260˚C
230˚C
(7) TDK internal code
Natural
cooling
PACKAGING STYLE AND QUANTITIES
Packaging style
Taping
Quantity
4000 pieces/reel
180˚C
150˚C
Preheating
60 to 120s
Soldering
30 to 60s
HANDLING AND PRECAUTIONS
• Before soldering, be sure to preheat components.
The preheating temperature should be set so that the tempera-
ture difference between the solder temperature and product
temperature does not exceed 150°C.
Time(s)
• After mounting components onto the printed circuit board, do not
apply stress through board bending or mishandling.
• The inductance value may change due to magnetic saturation if
the current exceeds the rated maximum.
• Do not expose the inductors to stray magnetic fields.
• Avoid static electricity discharge during handling.
• When hand soldering, apply the soldering iron to the printed cir-
cuit board only. Temperature of the iron tip should not exceed
350°C. Soldering time should not exceed 3 seconds.
• Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific
bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications.
• Please contact our Sales office when your application is considered the following:
The device’s failure or malfunction may directly endanger human life (e.g. application for automobile/aircraft/medical/nuclear power devices, etc.)
• All specifications are subject to change without notice.
001-05 / 20111129 / e511_mlf_02
(5/9)
SHAPES AND DIMENSIONS/RECOMMENDED PC BOARD PATTERN
1.6 0.15
0.6 0.8 0.6
0.3 0.2
Weight: 4mg
Dimensions in mm
ELECTRICAL CHARACTERISTICS
Self-resonant
frequency (MHz) (Ω)
DC resistance
Test
frequency
L, Q (MHz)
Test
current
L, Q (mA)
Q
Inductance
(µH)
Inductance
tolerance
Rated current
(mA)max.
Part No.
min. typ.
min.
600
550
500
450
400
350
320
290
260
230
210
190
170
150
130
120
110
100
90
80
70
65
60
55
45
40
35
30
25
22
20
18
15
10
typ.
900
700
650
600
550
500
450
400
350
320
290
260
230
210
190
170
150
140
130
120
110
100
90
max.
0.20
0.30
0.30
0.35
0.40
0.45
0.50
0.55
0.60
0.75
0.85
0.95
1.05
1.25
1.40
0.50
0.65
0.70
0.85
1.00
1.15
1.30
1.45
1.60
1.10
1.30
1.50
1.70
1.80
1.50
1.60
1.70
1.80
2.20
typ.
MLF1608D47N∗MT
MLF1608D68NMT
MLF1608D82NMT
MLF1608DR10KT
MLF1608DR12KT
MLF1608DR15KT
MLF1608DR18KT
MLF1608DR22KT
MLF1608DR27KT
MLF1608DR33KT
MLF1608DR39KT
MLF1608DR47KT
MLF1608DR56KT
MLF1608DR68KT
MLF1608DR82KT
MLF1608A1R0KT
MLF1608A1R2KT
MLF1608A1R5KT
MLF1608A1R8KT
MLF1608A2R2KT
MLF1608A2R7KT
MLF1608A3R3KT
MLF1608A3R9KT
MLF1608A4R7KT
MLF1608E5R6KT
MLF1608E6R8KT
MLF1608E8R2KT
MLF1608E100KT
MLF1608E120KT
MLF1608C150KT
MLF1608C180KT
MLF1608C220KT
MLF1608C270KT
MLF1608C330KT
0.047
0.068
0.082
0.1
20%
20%
20%
10%
10%
10%
10%
10%
10%
10%
10%
10%
10%
10%
10%
10%
10%
10%
10%
10%
10%
10%
10%
10%
10%
10%
10%
10%
10%
10%
10%
10%
10%
10%
10
10
10
15
15
15
15
15
15
15
15
15
15
15
15
35
35
35
35
35
35
35
35
35
35
35
35
30
30
20
20
20
20
20
20
20
20
25
25
25
25
25
25
25
25
30
30
30
30
50
50
55
55
55
55
60
60
60
60
60
60
55
55
40
40
40
40
40
50
50
50
25
25
25
25
25
25
25
25
25
25
25
25
10
10
10
10
10
10
10
10
10
4
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.10
0.15
0.15
0.20
0.20
0.25
0.25
0.30
0.35
0.40
0.45
0.50
0.55
0.65
0.75
0.25
0.25
0.30
0.35
0.45
0.50
0.55
0.65
0.75
0.55
0.65
0.80
1.00
1.20
0.80
0.85
0.90
1.20
1.40
200
200
200
200
200
200
150
150
150
100
100
100
100
70
70
50
50
50
50
30
30
30
30
30
15
15
10
10
10
2
2
2
2
2
0.12
0.15
0.18
0.22
0.27
0.33
0.39
0.47
0.56
0.68
0.82
1
1.2
1.5
1.8
2.2
2.7
3.3
3.9
4.7
80
70
60
55
50
45
42
40
5.6
6.8
8.2
10
12
15
18
22
4
4
2
2
1
1
1
1
38
35
30
27
33
1
∗ 47N means for 47nH (0.047µH).
• Test equipment
Inductance, Q: Ag4294A-16034G
• All specifications are subject to change without notice.
001-05 / 20111129 / e511_mlf_02
(6/9)
TYPICAL ELECTRICAL CHARACTERISTICS
INDUCTANCE CHANGE vs. DC SUPERPOSITION
CHARACTERISTICS
IMPEDANCE vs. FREQUENCY CHARACTERISTICS
100
100
22µH
8.2µH
10
1
10
1µH
1
22µH
1µH
8.2µH
0.68µH
0.1
0.068µH
0.1
0.01
0.01
1
5
10
50 100
5001000
1
5
10
50 100
5001000
(
)
DC current mA
(
)
Frequency MHz
INDUCTANCE CHANGE vs. TEMPERATURE
CHARACTERISTICS
Q vs. FREQUENCY CHARACTERISTICS
80
60
22µH
10
5
0.68µH
8.2µH
1µH
8.2µH
1µH
–25
0
1µH
0 25
50
Temperature ˚C
85
)
40
20
0
–5
8.2µH
0.68µH
22µH
(
22µH
0.68µH
–10
0.1
0.5 1
5
10
50100
5001000
(
)
Frequency MHz
PACKAGING STYLES
REEL DIMENSIONS
TAPE DIMENSIONS
+0.1
–0.0
1.5
Sprocket hole
Cavity
1.0
1.1max.
1.1 0.2
4.0 0.1
2.0 0.05
4.0 0.1
+2.0
8.4
–0.0
2.0 0.5
160min.
Taping
200min.
ø13 0.2
ø21 0.8
14.4max.
ø180 2.0
Dimensions in mm
300min.
Dimensions in mm
Drawing direction
• All specifications are subject to change without notice.
001-05 / 20111129 / e511_mlf_02
(7/9)
Conformity to RoHS Directive
Inductors for Standard Circuits
Multilayer/STD • Magnetic Shielded
MLF Series MLF2012
FEATURES
PRODUCT IDENTIFICATION
MLF 2012 1R0
(1) (2) (3) (4) (5) (6)
• High-reliability monolithic structure.
• Ferrite core and magnetic shielding enables the design of com-
pact circuits with high density mounting.
• Excellent solderability and high heat resistance permits either
flow or reflow soldering.
A
K
T
(7)
(1) Series name
(2) Dimensions L×W
• The products contain no lead and also support lead-free
soldering.
2012
2.0×1.25mm
• It is a product conforming to RoHS directive.
(3) Type name
(4) Inductance
APPLICATIONS
Digital cellular phone, car audio, TV, personal computers, or vari-
ous electronic appliances
47N
R15
1R0
100
47nH[0.047µH]
0.15µH
1µH
SPECIFICATIONS
10µH
Operating temperature range
Storage temperature range
–40 to +85°C
–40 to +85°C(After mount)
(5) Tolerance
K
M
10%
20%
RECOMMENDED SOLDERING CONDITION
REFLOW SOLDERING
(6) Packaging style
T
10s max.
Taping [reel]
250 to 260˚C
230˚C
Natural
cooling
(7) TDK internal code
PACKAGING STYLE AND QUANTITIES
180˚C
150˚C
Packaging style
Taping
Product’s thickness
0.85mm
Quantity
4000 pieces/reel
2000 pieces/reel
1.25mm
Preheating
60 to 120s
Soldering
30 to 60s
HANDLING AND PRECAUTIONS
Time(s)
• Before soldering, be sure to preheat components.
The preheating temperature should be set so that the tempera-
ture difference between the solder temperature and product
temperature does not exceed 150°C.
• After mounting components onto the printed circuit board, do not
apply stress through board bending or mishandling.
• The inductance value may change due to magnetic saturation if
the current exceeds the rated maximum.
• Do not expose the inductors to stray magnetic fields.
• Avoid static electricity discharge during handling.
• When hand soldering, apply the soldering iron to the printed cir-
cuit board only. Temperature of the iron tip should not exceed
350°C. Soldering time should not exceed 3 seconds.
• Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific
bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications.
• Please contact our Sales office when your application is considered the following:
The device’s failure or malfunction may directly endanger human life (e.g. application for automobile/aircraft/medical/nuclear power devices, etc.)
• All specifications are subject to change without notice.
001-05 / 20111129 / e511_mlf_02
(8/9)
SHAPES AND DIMENSIONS/RECOMMENDED PC BOARD PATTERN
2.0 0.2
0.8
1
0.8
0.5 0.3
(
)
T Thickness
(
)
Weight mg
0.85 0.2
1.25 0.2
10
14
Dimensions in mm
Self-resonant
ELECTRICAL CHARACTERISTICS
DC resistance
Test
frequency
L, Q (MHz)
Test
Rated
current
Thickness
T
Q
Inductance
(µH)
Inductance
tolerance
frequency (MHz) (Ω)
current
Part No.
L, Q (mA)
(mA)max. (mm)
min. typ.
min.
550
500
450
400
360
320
280
250
220
200
180
160
150
140
130
120
110
100
90
80
70
60
55
50
45
40
35
30
25
22
20
18
17
15
13
typ.
700
600
550
500
450
410
370
330
300
270
250
230
210
190
170
160
150
140
130
120
100
90
80
70
65
60
55
50
45
40
38
35
33
28
23
20
18
16
max.
0.10
0.15
0.15
0.15
0.20
0.20
0.25
0.30
0.35
0.40
0.45
0.50
0.55
0.60
0.65
0.30
0.35
0.40
0.45
0.50
0.55
0.60
0.65
0.70
0.60
0.65
0.70
0.80
0.90
0.70
0.80
0.90
1.00
1.10
2.40
2.70
2.80
2.90
3.00
3.10
typ.
MLF2012D47N∗MT
MLF2012D68NMT
MLF2012D82NMT
MLF2012DR10KT
MLF2012DR12KT
MLF2012DR15KT
MLF2012DR18KT
MLF2012DR22KT
MLF2012DR27KT
MLF2012DR33KT
MLF2012DR39KT
MLF2012DR47KT
MLF2012DR56KT
MLF2012DR68KT
MLF2012DR82KT
MLF2012A1R0KT
MLF2012A1R2KT
MLF2012A1R5KT
MLF2012A1R8KT
MLF2012A2R2KT
MLF2012A2R7KT
MLF2012A3R3KT
MLF2012A3R9KT
MLF2012A4R7KT
MLF2012E5R6KT
MLF2012E6R8KT
MLF2012E8R2KT
MLF2012E100KT
MLF2012E120KT
MLF2012C150KT
MLF2012C180KT
MLF2012C220KT
MLF2012C270KT
MLF2012C330KT
MLF2012K390KT
MLF2012K470KT
MLF2012K560KT
MLF2012C680KT
MLF2012C820KT
MLF2012C101KT
0.047
0.068
0.082
0.1
0.12
0.15
0.18
0.22
0.27
0.33
0.39
0.47
0.56
0.68
0.82
1
1.2
1.5
1.8
2.2
2.7
3.3
3.9
4.7
5.6
6.8
8.2
10
12
15
18
22
27
33
39
47
56
68
82
100
20%
20%
20%
10%
10%
10%
10%
10%
10%
10%
10%
10%
10%
10%
10%
10%
10%
10%
10%
10%
10%
10%
10%
10%
10%
10%
10%
10%
10%
10%
10%
10%
10%
10%
10%
10%
10%
10%
10%
10%
15
15
15
20
20
20
20
20
20
20
25
25
25
25
25
45
45
45
45
45
45
45
45
45
50
50
50
50
50
30
30
30
30
30
35
35
35
25
25
25
25
25
25
30
30
30
30
30
30
30
35
35
35
35
35
55
55
60
60
60
70
70
70
70
75
75
75
75
75
45
45
45
45
45
55
55
55
45
45
45
50
50
50
25
25
25
25
25
25
25
25
25
25
25
25
10
10
10
10
10
10
10
10
10
4
4
4
2
2
1
1
1
1
0.4
2
2
2
1
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.05
0.08
0.08
0.10
0.12
0.13
0.15
0.16
0.18
0.23
0.25
0.25
0.30
0.35
0.40
0.15
0.15
0.18
0.20
0.22
0.25
0.28
0.30
0.35
0.30
0.32
0.35
0.40
0.50
0.35
0.38
0.45
0.50
0.55
1.30
1.60
1.80
2.00
2.40
2.50
300
300
300
300
300
300
300
250
250
250
200
200
150
150
150
80
80
80
80
50
50
50
30
30
15
15
15
15
15
5
0.85
0.85
0.85
0.85
0.85
0.85
0.85
0.85
0.85
0.85
0.85
1.25
1.25
1.25
1.25
0.85
0.85
0.85
0.85
0.85
1.25
1.25
1.25
1.25
1.25
1.25
1.25
1.25
1.25
1.25
1.25
1.25
1.25
1.25
1.25
1.25
1.25
1.25
1.25
1.25
5
5
5
5
4
4
4
2
11
10
9
8
1
1
14
12
2
2
7
∗ 47N means for 47nH (0.047µH).
• Test equipment
Inductance, Q: Ag4294A-16034G
• All specifications are subject to change without notice.
001-05 / 20111129 / e511_mlf_02
(9/9)
TYPICAL ELECTRICAL CHARACTERISTICS
INDUCTANCE CHANGE vs. DC SUPERPOSITION
CHARACTERISTICS
IMPEDANCE vs. FREQUENCY CHARACTERISTICS
100
100
22µH
10µH
10
10
1µH
1
1
22µH
10µH
0.1µH
1µH
0.1µH
0.1
0.1
0.01
0.01
1
5
10
50 100
5001000
1
5
10
50 100
5001000
(
)
(
)
Frequency MHz
DC current mA
INDUCTANCE CHANGE vs. TEMPERATURE
CHARACTERISTICS
Q vs. FREQUENCY CHARACTERISTICS
80
12
1µH
10µH
8
10µH
60
0.1µH
22µH
1µH
4
–25
0
0.1µH
22µH
0 25
–4
–8
50
85
40
0.1µH
1µH
22µH
(
)
Temperature ˚C
10µH
20
0
–12
–16
0.1
0.5 1
5
10
50100
5001000
(
)
Frequency MHz
PACKAGING STYLES
REEL DIMENSIONS
TAPE DIMENSIONS
t=0.85mm
+0.1
–0.0
1.5
Sprocket hole
Cavity
1.0
1.1max.
1.5 0.2
4.0 0.1
2.0 0.05
4.0 0.1
+2.0
8.4
–0.0
t=1.25mm
2.0 0.5
ø13 0.2
ø21 0.8
14.4max.
+0.1
–0.0
1.5
1.5max.
Sprocket hole
0.5min.
Cavity
ø180 2.0
Dimensions in mm
0.3max.
160min.
1.5 0.2
4.0 0.1
2.0 0.05
4.0 0.1
Taping
200min.
300min.
Drawing direction
Dimensions in mm
• All specifications are subject to change without notice.
001-05 / 20111129 / e511_mlf_02
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