MZA1608S241C [TDK]
Chip Beads(SMD Array) For General Signal Line; 片式磁珠(贴片阵列)对于一般信号线型号: | MZA1608S241C |
厂家: | TDK ELECTRONICS |
描述: | Chip Beads(SMD Array) For General Signal Line |
文件: | 总2页 (文件大小:53K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
(1/2)
Conformity to RoHS Directive
Chip Beads(SMD Array)
For General Signal Line
MZA Series MZA1608 Type
FEATURES
SHAPES AND DIMENSIONS/RECOMMENDED PC BOARD
PATTERN
• A single MZA series chip provides noise attenuation for four
lines, making it ideal for use with I/O lines of various highly
miniaturized.
1.6 0.1
Ferrite
Terminal
electrode
• Electronic equipment, such as portable products, which
comprise high density circuitry.
• Low crosstalk between adjacent circuits.
• Internal electrodes feature low DC resistance, minimizing
wasteful power consumption.
0.4
0.2
0.4
0.2
Dimensions in mm
• Electroplated terminal electrodes accommodate reflow
soldering.
CIRCUIT DIAGRAM
• Monolithic structure ensures high reliability.
• It is a product conforming to RoHS directive.
APPLICATIONS
High-frequency noise countermeasure in computers, printers,
VCRs, televisions, portable telephones, and other equipment.
• No polarity
TEMPERATURE RANGES
PRODUCT IDENTIFICATION
Operating/storage
–55 to +125°C
MZA 1608 S 121 C
T
(1) (2) (3) (4) (5) (6)
PACKAGING STYLE AND QUANTITIES
Packaging style
Taping
Quantity
5000 pieces/reel
(1) Series name
(2) Dimensions L× W
(3) Material code
HANDLING AND PRECAUTIONS
(4) Nominal impedance
• Before soldering, be sure to preheat components. The preheat-
ing temperature should be set so that the temperature difference
between the solder temperature and product temperature does
not exceed 150°C.
121:120Ω at 100MHz
(5) Characteristic type
(6) Packaging style
T:Taping
• After mounting components onto the printed circuit board, do not
apply stress through board bending or mishandling.
• The inductance value may change due to magnetic saturation if
the current exceeds the rated maximum.
RECOMMENDED SOLDERING CONDITION
REFLOW SOLDERING
• Do not expose the inductors to stray magnetic fields.
• Avoid static electricity discharge during handling.
• When hand soldering, apply the soldering iron to the printed cir-
cuit board only. Temperature of the iron tip should not exceed
350°C. Soldering time should not exceed 3 seconds.
• This product does not apply to flow soldering construction
method.
10s max.
250 to 260˚C
230˚C
Natural
cooling
180˚C
150˚C
Preheating
60 to 120s
Soldering
30 to 60s
Time(s)
• Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific
bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications.
• Please contact our Sales office when your application are considered the following:
The device’s failure or malfunction may directly endanger human life (e.g. application for automobile/aircraft/medical/nuclear power devices, etc.)
• All specifications are subject to change without notice.
001-01 / 20070723 / e9421_mza1608.
(2/2)
ELECTRICAL CHARACTERISTICS
Impedance
Part No.
Rated current
(mA)max.
150
150
150
DC resistance
(Ω)max.
0.35
0.4
0.5
(Ω)[100MHz]∗
MZA1608S800C
MZA1608S121C
MZA1608S241C
∗
80 25%
120 25%
240 25%
Test equipment: E4991A or equivalent
Test tool: 16192A or equivalent
Test temperature: 25 10°C
TYPICAL ELECTRICAL CHARACTERISTICS
Z, X, R vs. FREQUENCY CHARACTERISTICS
MZA1608S800C
MZA1608S121C
MZA1608S241C
250
200
150
100
50
400
350
300
250
200
150
100
50
160
140
120
Z
Z
Z
100
R
80
R
R
60
40
X
X
X
20
0
0
0
1
10
100
1000
)
10000
1
10
100
1000
( )
Frequency MHz
10000
1
10
100
1000
)
10000
(
(
Frequency MHz
Frequency MHz
PACKAGING STYLES
REEL DIMENSIONS
TAPE DIMENSIONS
+0.1
–0.0
1.5
Sprocket hole
Cavity
1.0
0.8max.
1.3 0.2
4.0 0.1
2.0 0.05
4.0 0.1
2.0 0.5
9.0 0.3
13.0 1.4
160min.
Taping
200min.
ø13 0.5
ø21 0.8
ø178 2.0
Dimensions in mm
300min.
Dimensions in mm
Drawing direction
• All specifications are subject to change without notice.
001-01 / 20070723 / e9421_mza1608.
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