MPU-3300 [TDK]
陀螺仪;
| 型号： | MPU-3300 |
| 厂家： | 
TDK ELECTRONICS |
| 描述： | 陀螺仪 |
| 文件： | 总45页 (文件大小：2614K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Document Number: PS-MPU-3300A-00
Revision: 1.1
Release Date: 7/23/2012
MPU-3300 Product Specification
MPU-3300
Product Specification
Revision 1.1
1 of 45
Document Number: PS-MPU-3300A-00
Revision: 1.1
Release Date: 7/23/2012
MPU-3300 Product Specification
CONTENTS
1
2
3
REVISION HISTORY...................................................................................................................................4
PURPOSE AND SCOPE .............................................................................................................................4
PRODUCT OVERVIEW...............................................................................................................................6
3.1
MPU-3300 OVERVIEW ........................................................................................................................6
APPLICATIONS...........................................................................................................................................7
FEATURES..................................................................................................................................................8
4
5
5.1
GYROSCOPE FEATURES.......................................................................................................................8
ADDITIONAL FEATURES ........................................................................................................................8
CLOCKING ...........................................................................................................................................8
5.2
5.3
6
ELECTRICAL CHARACTERISTICS...........................................................................................................9
6.1
GYROSCOPE SPECIFICATIONS..............................................................................................................9
ELECTRICAL AND OTHER COMMON SPECIFICATIONS............................................................................10
ELECTRICAL SPECIFICATIONS, CONTINUED .........................................................................................11
ELECTRICAL SPECIFICATIONS, CONTINUED .........................................................................................12
ELECTRICAL SPECIFICATIONS, CONTINUED .........................................................................................13
I2C TIMING CHARACTERIZATION..........................................................................................................14
SPI TIMING CHARACTERIZATION.........................................................................................................15
ABSOLUTE MAXIMUM RATINGS ...........................................................................................................16
6.2
6.3
6.4
6.5
6.6
6.7
6.8
7
APPLICATIONS INFORMATION..............................................................................................................17
7.1
PIN OUT AND SIGNAL DESCRIPTION....................................................................................................17
TYPICAL OPERATING CIRCUIT.............................................................................................................18
BILL OF MATERIALS FOR EXTERNAL COMPONENTS..............................................................................18
BLOCK DIAGRAM ...............................................................................................................................19
OVERVIEW ........................................................................................................................................19
THREE-AXIS MEMS GYROSCOPE WITH 16-BIT ADCS AND SIGNAL CONDITIONING................................19
PRIMARY I2C AND SPI SERIAL COMMUNICATIONS INTERFACES ............................................................20
AUXILIARY I2C SERIAL INTERFACE ......................................................................................................21
SELF-TEST........................................................................................................................................22
BIAS INSTABILITY ...............................................................................................................................22
7.2
7.3
7.4
7.5
7.6
7.7
7.8
7.9
7.10
Z-AXIS GYROSCOPE – EXAMPLE ALLAN VARIANCE PLOT..................................................................................23
7.11
7.12
7.13
MPU-3300 USING SPI INTERFACE.....................................................................................................23
INTERNAL CLOCK GENERATION ..........................................................................................................24
SENSOR DATA REGISTERS.................................................................................................................25
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Document Number: PS-MPU-3300A-00
Revision: 1.1
Release Date: 7/23/2012
MPU-3300 Product Specification
7.14
7.15
7.16
7.17
7.18
FIFO ................................................................................................................................................25
INTERRUPTS......................................................................................................................................26
DIGITAL-OUTPUT TEMPERATURE SENSOR ..........................................................................................26
BIAS AND LDO ..................................................................................................................................26
CHARGE PUMP ..................................................................................................................................26
8
9
PROGRAMMABLE INTERRUPTS............................................................................................................27
DIGITAL INTERFACE ...............................................................................................................................28
9.1
I2C AND SPI SERIAL INTERFACES .......................................................................................................28
I2C INTERFACE ..................................................................................................................................28
I2C COMMUNICATIONS PROTOCOL......................................................................................................28
I2C TERMS ........................................................................................................................................31
SPI INTERFACE .................................................................................................................................32
9.2
9.3
9.4
9.5
10 ASSEMBLY ...............................................................................................................................................33
10.1
10.2
10.3
10.4
10.5
10.6
10.7
10.8
10.9
10.10
ORIENTATION OF AXES ......................................................................................................................33
PACKAGE DIMENSIONS ......................................................................................................................34
PCB DESIGN GUIDELINES..................................................................................................................35
ASSEMBLY PRECAUTIONS ..................................................................................................................36
STORAGE SPECIFICATIONS.................................................................................................................39
PACKAGE MARKING SPECIFICATION....................................................................................................39
TAPE & REEL SPECIFICATION .............................................................................................................40
LABEL ...............................................................................................................................................41
PACKAGING.......................................................................................................................................42
REPRESENTATIVE SHIPPING CARTON LABEL...................................................................................43
11 RELIABILITY .............................................................................................................................................44
11.1
11.2
QUALIFICATION TEST POLICY .............................................................................................................44
QUALIFICATION TEST PLAN ................................................................................................................44
12 ENVIRONMENTAL COMPLIANCE...........................................................................................................45
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Document Number: PS-MPU-3300A-00
Revision: 1.1
Release Date: 7/23/2012
MPU-3300 Product Specification
1
Revision History
Revision
Date
Revision Description
5/31/2012
1.0
1.1
Initial Release
7/23/2012
Removed watermarks.
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Document Number: PS-MPU-3300A-00
Revision: 1.1
Release Date: 7/23/2012
MPU-3300 Product Specification
2
Purpose and Scope
This product specification provides advanced information regarding the electrical specification and design
related information for the MPU-3300™ MotionTracking™ devices.
Electrical characteristics are based upon design analysis and simulation results only. Specifications are subject
to change without notice. Final specifications will be updated based upon characterization of production silicon.
For references to register map and descriptions of individual registers, please refer to the MPU-3300 Register
Map and Register Descriptions document.
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Document Number: PS-MPU-3300A-00
Revision: 1.1
Release Date: 7/23/2012
MPU-3300 Product Specification
3
Product Overview
3.1 MPU-3300 Overview
The MPU-3300 is the world’s first integrated 3-axis gyroscope for Industrial applications. The MPU-3300
features three 16-bit analog-to-digital converters (ADCs) for digitizing the gyroscope outputs. For precision
tracking of motion, the parts feature a user-programmable gyroscope full-scale range of ±225 and ±450°/sec
(dps).
An on-chip 1024 Byte FIFO buffer helps lower system power consumption by allowing the system processor
to read the sensor data in bursts and then enter a low-power mode as the MPU collects more data.
Communication with all registers of the device is performed using either I2C at 400kHz or SPI at 1MHz. For
applications requiring faster communications, the sensor and interrupt registers may be read using SPI at
20MHz. Additional features include an embedded temperature sensor and an on-chip oscillator with ±1%
variation over the operating temperature range.
By leveraging its patented and volume-proven Nasiri-Fabrication platform, which integrates MEMS wafers with
companion CMOS electronics through wafer-level bonding, InvenSense has driven the MPU-3300 package
size down to a revolutionary footprint of 4x4x0.9mm (QFN), while providing the highest performance, lowest
noise, and the lowest cost semiconductor packaging required for industrial electronic devices. The part
features a robust 10,000g shock tolerance, and has programmable low-pass filters for the gyroscopes, and the
on-chip temperature sensor.
For power supply flexibility, the MPU-3300 operates from VDD power supply voltage range of 2.375V-3.46V.
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Document Number: PS-MPU-3300A-00
Revision: 1.1
Release Date: 7/23/2012
MPU-3300 Product Specification
4
Applications
•
•
Attitude Heading Reference Systems (AHRS)
o
o
Aerospace
Robotics
Navigation Systems
o
o
o
Industrial vehicles
Aircraft
Ships
•
•
•
•
•
•
•
•
•
•
Platform and Antenna Stabilization
Precision Robotics
Inventory Control Systems
Survey Instruments
Factory Equipment
Industrial Power Tools
Unmanned Aerial Vehicles (UAVs)
Precision Agriculture Machinery
Guidance and Steering Applications
Construction Equipment
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Document Number: PS-MPU-3300A-00
Revision: 1.1
Release Date: 7/23/2012
MPU-3300 Product Specification
5
Features
5.1 Gyroscope Features
The triple-axis MEMS gyroscope in the MPU-3300 includes a wide range of features:
Digital-output X-, Y-, and Z-Axis angular rate sensors (gyroscopes) with a user-programmable full-
scale range of ±225, and ±450°/sec
Integrated 16-bit ADCs enable simultaneous sampling of gyros
Enhanced bias and sensitivity temperature stability reduces the need for user calibration
Improved low-frequency noise performance
Digitally-programmable low-pass filter
Bias Instability: 15°/hour on each axis
Gyroscope operating current: 3.6mA
Standby current: 10µA
Factory calibrated sensitivity scale factor
User self-test
5.2 Additional Features
The MPU-3300 includes the following additional features:
VDD supply voltage range of 2.375V-3.46V
Smallest and thinnest QFN package for industrial applications: 4x4x0.9mm
1024 byte FIFO buffer reduces power consumption by allowing host processor to read the data in
bursts and then go into a low-power mode as the MPU collects more data
Digital-output temperature sensor
User-programmable digital filters for gyroscope and temp sensor
10,000 g shock tolerant
400kHz Fast Mode I2C for communicating with all registers
1MHz SPI serial interface for communicating with all registers
20MHz SPI serial interface for reading sensor and interrupt registers
MEMS structure hermetically sealed and bonded at wafer level
RoHS and Green compliant
5.3 Clocking
On-chip timing generator ±1% frequency variation over full temperature range
Optional external clock inputs of 32.768kHz or 19.2MHz
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Document Number: PS-MPU-3300A-00
Revision: 1.1
Release Date: 7/23/2012
MPU-3300 Product Specification
6
Electrical Characteristics
6.1 Gyroscope Specifications
Typical Operating Circuit of Section 7.2, VDD = 2.375V-3.46V, TA = 25°C
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNITS
NOTES
GYROSCOPE SENSITIVITY
Full-Scale Range
FS_SEL=0
FS_SEL=1
±225
±450
16
º/s
º/s
Gyroscope ADC Word Length
Sensitivity Scale Factor
bits
FS_SEL=0
FS_SEL=1
25°C
145.6
72.8
LSB/(º/s)
LSB/(º/s)
%
Sensitivity Scale Factor Tolerance
-3
+3
Sensitivity Scale Factor Variation Over
Temperature
-40°C to +105°C
±2
%
Nonlinearity
Best fit straight line; 25°C
0.2
±2
%
%
Cross-Axis Sensitivity
GYROSCOPE ZERO-RATE OUTPUT (ZRO)
Initial ZRO Tolerance
25°C
±20
±20
0.2
0.2
4
º/s
º/s
ZRO Variation Over Temperature
Power-Supply Sensitivity (1 – 10Hz)
Power-Supply Sensitivity (10 – 250Hz)
Power-Supply Sensitivity (250Hz – 100kHz)
Linear Acceleration Sensitivity
SELF-TEST RESPONSE
-40°C to +105°C
Sine wave, 100mVpp; VDD=2.5V
Sine wave, 100mVpp; VDD=2.5V
Sine wave, 100mVpp; VDD=2.5V
Static
º/s
º/s
º/s
0.1
º/s/g
Change from factory trim
-14
14
%
1
GYROSCOPE NOISE PERFORMANCE
Total RMS Noise
FS_SEL=0
DLPFCFG=2 (100Hz)
Bandwidth 1Hz to10Hz
At 10Hz
0.05
0.033
0.005
º/s-rms
º/s-rms
º/s/√Hz
Low-frequency RMS noise
Rate Noise Spectral Density
GYROSCOPE MECHANICAL
FREQUENCIES
X-Axis
30
27
24
33
30
27
36
33
30
kHz
kHz
kHz
Y-Axis
Z-Axis
LOW PASS FILTER RESPONSE
Programmable Range
5
4
256
Hz
Hz
ms
OUTPUT DATA RATE
Programmable
DLPFCFG=0
to ±1º/s of Final
8,000
GYROSCOPE START-UP TIME
ZRO Settling
30
1. Please refer to the following document for further information on Self-Test: MPU-3300 Register Map and Descriptions
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Document Number: PS-MPU-3300A-00
Revision: 1.1
Release Date: 7/23/2012
MPU-3300 Product Specification
6.2 Electrical and Other Common Specifications
Typical Operating Circuit of Section 7.2, VDD = 2.375V-3.46V, TA = 25°C
PARAMETER
TEMPERATURE SENSOR
Range
CONDITIONS
MIN
TYP
MAX
Units
Notes
-40 to +105
340
°C
Sensitivity
Untrimmed
35oC
LSB/ºC
LSB
Temperature Offset
Linearity
-521
Best fit straight line (-40°C to
+105°C)
±1
°C
VDD POWER SUPPLY
Operating Voltages
2.375
3.46
V
Normal Operating Current
Full-Chip Idle Mode Supply Current
Power Supply Ramp Rate
Gyroscope
3.6
10
mA
µA
Monotonic ramp. Ramp rate is 10%
to 90% of the final value
100
100
ms
ms
START-UP TIME FOR REGISTER
READ/WRITE
20
TEMPERATURE RANGE
Specified Temperature Range
Performance parameters are not
applicable beyond Specified
Temperature Range
-40
+105
°C
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Document Number: PS-MPU-3300A-00
Revision: 1.1
Release Date: 7/23/2012
MPU-3300 Product Specification
6.3 Electrical Specifications, Continued
Typical Operating Circuit of Section 7.2, VDD = 2.375V-3.46V, TA = 25°C
PARAMETER
CONDITIONS
MIN
TYP
MAX
Units
Notes
SERIAL INTERFACE
SPI Operating Frequency, All
Registers Read/Write
Low Speed Characterization
High Speed Characterization
100 ±10%
1 ±10%
kHz
MHz
MHz
SPI Operating Frequency, Sensor
and Interrupt Registers Read Only
I2C Operating Frequency
20 ±10%
All registers, Fast-mode
All registers, Standard-mode
AD0 = 0
400
100
kHz
kHz
I2C ADDRESS
1101000
1101001
AD0 = 1
DIGITAL INPUTS (SDI/SDA, AD0,
SCLK/SCL, FSYNC, /CS, CLKIN)
VIH, High Level Input Voltage
VIL, Low Level Input Voltage
0.7*VDD
0.9*VDD
V
V
0.3*VDD
CI, Input Capacitance
< 5
pF
DIGITAL OUTPUT (SDO, INT)
VOH, High Level Output Voltage
RLOAD=1MΩ
RLOAD=1MΩ
V
V
V
VOL1, LOW-Level Output Voltage
0.1*VDD
0.1
VOL.INT1, INT Low-Level Output
Voltage
OPEN=1, 0.3mA sink
Current
Output Leakage Current
tINT, INT Pulse Width
OPEN=1
100
50
nA
µs
LATCH_INT_EN=0
DIGITAL OUTPUT (CLKOUT)
VOH, High Level Output Voltage
VOL1, LOW-Level Output Voltage
R
LOAD=1MΩ
0.9*VDD
V
V
RLOAD=1MΩ
0.1*VDD
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Document Number: PS-MPU-3300A-00
Revision: 1.1
Release Date: 7/23/2012
MPU-3300 Product Specification
6.4 Electrical Specifications, Continued
Typical Operating Circuit of Section 7.2, VDD = 2.375V-3.46V, TA = 25°C
Parameters
Conditions
Typical
Units
Notes
Primary I2C I/O (SCL, SDA)
VIL, LOW Level Input Voltage
VIH, HIGH-Level Input Voltage
Vhys, Hysteresis
-0.5V to 0.3*VDD
V
V
0.7*VDD to VDD + 0.5V
0.1*VDD
V
VOL1, LOW-Level Output Voltage
IOL, LOW-Level Output Current
3mA sink current
VOL = 0.4V
0 to 0.4
V
3
mA
mA
nA
ns
pF
VOL = 0.6V
5
100
Output Leakage Current
tof, Output Fall Time from VIHmax to VILmax
CI, Capacitance for Each I/O pin
Auxiliary I2C I/O (AUX_CL, AUX_DA)
VIL, LOW-Level Input Voltage
VIH, HIGH-Level Input Voltage
Vhys, Hysteresis
Cb bus capacitance in pF
20+0.1Cb to 250
< 10
-0.5 to 0.3*VDD
0.7*VDD to VDD+0.5V
0.1*VDD
V
V
V
V
VOL1, LOW-Level Output Voltage
IOL, LOW-Level Output Current
1mA sink current
0 to 0.4
VOL = 0.4V
VOL = 0.6V
1
1
mA
mA
Output Leakage Current
100
20+0.1Cb to 250
< 10
nA
ns
pF
tof, Output Fall Time from VIHmax to VILmax
CI, Capacitance for Each I/O pin
Cb bus cap. in pF
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Document Number: PS-MPU-3300A-00
Revision: 1.1
Release Date: 7/23/2012
MPU-3300 Product Specification
6.5 Electrical Specifications, Continued
Typical Operating Circuit of Section 7.2, VDD = 2.375V-3.46V, TA = 25°C
Parameters
Conditions
Min
Typical
Max
Units Notes
INTERNAL CLOCK SOURCE
CLK_SEL=0,1,2,3
Gyroscope Sample Rate, Fast
DLPFCFG=0
SAMPLERATEDIV = 0
8
1
kHz
kHz
Gyroscope Sample Rate, Slow
DLPFCFG=1,2,3,4,5, or 6
SAMPLERATEDIV = 0
Reference Clock Output
CLKOUTEN = 1
CLK_SEL=0, 25°C
CLK_SEL=1,2,3; 25°C
CLK_SEL=0
1.024
MHz
%
Clock Frequency Initial Tolerance
-5
-1
+5
+1
%
Frequency Variation over Temperature
PLL Settling Time
-15 to +10
%
CLK_SEL=1,2,3
CLK_SEL=1,2,3
±1
1
%
10
ms
EXTERNAL 32.768kHz CLOCK
External Clock Frequency
CLK_SEL=4
32.768
1 to 2
8.192
kHz
µs
External Clock Allowable Jitter
Gyroscope Sample Rate, Fast
Cycle-to-cycle rms
DLPFCFG=0
kHz
SAMPLERATEDIV = 0
Gyroscope Sample Rate, Slow
DLPFCFG=1,2,3,4,5, or 6
SAMPLERATEDIV = 0
1.024
kHz
Reference Clock Output
PLL Settling Time
CLKOUTEN = 1
1.0486
1
MHz
ms
10
EXTERNAL 19.2MHz CLOCK
External Clock Frequency
CLK_SEL=5
19.2
8
MHz
Hz
Gyroscope Sample Rate
Full programmable range
3.9
8000
Gyroscope Sample Rate, Fast Mode
DLPFCFG=0
kHz
SAMPLERATEDIV = 0
Gyroscope Sample Rate, Slow Mode
DLPFCFG=1,2,3,4,5, or 6
SAMPLERATEDIV = 0
1
kHz
Reference Clock Output
PLL Settling Time
CLKOUTEN = 1
1.024
1
MHz
ms
10
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Document Number: PS-MPU-3300A-00
Revision: 1.1
Release Date: 7/23/2012
MPU-3300 Product Specification
6.6 I2C Timing Characterization
Typical Operating Circuit of Section 7.2, VDD = 2.375V-3.46V, TA = 25°C
Parameters
Conditions
Min
Typical
Max
Units
Notes
I2C TIMING
I2C FAST-MODE
fSCL, SCL Clock Frequency
400
kHz
µs
tHD.STA, (Repeated) START Condition Hold
Time
0.6
tLOW, SCL Low Period
tHIGH, SCL High Period
1.3
0.6
0.6
µs
µs
µs
tSU.STA, Repeated START Condition Setup
Time
tHD.DAT, SDA Data Hold Time
tSU.DAT, SDA Data Setup Time
tr, SDA and SCL Rise Time
tf, SDA and SCL Fall Time
0
µs
ns
ns
ns
µs
100
Cb bus cap. from 10 to 400pF
Cb bus cap. from 10 to 400pF
20+0.1Cb
20+0.1Cb
0.6
300
300
tSU.STO, STOP Condition Setup Time
tBUF, Bus Free Time Between STOP and
START Condition
1.3
µs
Cb, Capacitive Load for each Bus Line
tVD.DAT, Data Valid Time
< 400
pF
µs
µs
0.9
0.9
tVD.ACK, Data Valid Acknowledge Time
Note: Timing Characteristics apply to both Primary and Auxiliary I2C Bus
I2C Bus Timing Diagram
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Document Number: PS-MPU-3300A-00
Revision: 1.1
Release Date: 7/23/2012
MPU-3300 Product Specification
6.7 SPI Timing Characterization
Typical Operating Circuit of Section 7.2, VDD = 2.375V-3.46V, TA = 25°C, unless otherwise noted.
Notes
Parameters
Conditions
Min
Typical
Max
Units
SPI TIMING
fSCLK, SCLK Clock Frequency
tLOW, SCLK Low Period
tHIGH, SCLK High Period
tSU.CS, CS Setup Time
tHD.CS, CS Hold Time
tSU.SDI, SDI Setup Time
tHD.SDI, SDI Hold Time
tVD.SDO, SDO Valid Time
1
MHz
ns
400
400
8
ns
ns
500
11
7
ns
ns
ns
Cload = 20pF
Cload = 20pF
100
10
ns
tHD.SDO, SDO Hold Time
4
ns
ns
tDIS.SDO, SDO Output Disable Time
SPI Bus Timing Diagram
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Document Number: PS-MPU-3300A-00
Revision: 1.1
Release Date: 7/23/2012
MPU-3300 Product Specification
6.8 Absolute Maximum Ratings
Stress above those listed as “Absolute Maximum Ratings” may cause permanent damage to the device. These
are stress ratings only and functional operation of the device at these conditions is not implied. Exposure to
the absolute maximum ratings conditions for extended periods may affect device reliability.
Parameter
Rating
Supply Voltage, VDD
REGOUT
-0.5V to +6V
-0.5V to 2V
Input Voltage Level (CLKIN, AUX_DA, AD0, FSYNC, INT,
SCL, SDA)
-0.5V to VDD + 0.5V
CPOUT (2.5V ≤ VDD ≤ 3.6V )
Acceleration (Any Axis, unpowered)
Operating Temperature Range
Storage Temperature Range
-0.5V to 30V
10,000g for 0.2ms
-40°C to +125°C
-65°C to +150°C
2kV (HBM);
200V (MM)
Electrostatic Discharge (ESD) Protection
Latch-up
JEDEC Class II (2),125°C
±60mA
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Document Number: PS-MPU-3300A-00
Revision: 1.1
Release Date: 7/23/2012
MPU-3300 Product Specification
7
Applications Information
7.1 Pin Out and Signal Description
Pin Number
Pin Name
Pin Description
1
6
CLKIN
Optional external reference clock input. Connect to GND if unused.
I2C master serial data, for connecting to external sensors
I2C master serial clock, for connecting to external sensors
SPI chip select (0=SPI mode)
AUX_DA
AUX_CL
/CS
7
8
9
AD0 / SDO
REGOUT
FSYNC
INT
I2C Slave Address LSB (AD0); SPI serial data output (SDO)
10
11
12
13
18
19, 21
20
22
23
24
Regulator filter capacitor connection
Frame synchronization digital input. Connect to GND if unused.
Interrupt digital output (totem pole or open-drain)
Power supply voltage and Digital I/O supply voltage
Power supply ground
VDD
GND
RESV
Reserved. Do not connect.
CPOUT
CLKOUT
SCL / SCLK
SDA / SDI
Charge pump capacitor connection
System clock output
I2C serial clock (SCL); SPI serial clock (SCLK)
I2C serial data (SDA); SPI serial data input (SDI)
2, 3, 4, 5, 14,
15, 16, 17
NC
Not internally connected. May be used for PCB trace routing.
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Document Number: PS-MPU-3300A-00
Revision: 1.1
Release Date: 7/23/2012
MPU-3300 Product Specification
7.2 Typical Operating Circuit
7.3 Bill of Materials for External Components
Component Label
Regulator Filter Capacitor (Pin 10) C1
Specification
Quantity
Ceramic, X7R, 0.1µF ±10%, 2V
Ceramic, X7R, 0.1µF ±10%, 4V
Ceramic, X7R, 2.2nF ±10%, 50V
1
1
1
VDD Bypass Capacitor (Pin 13)
Charge Pump Capacitor (Pin 20)
C2
C3
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Document Number: PS-MPU-3300A-00
Revision: 1.1
Release Date: 7/23/2012
MPU-3300 Product Specification
7.4 Block Diagram
7.5 Overview
The MPU-3300 is comprised of the following key blocks and functions:
Three-axis MEMS rate gyroscope sensor with 16-bit ADCs and signal conditioning
Primary I2C and SPI serial communications interfaces
Auxiliary I2C serial interface for external accelerometer & other sensors
Clocking
Sensor Data Registers
FIFO
Interrupts
Digital-Output Temperature Sensor
Gyroscope & Self-test
Bias and LDO
Charge Pump
7.6 Three-Axis MEMS Gyroscope with 16-bit ADCs and Signal Conditioning
The MPU-3300 consists of three independent vibratory MEMS rate gyroscopes, which detect rotation about
the X-, Y-, and Z- Axes. When the gyros are rotated about any of the sense axes, the Coriolis Effect causes
a vibration that is detected by a capacitive pickoff. The resulting signal is amplified, demodulated, and filtered
to produce a voltage that is proportional to the angular rate. This voltage is digitized using individual on-chip
16-bit Analog-to-Digital Converters (ADCs) to sample each axis. The full-scale range of the gyro sensors may
be digitally programmed to ±225, or ±450 degrees per second (dps). The ADC sample rate is programmable
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Document Number: PS-MPU-3300A-00
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from 8,000 samples per second, down to 3.9 samples per second, and user-selectable low-pass filters enable
a wide range of cut-off frequencies.
7.7 Primary I2C and SPI Serial Communications Interfaces
The MPU-3300 communicates to a system processor using either a SPI or an I2C serial interface. The MPU-
3300 always acts as a slave when communicating to the system processor. The LSB of the of the I2C slave
address is set by pin 9 (AD0).
The logic levels for communications between the MPU-3300 and its master is set by the voltage on VDD.
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7.8 Auxiliary I2C Serial Interface
The MPU-3300 has an auxiliary I2C bus for communicating to an off-chip accelerometer, magnetometer or
other sensors. This bus has two operating modes:
I2C Master Mode: The MPU-3300 acts as a master to any external sensors connected to the auxiliary
I2C bus
Pass-Through Mode: The MPU-3300 directly connects the primary and auxiliary I2C buses together,
allowing the system processor to directly communicate with any external sensors.
Auxiliary I2C Bus Modes of Operation:
I2C Master Mode: Allows the MPU-3300 to directly access the data registers of external digital
sensors, such as a magnetometer. In this mode, the MPU-3300 directly obtains data from auxiliary
sensors, without intervention from the system applications processor.
For example, in I2C Master mode, the MPU-3300 can be configured to perform burst reads, returning
the following data from an accelerometer:
.
.
.
X accelerometer data (2 bytes)
Y accelerometer data (2 bytes)
Z accelerometer data (2 bytes)
Pass-Through Mode: Allows an external system processor to act as master and directly communicate
to the external sensors connected to the auxiliary I2C bus pins (AUX_DA and AUX_CL). In this mode,
the auxiliary I2C bus control logic (3rd party sensor interface block) of the MPU-3300 is disabled, and
the auxiliary I2C pins AUX_DA and AUX_CL (Pins 6 and 7) are connected to the main I2C bus (Pins
23 and 24) through analog switches.
Pass-Through Mode is useful for configuring the external sensors, or for keeping the MPU-3300 in a
low-power mode when only the external sensors are used.
In Pass-Through Mode the system processor can still access MPU-3300 data through the I2C interface.
Auxiliary I2C Bus IO Logic Levels
The logic level of the auxiliary I2C bus is VDD
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7.9 Self-Test
Self-test allows for the testing of the mechanical and electrical portions of the sensors. The self-test for each
measurement axis can be activated by the bits of the gyroscope control register (register 27, GYRO_CONFIG).
Please refer to the register map document for more details on self-test.
When self-test is activated, the electronics cause the sensors to be actuated and produce an output signal.
The output signal is used to observe the self-test response.
The self-test response is defined as follows:
Self-test response = Sensor output with self-test enabled – Sensor output without self-test enabled
The self-test response for each gyroscope axis is defined in the gyroscope specification table (Section 6.1).
When the value of the self-test response is within the min/max limits of the product specification, the part has
passed self-test. When the self-test response exceeds the min/max values, the part is deemed to have failed
self-test.
7.10 Bias Instability
Bias Instability is a critical performance parameter for gyroscopes. The MPU-3300 provides typical bias
instability of 15°/hour on each axis, measured using the Allan Variance method. The figures below show
example Allan Variance plots for representative MPU-3300 devices.
X-Axis Gyroscope – Example Allan Variance Plot
Y-Axis Gyroscope – Example Allan Variance Plot
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Z-Axis Gyroscope – Example Allan Variance Plot
7.11 MPU-3300 Using SPI Interface
In the figure below, the system processor is an SPI master to the MPU-3300. Pins 8, 9, 23, and 24 are used
to support the /CS, SDO, SCLK, and SDI signals for SPI communications. Because these SPI pins are shared
with the I2C slave pins (9, 23 and 24), the system processor cannot access the auxiliary I2C bus through the
interface bypass multiplexer, which connects the processor I2C interface pins to the sensor I2C interface pins.
Since the MPU-3300 has limited capabilities as an I2C Master, and depends on the system processor to
manage the initial configuration of any auxiliary sensors, another method must be used for programming the
sensors on the auxiliary sensor I2C bus pins 6 and 7 (AUX_DA and AUX_CL).
When using SPI communications between the MPU-3300 and the system processor, configuration of devices
on the auxiliary I2C sensor bus can be achieved by using I2C Slaves 0-4 to perform read and write transactions
on any device and register on the auxiliary I2C bus. The I2C Slave 4 interface can be used to perform only
single byte read and write transactions.
Once the external sensors have been configured, the MPU-3300 can perform single or multi-byte reads using
the sensor I2C bus. The read results from the Slave 0-3 controllers can be written to the FIFO buffer as well as
to the external sensor registers.
For further information regarding the control of the MPU-3300’s auxiliary I2C interface, please refer to the MPU-
3300 Register Map and Register Descriptions document.
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7.12 Internal Clock Generation
The MPU-3300 has a flexible clocking scheme, allowing a variety of internal or external clock sources to be
used for the internal synchronous circuitry. This synchronous circuitry includes the signal conditioning and
ADCs, and various control circuits and registers. An on-chip PLL provides flexibility in the allowable inputs for
generating this clock.
Allowable internal sources for generating the internal clock are:
An internal relaxation oscillator
Any of the X, Y, or Z gyros (MEMS oscillators with a variation of ±1% over temperature)
Allowable external clocking sources are:
32.768kHz square wave
19.2MHz square wave
Selection of the source for generating the internal synchronous clock depends on the availability of external
sources and the requirements for power consumption and clock accuracy. These requirements will most likely
vary by mode of operation.
Clock accuracy is important, since timing errors directly affect the distance and angle calculations performed
by the Digital Motion Processor (and by extension, by any processor).
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There are also start-up conditions to consider. When the MPU-3300 first starts up, the device uses its internal
clock until programmed to operate from another source. This allows the user, for example, to wait for the
MEMS oscillators to stabilize before they are selected as the clock source.
7.13 Sensor Data Registers
The sensor data registers contain the latest gyro, auxiliary sensor, and temperature measurement data. They
are read-only registers, and are accessed via the serial interface. Data from these registers may be read
anytime. However, the interrupt function may be used to determine when new data is available.
For a table of interrupt sources please refer to Section 8.
7.14 FIFO
The MPU-3300 contains a 1024-byte FIFO register that is accessible via the Serial Interface. The FIFO
configuration register determines which data is written into the FIFO. Possible choices include gyro data,
temperature readings, auxiliary sensor readings, and FSYNC input. A FIFO counter keeps track of how many
bytes of valid data are contained in the FIFO. The FIFO register supports burst reads. The interrupt function
may be used to determine when new data is available.
For further information regarding the FIFO, please refer to the MPU-3300 Register Map and Register
Descriptions document.
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7.15 Interrupts
Interrupt functionality is configured via the Interrupt Configuration register. Items that are configurable include
the INT pin configuration, the interrupt latching and clearing method, and triggers for the interrupt. Items that
can trigger an interrupt are (1) Clock generator locked to new reference oscillator (used when switching clock
sources); (2) new data is available to be read (from the FIFO and Data registers); and (3) the MPU-3300 did
not receive an acknowledge from an auxiliary sensor on the secondary I2C bus. The interrupt status can be
read from the Interrupt Status register.
For further information regarding interrupts, please refer to the MPU-3300 Register Map and Register
Descriptions document.
7.16 Digital-Output Temperature Sensor
An on-chip temperature sensor and ADC are used to measure the MPU-3300 die temperature. The readings
from the ADC can be read from the FIFO or the Sensor Data registers.
7.17 Bias and LDO
The bias and LDO section generates the internal supply and the reference voltages and currents required by
the MPU-3300. Its input is an unregulated VDD of 2.375 to 3.46V. The LDO output is bypassed by a capacitor
at REGOUT. For further details on the capacitor, please refer to the Bill of Materials for External Components
(Section 7.3).
7.18 Charge Pump
An on-board charge pump generates the high voltage required for the MEMS oscillators. Its output is bypassed
by a capacitor at CPOUT. For further details on the capacitor, please refer to the Bill of Materials for External
Components (Section 7.3).
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8
Programmable Interrupts
The MPU-3300 has a programmable interrupt system which can generate an interrupt signal on the INT pin.
Status flags indicate the source of an interrupt. Interrupt sources may be enabled and disabled individually.
Table of Interrupt Sources
Interrupt Name
Module
FIFO Overflow
FIFO
Data Ready
Sensor Registers
I2C Master
I2C Master
I2C Master errors: Lost Arbitration, NACKs
I2C Slave 4
For information regarding the interrupt enable/disable registers and flag registers, please refer to the MPU-
3300 Register Map and Register Descriptions document.
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9
Digital Interface
9.1 I2C and SPI Serial Interfaces
The internal registers and memory of the MPU-3300 can be accessed using either I2C at 400 kHz or SPI at
1MHz. SPI operates in four-wire mode.
Serial Interface
Pin Number
Pin Name
/CS
Pin Description
8
9
SPI chip select (0=SPI enable)
AD0 / SDO
SCL / SCLK
SDA / SDI
I2C Slave Address LSB (AD0); SPI serial data output (SDO)
I2C serial clock (SCL); SPI serial clock (SCLK)
I2C serial data (SDA); SPI serial data input (SDI)
23
24
Note:
To prevent switching into I2C mode when using SPI, the I2C interface should be disabled by setting the
I2C_IF_DIS configuration bit. Setting this bit should be performed immediately after waiting for the time
specified by the “Start-Up Time for Register Read/Write” in Section 6.2.
For further information regarding the I2C_IF_DIS bit, please refer to the MPU-3300 Register Map and Register
Descriptions document.
9.2 I2C Interface
I2C is a two-wire interface comprised of the signals serial data (SDA) and serial clock (SCL). In general, the
lines are open-drain and bi-directional. In a generalized I2C interface implementation, attached devices can be
a master or a slave. The master device puts the slave address on the bus, and the slave device with the
matching address acknowledges the master.
The MPU-3300 always operates as a slave device when communicating to the system processor, which thus
acts as the master. SDA and SCL lines typically need pull-up resistors to VDD. The maximum bus speed is
400 kHz.
The slave address of the MPU-3300 is b110100X which is 7 bits long. The LSB bit of the 7 bit address is
determined by the logic level on pin AD0. This allows two MPU-3300s to be connected to the same I2C bus.
When used in this configuration, the address of the one of the devices should be b1101000 (pin AD0 is logic
low) and the address of the other should be b1101001 (pin AD0 is logic high).
9.3 I2C Communications Protocol
START (S) and STOP (P) Conditions
Communication on the I2C bus starts when the master puts the START condition (S) on the bus, which is
defined as a HIGH-to-LOW transition of the SDA line while SCL line is HIGH (see figure below). The bus is
considered to be busy until the master puts a STOP condition (P) on the bus, which is defined as a LOW to
HIGH transition on the SDA line while SCL is HIGH (see figure below).
Additionally, the bus remains busy if a repeated START (Sr) is generated instead of a STOP condition.
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START and STOP Conditions
Data Format / Acknowledge
I2C data bytes are defined to be 8-bits long. There is no restriction to the number of bytes transmitted per data
transfer. Each byte transferred must be followed by an acknowledge (ACK) signal. The clock for the
acknowledge signal is generated by the master, while the receiver generates the actual acknowledge signal
by pulling down SDA and holding it low during the HIGH portion of the acknowledge clock pulse.
If a slave is busy and cannot transmit or receive another byte of data until some other task has been performed,
it can hold SCL LOW, thus forcing the master into a wait state. Normal data transfer resumes when the slave
is ready, and releases the clock line (refer to the following figure).
Acknowledge on the I2C Bus
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Communications
After beginning communications with the START condition (S), the master sends a 7-bit slave address followed
by an 8th bit, the read/write bit. The read/write bit indicates whether the master is receiving data from or is
writing to the slave device. Then, the master releases the SDA line and waits for the acknowledge signal (ACK)
from the slave device. Each byte transferred must be followed by an acknowledge bit. To acknowledge, the
slave device pulls the SDA line LOW and keeps it LOW for the high period of the SCL line. Data transmission
is always terminated by the master with a STOP condition (P), thus freeing the communications line. However,
the master can generate a repeated START condition (Sr), and address another slave without first generating
a STOP condition (P). A LOW to HIGH transition on the SDA line while SCL is HIGH defines the stop condition.
All SDA changes should take place when SCL is low, with the exception of start and stop conditions.
Complete I2C Data Transfer
To write the internal MPU-3300 registers, the master transmits the start condition (S), followed by the I2C
address and the write bit (0). At the 9th clock cycle (when the clock is high), the MPU-3300 acknowledges the
transfer. Then the master puts the register address (RA) on the bus. After the MPU-3300 acknowledges the
reception of the register address, the master puts the register data onto the bus. This is followed by the ACK
signal, and data transfer may be concluded by the stop condition (P). To write multiple bytes after the last ACK
signal, the master can continue outputting data rather than transmitting a stop signal. In this case, the MPU-
3300 automatically increments the register address and loads the data to the appropriate register. The
following figures show single and two-byte write sequences.
Single-Byte Write Sequence
Master
Slave
S
AD+W
RA
RA
DATA
DATA
P
ACK
ACK
ACK
ACK
ACK
ACK
Burst Write Sequence
Master
Slave
S
AD+W
DATA
P
ACK
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To read the internal MPU-3300 registers, the master sends a start condition, followed by the I2C address and
a write bit, and then the register address that is going to be read. Upon receiving the ACK signal from the MPU-
3300, the master transmits a start signal followed by the slave address and read bit. As a result, the MPU-
3300 sends an ACK signal and the data. The communication ends with a not acknowledge (NACK) signal and
a stop bit from master. The NACK condition is defined such that the SDA line remains high at the 9th clock
cycle. The following figures show single and two-byte read sequences.
Single-Byte Read Sequence
Master
Slave
S
AD+W
RA
RA
S
S
AD+R
AD+R
NACK
ACK
P
ACK
ACK
ACK
ACK
ACK DATA
ACK DATA
Burst Read Sequence
Master
Slave
S
AD+W
NACK
P
DATA
9.4 I2C Terms
Signal Description
S
AD
W
Start Condition: SDA goes from high to low while SCL is high
Slave I2C address
Write bit (0)
R
Read bit (1)
ACK
Acknowledge: SDA line is low while the SCL line is high at the 9th
clock cycle
NACK Not-Acknowledge: SDA line stays high at the 9th clock cycle
RA MPU-3300 internal register address
DATA Transmit or received data
Stop condition: SDA going from low to high while SCL is high
P
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9.5 SPI Interface
SPI is a 4-wire synchronous serial interface that uses two control lines and two data lines. The MPU-3300
always operates as a Slave device during standard Master-Slave SPI operation.
With respect to the Master, the Serial Clock output (SCLK), the Serial Data Output (SDO) and the Serial Data
Input (SDI) are shared among the Slave devices. Each SPI slave device requires its own Chip Select (/CS)
line from the master.
/CS goes low (active) at the start of transmission and goes back high (inactive) at the end. Only one /CS line
is active at a time, ensuring that only one slave is selected at any given time. The /CS lines of the non-selected
slave devices are held high, causing their SDO lines to remain in a high-impedance (high-z) state so that they
do not interfere with any active devices.
SPI Operational Features
1. Data is delivered MSB first and LSB last
2. Data is latched on the rising edge of SCLK
3. Data should be transitioned on the falling edge of SCLK
4. The maximum frequency of SCLK is 1MHz
5. SPI read and write operations are completed in 16 or more clock cycles (two or more bytes). The
first byte contains the SPI Address, and the following byte(s) contain(s) the SPI data. The first bit
of the first byte contains the Read/Write bit and indicates the Read (1) or Write (0) operation. The
following 7 bits contain the Register Address. In cases of multiple-byte Read/Writes, data is two
or more bytes:
SPI Address format
MSB
LSB
R/W A6 A5 A4 A3 A2 A1
A0
SPI Data format
MSB
LSB
D7
D6 D5 D4 D3 D2 D1
D0
6. Supports Single or Burst Read/Writes.
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10 Assembly
This section provides general guidelines for assembling InvenSense Micro Electro-Mechanical Systems
(MEMS) gyros packaged in Quad Flat No leads package (QFN) surface mount integrated circuits.
10.1 Orientation of Axes
The diagram below shows the orientation of the axes of sensitivity and the polarity of rotation. Note the pin 1
identifier (•) in the figure.
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10.2 Package Dimensions
24 Lead QFN (4x4x0.9) mm NiPdAu Lead-frame finish
L
c
24
19
1
18
PIN 1 IDENTIFIER IS A LASER
MARKED FEATURE ON TOP
CO.3
f
E
E2
e
b
13
L1
6
A1
7
12
D
D2
A
On 4 corners -
lead dimensions
s
SYMBOLS DIMENSIONS IN MILLIMETERS
MIN
0.85
0.00
0.18
‐‐‐
3.90
2.65
3.90
2.55
‐‐‐
NOM
0.90
0.02
0.25
0.20 REF
4.00
2.70
4.00
2.60
0.50
0.25
0.30
0.35
0.40
‐‐‐
MAX
0.95
0.05
0.30
‐‐‐
4.10
2.75
4.10
2.65
‐‐‐
A
A1
b
c
D
D2
E
E2
e
f (e‐b)
K
L
‐‐‐
‐‐‐
0.25
0.30
0.35
0.05
0.35
0.40
0.45
0.15
L1
s
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10.3 PCB Design Guidelines
The Pad Diagram using a JEDEC type extension with solder rising on the outer edge is shown below. The Pad
Dimensions Table shows pad sizing (mean dimensions) recommended for the MPU-3300 product.
JEDEC type extension with solder rising on outer edge
D3
D
D2
PIN 1
IDENTIFIER
24
19
1
18
e
E2
E
E3
b
c
L3 L1
6
13
7
12
L2
Tout
Tin
Tout
L
PCB Layout Diagram
SYMBOLS
DIMENSIONS IN MILLIMETERS
NOM
Nominal Package I/O Pad Dimensions
e
b
L
L1
D
E
Pad Pitch
Pad Width
Pad Length
Pad Length
Package Width
Package Length
Exposed Pad Width
Exposed Pad Length
0.50
0.25
0.35
0.40
4.00
4.00
2.70
2.60
D2
E2
I/O Land Design Dimensions (Guidelines )
I/O Pad Extent Width
I/O Pad Extent Length
Land Width
Outward Extension
Inward Extension
D3
E3
c
Tout
Tin
L2
4.80
4.80
0.35
0.40
0.05
0.80
0.85
Land Length
Land Length
L3
PCB Dimensions Table (for PCB Lay-out Diagram)
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10.4 Assembly Precautions
10.4.1 Gyroscope Surface Mount Guidelines
InvenSense MEMS Gyros sense rate of rotation. In addition, gyroscopes sense mechanical stress coming from
the printed circuit board (PCB). This PCB stress can be minimized by adhering to certain design rules:
When using MEMS gyroscope components in plastic packages, PCB mounting and assembly can cause
package stress. This package stress in turn can affect the output offset and its value over a wide range of
temperatures. This stress is caused by the mismatch between the Coefficient of Linear Thermal Expansion
(CTE) of the package material and the PCB. Care must be taken to avoid package stress due to mounting.
Traces connected to pads should be as symmetric as possible. Maximizing symmetry and balance for pad
connection will help component self alignment and will lead to better control of solder paste reduction after
reflow.
Any material used in the surface mount assembly process of the MEMS gyroscope should be free of restricted
RoHS elements or compounds. Pb-free solders should be used for assembly.
10.4.2 Exposed Die Pad Precautions
The MPU-3300 has very low active and standby current consumption. There is no electrical connection
between the exposed die pad and the internal CMOS circuits. The exposed die pad is not required for heat-
sinking, and should not be soldered to the PCB. Underfill is also not recommended. Soldering or adding
underfill to the e-pad can induce performance changes due to package thermo-mechanical stress.
10.4.3 Trace Routing
Routing traces or vias under the gyro package such that they run under the exposed die pad is prohibited.
Routed active signals may harmonically couple with the gyro MEMS devices, compromising gyro response.
These devices are designed with the drive frequencies as follows: X = 33±3Khz, Y = 30±3Khz, and Z=27±3Khz.
To avoid harmonic coupling don’t route active signals in non-shielded signal planes directly below, or above
the gyro package. Note: For best performance, design a ground plane under the e-pad to reduce PCB signal
noise from the board on which the gyro device is mounted. If the gyro device is stacked under another PCB
board, design a ground plane directly above the gyro device to shield active signals from the PCB board
mounted above.
10.4.4 Component Placement
Do not place large insertion components such as keyboard or similar buttons, connectors, or shielding boxes
at a distance of less than 6 mm from the MEMS gyro. Maintain generally accepted industry design practices
for component placement near the MPU-3300 to prevent noise coupling and thermo-mechanical stress.
10.4.5 PCB Mounting and Cross-Axis Sensitivity
Orientation errors of the gyroscope and accelerometer mounted to the printed circuit board can cause cross-
axis sensitivity in which one gyro or accel responds to rotation or acceleration about another axis, respectively.
For example, the X-axis gyroscope may respond to rotation about the Y or Z axes. The orientation mounting
errors are illustrated in the figure below.
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Z
Φ
Y
X
Θ
Package Gyro Axes (
) Relative to PCB Axes (
) with Orientation Errors (Θ and Φ)
The table below shows the cross-axis sensitivity as a percentage of the gyroscope sensitivity for a given
orientation error, respectively.
Cross-Axis Sensitivity vs. Orientation Error
Orientation Error
Cross-Axis Sensitivity
(θ or Φ)
(sinθ or sinΦ)
0º
0.5º
1º
0%
0.87%
1.75%
The specifications for cross-axis sensitivity in Section 6.1 include the effect of the die orientation error with
respect to the package.
10.4.6 MEMS Handling Instructions
MEMS (Micro Electro-Mechanical Systems) are a time-proven, robust technology used in hundreds of millions
of consumer, automotive and industrial products. MEMS devices consist of microscopic moving mechanical
structures. They differ from conventional IC products, even though they can be found in similar packages.
Therefore, MEMS devices require different handling precautions than conventional ICs prior to mounting onto
printed circuit boards (PCBs).
The MPU-3300 has been qualified to a shock tolerance of 10,000g. InvenSense packages its gyroscopes as
it deems proper for protection against normal handling and shipping. It recommends the following handling
precautions to prevent potential damage.
Do not drop individually packaged gyroscopes, or trays of gyroscopes onto hard surfaces. Components
placed in trays could be subject to g-forces in excess of 10,000g if dropped.
Printed circuit boards that incorporate mounted gyroscopes should not be separated by manually snapping
apart. This could also create g-forces in excess of 10,000g.
Do not clean MEMS gyroscopes in ultrasonic baths. Ultrasonic baths can induce MEMS damage if the
bath energy causes excessive drive motion through resonant frequency coupling.
10.4.7 ESD Considerations
Establish and use ESD-safe handling precautions when unpacking and handling ESD-sensitive devices.
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Store ESD sensitive devices in ESD safe containers until ready for use. The Tape-and-Reel moisture-
sealed bag is an ESD approved barrier. The best practice is to keep the units in the original moisture
sealed bags until ready for assembly.
Restrict all device handling to ESD protected work areas that measure less than 200V static charge.
Ensure that all workstations and personnel are properly grounded to prevent ESD.
10.4.8 Reflow Specification
Qualification Reflow: The MPU-3300 was qualified in accordance with IPC/JEDEC J-STD-020D.01. This
standard classifies proper packaging, storage and handling in order to avoid subsequent thermal and
mechanical damage during the solder reflow attachment phase of PCB assembly.
The qualification preconditioning process specifies a sequence consisting of a bake cycle, a moisture soak
cycle (in a temperature humidity oven), and three consecutive solder reflow cycles, followed by functional
device testing.
The peak solder reflow classification temperature requirement for package qualification is (260 +5/-0°C) for
lead-free soldering of components measuring less than 1.6 mm in thickness. The qualification profile and a
table explaining the set-points are shown below:
TPmax
TPmin
10-30sec
TLiquidus
Tsmax
Liquidus
60-120sec
Tramp-up
( < 3 C/sec)
Tramp-down
( < 4 C/sec)
Tsmin
Preheat
60-120sec
Troom-Pmax
(< 480sec)
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Document Number: PS-MPU-3300A-00
Revision: 1.1
Release Date: 7/23/2012
MPU-3300 Product Specification
Temperature Set Points Corresponding to Reflow Profile Above
CONSTRAINTS
Step Setting
Temp (°C)
Time (sec)
Max. Rate (°C/sec)
A
B
C
D
Troom
TSmin
TSmax
TLiquidus
25
150
200
217
60 < tBC < 120
r(TLiquidus-TPmax) < 3
r(TLiquidus-TPmax) < 3
r(TLiquidus-TPmax) < 3
r(TPmax-TLiquidus) < 4
E
TPmin
255
[255°C, 260°C]
F
G
TPmax
TPmin
260
255
tAF < 480
10< tEG < 30
[ 260°C, 265°C]
[255°C, 260°C]
H
I
TLiquidus
Troom
217
25
60 < tDH < 120
Notes: Customers must never exceed the Classification temperature (TPmax = 260°C).
All temperatures refer to the topside of the QFN package, as measured on the package body surface.
Production Reflow: Check the recommendations of your solder manufacturer. For optimum results, use lead-
free solders that have lower specified temperature profiles (Tpmax ~ 235°C). Also use lower ramp-up and ramp-
down rates than those used in the qualification profile. Never exceed the maximum conditions that we used
for qualification, as these represent the maximum tolerable ratings for the device.
10.5 Storage Specifications
The storage specification of the MPU-3300 conforms to IPC/JEDEC J-STD-020D.01 Moisture Sensitivity Level
(MSL) 3.
Calculated shelf-life in moisture-sealed bag 12 months -- Storage conditions: <40°C and <90% RH
After opening moisture-sealed bag
168hours -- Storage conditions: ambient ≤30°C at 60%RH
10.6 Package Marking Specification
Package Marking Specification
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Document Number: PS-MPU-3300A-00
Revision: 1.1
Release Date: 7/23/2012
MPU-3300 Product Specification
10.7 Tape & Reel Specification
Tape Dimensions
Reel Outline Drawing
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Document Number: PS-MPU-3300A-00
Revision: 1.1
Release Date: 7/23/2012
MPU-3300 Product Specification
Reel Dimensions and Package Size
PACKAGE
SIZE
REEL (mm)
L
V
W
Z
4x4
330
100
13.2
2.2
Package Orientation
User Direction
of Feed
Pin 1
INVENSENSE
INVENSENSE
Cover Tape
(Anti-Static)
Carrier Tape
(Anti-Static)
Reel
Terminal Tape
Label
Tape and Reel Specification
Reel Specifications
Quantity Per Reel
Reels per Box
5,000
1
5
Boxes Per Carton (max)
Pcs/Carton (max)
25,000
10.8 Label
Barcode Label
Location of Label on Reel
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Document Number: PS-MPU-3300A-00
Revision: 1.1
Release Date: 7/23/2012
MPU-3300 Product Specification
10.9 Packaging
REEL – with Barcode &
Caution labels
Vacuum-Sealed Moisture
Barrier Bag with ESD, MSL3,
Caution, and Barcode Labels
MSL3 Label
Caution Label
ESD Label
Inner Bubble Wrap
Pizza Box
Pizza Boxes Placed in Foam-
Lined Shipper Box
Outer Shipper Label
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Document Number: PS-MPU-3300A-00
Revision: 1.1
Release Date: 7/23/2012
MPU-3300 Product Specification
10.10 Representative Shipping Carton Label
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Document Number: PS-MPU-3300A-00
Revision: 1.1
Release Date: 7/23/2012
MPU-3300 Product Specification
11 Reliability
11.1 Qualification Test Policy
InvenSense’s products complete a Qualification Test Plan before being released to production. The
Qualification Test Plan for the MPU-3300 followed the JESD 47H.01 Standards, “Stress-Test-Driven
Qualification of Integrated Circuits,” with the individual tests described below.
11.2 Qualification Test Plan
Accelerated Life Tests
TEST
Method/Condition
Lot
Quantity
Sample /
Lot
Acc /
Reject
Criteria
(HTOL/LFR)
High Temperature Operating Life
JEDEC JESD22-A108D, Dynamic, 3.63V biased,
Tj>125°C [read-points 168, 500, 1000 hours]
3
3
77
77
(0/1)
(HAST)
JEDEC JESD22-A118
Condition A, 130°C, 85%RH, 33.3 psia., unbiased, [read-
point 96 hours]
(0/1)
Highly Accelerated Stress Test (1)
(HTS)
JEDEC JESD22-A103D, Cond. A, 125°C Non-Bias Bake
[read-points 168, 500, 1000 hours]
3
77
(0/1)
High Temperature Storage Life
Device Component Level Tests
Method/Condition
TEST
Lot
Quantity
Sample /
Lot
Acc /
Reject
Criteria
(ESD-HBM)
JEDEC JS-001-2012, (1.5KV)
1
3
(0/1)
ESD-Human Body Model
(ESD-MM)
ESD-Machine Model
JEDEC JESD22-A115C, (200V)
1
1
3
3
6
5
(0/1)
(0/1)
(0/1)
(LU)
Latch Up
JEDEC JESD-78D Class II (2), 125°C; ±60mA
(MS)
Mechanical Shock
JEDEC JESD22-B104C, Mil-Std-883,
Method 2002.5, Cond. E, 10,000g’s, 0.2ms,
±X, Y, Z – 6 directions, 5 times/direction
(VIB)
Vibration
JEDEC JESD22-B103B, Variable Frequency (random),
Cond. B, 5-500Hz,
X, Y, Z – 4 times/direction
3
3
5
(0/1)
(0/1)
(TC)
JEDEC JESD22-A104D
Condition N [-40°C to +85°C],
Soak Mode 2 [5’], 100 cycles
77
Temperature Cycling (1)
Board Level Tests
Method/Condition
TEST
Lot
Quantity
Sample /
Lot
Acc /
Reject
Criteria
(BMS)
Board Mechanical Shock
JEDEC JESD22-B104C,Mil-Std-883,
Method 2002.5, Cond. E, 10000g’s, 0.2ms,
+-X, Y, Z – 6 directions, 5 times/direction
1
1
5
(0/1)
(BTC)
JEDEC JESD22-A104D
40
(0/1)
Board
Condition N [ -40°C to +85°C],
Soak mode 2 [5’], 100 cycles
Temperature Cycling (1)
(1) Tests are preceded by MSL3 Preconditioning in accordance with JEDEC JESD22-A113F
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Document Number: PS-MPU-3300A-00
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Release Date: 7/23/2012
MPU-3300 Product Specification
12 Environmental Compliance
The MPU-3300 is RoHS and Green compliant.
The MPU-3300 is in full environmental compliance as evidenced in report HS-MPU-3300, Materials Declaration
Data Sheet.
Environmental Declaration Disclaimer:
InvenSense believes this environmental information to be correct but cannot guarantee accuracy or completeness. Conformity documents
for the above component constitutes are on file. InvenSense subcontracts manufacturing and the information contained herein is based
on data received from vendors and suppliers, which has not been validated by InvenSense.
This information furnished by InvenSense is believed to be accurate and reliable. However, no responsibility is assumed by InvenSense
for its use, or for any infringements of patents or other rights of third parties that may result from its use. Specifications are subject to
change without notice. InvenSense reserves the right to make changes to this product, including its circuits and software, in order to
improve its design and/or performance, without prior notice. InvenSense makes no warranties, neither expressed nor implied, regarding
the information and specifications contained in this document. InvenSense assumes no responsibility for any claims or damages arising
from information contained in this document, or from the use of products and services detailed therein. This includes, but is not limited to,
claims or damages based on the infringement of patents, copyrights, mask work and/or other intellectual property rights.
Certain intellectual property owned by InvenSense and described in this document is patent protected. No license is granted by implication
or otherwise under any patent or patent rights of InvenSense. This publication supersedes and replaces all information previously supplied.
Trademarks that are registered trademarks are the property of their respective companies. InvenSense sensors should not be used or
sold in the development, storage, production or utilization of any conventional or mass-destructive weapons or for any other weapons or
life threatening applications, as well as in any other life critical applications such as medical equipment, transportation, aerospace and
nuclear instruments, undersea equipment, power plant equipment, disaster prevention and crime prevention equipment.
InvenSense® is a registered trademark of InvenSense, Inc. MPUTM, MPU-3300TM, Digital Motion Processor™, DMP ™, Motion Processing
Unit™, MotionFusion™, and MotionApps™ are trademarks of InvenSense, Inc.
©2011 InvenSense, Inc. All rights reserved.
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