MPU-9150 [TDK]
IMU (惯性测量设备);
| 型号： | MPU-9150 |
| 厂家： | 
TDK ELECTRONICS |
| 描述： | IMU (惯性测量设备) |
| 文件： | 总50页 (文件大小：1501K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
InvenSense Inc.
Document Number: PS-MPU-9150A-00
Revision: 4.3
1197 Borregas Ave, Sunnyvale, CA 94089 U.S.A.
Tel: +1 (408) 988-7339 Fax: +1 (408) 988-8104
Website: www.invensense.com
Release Date: 9/18/2013
MPU-9150
Product Specification
Revision 4.3
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Document Number: PS-MPU-9150A-00
Revision: 4.3
Release Date: 9/18/2013
MPU-9150 Product Specification
CONTENTS
1
2
3
REVISION HISTORY ...................................................................................................................................5
PURPOSE AND SCOPE .............................................................................................................................6
PRODUCT OVERVIEW...............................................................................................................................7
3.1
MPU-9150 OVERVIEW ........................................................................................................................7
APPLICATIONS...........................................................................................................................................8
FEATURES..................................................................................................................................................9
4
5
5.1
GYROSCOPE FEATURES.......................................................................................................................9
ACCELEROMETER FEATURES ...............................................................................................................9
MAGNETOMETER FEATURES.................................................................................................................9
ADDITIONAL FEATURES ........................................................................................................................9
MOTIONPROCESSING.........................................................................................................................10
CLOCKING.........................................................................................................................................10
5.2
5.3
5.4
5.5
5.6
6
ELECTRICAL CHARACTERISTICS.........................................................................................................11
6.1
GYROSCOPE SPECIFICATIONS............................................................................................................11
ACCELEROMETER SPECIFICATIONS.....................................................................................................12
MAGNETOMETER SPECIFICATIONS......................................................................................................13
ELECTRICAL AND OTHER COMMON SPECIFICATIONS............................................................................14
ELECTRICAL SPECIFICATIONS, CONTINUED .........................................................................................15
ELECTRICAL SPECIFICATIONS, CONTINUED .........................................................................................16
ELECTRICAL SPECIFICATIONS, CONTINUED .........................................................................................17
I2C TIMING CHARACTERIZATION..........................................................................................................18
ABSOLUTE MAXIMUM RATINGS ...........................................................................................................19
6.2
6.3
6.4
6.5
6.6
6.7
6.8
6.9
7
APPLICATIONS INFORMATION..............................................................................................................20
7.1
PIN OUT AND SIGNAL DESCRIPTION....................................................................................................20
TYPICAL OPERATING CIRCUIT.............................................................................................................21
BILL OF MATERIALS FOR EXTERNAL COMPONENTS..............................................................................21
RECOMMENDED POWER-ON PROCEDURE ...........................................................................................22
BLOCK DIAGRAM ...............................................................................................................................23
OVERVIEW ........................................................................................................................................23
THREE-AXIS MEMS GYROSCOPE WITH 16-BIT ADCS AND SIGNAL CONDITIONING................................24
THREE-AXIS MEMS ACCELEROMETER WITH 16-BIT ADCS AND SIGNAL CONDITIONING ........................24
THREE-AXIS MEMS MAGNETOMETER WITH 13-BIT ADCS AND SIGNAL CONDITIONING .........................24
7.2
7.3
7.4
7.5
7.6
7.7
7.8
7.9
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MPU-9150 Product Specification
7.10
7.11
7.12
7.13
7.14
7.15
7.16
7.17
7.18
7.19
7.20
7.21
7.22
DIGITAL MOTION PROCESSOR ............................................................................................................24
PRIMARY I2C .....................................................................................................................................24
AUXILIARY I2C SERIAL INTERFACE ......................................................................................................25
SELF-TEST........................................................................................................................................25
MPU-9150 SOLUTION FOR 10-AXIS SENSOR FUSION USING I2C INTERFACE........................................26
PROCEDURE FOR DIRECTLY ACCESSING THE AK8975 3-AXIS COMPASS .............................................28
INTERNAL CLOCK GENERATION ..........................................................................................................28
SENSOR DATA REGISTERS.................................................................................................................29
FIFO ................................................................................................................................................29
INTERRUPTS......................................................................................................................................29
DIGITAL-OUTPUT TEMPERATURE SENSOR ..........................................................................................29
BIAS AND LDO ..................................................................................................................................30
CHARGE PUMP ..................................................................................................................................30
8
9
PROGRAMMABLE INTERRUPTS............................................................................................................31
DIGITAL INTERFACE ...............................................................................................................................32
9.1
I2C SERIAL INTERFACE.......................................................................................................................32
I2C INTERFACE ..................................................................................................................................32
I2C COMMUNICATIONS PROTOCOL......................................................................................................32
I2C TERMS ........................................................................................................................................35
9.2
9.3
9.4
10 SERIAL INTERFACE CONSIDERATIONS...............................................................................................36
10.1
10.2
10.3
MPU-9150 SUPPORTED INTERFACES.................................................................................................36
LOGIC LEVELS ...................................................................................................................................36
LOGIC LEVELS DIAGRAM ....................................................................................................................37
11 ASSEMBLY ...............................................................................................................................................38
11.1
11.2
11.3
11.4
11.5
11.6
11.7
11.8
11.9
11.10
ORIENTATION OF AXES ......................................................................................................................38
PACKAGE DIMENSIONS ......................................................................................................................39
PCB DESIGN GUIDELINES:.................................................................................................................40
ASSEMBLY PRECAUTIONS ..................................................................................................................41
REFLOW SPECIFICATION ....................................................................................................................43
STORAGE SPECIFICATIONS.................................................................................................................44
PACKAGE MARKING SPECIFICATION....................................................................................................44
TAPE & REEL SPECIFICATION.............................................................................................................45
LABEL ...............................................................................................................................................46
PACKAGING...................................................................................................................................47
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MPU-9150 Product Specification
11.11
REPRESENTATIVE SHIPPING CARTON LABEL...................................................................................48
12 RELIABILITY .............................................................................................................................................49
12.1
12.2
QUALIFICATION TEST POLICY .............................................................................................................49
QUALIFICATION TEST PLAN ................................................................................................................49
13 ENVIRONMENTAL COMPLIANCE...........................................................................................................50
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MPU-9150 Product Specification
1
Revision History
Revision
Date
Revision Description
05/27/2011
06/14/2011
1.0
2.0
Initial Release of Product Specification
Modified for Rev C Silicon (sections 5.2, 6.2, 6.4, 6.6, 8.2, 8.3, 8.4)
Edits for clarity (several sections)
10/21/2011
2.1
Updated Supply current vs. operating modes (sections 5.3, 5.4, 6.4)
Modified Self-Test Response of Accelerometers (section 6.2)
Modified absolute maximum rating for acceleration (section 6.9)
Updated latch up current rating (sections 6.9, 12.2)
Modified package dimensions and PCB design guidelines (sections 11.2, 11.3)
Updated assembly precautions (section 11.4)
Updated qualification test plan (section 12.2)
Edits for clarity (several sections)
10/24/2011
3.0
Modified for Rev D Silicon (sections 6.2, 8.2, 8.3, 8.4)
Edits for Clarity (several sections)
12/23/2011
05/14/2012
3.1
4.0
Updated package dimensions (section 11.2)
Added Gyroscope specifications (section 6.1)
Added Accelerometer specifications (section 6.2)
Updated Electrical Other Common Specifications (section 6.3)
Updated latch-up information (section 6.9)
Updated Block Diagram (section 7.5)
Update Self-Test description (section 7.13)
Updated PCB design guidelines (section 11.3)
Updated packing and shipping information (sections 11.8, 11.9, 11.10, 11.11)
Updated reliability references (section 12.2)
8/28/2013
4.1
Removed “Advanced Information” watermark. Updated section 2.0, 6.5, 6.7,
1.7, 7.2, 7.15, 8, 10.3 and 11.8. Removed section 8.1.
9/13/2013
9/18/2013
.
4.2
4.3
Updated Section 6.
Updated Section 5.5 & 8.
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MPU-9150 Product Specification
2
Purpose and Scope
This product specification provides information regarding the electrical specification and design related
information for the MPU-9150™ Motion Processing Unit™ or MPU™.
Electrical characteristics are based upon design analysis and simulation results only. Specifications are
subject to change without notice. For references to register map and descriptions of individual registers,
please refer to the MPU-9150 Register Map and Register Descriptions document.
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MPU-9150 Product Specification
3
Product Overview
3.1
MPU-9150 Overview
MotionInterface™ is becoming a “must-have” function being adopted by smartphone and tablet
manufacturers due to the enormous value it adds to the end user experience. In smartphones, it finds use in
applications such as gesture commands for applications and phone control, enhanced gaming, augmented
reality, panoramic photo capture and viewing, and pedestrian and vehicle navigation. With its ability to
precisely and accurately track user motions, MotionTracking technology can convert handsets and tablets
into powerful 3D intelligent devices that can be used in applications ranging from health and fitness
monitoring to location-based services. Key requirements for MotionInterface enabled devices are small
package size, low power consumption, high accuracy and repeatability, high shock tolerance, and application
specific performance programmability – all at a low consumer price point.
The MPU-9150 is the world’s first integrated 9-axis MotionTracking device that combines a 3-axis MEMS
gyroscope, a 3-axis MEMS accelerometer, a 3-axis MEMS magnetometer and a Digital Motion Processor™
(DMP™) hardware accelerator engine. The MPU-9150 is an ideal solution for handset and tablet
applications, game controllers, motion pointer remote controls, and other consumer devices. The MPU-
9150’s 9-axis MotionFusion combines acceleration and rotational motion plus heading information into a
single data stream for the application. This MotionProcessing™ technology integration provides a smaller
footprint and has inherent cost advantages compared to discrete gyroscope, accelerometer, plus
magnetometer solutions. The MPU-9150 is also designed to interface with multiple non-inertial digital
sensors, such as pressure sensors, on its auxiliary I2C port to produce a 10-Axis sensor fusion output. The
MPU-9150 is a 3rd generation motion processor and is footprint compatible with the MPU-60X0 and MPU-
30X0 families.
The MPU-9150 features three 16-bit analog-to-digital converters (ADCs) for digitizing the gyroscope outputs,
three 16-bit ADCs for digitizing the accelerometer outputs and three 13-bit ADCs for digitizing the
magnetometer outputs. For precision tracking of both fast and slow motions, the parts feature a user-
programmable gyroscope full-scale range of ±250, ±500, ±1000, and ±2000°/sec (dps), a user-
programmable accelerometer full-scale range of ±2g, ±4g, ±8g, and ±16g, and a magnetometer full-scale
range of ±1200µT.
The MPU-9150 is a multi-chip module (MCM) consisting of two dies integrated into a single LGA package.
One die houses the 3-Axis gyroscope and the 3-Axis accelerometer. The other die houses the AK8975 3-
Axis magnetometer from Asahi Kasei Microdevices Corporation.
An on-chip 1024 Byte FIFO buffer helps lower system power consumption by allowing the system processor
to read the sensor data in bursts and then enter a low-power mode as the MPU collects more data. With all
the necessary on-chip processing and sensor components required to support many motion-based use
cases, the MPU-9150 uniquely supports a variety of advanced motion-based applications entirely on-chip.
The MPU-9150 thus enables low-power MotionProcessing in portable applications with reduced processing
requirements for the system processor. By providing an integrated MotionFusion output, the DMP in the
MPU-9150 offloads the intensive MotionProcessing computation requirements from the system processor,
minimizing the need for frequent polling of the motion sensor output.
Communication with all registers of the device is performed using I2C at 400 kHz. Additional features include
an embedded temperature sensor and an on-chip oscillator with ±1% variation over the operating
temperature range.
By leveraging its patented and volume-proven Nasiri-Fabrication platform, which integrates MEMS wafers
with companion CMOS electronics through wafer-level bonding, InvenSense has driven the MPU-9150
package size down to a revolutionary footprint of 4x4x1mm (LGA), while providing the highest performance,
lowest noise, and the lowest cost semiconductor packaging required for handheld consumer electronic
devices. The part features a robust 10,000g shock tolerance, and has programmable low-pass filters for the
gyroscopes, accelerometers, magnetometers, and the on-chip temperature sensor.
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4
Applications
BlurFree™ technology (for Video/Still Image Stabilization)
AirSign™ technology (for Security/Authentication)
TouchAnywhere™ technology (for “no touch” UI Application Control/Navigation)
MotionCommand™ technology (for Gesture Short-cuts)
Motion-enabled game and application framework
InstantGesture™ iG™ gesture recognition
Location based services, points of interest, and dead reckoning
Handset and portable gaming
Motion-based game controllers
3D remote controls for Internet connected DTVs and set top boxes, 3D mice
Wearable sensors for health, fitness and sports
Toys
Pedestrian based navigation
Navigation
Electronic Compass
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MPU-9150 Product Specification
5
Features
5.1
Gyroscope Features
The triple-axis MEMS gyroscope in the MPU-9150 includes a wide range of features:
Digital-output X-, Y-, and Z-Axis angular rate sensors (gyroscopes) with a user-programmable full-
scale range of ±250, ±500, ±1000, and ±2000°/sec
External sync signal connected to the FSYNC pin supports image, video and GPS synchronization
Integrated 16-bit ADCs enable simultaneous sampling of gyros
Enhanced bias and sensitivity temperature stability reduces the need for user calibration
Improved low-frequency noise performance
Digitally-programmable low-pass filter
Factory calibrated sensitivity scale factor
User self-test
5.2
Accelerometer Features
The triple-axis MEMS accelerometer in MPU-9150 includes a wide range of features:
Digital-output 3-Axis accelerometer with a programmable full scale range of ±2g, ±4g, ±8g and ±16g
Integrated 16-bit ADCs enable simultaneous sampling of accelerometers while requiring no external
multiplexer
Orientation detection and signaling
Tap detection
User-programmable interrupts
High-G interrupt
User self-test
5.3
Magnetometer Features
The triple-axis MEMS magnetometer in MPU-9150 includes a wide range of features:
3-axis silicon monolithic Hall-effect magnetic sensor with magnetic concentrator
Wide dynamic measurement range and high resolution with lower current consumption.
Output data resolution is 13 bit (0.3 µT per LSB)
Full scale measurement range is ±1200 µT
Self-test function with internal magnetic source to confirm magnetic sensor operation on end
products
5.4
Additional Features
The MPU-9150 includes the following additional features:
9-Axis MotionFusion via on-chip Digital Motion Processor (DMP)
Auxiliary master I2C bus for reading data from external sensors (e.g., pressure sensor)
Flexible VLOGIC reference voltage supports multiple I2C interface voltages
Smallest and thinnest package for portable devices: 4x4x1mm LGA
Minimal cross-axis sensitivity between the accelerometer, gyroscope and magnetometer axes
1024 byte FIFO buffer reduces power consumption by allowing host processor to read the data in
bursts and then go into a low-power mode as the MPU collects more data
Digital-output temperature sensor
User-programmable digital filters for gyroscope, accelerometer, and temp sensor
10,000 g shock tolerant
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400kHz Fast Mode I2C for communicating with all registers
MEMS structure hermetically sealed and bonded at wafer level
RoHS and Green compliant
5.5
MotionProcessing
Internal Digital Motion Processing™ (DMP™) engine supports 3D MotionProcessing and gesture
recognition algorithms
The MPU-9150 collects gyroscope, accelerometer and magnetometer data while synchronizing data
sampling at a user defined rate. The total dataset obtained by the MPU-9150 includes 3-Axis
gyroscope data, 3-Axis accelerometer data, 3-Axis magnetometer data, and temperature data.
The FIFO buffers the complete data set, reducing timing requirements on the system processor by
allowing the processor burst read the FIFO data. After burst reading the FIFO data, the system
processor can save power by entering a low-power sleep mode while the MPU collects more data.
Programmable interrupt supports features such as gesture recognition, panning, zooming, scrolling,
tap detection, and shake detection
Digitally-programmable low-pass filters.
Low-power pedometer functionality allows the host processor to sleep while the DMP maintains the
step count.
5.6
Clocking
On-chip timing generator ±1% frequency variation over full temperature range
Optional external clock inputs of 32.768kHz or 19.2MHz
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6
Electrical Characteristics
6.1
Gyroscope Specifications
Typical Operating Circuit of Section 7.2, VDD = 2.375V-3.465V, VLOGIC= 1.8V±5% or VDD, TA = 25°C
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNITS
NOTES
GYROSCOPE SENSITIVITY
Full-Scale Range
FS_SEL=0
FS_SEL=1
FS_SEL=2
FS_SEL=3
±250
±500
±1000
±2000
16
º/s
º/s
º/s
º/s
Gyroscope ADC Word Length
Sensitivity Scale Factor
bits
FS_SEL=0
FS_SEL=1
FS_SEL=2
FS_SEL=3
25°C
131
LSB/(º/s)
LSB/(º/s)
LSB/(º/s)
LSB/(º/s)
%
65.5
32.8
16.4
Sensitivity Scale Factor Tolerance
-3
+3
Sensitivity Scale Factor Variation Over
Temperature
-40°C to +85°C
±0.04
%/°C
Nonlinearity
Best fit straight line; 25°C
0.2
±2
%
%
Cross-Axis Sensitivity
GYROSCOPE ZERO-RATE OUTPUT (ZRO)
Initial ZRO Tolerance
Component level (25°C)
-40°C to +85°C
FS_SEL=0
±20
±20
º/s
º/s
ZRO Variation Over Temperature
GYROSCOPE NOISE PERFORMANCE
Total RMS Noise
DLPFCFG=2 (92Hz)
At 10Hz
0.06
º/s-rms
Rate Noise Spectral Density
0.005
º/s/√Hz
GYROSCOPE MECHANICAL
FREQUENCIES
X-Axis
30
27
24
33
30
27
36
33
30
kHz
kHz
kHz
Y-Axis
Z-Axis
LOW PASS FILTER RESPONSE
Programmable Range
5
4
256
Hz
Hz
ms
OUTPUT DATA RATE
Programmable
DLPFCFG=0
to ±1º/s of Final
8,000
GYROSCOPE START-UP TIME
ZRO Settling
30
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6.2
Accelerometer Specifications
Typical Operating Circuit of Section 7.2, VDD = 2.375V-3.465V, VLOGIC= 1.8V±5% or VDD, TA = 25°C
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNITS
NOTES
ACCELEROMETER SENSITIVITY
Full-Scale Range
AFS_SEL=0
±2
±4
g
AFS_SEL=1
g
AFS_SEL=2
±8
g
AFS_SEL=3
±16
g
ADC Word Length
Output in two’s complement format
AFS_SEL=0
16
bits
LSB/g
LSB/g
LSB/g
LSB/g
%
Sensitivity Scale Factor
16,384
8,192
4,096
2,048
±3
AFS_SEL=1
AFS_SEL=2
AFS_SEL=3
Initial Calibration Tolerance
Sensitivity Change vs. Temperature
Nonlinearity
AFS_SEL=0, -40°C to +85°C
Best Fit Straight Line
±0.02
0.5
%/°C
%
ZERO-G OUTPUT
Initial Calibration Tolerance
X and Y axes
Z axis
±80
mg
mg
±150
Change over specified temperature –
Component level -25°C to 85°C
X & Y Axis
Z Axis
±0.75
±1.50
mg/°C
mg/°C
NOISE PERFORMANCE
g/√Hz
Power Spectral Density
X, Y & Z Axes, @10Hz,
AFS_SEL=0 & ODR=1kHz
AFS = 0 @100Hz
400
4
mg-rms
Total RMS Noise
LOW PASS FILTER RESPONSE
Programmable Range
Programmable Range
5
4
260
Hz
OUTPUT DATA RATE
1,000
Hz
INTELLIGENCE FUNCTION
INCREMENT
32
mg/LSB
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6.3
Magnetometer Specifications
Typical Operating Circuit of Section 7.2, VDD = 2.375V-3.465V, VLOGIC= 1.8V±5% or VDD, TA = 25°C
The information in the following table is from the AKM AK8975 datasheet.
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNITS
NOTES
MAGNETOMETER SENSITIVITY
Full-Scale Range
±1200
13
µT
ADC Word Length
Output in two’s complement format
bits
Sensitivity Scale Factor
ZERO-FIELD OUTPUT
Initial Calibration Tolerance
0.285
-1000
0.3
0.315
1000
µT /LSB
LSB
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6.4
Electrical and Other Common Specifications
Typical Operating Circuit of Section 7.2, VDD = 2.375V-3.465V, VLOGIC= 1.8V±5% or VDD, TA = 25°C
PARAMETER
CONDITIONS
MIN
TYP
MAX
Units
Notes
TEMPERATURE SENSOR
Range
-40 to
+85
°C
Sensitivity
Untrimmed
340
-521
±1
LSB/ºC
LSB
Temperature Offset
Linearity
35oC
Best fit straight line (-40°C to +85°C)
°C
VDD POWER SUPPLY
Operating Voltages
Power Supply Ramp Rate
OPERATING CURRENT
2.375
3.465
100
V
Monotonic ramp. Ramp rate is 10% to 90% of the final value
ms
Normal Operating Current
Gyro + Accel
(Magnetometer and DMP disabled)
Gyro at all rates
3.9
mA
µA
Accel + Magnetometer
(Gyro and DMP disabled)
Accel at 1kHz
sample rate
900
Magnetometer at
8Hz repetition rate
Magnetometer only
(DMP, Gyro, and Accel disabled)
350
µA
Accelerometer Low Power
Mode Current
1.25 Hz update rate
5 Hz update rate
20 Hz update rate
40 Hz update rate
10
20
70
µA
µA
µA
µA
140
100% Duty Cycle
Magnetometer Full Power
Mode Current
6
6
mA
µA
Full-Chip Idle Mode Supply
Current
VLOGIC REFERENCE
VOLTAGE
Voltage Range
1.71
-40
VDD
3
V
VLOGIC must be ≤VDD at all times
Power Supply Ramp Rate
Monotonic ramp. Ramp rate is 10% to 90% of the final value
ms
Normal Operating Current
100
µA
TEMPERATURE RANGE
Specified Temperature
Range
Performance parameters are not applicable beyond Specified
Temperature Range
+85
°C
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6.5
Electrical Specifications, Continued
Typical Operating Circuit of Section 7.2, VDD = 2.375V-3.465V, VLOGIC= 1.8V±5% or VDD, TA = 25°C
PARAMETER
CONDITIONS
MIN
TYP
MAX
Units
Notes
SERIAL INTERFACE
I2C Operating Frequency
All registers, Fast-mode
400
100
kHz
kHz
All registers, Standard-mode
I2C ADDRESS
AD0 = 0
AD0 = 1
1101000
1101001
DIGITAL INPUTS (SDA, AD0,
SCL, FSYNC, CLKIN)
VIH, High Level Input Voltage
VIL, Low Level Input Voltage
0.7*VLOGIC
0.9*VLOGIC
V
V
0.3*VLOGIC
CI, Input Capacitance
< 5
pF
DIGITAL OUTPUT (INT)
VOH, High Level Output Voltage
RLOAD=1MΩ
RLOAD=1MΩ
V
V
V
VOL1, LOW-Level Output Voltage
0.1*VLOGIC
0.1
VOL.INT1, INT Low-Level Output
Voltage
OPEN=1, 0.3mA sink
Current
Output Leakage Current
tINT, INT Pulse Width
OPEN=1
100
50
nA
µs
LATCH_INT_EN=0
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6.6
Electrical Specifications, Continued
Typical Operating Circuit of Section 7.2, VDD = 2.375V-3.465V, VLOGIC= 1.8V±5% or VDD, TA = 25°C
Parameters
Conditions
Typical
Units
Notes
Primary I2C I/O (SCL, SDA)
VIL, LOW Level Input Voltage
VIH, HIGH-Level Input Voltage
Vhys, Hysteresis
-0.5V to 0.3*VLOGIC
V
V
0.7*VLOGIC to VLOGIC + 0.5V
0.1*VLOGIC
V
VOL1, LOW-Level Output Voltage
IOL, LOW-Level Output Current
3mA sink current
VOL = 0.4V
0 to 0.4
V
3
mA
mA
nA
ns
pF
VOL = 0.6V
5
100
Output Leakage Current
tof, Output Fall Time from VIHmax to VILmax
CI, Capacitance for Each I/O pin
Auxiliary I2C I/O (ES_CL, ES_DA)
VIL, LOW-Level Input Voltage
VIH, HIGH-Level Input Voltage
Vhys, Hysteresis
Cb bus capacitance in pF
20+0.1Cb to 250
< 10
-0.5 to 0.3*VDD
0.7*VDD to VDD+0.5V
0.1*VDD
V
V
V
V
VOL1, LOW-Level Output Voltage
IOL, LOW-Level Output Current
1mA sink current
0 to 0.4
VOL = 0.4V
VOL = 0.6V
1
1
mA
mA
Output Leakage Current
100
20+0.1Cb to 250
< 10
nA
ns
pF
tof, Output Fall Time from VIHmax to VILmax
CI, Capacitance for Each I/O pin
Cb bus cap. in pF
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6.7
Electrical Specifications, Continued
Typical Operating Circuit of Section 7.2, VDD = 2.375V-3.465V, VLOGIC= 1.8V±5% or VDD, TA = 25°C
Parameters
Conditions
Min
Typical
Max
Units Notes
INTERNAL CLOCK SOURCE
CLK_SEL=0,1,2,3
Gyroscope Sample Rate, Fast
DLPFCFG=0
SAMPLERATEDIV = 0
8
1
1
kHz
kHz
kHz
Gyroscope Sample Rate, Slow
Accelerometer Sample Rate
Clock Frequency Initial Tolerance
Frequency Variation over Temperature
PLL Settling Time
DLPFCFG=1,2,3,4,5, or 6
SAMPLERATEDIV = 0
CLK_SEL=0, 25°C
CLK_SEL=1,2,3; 25°C
CLK_SEL=0
-5
-1
+5
+1
%
%
-15 to +10
%
CLK_SEL=1,2,3
CLK_SEL=1,2,3
±1
1
%
ms
EXTERNAL 32.768kHz CLOCK
External Clock Frequency
CLK_SEL=4
32.768
1 to 2
8.192
kHz
µs
External Clock Allowable Jitter
Gyroscope Sample Rate, Fast
Cycle-to-cycle rms
DLPFCFG=0
kHz
SAMPLERATEDIV = 0
Gyroscope Sample Rate, Slow
Accelerometer Sample Rate
PLL Settling Time
DLPFCFG=1,2,3,4,5, or 6
SAMPLERATEDIV = 0
1.024
1.024
1
kHz
kHz
ms
EXTERNAL 19.2MHz CLOCK
External Clock Frequency
CLK_SEL=5
19.2
MHz
Hz
Gyroscope Sample Rate
Full programmable range
3.9
8000
Gyroscope Sample Rate, Fast Mode
DLPFCFG=0
SAMPLERATEDIV = 0
8
1
1
1
kHz
Gyroscope Sample Rate, Slow Mode
Accelerometer Sample Rate
PLL Settling Time
DLPFCFG=1,2,3,4,5, or 6
SAMPLERATEDIV = 0
kHz
kHz
ms
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6.8
Typical Operating Circuit of Section 7.2, VDD = 2.375V-3.465V, VLOGIC= 1.8V±5% or VDD, TA = 25°C
I2C Timing Characterization
Parameters
I2C TIMING
Conditions
I2C FAST-MODE
Min
Typical
Max
Units
Notes
fSCL, SCL Clock Frequency
400
kHz
µs
tHD.STA, (Repeated) START Condition Hold
Time
0.6
tLOW, SCL Low Period
tHIGH, SCL High Period
1.3
0.6
0.6
µs
µs
µs
tSU.STA, Repeated START Condition Setup
Time
tHD.DAT, SDA Data Hold Time
tSU.DAT, SDA Data Setup Time
tr, SDA and SCL Rise Time
tf, SDA and SCL Fall Time
0
µs
ns
ns
ns
µs
100
Cb bus cap. from 10 to 400pF
Cb bus cap. from 10 to 400pF
20+0.1Cb
20+0.1Cb
0.6
300
300
tSU.STO, STOP Condition Setup Time
tBUF, Bus Free Time Between STOP and
START Condition
1.3
µs
Cb, Capacitive Load for each Bus Line
tVD.DAT, Data Valid Time
< 400
pF
µs
µs
0.9
0.9
tVD.ACK, Data Valid Acknowledge Time
I2C Bus Timing Diagram
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6.9
Absolute Maximum Ratings
Stress above those listed as “Absolute Maximum Ratings” may cause permanent damage to the device.
These are stress ratings only and functional operation of the device at these conditions is not implied.
Exposure to the absolute maximum ratings conditions for extended periods may affect device reliability.
Parameter
Rating
Supply Voltage, VDD
VLOGIC Input Voltage Level
REGOUT
-0.5V to +6V
-0.5V to VDD + 0.5V
-0.5V to 2V
Input Voltage Level (CLKIN, AUX_DA, AD0, FSYNC,
INT, SCL, SDA)
-0.5V to VDD + 0.5V
CPOUT (2.5V ≤ VDD ≤ 3.6V )
-0.5V to 30V
10,000g for 0.2ms
-40°C to +85°C
-40°C to +125°C
Acceleration (Any Axis, unpowered)
Operating Temperature Range
Storage Temperature Range
Electrostatic Discharge (ESD) Protection
2kV (HBM);
250V (MM)
Latch-up
JEDEC Class II (2),125°C
±100mA
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7
Applications Information
7.1
Pin Out and Signal Description
Pin Number
Pin Name
CLKIN
ES_DA
ES_CL
VLOGIC
AD0
Pin Description
1
Optional external reference clock input. Connect to GND if unused.
Auxiliary I2C master serial data
Auxiliary I2C Master serial clock
6
7
8
9
Digital I/O supply voltage
I2C Slave Address LSB (AD0)
10
REGOUT
FSYNC
INT
Regulator filter capacitor connection
Frame synchronization digital input. Connect to GND if unused.
Interrupt digital output (totem pole or open-drain)
Power supply voltage and Digital I/O supply voltage
Power supply ground
11
12
3, 13
15, 17,18
20
VDD
GND
CPOUT
RESV
SCL
Charge pump capacitor connection
Reserved. Do not connect
I2C serial clock (SCL)
I2C serial data (SDA)
22
23
24
SDA
2, 4, 5, 14,
16, 19, 21
RESV
Reserved. Do not connect.
Top View
24 23 22 21 20 19
+Z
CLKIN
RESV
VDD
1
2
3
4
5
6
18 GND
17 GND
16 RESV
15 GND
14 RESV
13 VDD
+X
+Y
+Z
M
P
M
+Y
U
P
-
9
U
1
MPU-9150
-
9
5
0
1
5
0
RESV
RESV
ES_DA
+Y
+X
+X
+Z
7
8
9
10 11 12
Orientation of Axes of Sensitivity and
Polarity of Rotation for Accel & Gyro
Orientation of Axes of Sensitivity for
Magnetometer
LGA Package
24-pin, 4mm x 4mm x 1mm
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7.2
Typical Operating Circuit
GND
C3
2.2nF
24 23 22 21 20 19
1
2
3
4
5
6
18
17
16
15
14
13
CLKIN
GND
VDD
MPU-9150
VDD
ES_DA
ES_CL
7
8
9
10 11 12
C2
0.1µF
GND
C1
VLOGIC
0.1µF
C4
10nF
GND
GND
Typical Operating Circuit
7.3
Bill of Materials for External Components
Component
Label
C1
Specification
Quantity
Regulator Filter Capacitor (Pin 10)
VDD Bypass Capacitor (Pin 13)
Charge Pump Capacitor (Pin 20)
VLOGIC Bypass Capacitor (Pin 8)
Ceramic, X7R, 0.1µF ±10%, 2V
Ceramic, X7R, 0.1µF ±10%, 4V
Ceramic, X7R, 2.2nF ±10%, 50V
Ceramic, X7R, 10nF ±10%, 4V
1
1
1
1
C2
C3
C4*
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7.4
Recommended Power-on Procedure
Power-Up Sequencing
1. VLOGIC amplitude must always be ≤VDD
amplitude
TVDDR
2. TVDDR is VDD rise time: Time for VDD to rise
from 10% to 90% of its final value
90%
3. TVDDR is ≤100msec
10%
VDD
4. TVLGR is VLOGIC rise time: Time for
VLOGIC to rise from 10% to 90% of its final
value
TVLGR
90%
5. TVLGR is ≤3msec
10%
6. TVLG-VDD is the delay from the start of VDD
ramp to the start of VLOGIC rise
VLOGIC
7. TVLG-VDD is ≥0ms;
TVLG - VDD
8. VDD and VLOGIC must be monotonic
ramps
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7.5
Block Diagram
1
CLKIN
CLKOUT
CLOCK
Clock
MPU-9150
22
Self
test
12
X Accel
Y Accel
Z Accel
ADC
INT
Interrupt
Status
Register
Self
test
ADC
9
AD0
Slave I2C
23
24
FIFO
SCL
SDA
Self
test
ADC
Config
Registers
7
6
Serial
Interface
Bypass
Mux
Master I2C
Serial
Interface
ES_CL
ES_DA
Self
test
X Gyro
Y Gyro
Z Gyro
ADC
Sensor
Registers
11
Self
test
FSYNC
ADC
Factory
Calibration
Digital Motion
Processor
(DMP)
Self
test
ADC
ADC
Temp Sensor
Signal Conditioning
Charge
Pump
20
CPOUT
ADC
ADC
ADC
X
Y
Z
Bias & LDO
18
GND
Compass
Compass
Compass
13
VDD
10
REGOUT VLOGIC
8
7.6
Overview
The MPU-9150 is comprised of the following key blocks and functions:
Three-axis MEMS rate gyroscope sensor with 16-bit ADCs and signal conditioning
Three-axis MEMS accelerometer sensor with 16-bit ADCs and signal conditioning
Three-axis MEMS magnetometer sensor with 13-bit ADCs and signal conditioning
Digital Motion Processor (DMP) engine
Primary I2C serial communications interface
Auxiliary I2C serial interface for 3rd party sensors
Clocking
Sensor Data Registers
FIFO
Interrupts
Digital-Output Temperature Sensor
Gyroscope, Accelerometer and Magnetometer Self-test
Bias and LDO
Charge Pump
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7.7
Three-Axis MEMS Gyroscope with 16-bit ADCs and Signal Conditioning
The MPU-9150 includes a 3-Axis vibratory MEMS rate gyroscope, which detect rotations about the X-, Y-,
and Z- Axes. When the gyro is are rotated about any of the sense axes, the Coriolis Effect causes a
vibration that is detected by a capacitive pickoff. The resulting signal is amplified, demodulated, and filtered
to produce a voltage that is proportional to the angular rate. This voltage is digitized using individual on-chip
16-bit Analog-to-Digital Converters (ADCs) to sample each axis. The full-scale range of the gyro sensor may
be digitally programmed to ±250, ±500, ±1000, or ±2000 degrees per second (dps). The ADC sample rate is
programmable from 8,000 samples per second, down to 3.9 samples per second, and user-selectable low-
pass filters enable a wide range of cut-off frequencies.
7.8
Three-Axis MEMS Accelerometer with 16-bit ADCs and Signal Conditioning
The MPU-9150’s 3-axis accelerometer uses separate proof masses for each axis. Acceleration along a
particular axis induces displacement on the corresponding proof mass, and capacitive sensors detect the
displacement differentially. The MPU-9150’s architecture reduces the accelerometer’s susceptibility to
fabrication variations as well as to thermal drift. When the device is placed on a flat surface, it will measure
0g on the X- and Y-axes and +1g on the Z-axis. The accelerometer’s scale factor is calibrated at the factory
and is nominally independent of supply voltage. Each sensor has a dedicated sigma-delta ADC for providing
digital outputs. The full scale range of the digital output can be adjusted to ±2g, ±4g, ±8g, or ±16g.
7.9
Three-Axis MEMS Magnetometer with 13-bit ADCs and Signal Conditioning
The 3-axis magnetometer uses highly sensitive Hall sensor technology. The compass portion of the IC
incorporates magnetic sensors for detecting terrestrial magnetism in the X-, Y-, and Z- Axes, a sensor driving
circuit, a signal amplifier chain, and an arithmetic circuit for processing the signal from each sensor. Each
ADC has a 13-bit resolution and a full scale range of ±1200 µT.
7.10 Digital Motion Processor
The embedded Digital Motion Processor (DMP) is located within the MPU-9150 and offloads computation of
motion processing algorithms from the host processor. The DMP acquires data from accelerometers,
gyroscopes, magnetometers and additional 3rd party sensors such as pressure sensors, and processes the
data. The resulting data can be read from the DMP’s registers, or can be buffered in a FIFO. The DMP has
access to one of the MPU’s external pins, which can be used for generating interrupts.
The purpose of the DMP is to offload both timing requirements and processing power from the host
processor. Typically, motion processing algorithms should be run at a high rate, often around 200Hz, in order
to provide accurate results with low latency. This is required even if the application updates at a much lower
rate; for example, a low power user interface may update as slowly as 5Hz, but the motion processing should
still run at 200Hz. The DMP can be used as a tool in order to minimize power, simplify timing, simplify the
software architecture, and save valuable MIPS on the host processor for use in the application.
7.11 Primary I2C
The MPU-9150 communicates to a system processor using an I2C serial interface. The MPU-9150 always
acts as a slave when communicating to the system processor. The logic level for communications to the
master is set by the voltage on the VLOGIC pin. The LSB of the of the I2C slave address is set by pin 9
(AD0).
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7.12 Auxiliary I2C Serial Interface
The MPU-9150 has an auxiliary I2C bus for communicating to off-chip sensors. This bus has two operating
modes:
I2C Master Mode: The MPU-9150 acts as a master to any external sensors connected to the
auxiliary I2C bus
Pass-Through Mode: The MPU-9150 directly connects the primary and auxiliary I2C buses together,
allowing the system processor to directly communicate with any external sensors.
Auxiliary I2C Bus Modes of Operation:
I2C Master Mode: Allows the MPU-9150 to directly access the data registers of external digital
sensors, such as a pressure sensor. In this mode, the MPU-9150 directly obtains data from auxiliary
sensors, allowing the on-chip DMP to generate sensor fusion data without intervention from the
system applications processor.
For example, In I2C Master mode, the MPU-9150 can be configured to perform burst reads, returning
the following data from a triple-Axis external sensor:
.
.
.
X-Axis data (2 bytes)
Y-Axis data (2 bytes)
Z-Axis data (2 bytes)
The I2C Master can be configured to read up to 24 bytes from up to 3 auxiliary sensors. A fourth
sensor can be configured to work single byte read/write mode.
Pass-Through Mode: Allows an external system processor to act as master and directly
communicate to the external sensors connected to the auxiliary I2C bus pins (ES_DA and ESCL). In
this mode, the auxiliary I2C bus control logic (3rd-party sensor interface block) of the MPU-9150 is
disabled, and the auxiliary I2C pins ES_DA and ES_CL (Pins 6 and 7) are connected to the main I2C
bus (Pins 23 and 24) through analog switches.
Pass-Through Mode is useful for configuring the external sensor, or for keeping the MPU-9150 in a
low-power mode when only the external sensors are used. In Pass-Through Mode the system
processor can still access MPU-9150 data through the I2C interface.
Auxiliary I2C Bus IO Logic Level
The logic level of the auxiliary I2C bus is VDD.
For further information regarding the MPU-9150’s logic level, please refer to Section 10.2.
7.13 Self-Test
Please refer to the MPU-9150 self-test applications note and MPU-9150 register map for more details on
self-test.
Self-test allows for the testing of the mechanical and electrical portions of the sensors. The self-test for each
measurement axis can be activated by controlling the bits of the Gyro and Accel control registers.
When self-test is activated, the electronics cause the sensors to be actuated and produce an output signal.
The output signal is used to observe the self-test response.
The self-test response is defined as follows:
Self-test response = Sensor output with self-test enabled – Sensor output without self-test enabled
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The self-test response for each accelerometer axis is defined in the accelerometer specification table
(Section 6.2), while that for each gyroscope axis is defined in the gyroscope specification table (Section 6.1).
When the value of the self-test response is within the min/max limits of the product specification, the part has
passed self-test. When the self-test response exceeds the min/max values, the part is deemed to have
failed self-test. Code for operating self-test code is included within the MotionApps software provided by
InvenSense.
7.14 MPU-9150 Solution for 10-Axis Sensor Fusion Using I2C Interface
In the figure below, the system processor is an I2C master to the MPU-9150. In addition, the MPU-9150 is an
I2C master to the optional external pressure sensor. The MPU-9150 has limited capabilities as an I2C Master,
and depends on the system processor to manage the initial configuration of any auxiliary sensors. The MPU-
9150 has an interface bypass multiplexer, which connects the system processor I2C bus pins 23 and 24
(SDA and SCL) directly to the auxiliary sensor I2C bus pins 6 and 7 (ES_DA and ES_CL).
Once the auxiliary sensors have been configured by the system processor, the interface bypass multiplexer
should be disabled so that the MPU-9150 auxiliary I2C master can take control of the sensor I2C bus and
gather data from the auxiliary sensors.
For further information regarding I2C master control, please refer to Section 10.
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I2C Processor Bus: for reading all
sensor data from MPU and for
configuring external sensors (i.e.
compass in this example)
Interrupt
12
INT
Status
Register
8
9
/CS
VDD
VDD or GND
MPU-9150
AD0/SDO
Slave I2C
or SPI
Serial
Interface
23
SCL/SCLK
SDA/SDI
SCL
SDA
System
Processor
24
FIFO
Sensor I2C Bus: for
configuring and reading
from external sensors
Config
Register
Optional
Sensor
Master I2C
Serial
7
6
ES_CL
ES_DA
SCL
SDA
Sensor
Register
Interface
Bypass
Mux
Pressure
Sensor
Interface
Factory
Calibration
Digital
Motion
Processor
(DMP)
Interface bypass mux allows
direct configuration of
compass by system processor
Bias & LDO
18
13
VDD
10
REGOUT
GND
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7.15 Procedure for Directly Accessing the AK8975 3-Axis Compass
The AK8975 3-Axis Compass is connected to the MPU-9150 through the MPU’s Auxiliary I2C Bus. In order to
access this compass directly, the MPU-9150 should be put into Pass-Through Mode.
For further information regarding MPU-9150 Pass-Through Mode, please refer to Section 7.12.
The slave address for AK8975 is 0x0C or 12 decimal.
The MPU-9150 pin configuration for Direct Access to the AK8975 is described in the table below.
Pin Configuration for Direct Access to AK8975 3-Axis Compass
Pin Number
Pin Name
CLKIN
Pin Description
1
6
Inactive. Connect to GND.
Active. Leave as NC.
ES_DA
(provision for option external pull-up resistor to VDD)
7
ES_CL
Active. Leave as NC.
(provision for option external pull-up resistor to VDD)
8
9
VLOGIC
AD0
Active. Digital I/O supply voltage.
Active. Connect to GND.
10
REGOUT
FSYNC
INT
Active. Connect a 100nF bypass capacitor on the board.
Inactive. Connect to GND.
11
12
Inactive. Leave as NC.
3, 13
15, 17,18
20
VDD
Power supply voltage and Digital I/O supply voltage
Power supply ground.
GND
CPOUT
RESV
SCL
Active. Connect a 10nF bypass capacitor on the board.
Reserved. Do not connect.
Active. I2C serial clock (SCL)
Active. I2C serial data (SDA)
22
23
24
SDA
2, 4, 5, 14,
16, 19, 21
RESV
Reserved. Do not connect.
For detailed information regarding the Register Map of the AK8975, please refer to the MPU-9150 Register
Map and Register Descriptions document.
7.16 Internal Clock Generation
The MPU-9150 has a flexible clocking scheme, allowing a variety of internal or external clock sources to be
used for the internal synchronous circuitry. This synchronous circuitry includes the signal conditioning and
ADCs, the DMP, and various control circuits and registers. An on-chip PLL provides flexibility in the
allowable inputs for generating this clock.
Allowable internal sources for generating the internal clock are:
An internal relaxation oscillator
Any of the X, Y, or Z gyros (MEMS oscillators with a variation of ±1% over temperature)
Allowable external clocking sources are:
32.768kHz square wave
19.2MHz square wave
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Selection of the source for generating the internal synchronous clock depends on the availability of external
sources and the requirements for power consumption and clock accuracy. These requirements will most
likely vary by mode of operation. For example, in one mode, where the biggest concern is power
consumption, the user may wish to operate the Digital Motion Processor of the MPU-9150 to process
accelerometer data, while keeping the gyros and magnetometer off. In this case, the internal relaxation
oscillator is a good clock choice. However, in another mode, where the gyros are active, selecting the gyros
as the clock source provides for a more accurate clock source.
Clock accuracy is important, since timing errors directly affect the distance and angle calculations performed
by the Digital Motion Processor (and by extension, by any processor).
There are also start-up conditions to consider. When the MPU-9150 first starts up, the device uses its
internal clock until programmed to operate from another source. This allows the user, for example, to wait
for the MEMS oscillators to stabilize before they are selected as the clock source.
7.17 Sensor Data Registers
The sensor data registers contain the latest gyro, accelerometer, magnetometer, and temperature
measurement data. They are read-only registers, and are accessed via the serial interface. Data from these
registers may be read anytime. However, the interrupt function may be used to determine when new data is
available.
For a table of interrupt sources please refer to Section 8.
7.18 FIFO
The MPU-9150 contains a 1024-byte FIFO register that is accessible via the Serial Interface. The FIFO
configuration register determines which data is written into the FIFO. Possible choices include gyro data,
accelerometer data, temperature readings, auxiliary sensor readings, and FSYNC input. A FIFO counter
keeps track of how many bytes of valid data are contained in the FIFO. The FIFO register supports burst
reads. The interrupt function may be used to determine when new data is available.
For further information regarding the FIFO, please refer to the MPU-9150 Register Map and Register
Descriptions document.
7.19 Interrupts
Interrupt functionality is configured via the Interrupt Configuration register. Items that are configurable include
the INT pin configuration, the interrupt latching and clearing method, and triggers for the interrupt. Items that
can trigger an interrupt are (1) new data is available to be read (from the FIFO and Data registers); (2)
accelerometer event interrupts; and (3) the MPU-9150 did not receive an acknowledge from an auxiliary
sensor on the secondary I2C bus. The interrupt status can be read from the Interrupt Status register.
For further information regarding interrupts, please refer to the MPU-9150 Register Map and Register
Descriptions document.
For information regarding the MPU-9150’s accelerometer event interrupts, please refer to Section 8.
7.20 Digital-Output Temperature Sensor
An on-chip temperature sensor and ADC are used to measure the MPU-9150 die temperature. The readings
from the ADC can be read from the FIFO or the Sensor Data registers.
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7.21 Bias and LDO
The bias and LDO section generates the internal supply and the reference voltages and currents required by
the MPU-9150. Its two inputs are an unregulated VDD and a VLOGIC logic reference supply voltage. The
LDO output is bypassed by a capacitor at REGOUT. For further details on the capacitor, please refer to the
Bill of Materials for External Components (Section 7.3).
7.22 Charge Pump
An on-board charge pump generates the high voltage required for the MEMS oscillators. Its output is
bypassed by a capacitor at CPOUT. For further details on the capacitor, please refer to the Bill of Materials
for External Components (Section 7.3).
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8
Programmable Interrupts
The MPU-9150 has a programmable interrupt system which can generate an interrupt signal on the INT pin.
Status flags indicate the source of an interrupt. Interrupt sources may be enabled and disabled individually.
Table of Interrupt Sources
Interrupt Name
Module
FIFO Overflow
FIFO
Data Ready
Sensor Registers
I2C Master
I2C Master
I2C Master errors: Lost Arbitration, NACKs
I2C Slave 4
For information regarding the interrupt enable/disable registers and flag registers, please refer to the MPU-
9150 Register Map and Register Descriptions document.
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9
Digital Interface
I2C Serial Interface
9.1
The internal registers and memory of the MPU-9150 can be accessed using either I2C at 400 kHz.
Serial Interface
Pin Number
Pin Name
VLOGIC
AD0
Pin Description
8
9
Digital I/O supply voltage. VLOGIC must be ≤ VDD at all times.
I2C Slave Address LSB
I2C serial clock
I2C serial data
23
24
SCL
SDA
9.2
I2C Interface
I2C is a two-wire interface comprised of the signals serial data (SDA) and serial clock (SCL). In general, the
lines are open-drain and bi-directional. In a generalized I2C interface implementation, attached devices can
be a master or a slave. The master device puts the slave address on the bus, and the slave device with the
matching address acknowledges the master.
The MPU-9150 always operates as a slave device when communicating to the system processor, which thus
acts as the master. SDA and SCL lines typically need pull-up resistors to VDD. The maximum bus speed is
400 kHz.
The slave address of the MPU-9150 is b110100X which is 7 bits long. The LSB bit of the 7 bit address is
determined by the logic level on pin AD0. This allows two MPU-9150s to be connected to the same I2C bus.
When used in this configuration, the address of the one of the devices should be b1101000 (pin AD0 is logic
low) and the address of the other should be b1101001 (pin AD0 is logic high).
9.3
I2C Communications Protocol
START (S) and STOP (P) Conditions
Communication on the I2C bus starts when the master puts the START condition (S) on the bus, which is
defined as a HIGH-to-LOW transition of the SDA line while SCL line is HIGH (see figure below). The bus is
considered to be busy until the master puts a STOP condition (P) on the bus, which is defined as a LOW to
HIGH transition on the SDA line while SCL is HIGH (see figure below).
Additionally, the bus remains busy if a repeated START (Sr) is generated instead of a STOP condition.
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SDA
SCL
S
P
START condition
STOP condition
START and STOP Conditions
Data Format / Acknowledge
I2C data bytes are defined to be 8-bits long. There is no restriction to the number of bytes transmitted per
data transfer. Each byte transferred must be followed by an acknowledge (ACK) signal. The clock for the
acknowledge signal is generated by the master, while the receiver generates the actual acknowledge signal
by pulling down SDA and holding it low during the HIGH portion of the acknowledge clock pulse.
If a slave is busy and cannot transmit or receive another byte of data until some other task has been
performed, it can hold SCL LOW, thus forcing the master into a wait state. Normal data transfer resumes
when the slave is ready, and releases the clock line (refer to the following figure).
DATA OUTPUT BY
TRANSMITTER (SDA)
not acknowledge
DATA OUTPUT BY
RECEIVER (SDA)
acknowledge
SCL FROM
MASTER
1
2
8
9
clock pulse for
acknowledgement
START
condition
Acknowledge on the I2C Bus
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Communications
After beginning communications with the START condition (S), the master sends a 7-bit slave address
followed by an 8th bit, the read/write bit. The read/write bit indicates whether the master is receiving data from
or is writing to the slave device. Then, the master releases the SDA line and waits for the acknowledge
signal (ACK) from the slave device. Each byte transferred must be followed by an acknowledge bit. To
acknowledge, the slave device pulls the SDA line LOW and keeps it LOW for the high period of the SCL line.
Data transmission is always terminated by the master with a STOP condition (P), thus freeing the
communications line. However, the master can generate a repeated START condition (Sr), and address
another slave without first generating a STOP condition (P). A LOW to HIGH transition on the SDA line while
SCL is HIGH defines the stop condition. All SDA changes should take place when SCL is low, with the
exception of start and stop conditions.
SDA
SCL
1 – 7
8
9
1 – 7
8
9
1 – 7
8
9
S
P
START
STOP
ADDRESS
R/W
ACK
DATA
ACK
DATA
ACK
condition
condition
Complete I2C Data Transfer
To write the internal MPU-9150 registers, the master transmits the start condition (S), followed by the I2C
address and the write bit (0). At the 9th clock cycle (when the clock is high), the MPU-9150 acknowledges the
transfer. Then the master puts the register address (RA) on the bus. After the MPU-9150 acknowledges the
reception of the register address, the master puts the register data onto the bus. This is followed by the ACK
signal, and data transfer may be concluded by the stop condition (P). To write multiple bytes after the last
ACK signal, the master can continue outputting data rather than transmitting a stop signal. In this case, the
MPU-9150 automatically increments the register address and loads the data to the appropriate register. The
following figures show single and two-byte write sequences.
Single-Byte Write Sequence
Master
Slave
S
AD+W
RA
RA
DATA
DATA
P
ACK
ACK
ACK
ACK
ACK
ACK
Burst Write Sequence
Master
Slave
S
AD+W
DATA
P
ACK
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To read the internal MPU-9150 registers, the master sends a start condition, followed by the I2C address and
a write bit, and then the register address that is going to be read. Upon receiving the ACK signal from the
MPU-9150, the master transmits a start signal followed by the slave address and read bit. As a result, the
MPU-9150 sends an ACK signal and the data. The communication ends with a not acknowledge (NACK)
signal and a stop bit from master. The NACK condition is defined such that the SDA line remains high at the
9th clock cycle. The following figures show single and two-byte read sequences.
Single-Byte Read Sequence
Master
Slave
S
AD+W
RA
RA
S
S
AD+R
AD+R
NACK
ACK
P
ACK
ACK
ACK
ACK
ACK DATA
ACK DATA
Burst Read Sequence
Master
Slave
S
AD+W
NACK
P
DATA
9.4
I2C Terms
Signal Description
S
AD
W
Start Condition: SDA goes from high to low while SCL is high
Slave I2C address
Write bit (0)
R
Read bit (1)
ACK
Acknowledge: SDA line is low while the SCL line is high at the
9th clock cycle
NACK Not-Acknowledge: SDA line stays high at the 9th clock cycle
RA
DATA
P
MPU-9150 internal register address
Transmit or received data
Stop condition: SDA going from low to high while SCL is high
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10 Serial Interface Considerations
10.1 MPU-9150 Supported Interfaces
The MPU-9150 supports I2C communications.
10.2 Logic Levels
The MPU-9150’s I/O logic levels are set to be either VDD or VLOGIC, as shown in the table below.
I/O Logic Levels
MICROPROCESSOR LOGIC LEVELS
AUXILIARY LOGIC LEVELS
(Pins: SDA, SCL, AD0, CLKIN, INT)
(Pins: ES_DA, ES_CL)
VLOGIC
VDD
VLOGIC may be set to be equal to VDD or to another voltage. However, VLOGIC must be ≤ VDD at all
times. VLOGIC is the power supply voltage for the microprocessor system bus and VDD is the supply for the
auxiliary I2C bus, as shown in the figure of Section 10.3.
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10.3 Logic Levels Diagram
The figure below depicts a sample circuit with a third party pressure sensor attached to the auxiliary I2C bus.
It shows logic levels and voltage connections. Note: Actual configuration will depend on the auxiliary sensors
used.
VLOGIC
VDD_IO
(0V - VLOGIC)
SYSTEM BUS
System
Processor
IO
VDD
VLOGIC
(0V - VLOGIC)
VDD
INT
(0V - VLOGIC)
(0V - VLOGIC)
VLOGIC
SDA
SCL
(0V - VLOGIC)
(0V - VLOGIC)
CLKIN
VDD
FSYNC
VLOGIC
MPU-9150
VDD
VLOGIC
AD0
INT 1
(0V - VLOGIC)
(0V - VLOGIC)
INT 2
0V - VDD
0V - VDD
ES_DA
ES_CL
SDA
SCL
(0V, VLOGIC)
0V - VDD
ADDR
3rd Party
Pressure sensor
I/O Levels and Connections
Notes:
1. The IO voltage levels of ES_DA and ES_CL are set relative to VDD.
2. Third-party auxiliary device logic levels are referenced to VDD. Setting INT1 and INT2 to open drain
configuration provides voltage compatibility when VDD ≠ VLOGIC. When VDD = VLOGIC, INT1 and
INT2 may be set to push-pull outputs, and external pull-up resistors are not needed.
3. All other MPU-9150 logic IO is always referenced to VLOGIC.
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11 Assembly
This section provides general guidelines for assembling InvenSense Micro Electro-Mechanical Systems
(MEMS) gyros packaged in Lead Grid Array package (LGA) surface mount integrated circuits.
11.1 Orientation of Axes
The diagram below shows the orientation of the axes of sensitivity and the polarity of rotation. Note the pin 1
identifier (•) in the figure.
+Z
+Y
M
P
U
-
9
1
5
0
+X
Orientation of Axes of Sensitivity
and Polarity of Rotation for
Gyroscopes and Accelerometers
+X
M
P
U
-
9
1
5
0
+Y
+Z
Orientation of Axes of Sensitivity
for Compass
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11.2 Package Dimensions
SYMBOLS
DIMENSIONS IN MILLIMETERS
MIN.
NOM.
MAX.
0.90
0.106
3.90
3.90
---
---
---
0.22
0.22
0.32
---
1.00
0.136
4.00
4.00
2.50
3.41
0.50
0.25
0.25
0.35
0.12
0.35
1.10
0.166
4.10
4.10
---
---
---
0.28
0.28
0.38
---
A
c
D
E
D1/E1
D2/E2
e
b
f
L
s
0.32
0.38
x
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11.3 PCB Design Guidelines:
The Pad Diagram using a JEDEC type extension with solder rising on the outer edge is shown below. The
Pad Dimensions Table shows pad sizing (mean dimensions) recommended for the MPU-9150 product.
JEDEC type extension with solder rising on outer edge
PCB Lay-out Diagram
SYMBOLS
DIMENSIONS IN MILLIMETERS
NOM
Nominal Package I/O Pad Dimensions
e
b
L1
L3
D
Pad Pitch
Pad Width
Pad Length
Pad Length
0.50
0.25
0.35
0.40
4.00
4.00
Package Width
E
Package Length
I/O Land Design Dimensions (Guidelines )
I/O Pad Extent Width
I/O Pad Extent Length
Land Width
Outward Extension
Inward Extension
Land Length
D2
E2
c
Tout
Tin
L2
4.80
4.80
0.35
0.40
0.05
0.80
0.85
L4
Land Length
PCB Dimensions Table (for PCB Lay-out Diagram)
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11.4 Assembly Precautions
11.4.1 Surface Mount Guidelines
InvenSense MEMS motion sensors are sensitive to mechanical stress coming from the printed circuit board
(PCB). This PCB stress can be minimized by adhering to certain design rules.
When using MEMS components in plastic packages, PCB mounting and assembly can cause package
stress. This package stress in turn can affect the output offset and its value over a wide range of
temperatures. This stress is caused by the mismatch between the Coefficient of Linear Thermal Expansion
(CTE) of the package material and the PCB. Care must be taken to avoid package stress due to mounting.
Traces connected to pads should be as symmetric as possible. Maximizing symmetry and balance for pad
connection will help component self alignment and will lead to better control of solder paste reduction after
reflow.
Any material used in the surface mount assembly process of the MEMS product should be free of restricted
RoHS elements or compounds. Pb-free solders should be used for assembly.
11.4.2 Exposed Die Pad Precautions
The MPU-9150 has very low active and standby current consumption. The exposed center die pad is not
required for heat sinking, and should not be soldered to the PCB. Under-fill should also not be used. Failure
to adhere to this rule can induce performance changes due to package thermo-mechanical stress. There is
no electrical connection between the pad and the CMOS.
11.4.3 Trace Routing
Routing traces or vias under the gyro package such that they run under the exposed die pad is prohibited.
Routed active signals may harmonically couple with the gyro MEMS devices, compromising gyro response.
These devices are designed with the drive frequencies as follows: X = 33±3kHz, Y = 30±3kHz, and
Z=27±3kHz. To avoid harmonic coupling don’t route active signals in non-shielded signal planes directly
below, or above the gyro package. Note: For best performance, design a ground plane under the e-pad to
reduce PCB signal noise from the board on which the gyro device is mounted. If the gyro device is stacked
under an adjacent PCB board, design a ground plane directly above the gyro device to shield active signals
from the adjacent PCB board.
11.4.4 Component Placement
Do not place large insertion components such as keyboard or similar buttons, connectors, or shielding boxes
at a distance of less than 6 mm from the MEMS gyro. Maintain generally accepted industry design practices
for component placement near the MPU-9150 to prevent noise coupling and thermo-mechanical stress.
11.4.5 PCB Mounting and Cross-Axis Sensitivity
Orientation errors of the gyroscope and accelerometer mounted to the printed circuit board can cause cross-
axis sensitivity in which one gyro or accel responds to rotation or acceleration about another axis,
respectively. For example, the X-axis gyroscope may respond to rotation about the Y or Z axes. The
orientation mounting errors are illustrated in the figure below.
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Z
Φ
Y
M
P
U
-
9
1
5
0
X
Θ
Package Gyro & Accel Axes (
) Relative to PCB Axes (
) with Orientation Errors (Θ and Φ)
The table below shows the cross-axis sensitivity as a percentage of the specified gyroscope or
accelerometer’s sensitivity for a given orientation error, respectively.
Cross-Axis Sensitivity vs. Orientation Error
Orientation Error
Cross-Axis Sensitivity
(θ or Φ)
0º
(sinθ or sinΦ)
0%
0.5º
1º
0.87%
1.75%
The specifications for cross-axis sensitivity in Section 6.1 and Section 6.2 include the effect of the die
orientation error with respect to the package.
11.4.6 MEMS Handling Instructions
MEMS (Micro Electro-Mechanical Systems) are a time-proven, robust technology used in hundreds of
millions of consumer, automotive and industrial products. MEMS devices consist of microscopic moving
mechanical structures. They differ from conventional IC products, even though they can be found in similar
packages. Therefore, MEMS devices require different handling precautions than conventional ICs prior to
mounting onto printed circuit boards (PCBs).
The MPU-9150 has been qualified to a shock tolerance of 10,000g. InvenSense packages its gyroscopes as
it deems proper for protection against normal handling and shipping. It recommends the following handling
precautions to prevent potential damage.
Do not drop individually packaged gyroscopes, or trays of gyroscopes onto hard surfaces. Components
placed in trays could be subject to g-forces in excess of 10,000g if dropped.
Printed circuit boards that incorporate mounted gyroscopes should not be separated by manually
snapping apart. This could also create g-forces in excess of 10,000g.
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Do not clean MEMS gyroscopes in ultrasonic baths. Ultrasonic baths can induce MEMS damage if the
bath energy causes excessive drive motion through resonant frequency coupling.
11.4.7 ESD Considerations
Establish and use ESD-safe handling precautions when unpacking and handling ESD-sensitive devices.
Store ESD sensitive devices in ESD safe containers until ready for use. The Tape-and-Reel moisture-
sealed bag is an ESD approved barrier. The best practice is to keep the units in the original moisture
sealed bags until ready for assembly.
Restrict all device handling to ESD protected work areas that measure less than 200V static charge.
Ensure that all workstations and personnel are properly grounded to prevent ESD.
11.5 Reflow Specification
Qualification Reflow: The MPU-9150 was qualified in accordance with IPC/JEDEC J-STD-020D.1. This
standard classifies proper packaging, storage and handling in order to avoid subsequent thermal and
mechanical damage during the solder reflow attachment phase of PCB assembly.
The qualification preconditioning process specifies a sequence consisting of a bake cycle, a moisture soak
cycle (in a temperature humidity oven), and three consecutive solder reflow cycles, followed by functional
device testing.
The peak solder reflow classification temperature requirement for package qualification is (260 +5/-0°C) for
lead-free soldering of components measuring less than 1.6 mm in thickness. The qualification profile and a
table explaining the set-points are shown below:
SOLDER REFLOW PROFILE FOR QUALIFICATION
LEAD-FREE IR/CONVECTION
F
TPmax
TPmin
E
G
10-30sec
H
D
TLiquidus
Tsmax
C
Liquidus
60-120sec
Tramp-up
( < 3 C/sec)
B
I
Tramp-down
( < 4 C/sec)
Tsmin
Preheat
60-120sec
Troom-Pmax
(< 480sec)
A
Time [Seconds]
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Temperature Set Points Corresponding to Reflow Profile Above
CONSTRAINTS
Step Setting
Temp (°C)
Time (sec)
Max. Rate (°C/sec)
A
B
C
D
Troom
TSmin
TSmax
TLiquidus
25
150
200
217
60 < tBC < 120
r(TLiquidus-TPmax) < 3
r(TLiquidus-TPmax) < 3
r(TLiquidus-TPmax) < 3
r(TPmax-TLiquidus) < 4
E
TPmin
255
[255°C, 260°C]
F
G
TPmax
TPmin
260
255
tAF < 480
10< tEG < 30
[ 260°C, 265°C]
[255°C, 260°C]
H
I
TLiquidus
Troom
217
25
60 < tDH < 120
Notes: Customers must never exceed the Classification temperature (TPmax = 260°C).
All temperatures refer to the topside of the QFN package, as measured on the package body surface.
Production Reflow: Check the recommendations of your solder manufacturer. For optimum results, use
lead-free solders that have lower specified temperature profiles (Tpmax ~ 235°C). Also use lower ramp-up and
ramp-down rates than those used in the qualification profile. Never exceed the maximum conditions that we
used for qualification, as these represent the maximum tolerable ratings for the device.
11.6 Storage Specifications
The storage specification of the MPU-9150 conforms to IPC/JEDEC J-STD-020D.1 Moisture Sensitivity Level
(MSL) 3.
Calculated shelf-life in moisture-sealed bag 12 months -- Storage conditions: <40°C and <90% RH
After opening moisture-sealed bag
168hours -- Storage conditions: ambient ≤30°C at 60%RH
11.7 Package Marking Specification
TOP VIEW
InvenSense
MPU9150
Part number
Lot traceability code
XXXXXX-XX
XX YYWW X
Foundry code
Package Vendor Code
Rev Code
YY = Year Code
WW = Work Week
Package Marking Specification
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11.8 Tape & Reel Specification
Tape Dimensions
Reel Outline Drawing
Reel Dimensions and Package Size
PACKAGE
REEL (mm)
SIZE
4x4
L
V
W
Z
330
102
12.8
2.3
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Package Orientation
User Direction
of Feed
Pin 1
INVENSENSE
INVENSENSE
Cover Tape
(Anti-Static)
Carrier Tape
(Anti-Static)
Reel
Terminal Tape
Label
Tape and Reel Specification
Reel Specifications
Quantity Per Reel
Reels per Box
5,000
1
5
Boxes Per Carton (max)
Pcs/Carton (max)
25,000
11.9 Label
Location of Label
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11.10 Packaging
REEL – with Barcode &
Caution labels
Vacuum-Sealed Moisture
Barrier Bag with ESD, MSL3,
Caution, and Barcode Labels
MSL3 Label
Caution Label
ESD Label
Inner Bubble Wrap
Pizza Box
Pizza Boxes Placed in Foam-
Lined Shipper Box
Outer Shipper Label
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11.11 Representative Shipping Carton Label
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12 Reliability
12.1 Qualification Test Policy
InvenSense’s products complete a Qualification Test Plan before being released to production. The
Qualification Test Plan for the MPU-9150 followed the JESD 47I Standards, “Stress-Test-Driven Qualification
of Integrated Circuits,” with the individual tests described below.
12.2 Qualification Test Plan
Accelerated Life Tests
TEST
Method/Condition
Lot
Quantity
Sample /
Lot
Acc /
Reject
Criteria
(HTOL/LFR)
High Temperature Operating Life
JEDEC JESD22-A108D
Dynamic, 3.63V biased, Tj>125°C
[read-points 168, 500, 1000 hours]
3
3
3
77
77
77
(0/1)
(0/1)
(0/1)
(HAST)
JEDEC JESD22-A118A
Condition A, 130°C, 85%RH, 33.3 psia., unbiased,
[read-point 96 hours]
Highly Accelerated Stress Test (1)
(HTS)
JEDEC JESD22-A103D
High Temperature Storage Life
Condition A, 125°C Non-Bias Bake
[read-points 168, 500, 1000 hours]
Device Component Level Tests
Method/Condition
TEST
Lot
Quantity
Sample /
Lot
Acc /
Reject
Criteria
(ESD-HBM)
ESD-Human Body Model
JEDEC JS-001-2012
(2KV)
1
3
(0/1)
(ESD-MM)
ESD-Machine Model
JEDEC JESD22-A115C
(250V)
1
1
3
3
6
5
(0/1)
(0/1)
(0/1)
(LU)
Latch Up
JEDEC JESD-78D
Class II (2), 125°C; ±100mA
(MS)
Mechanical Shock
JEDEC JESD22-B104C, Mil-Std-883
Method 2002.5, Cond. E, 10,000g’s, 0.2ms,
±X, Y, Z – 6 directions, 5 times/direction
(VIB)
Vibration
JEDEC JESD22-B103B
Variable Frequency (random), Cond. B, 5-500Hz,
X, Y, Z – 4 times/direction
1
3
5
(0/1)
(0/1)
(TC)
JEDEC JESD22-A104D
Condition G [-40°C to +125°C],
Soak Mode 2 [5’],
77
Temperature Cycling (1)
[Read-Points 1000 cycles]
(1) Tests are preceded by MSL3 Preconditioning in accordance with JEDEC JESD22-A113F
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13 Environmental Compliance
The MPU-9150 is RoHS and Green compliant.
The MPU-9150 is in full environmental compliance as evidenced in report HS-MPU-9150, Materials
Declaration Data Sheet.
Environmental Declaration Disclaimer:
InvenSense believes this environmental information to be correct but cannot guarantee accuracy or completeness. Conformity
documents for the above component constitutes are on file. InvenSense subcontracts manufacturing and the information contained
herein is based on data received from vendors and suppliers, which has not been validated by InvenSense.
This information furnished by InvenSense is believed to be accurate and reliable. However, no responsibility is assumed by InvenSense
for its use, or for any infringements of patents or other rights of third parties that may result from its use. Specifications are subject to
change without notice. InvenSense reserves the right to make changes to this product, including its circuits and software, in order to
improve its design and/or performance, without prior notice. InvenSense makes no warranties, neither expressed nor implied, regarding
the information and specifications contained in this document. InvenSense assumes no responsibility for any claims or damages arising
from information contained in this document, or from the use of products and services detailed therein. This includes, but is not limited
to, claims or damages based on the infringement of patents, copyrights, mask work and/or other intellectual property rights.
Certain intellectual property owned by InvenSense and described in this document is patent protected. No license is granted by
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any other weapons or life threatening applications, as well as in any other life critical applications such as medical equipment,
transportation, aerospace and nuclear instruments, undersea equipment, power plant equipment, disaster prevention and crime
prevention equipment.
InvenSense®, MotionCommand®, TouchAnywhere®, and AirSign® are registered trademarks of InvenSense, Inc. MPU™, MPU-
9150™, Motion Processing Unit™, MotionFusion™, MotionProcessing™, MotionApps™, Digital Motion Processor™, Digital Motion
Processing™, DMP™, BlurFree™, and InstantGesture™ are trademarks of InvenSense, Inc.
©2013 InvenSense, Inc. All rights reserved.
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