325541010-00 [TE]
6 coefficients for software compensation stored on-chip;
| 型号： | 325541010-00 |
| 厂家： | 
TE CONNECTIVITY |
| 描述： | 6 coefficients for software compensation stored on-chip 传感器 换能器 |
| 文件： | 总19页 (文件大小：431K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
MS5541-30C
Miniature 30 bar Module
SPECIFICATIONS
0 – 30 bar absolute pressure range
6 coefficients for software compensation stored on-chip
Piezoresistive silicon micromachined sensor
Integrated miniature pressure sensor 6.2 x 6.4 mm
16 Bit ADC
3-wire serial interface
1 system clock line (32.768 kHz)
Low voltage and low power consumption
High Endurance (HM version)
The MS5541-30C is the high-pressure version of MS5541C
pressure sensor module. The MS5541-30HM is the high
endurance pad technology version of MS5541-30C pressure
sensor module. It contains a precision piezoresistive pressure
sensor and an improved version of the 16 Bit Micropower Sensor
interface IC known from the MS5535C. The ESD sensitivity has
been improved to 4kV on all pins. In addition to this the
MS5541-30C is from its outer dimensions compatible to the
MS54xx series of pressure sensors. It uses an antimagnetic
polished stainless steel ring for sealing with O-ring. The sensor
provides 16 Bit pressure and temperature data via a 3 wire serial
interface that can be easily interfaced with 4 Bit low power
microcontrollers. 64 Bit of factory programmed PROM provides
calibration data for a highly accurate pressure and temperature
calculation.
SENSOR SOLUTIONS ///MS5541-30C
Page 1
09/2015
MS5541-30C
Miniature 30 bar Module
FEATURES
FIELD OF APPLICATION
Diving computers and watches
Mobile water depth and measurement systems
High endurance pad technology (HM version)
TECHNICAL DATA
Sensor Performances (VDD = 3 V)
Pressure
Range
Min
Typ
Max
Unit
bar
0
30
ADC
16
bit
Resolution
3.0
mbar
Accuracy 0°C to +40°C,
0 to 10 bar
Accuracy -20°C to +85°C
0 to 10 bar
-50
+100
+250
mbar
-100
mbar
ms
Response time
35
50
Long term stability
Temperature
Range
mbar/yr
Unit
°C
Min
-40
Typ
Max
+85
Resolution
Accuracy
0.005
-0.8
0.015
+0.8
°C
°C
FUNCTIONAL BLOCK DIAGRAM
VDD
MCLK
Input MUX
+IN
Digital
Interface
SENSOR
DIN
DOUT
SCLK
dig.
Filter
ADC
-IN
Memory
(PROM)
64 bits
Sensor
Interface IC
SGND
GND
09/2015
SENSOR SOLUTIONS ///MS5541-30C
Page 2
MS5541-30C
Miniature 30 bar Module
PERFORMANCE SPECIFICATIONS
ABSOLUTE MAXIMUM RATINGS
Parameter
Symbol
VDD
TS
Conditions
Min
-0.3
-40
Max
4
Unit
V
Notes
Supply voltage
Storage temperature
Overpressure
Ta = 25 °C
+85
50
°C
1
P
Ta = 25 °C
bar
NOTE
1)
Storage and operation in an environment of dry and non-corrosive gases.
RECOMMENDED OPERATING CONDITIONS
(Ta = 25 °C, VDD = 3.0 V unless noted otherwise)
Parameter
Symbol
Conditions
Min
0
Typ
Max
30
Unit
bar
V
Operating pressure range
Supply voltage
p
VDD
2.2
3.0
3.6
Supply current,
VDD = 3.0 V
average (1)
during conversion (2)
standby (no conversion)
Iavg
Isc
4
1
µA
mA
µA
Iss
0.1
0.5
Current consumption into MCLK
(3)
MCLK = 32.768 kHz
MCLK = 32.768 kHz
µA
Operating temperature range
Conversion time
T
-40
+85
35
°C
ms
kHz
%
tconv
MCLK
External clock signal (4)
Duty cycle of MCLK
Serial data clock
30.000
40/60
32.768
50/50
35.000
60/40
500
SCLK
kHz
NOTES
1) Under the assumption of one conversion every second. Conversion means either a pressure or a temperature
measurement started by a command to the serial interface of MS5541-30C.
2) During conversion the sensor will be switched on and off in order to reduce power consumption; the total on
time within a conversion is about 2 ms.
3) This value can be reduced by switching off MCLK while MS5541-30C is in standby mode.
4) It is strongly recommended that a crystal oscillator be used because the device is sensitive to clock jitter. A
square-wave form of the clock signal is a must.
09/2015
SENSOR SOLUTIONS ///MS5541-30C
Page 3
MS5541-30C
Miniature 30 bar Module
PERFORMANCE SPECIFICATIONS (CONTINUED)
PRESSURE OUTPUT CHARACTERISTICS
With the calibration data stored in the interface IC of the MS5541-30C, the following characteristics can be achieved:
(VDD = 3.0 V unless noted otherwise)
Parameter
Conditions
Min
Typ
Max
Unit
Notes
Resolution
3.0
mbar
1
p = 0 .. 2 bar
p = 0 .. 10 bar
p = 0 .. 20 bar
p = 0 .. 30 bar
-25
-50
-100
-250
+50
+100
+100
+100
Absolute Pressure Accuracy
(Temperature range 0 .. +40 °C)
mbar
mbar
2
3
p = 0 .. 2 bar
p = 0 .. 10 bar
p = 0 .. 20 bar
p = 0 .. 30 bar
-100
-100
-150
-400
+100
+250
+450
+500
Absolute Pressure Accuracy
(Temperature range -20 .. +85 °C)
Error over Temperature
Ta = -40 .. +85 °C
-25
+250
mbar
mbar
mbar
(p = const. relative to 20 °C)
Long-term Stability
1 year
50
40
4
VDD = 2.2 .. 3.6 V
p = const.
Maximum Error over Supply
Voltage
NOTES
1) A stable pressure reading of the given resolution requires taking the average of 2 to 4 subsequent pressure
values due to noise of the ADC.
2) Maximum error of pressure reading over the pressure range.
2) With the second-order temperature compensation as described in Section "FUNCTION". See next section for
typical operating curves.
4) The long-term stability is measured with non-soldered devices.
TEMPERATURE OUTPUT CHARACTERISTICS
This temperature information is not required for most applications, but it is necessary to allow for temperature
compensation of the pressure output.
(VDD = 3.0 V unless noted otherwise)
Parameter
Conditions
Min
0.005
-0.8
-2
Typ
Max
0.015
0.8
Unit
°C
Notes
Resolution
T = 20 °C, P = 0..10bar
T = -40 .. +85°C
°C
Accuracy
+6
°C
1
Maximum Error over Supply
Voltage
VDD = 2.2 .. 3.6 V
0.2
°C
NOTE
1) With the second-order temperature compensation as described in Section "FUNCTION". See next section
for typical operating curves.
09/2015
SENSOR SOLUTIONS ///MS5541-30C
Page 4
MS5541-30C
Miniature 30 bar Module
PERFORMANCE SPECIFICATIONS (CONTINUED)
DIGITAL INPUTS
(T = -40 °C .. 85 °C, VDD = 2.2 V .. 3.6 V)
Parameter
Symbol
Conditions
Min
Typ
Max
Unit
V
Input High Voltage
Input Low Voltage
Signal Rise Time
Signal Fall Time
VIH
VIL
tr
80% VDD
0% VDD
100% VDD
20% VDD
V
200
200
ns
ns
tf
DIGITAL OUTPUTS
(T = -40 °C .. 85 °C VDD = 2.2 V .. 3.6 V)
Parameter
Symbol
Conditions
Min
Typ
Max
Unit
V
Output High Voltage
Output Low Voltage
Signal Rise Time
Signal Fall Time
VOH
VOL
tr
Isource = 0.6 mA
Isink = 0.6 mA
80% VDD
0% VDD
100% VDD
20% VDD
V
200
200
ns
ns
tf
AD-CONVERTER
(T = -40 °C .. 85 °C VDD = 2.2 V .. 3.6 V)
Parameter
Resolution
Linear Range
Conversion Time
INL
Symbol
Conditions
Min
4'000
-5
Typ
Max
Unit
Bit
16
40'000
35
LSB
ms
MCLK = 32.768 kHz
Within linear range
+5
LSB
09/2015
SENSOR SOLUTIONS ///MS5541-30C
Page 5
MS5541-30C
Miniature 30 bar Module
TYPICAL PERFORMANCE CURVES
PRESSURE ERROR VS PRESSURE AND TEMPERATURE
Pressure accuracy vs temperature
Typical
Absolute pressure accuracy
Typical
600
500
400
300
200
100
0
500.00
400.00
85°C
1000mbar
14000mbar
30000mbar
300.00
60°C
200.00
25°C
-25°C
100.00
0.00
0
5000
10000
15000
20000
25000
30000
-40
-20
0
20
40
60
80
-100.00
-200.00
-100
-200
Temperature (°C)
Pressure (mbar)
TEMPERATURE ERROR VS TEMPERATURE
Temperature accuracy vs temperature
Typical
6
4
2
0
1000mbar
14000mbar
30000mbar
-40
-20
0
20
40
60
80
-2
-4
-6
Temperature (°C)
PRESSURE AND TEMPERATURE ERROR VS POWER SUPPLY
Pressureerror vs supply voltage at 25°C
Typical
Temperatureerror vs supply voltage at 25°C
Typical
30.0
20.0
10.0
0.0
0.3
0.2
1000mbar
14000mbar
30000mbar
1000mbar
0.1
14000mbar
30000mbar
0.0
2.20
2.40
2.60
2.80
3.00
3.20
3.40
3.60
2.20
2.40
2.60
2.80
3.00
3.20
3.40
3.60
-10.0
-20.0
-30.0
-0.1
-0.2
-0.3
Power supply [V]
Power supply [V]
09/2015
SENSOR SOLUTIONS ///MS5541-30C
Page 6
MS5541-30C
Miniature 30 bar Module
FUNCTION
GENERAL
The MS5541-30C consists of a piezo-resistive sensor and a sensor interface IC. The main function of the MS5541-
30C is to convert the uncompensated analogue output voltage from the piezo-resistive pressure sensor to a 16-bit
digital value, as well as providing a 16-bit digital value for the temperature of the sensor.
Measured pressure (16-bit)
Measured temperature (16-bit)
“D1”
“D2”
As the output voltage of a pressure sensor is strongly dependent on temperature and process tolerances, it is
necessary to compensate for these effects. This compensation procedure must be performed by software using an
external microcontroller.
D1
Pressure
Calculation
in external
micro-
D2
Word 1..4
Temperature
controller
Sensor
For both pressure and temperature measurement the same ADC is used (sigma delta converter):
•
•
for the pressure measurement, the differential output voltage from the pressure sensor is converted
for the temperature measurement, the sensor bridge resistor is sensed and converted
During both measurements the sensor will only be switched on for a very short time in order to reduce power
consumption. As both, the bridge bias and the reference voltage for the ADC are derived from VDD, the digital output
data is independent of the supply voltage.
FACTORY CALIBRATION
Every module is individually factory calibrated at two temperatures and two pressures. As a result, 6 coefficients
necessary to compensate for process variations and temperature variations are calculated and stored in the 64-bit
PROM of each module. These 64-bit (partitioned into four words of 16-bit) must be read by the microcontroller
software and used in the program converting D1 and D2 into compensated pressure and temperature values.
PRESSURE AND TEMPERATURE MEASUREMENT
The sequence of reading pressure and temperature as well as of performing the software compensation is depicted
in Fig. 3 and Fig. 5.
First Word1 to Word4 have to be read through the serial interface. This can be done once after reset of the
microcontroller that interfaces to the MS5541-30C. Next, the compensation coefficients C1 to C6 are extracted
using bit-wise logical- and shift-operations (refer to Fig. 4 for the bit-pattern of Word1 to Word4).
For the pressure measurement, the microcontroller has to read the 16-bit values for pressure (D1) and temperature
(D2) via the serial interface in a loop (for instance every second). Then, the compensated pressure is calculated
out of D1, D2 and C1 to C6 according to the algorithm in Fig. 3 (possibly using quadratic temperature compensation
according to Fig. 5). All calculations can be performed with signed 16-bit variables. Results of multiplications may
be up to 32-bit long (+sign). In the flow according to Fig. 3 a division follows each multiplication. This division can
be performed by bit-wise shifting (divisors are to the power of 2). It is ensured that the results of these divisions are
less than 65536 (16 bit).
For the timing of signals to read out Word1 to Word4, D1, and D2 please refer to the paragraph “Serial Interface".
09/2015
SENSOR SOLUTIONS ///MS5541-30C
Page 7
MS5541-30C
Miniature 30 bar Module
Basic equations:
Example:
Start
Read calibration data (factory calibrated) from
PROM of MS5541-30C
Word1 = 46076
Word2 = 14170
Word3 = 39937
Word4 = 33721
Word1, Word2, Word3 and Word4 (4x16 Bit)
Convert calibration data into coefficients:
(see bit pattern of Word1-Word4)
SENST1
C1 = 5759
C2 = 4317
C3 = 624
C4 = 263
C5 = 1665
OFFT1
TCS
TCO
Tref
TEMPSENS
C1: Pressure sensitivity
C2: Pressure offset
C3: Temperature coefficient of pressure sensitivity (10 Bit)
C4: Temperature coefficient of pressure offset
C5: Reference Temperature
C6: Temperature coefficient of the temperature
(13 Bit)
(13 Bit)
(9 Bit)
(12 Bit)
(7 Bit)
C6 =
57
Read digital pressure value from MS5541-30C
D1 (16 Bit)
D1 = 15380
Read digital temperature value from MS5541-30C
D2 (16 Bit)
D2 = 22027
Calculate calibration temperature
UT1 = 23320
UT1=8*C5+10000
Calculate actual temperature
Difference between actual temperature and reference
temperature:
dT(D2) = D2 - Tref
dT
= -1293
dT = D2 - UT1
TEMP(D2)=20°+dT(D2)*TEMPSENS
TEMP = 101
= 10.1 °C
Actual temperature:
TEMP = 200 + dT*(C6+100)/211 (0.1°C)
Calculate temperature compensated pressure
Offset at actual temperature:
OFF(D2)=OFFT1+TCO*dT(D2)
SENS(D2)=SENST1+TCS*dT(D2)
OFF = C2 + ((C4-250)*dT)/212 + 10000
Sensitivity at actual temperature:
OFF = 14312
SENS = 5749
SENS = C1/2 + ((C3+200)*dT)/213 + 3000
Temperature compensated pressure in mbar:
P = (SENS * (D1-OFF))/211 + 1000
P(D1,D2)=D1*SENS(D2)-OFF(D2)
P
= 3998
= 3998 mbar
Display pressure and temperature value
Fig. 3: Flow chart for pressure and temperature reading and software compensation
09/2015
SENSOR SOLUTIONS ///MS5541-30C
Page 8
MS5541-30C
Miniature 30 bar Module
NOTES
1) Readings of D2 can be done less frequently, but the display will be less stable in this case.
2) For a stable display of 1 mbar resolution, it is recommended to display the average of 8 subsequent
pressure values.
C1 (13 Bit)
C2/I (3 Bit)
DB12
DB9
DB11
DB8
DB10
DB7
DB9
DB6
DB8
DB7
DB6
DB5
DB2
DB4
DB1
DB3
DB0
DB2
DB1
DB0
DB12
DB11
DB10
DB6
Word 1
Word 2
C2/II (10 Bit)
C5/I (6 Bit)
DB5
DB4
DB3
DB11
DB10
DB9
DB8
DB7
C3 (10 Bit)
C5/II (6 Bit)
DB9
DB8
DB8
DB7
DB7
DB6
DB6
DB5
DB5
DB4
DB3
DB2
DB2
DB1
DB1
DB1
DB0
DB6
DB5
DB5
DB4
DB4
DB3
DB2
DB1
DB1
DB0
DB0
Word 3
Word 4
C4 (9 Bit)
C6 (7 Bit)
DB4
DB3
DB3
DB2
Fig. 4: Arrangement (Bit-pattern) of calibration data in Word1 to Word4
09/2015
SENSOR SOLUTIONS ///MS5541-30C
Page 9
MS5541-30C
Miniature 30 bar Module
SECOND-ORDER TEMPERATURE COMPENSATION
In order to obtain full temperature accuracy over the whole temperature range, it is recommended to compensate
for the non-linearity of the output of the temperature sensor. This can be achieved by correcting the calculated
temperature by a second order correction factor. The second-order factors are calculated as follows:
dT < 0
dT 0
yes
yes
Low Temperatures
High Temperatures
dT2 = dT – (dT/128*dT/128)/2
dT2 = dT – (dT/128*dT/128)/8
Calculate temperature
TEMP = (200 + dT2*(C6+100)/211) (0.1°C)
Fig. 5: Flow chart for calculating the temperature to the optimum accuracy.
09/2015
SENSOR SOLUTIONS ///MS5541-30C
Page 10
MS5541-30C
Miniature 30 bar Module
SERIAL INTERFACE
The MS5541-30C communicates with microprocessors and other digital systems via a 3-wire synchronous serial
interface as shown in Fig. 1. The SCLK (Serial clock) signal initiates the communication and synchronizes the data
transfer with each bit being sampled by the MS5541-30C on the rising edge of SCLK and each bit being sent by
the MS5541-30C on the rising edge of SCLK. The data should thus be sampled by the microcontroller on the falling
edge of SCLK and sent to the MS5541-30C with the falling edge of SCLK. The SCLK-signal is generated by the
microprocessor’s system. The digital data provided by the MS5541-30C on the DOUT pin is either the conversion
result or the software calibration data. In addition, the signal DOUT (Data out) is also used to indicate the conversion
status (conversion-ready signal, see below). The selection of the output data is done by sending the corresponding
instruction on the pin DIN (Data input).
Following is a list of possible output data instructions:
Conversion start for pressure measurement and ADC-data-out
Conversion start for temperature measurement and ADC-data-out
Calibration data read-out sequence for Word1
Calibration data read-out sequence for Word2
Calibration data read-out sequence for Word3
Calibration data read-out sequence for Word4
RESET sequence
“D1”
“D2”
(Figure 6a)
(Figure 6b)
(Figure 6c)
(Figure 6d)
(Figure 6c)
(Figure 6d)
(Figure 6e)
Every communication starts with an instruction sequence at pin DIN. Fig. 6 shows the timing diagrams for the
MS5541-30C. The device does not need a ‘Chip select’ signal. Instead there is a START sequence (3-Bit high)
before each SETUP sequence and STOP sequence (3-Bit low) after each SETUP sequence. The SETUP sequence
consists in 4-Bit that select a reading of pressure, temperature or calibration data. In case of pressure- (D1) or
temperature- (D2) reading the module acknowledges the start of a conversion by a low to high transition at pin
DOUT.
Two additional clocks at SCLK are required after the acknowledge signal. Then SCLK is to be held low by the
microcontroller until a high to low transition on DOUT indicates the end of the conversion.
This signal can be used to create an interrupt in the microcontroller. The microcontroller may now read out the 16
bit word by giving another 17 clocks on the SLCK pin. It is possible to interrupt the data READOUT sequence with
a hold of the SCLK signal. It is important to always read out the last conversion result before starting a new
conversion.
The RESET sequence is special as the module in any state recognizes its unique pattern. By consequence, it can
be used to restart if synchronization between the microcontroller and the MS5541-30C has been lost. This sequence
is 21-bit long. The DOUT signal might change during that sequence (see Fig. 6e). It is recommended to send the
RESET sequence before each CONVERSION sequence to avoid hanging up the protocol permanently in case of
electrical interference.
Conversion start for pressure measurement and ADC-data-out "D1":
end of conversion
conversion
(33ms)
start of conversion
ADC-data outMSB
ADC-data outLSB
DB6
DB5 DB4 DB3 DB2 DB1 DB0
DB7 DB6 DB5 DB4 DB3 DB2 DB1
DB0 DB7
sequence: START+P-measurement
Bit0 Bit1 Bit2 Bit3 Bit4 Bit5 Bit6 Bit7 Bit8 Bit9
Start-bit
Setup-bits
Stop-bit
Fig. 6a: D1 ACQUISITION sequence
09/2015
SENSOR SOLUTIONS ///MS5541-30C
Page 11
MS5541-30C
Miniature 30 bar Module
Conversion start for temperature measurement and ADC-data-out "D2":
end of conversion
conversion
(33ms)
ADC-data outMSB
ADC-data outLSB
start of conversion
DB7 DB6 DB5 DB4 DB3 DB2 DB1
DB0 DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0
sequence: START+T-measurement
Bit0 Bit1 Bit2 Bit3 Bit4 Bit5 Bit6 Bit7 Bit8 Bit9
Start-bit
Setup-bits
Stop-bit
Fig. 6b: D2 ACQUISITION sequence
Calibration data read out sequence for word 1/ word 3:
coefficient-data outMSB
DB7 DB6 DB5 DB4 DB3 DB2 DB1
coefficient-data outLSB
DB0 DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0
sequence: coefficient read + address
Bit0 Bit1 Bit2 Bit3 Bit4 Bit5 Bit6 Bit7 Bit8 Bit9Bit10Bit11
Stop-bit
Setup-bits
Start-bit
address word 1
address word 3
Fig. 6c: Word1, Word3 READING sequence
Calibration data read out sequence for word 2/ word 4:
coefficient-data outMSB
DB7 DB6 DB5 DB4 DB3 DB2 DB1
coefficient-data outLSB
DB0 DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0
sequence: coefficient read + address
Bit0 Bit1 Bit2 Bit3 Bit4 Bit5 Bit6 Bit7 Bit8 Bit9 Bit10Bit11
Stop-bit
Setup-bits
Start-bit
address word 2
address word 4
Fig. 6d: W2, W4 READING sequence
RESET- sequence:
sequence: RESET
Bit0 Bit1 Bit2 Bit3 Bit4 Bit5 Bit6 Bit7 Bit8 Bit9 Bit10Bit11Bit12Bit13Bit14Bit15Bit16Bit17Bit18Bit19Bit20
Fig. 6e: RESET sequence (21 bit)
09/2015
SENSOR SOLUTIONS ///MS5541-30C
Page 12
MS5541-30C
Miniature 30 bar Module
APPLICATION INFORMATION
GENERAL
The advantage for this combination of a sensor with a directly adapted integrated circuit is to save other external
components and to achieve very low power consumption. The main application field for this system includes
portable devices with battery supply, but its high accuracy and resolution make it also suited for industrial and
automotive applications. The possibility to compensate the sensor with software allows the user to adapt it to his
particular application. Communication between the MS5541-30C and the widely available microcontrollers is
realised over an easy-to-use 3-wire serial interface. Customers may select which microcontroller system to be used,
and there are no specific standard interface cells required, which may be of interest for specially designed 4 Bit-
microcontroller applications.
CALIBRATION
The MS5541-30C is factory calibrated. The calibration data is stored inside the 64 bit PROM memory.
SOLDERING
Please refer to the application note AN808 for all soldering issues.
HUMIDITY, WATER PROTECTION
The silicon pressure transducer and the bonding wires are protected by an anticorrosive and antimagnetic protection
cap. The MS5541-30C carries a metal protection cap filled with silicone gel for enhanced protection against
humidity. The properties of this gel ensure function of the sensor even when in direct water contact. This feature
can be useful for waterproof watches or other applications, where direct water contact cannot be avoided.
Nevertheless the user should avoid drying of hard materials like for example salt particles on the silicone gel surface.
In this case it is better to rinse with clean water afterwards. Special care has to be taken to not mechanically damage
the gel. Damaged gel could lead to air entrapment and consequently to unstable sensor signal, especially if the
damage is close to the sensor surface.
The metal protection cap is fabricated of special anticorrosive and antimagnetic stainless steel in order to avoid any
corrosive battery effects inside the final product.
For underwater operations it is important to seal the sensor with a rubber O-Ring around the metal ring. Any salt
water coming to the contact side (ceramic and Pads) of the sensor could lead to permanent damage.
LIGHT SENSITIVITY
The MS5541-30C is protected against sunlight by a layer of white gel. It is, however, important to note that the
sensor may still be slightly sensitive to sunlight, especially to infrared light sources. This is due to the strong photo
effect of silicon. As the effect is reversible there will be no damage, but the user has to take care that in the final
product the sensor cannot be exposed to direct light during operation. This can be achieved for instance by placing
mechanical parts with holes in such that light cannot pass.
CONNECTION TO PCB
The package outline of the module allows the use of a flexible PCB to connect it. This can be important for
applications in watches and other special devices, and will also reduce mechanical stress on the device.
For applications subjected to mechanical shock, it is recommended to enhance the mechanical reliability of the
solder junctions by covering the rim or the corners of MS5541-30C's ceramic substrate with glue or Globtop-like
material.
09/2015
SENSOR SOLUTIONS ///MS5541-30C
Page 13
MS5541-30C
Miniature 30 bar Module
DECOUPLING CAPACITOR
Particular care must be taken when connecting the device to power supply. A 47 F tantalum capacitor must be
placed as close as possible of the MS5541-30C's VDD pin. This capacitor will stabilize the power supply during
data conversion and thus, provide the highest possible accuracy.
APPLICATION EXAMPLE: DIVING COMPUTER SYSTEM USING MS5541-30C
MS5541-30C is a circuit that can be used in connection with a microcontroller in diving computer applications. It is
designed for low-voltage systems with a supply voltage of 3V, particularly in battery applications. The MS5541-30C
is optimised for low current consumption as the AD-converter clock (MCLK) can use the 32.768 kHz frequency of
a standard watch crystal, which is supplied in most portable watch systems.
For applications in altimeter systems MEAS Switzerland can deliver a simple formula to calculate the altitude, based
on a linear interpolation, where the number of interpolation points influences the accuracy of the formula.
3V-Battery
LCD-Display
VDD
XTAL1
XTAL2
32.768 kHz
MS5541-30C
47µF
Tantal
VDD
MCLK
Keypad
DIN
4/8bit-Microcontroller
DOUT
SCLK
GND
GND
EEPROM
optional
Figure 7: Demonstration of MS5541-30C in a diving computer
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MS5541-30C
Miniature 30 bar Module
PIN CONFIGURATION
Fig. 2: Pin configuration of MS5541-30C
Pin Name
SCLK
GND
Pin
1
Type
Function
I
Serial data clock
2
G
N
I
Ground
PV (1)
PEN (1)
VDD
3
Negative programming voltage
Programming enable
Positive supply voltage
Master clock (32.768 kHz)
Serial data input
4
5
P
I
MCLK
DIN
6
7
I
DOUT
8
O
Serial data output
NOTE
1) Pin 3 (PV) and Pin 4 (PEN) are only used by the manufacturer for calibration purposes and should not be
connected.
RECOMMENDED PAD LAYOUT
Pad layout for bottom side of MS5541-30C soldered onto printed circuit board.
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MS5541-30C
Miniature 30 bar Module
DEVICE PACKAGE OUTLINES
Fig. 8: Device package outlines of MS5541-30C
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SENSOR SOLUTIONS ///MS5541-30C
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MS5541-30C
Miniature 30 bar Module
SHIPPING PACKAGE
Tube
Tape & reel
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SENSOR SOLUTIONS ///MS5541-30C
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MS5541-30C
Miniature 30 bar Module
ASSEMBLY
MECHANICAL STRESS
It is recommended to avoid mechanical stress on the PCB on which the sensor is mounted. The thickness of the
PCB should not be below 1.6 mm. A thicker PCB is stiffer creating less stress on the soldering contacts. For
applications where mechanical stress cannot be avoided (for example ultrasound welding of the case or thin PCB’s
in watches) please fix the sensor with drops of low stress epoxy (for exemple Hysol FP-4401).
MOUNTING
The MS5541-30C can be placed with automatic Pick&Place equipment using vacuum nozzles. It will not be
damaged by the vacuum. Due to the low stress assembly the sensor does not show pressure hysteresis effects.
Special care has to be taken to not touch the protective gel of the sensor during the assembly.
The MS5541-30C can be mounted with the cap down or the cap looking upwards. In both cases it is important to
solder all contact pads. The Pins PEN and PV shall be left open or connected to VDD. Do not connect the Pins
PEN and PV to GND!
SEALING WITH O-RING
In products like outdoor watches the electronics must be protected against direct water or humidity. For those
products the MS5541-30C provides the possibility to seal with an O-ring. The protective cap of the MS5541-30C is
made of special anticorrosive stainless steel with a polished surface. In addition to this the MS5541-30C is filled
with silicone gel covering the sensor and the bonding wires. The O-ring (or O-rings) shall be placed at the outer
diameter of the metal cap. This method avoids mechanical stress because the sensor can move in vertical direction.
CLEANING
The MS5541-30C has been manufactured under cleanroom conditions. Each device has been inspected for the
homogeneity and the cleanness of the silicone gel. It is therefore recommended to assemble the sensor under class
10’000 or better conditions. Should this not be possible, it is recommended to protect the sensor opening during
assembly from entering particles and dust. To avoid cleaning of the PCB, solder paste of type “no-clean” shall be
used. Cleaning might damage the sensor!
ESD PRECAUTIONS
The electrical contact pads are protected against ESD up to 4 kV HBM (human body model). It is therefore essential
to ground machines and personal properly during assembly and handling of the device. The MS5541-30C is shipped
in antistatic transport boxes. Any test adapters or production transport boxes used during the assembly of the sensor
shall be of an equivalent antistatic material.
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SENSOR SOLUTIONS ///MS5541-30C
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MS5541-30C
Miniature 30 bar Module
ORDERING INFORMATION
Part Number / Art. Number
325541010-00
Product
Delivery Form
Tube
MS5541-CM 30BAR WHITE GEL
MS5541-HM 30BA WHITE GEL HE
MS5541-HM 30BA WHITEGEL HE T&R
325541030-00
Tube
325541030-50
Tape& reel TOP-UP
NORTH AMERICA
EUROPE
ASIA
Measurement Specialties, Inc.,
a TE Connectivity Company
45738 Northport Loop West
Fremont, CA 94538
Tel: +1 800 767 1888
Fax: +1 510 498 1578
Measurement Specialties (Europe), Ltd.,
a TE Connectivity Company
Switzerland Sàrl
Ch. Chapons-des-Prés 11
CH-2022 Bevaix
Measurement Specialties (China), Ltd.,
a TE Connectivity Company
No. 26 Langshan Road
Shenzhen High-Tech Park (North) Nanshan
District, Shenzhen, 518057 China
Tel: +86 755 3330 5088
Tel: +41 32 847 9550
e-mail: pfg.cs.amer@meas-spec.com
Website: www.meas-spec.com
Fax: + 41 32 847 9569
e-mail: sales.ch@meas-spec.com
Website: www.meas-spec.com
Fax: +86 755 3330 5099
e-mail: pfg.cs.asia@meas-spec.com
Website: www.meas-spec.com
TE.com/sensorsolutions
Measurement Specialties, Inc., a TE Connectivity company.
Measurement Specialties, TE Connectivity, TE Connectivity (logo) and EVERY CONNECTION COUNTS are trademarks. All other logos, products and/or company names referred to herein
might be trademarks of their respective owners.
The information given herein, including drawings, illustrations and schematics which are intended for illustration purposes only, is believed to be reliable. However, TE Connectivity makes
no warranties as to its accuracy or completeness and disclaims any liability in connection with its use. TE Connectivity‘s obligations shall only be as set forth in TE Connectivity‘s Standard
Terms and Conditions of Sale for this product and in no case will TE Connectivity be liable for any incidental, indirect or consequential damages arising out of the sale, resale, use or misuse
of the product. Users of TE Connectivity products should make their own evaluation to determine the suitability of each such product for the specific application.
© 2015 TE Connectivity Ltd. family of companies All Rights Reserved.
DA5541-30C_007
000055411348 ECN2035
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SENSOR SOLUTIONS ///MS5541-30C
Page 19
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