TC1173 [TELCOM]
300mA CMOS LDO with Shutdown, ERROR Output and Bypass; 300毫安CMOS LDO ，带有关断，错误输出和旁路
| 型号： | TC1173 |
| 厂家： | 
TELCOM SEMICONDUCTOR, INC |
| 描述： | 300mA CMOS LDO with Shutdown, ERROR Output and Bypass |
| 文件： | 总7页 (文件大小：57K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TC1173
300mA CMOS LDO with Shutdown, ERROR Output and Bypass
FEATURES
GENERAL DESCRIPTION
■ Extremely Low Supply Current for Longer Battery
Life!
■ Very Low Dropout Voltage
The TC1173 is a precision output (typically ±0.5%)
CMOS low dropout regulator. Total supply current is typi-
cally 50µA at full load (20 to 60 times lower than in bipolar
regulators!).
■ Guaranteed 300mA Output
■ Standard or Custom Output Voltages
■ ERROR Output Can be Used as a Low Battery
Detector or Processor Reset Generator
■ Power-Saving Shutdown Mode
■ Bypass Input for Ultra-Quiet Operation
■ Over-Current and Over-Temperature Protection
■ Space-Saving MSOP Package Option
TC1173 key features include ultra low noise operation
(plus optional Bypass input); very low dropout voltage
(typically 240mV at full load) and internal feed-forward
compensation for fast response to step changes in load. An
error output (ERROR) is asserted when the TC1173 is out-
of-regulation (due to a low input voltage or excessive output
current). ERROR can be set as a low battery warning or as
a processor RESET signal (with the addition of an external
RC network). Supply current is reduced to 0.05µA (typical)
and VOUT and ERROR fall to zero when the shutdown input
is low.
APPLICATIONS
■ Battery-Operated Systems
■ Portable Computers
■ Medical Instruments
■ Instrumentation
■ Cellular / GSM / PHS Phones
■ Linear Post-Regulator for SMPS
■ Pagers
The TC1173 incorporates both over-temperature and
over-currentprotection.TheTC1173isstablewithanoutput
capacitor of only 1µF and has a maximum output current of
300mA.
ORDERING INFORMATION
Part
Junction
Number
Package
Temp. Range
TYPICAL APPLICATION
TC1173-xxVOA
TC1173-xxVUA
8-Pin SOIC
8-Pin MSOP
– 40°C to +125°C
– 40°C to +125°C
8
7
6
1
VIN
VOUT
GND
VIN
NC
C1
1µF
Available Output Voltages:
2.5, 2.8, 3.0, 3.3, 5.0
xx indicates output voltages
2
3
R3
1M
TC1173
NC
SHDN
Other output voltages are available. Please contact TelCom
Semiconductor for details.
4
5
Bypass
ERROR
ERROR
PIN CONFIGURATION
CBYPASS
470pF
(Optional)
Shutdown Control
(from Power Control Logic)
1
2
3
4
8
7
6
5
VOUT
GND
VIN
MSOP
SOIC
NC
NC
TC1173VUA
SHDN
ERROR
Bypass
1
2
8
7
6
5
VOUT
GND
VIN
NC
3 TC1173VOA
NC
SHDN
Bypass 4
ERROR
TC1173-2 2/2/00 TelCom Semiconductor reserves the right to make changes in the circuitry and specifications of its devices.
300mA CMOS LDO With Shutdown,
ERROR Output, And Bypass
TC1173
Storage Temperature ............................ – 65°C to +150°C
Maximum Voltage on Any Pin ............ VIN +0.3V to – 0.3V
Lead Temperature (Soldering, 10 Sec.)................ +300°C
ABSOLUTE MAXIMUM RATINGS*
Input Voltage ..............................................................6.5V
Output Voltage ........................... (VSS – 0.3) to (VIN + 0.3)
Power Dissipation ....................Internally Limited (Note 7)
Operating Temperature.................... – 40°C < TJ < 125°C
*Absolute Maximum Ratings indicate device operation limits beyond dam-
age may occur. Device operation beyond the limits listed in Electrical
Characteristics is not recommended.
ELECTRICAL CHARACTERISTICS: VIN = VOUT + 1V, IL = 0.1µA, CL = 3.3µF, SHDN > VIH, TA = 25°C, unless otherwise noted.
BOLDFACE type specifications apply for junction temperatures of – 40°C to +125°C
Symbol
Parameter
Test Conditions
Min
Typ
Max
Units
VIN
Input Operating Voltage
Maximum Output Current
Output Voltage
—
—
—
6.0
V
mA
V
IOUT
300
—
MAX
VOUT
Note 1
Note 2
—
VR ± 0.5%
—
VR - 2.5%
VR + 2.5%
∆VOUT/∆T
VOUT Temperature Coefficient
—
—
—
ppm/°C
40
∆VOUT/∆VIN
∆VOUT/VOUT
VIN – VOUT
Line Regulation
(VR + 1V) < VIN < 6V
—
—
—
0.05
0.5
0.35
2.0
%
%
Load Regulation
IL = 0.1mA to IOUTMAX (Note 3)
Dropout Voltage (Note 4)
IL = 0.1mA
IL = 100mA
IL = 300mA
20
80
240
30
160
480
mV
ISS1
Supply Current
SHDN = VIH
SHDN = 0V
—
—
—
—
—
—
50
0.05
60
90
0.5
—
µA
µA
ISS2
Shutdown Supply Current
Power Supply Rejection Ratio
Output Short Circuit Current
Thermal Regulation
PSRR
F
RE ≤ 1kHz
dB
IOUT
VOUT = 0V
550
0.04
260
650
—
mA
SC
∆VOUT∆PD
Note 5
V/W
nV/√Hz
eN
Output Noise
F = 1kHz, COUT = 1µF,
—
RLOAD = 50Ω
SHDN Input
VIH
VIL
SHDN Input High Threshold
SHDN Input Low Threshold
45
—
—
—
%VIN
%VIN
—
15
ERROR Output
VMIN
VOL
VTH
VOL
Minimum Operating Voltage
1.0
—
—
—
—
—
—
400
—
V
mV
V
Output Logic Low Voltage
ERROR Threshold Voltage
ERROR Positive Hysteresis
1mA Flows to ERROR
Note 7
0.95 x VR
50
—
mV
NOTES: 1. VR is the user-programmed regulator output voltage setting.
MIN) x 10 6
2. TC VOUT = (VOUT
V
OUT
–
MAX
∆T
x
VOUT
3. Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested over a load range from 0.1mA
to the maximum specified output current. Changes in output voltage due to heating effects are covered by the thermal regulation specification.
4. Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal value measured at a 1V differential.
5. Thermal Regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied, excluding load
or line regulation effects. Specifications are for a current pulse equal to ILMAX at VIN = 6V for T = 10msec.
6. The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature, and the
thermal resistance from junction-to-air (i.e. TA, TJ, θJA). Exceeding the maximum allowable power dissipation causes the device to initiate
thermal shutdown. Please see Thermal Considerations section of this data sheet for more details.
7. Hysteresis voltage is referenced to VR.
TC1173-2 2/2/00
2
300mA CMOS LDO With Shutdown,
ERROR Output, And Bypass
TC1173
SHDN may be controlled by a CMOS logic gate, or I/O port
of a microcontroller. If the SHDN input is not required, it
should be connected directly to the input supply. While in
shutdown, supply current decreases to 0.05µA (typical),
VOUT falls to zero and ERROR is disabled.
DETAILED DESCRIPTION
The TC1173 is a fixed output, low drop-out regulator.
Unlike bipolar regulators, the TC1173 supply current does not
increasewithloadcurrent. Inaddition, VOUT remainsstableand
withinregulationatverylowloadcurrents(animportantconsid-
eration in RTC and CMOS RAM battery back-up applications).
TC1173 pin functions are detailed below:
ERROR Output
ERROR is driven low whenever VOUT falls out of regu-
lation by more than – 5% (typical). This condition may be
caused by low input voltage, output current limiting, or
thermal limiting.
PIN DESCRIPTIONS
The ERROR threshold is 5% below rated VOUT regard-
less of the programmed output voltage value (e.g., ERROR
= VOL at 4.75V (typ) for a 5.0V regulator and 2.85V (typ) for
a 3.0V regulator). ERROR output operation is shown in
Figure 2. Note that ERROR is active when VOUT is at or
below VTH, and inactive when VOUT is above VTH + VH.
As shown in Figure 1, ERROR can be used as a battery
low flag, or as a processor RESET signal (with the addition
of timing capacitor C2). R1 x C3 should be chosen to
maintain ERROR below VIH of the processor RESET input
for at least 200msec to allow time for the system to stabilize.
Pull-up resistor R1 can be tied to VOUT, VIN or any other
voltage less than (VIN + 0.3V.)
Pin
No.
Symbol Description
1
2
3
4
VOUT
GND
NC
Regulated voltage output
Ground terminal
No connect
Bypass
Referencebypassinput.Connectinga470pF
to this input further reduces output noise.
5
6
ERROR
SHDN
Out-of-Regulation Flag (Open Drain Out-
put). This output goes low when VOUT is out-
of-tolerance by approximately -5%.
Shutdown control input. The regulator is fully
enabled when a logic high is applied to this
input. The regulator enters shutdown when a
logic low is applied to this input. During
shutdown, output voltage falls to zero and
supply current is reduced to 0.05µA (typical).
VOUT
7
8
NC
VIN
No connect
Hysteresis (VH)
VTH
Unregulated supply input
Figure 1 shows a typical application circuit. The regula-
tor is enabled any time the shutdown input (SHDN) is above
VIH, and shutdown (disabled) when SHDN is at or below VIL.
ERROR
VIH
VOL
Figure 2: ERROR Output Operation
8
7
6
1
VIN
VOUT
VOUT
GND
VIN
NC
C1
1µF
Output Capacitor
A 1µF (min) capacitor from VOUT to ground is recom-
mended. The output capacitor should have an effective
series resistance of 5Ω or less. A 1µF capacitor should be
connected from VIN to GND if there is more than 10 inches
of wire between the regulator and the AC filter capacitor, or
if a battery is used as the power source. Aluminum electro-
lytic or tantalum capacitor types can be used. (Since many
aluminum electrolytic capacitors freeze at approximately –
30°C, solid tantalums are recommended for applications
operating below – 25°C.) When operating from sources
other than batteries, supply-noise rejection and transient
response can be improved by increasing the value of the
input and output capacitors and employing passive filtering
techniques.
2
3
R3
1M
TC1173
NC
SHDN
4
5
Bypass
ERROR
ERROR
CBYPASS
470pF
(Optional)
Shutdown Control
(from Power Control Logic)
Figure 1: Typical Application Circuit
3
TC1173-2 2/2/00
300mA CMOS LDO With Shutdown,
ERROR Output, And Bypass
TC1173
Bypass Input
Equation 1 can be used in conjunction with Equation 2
to ensure regulator thermal operation is within limits. For
example:
A 470pF capacitor connected from the Bypass input to
ground reduces noise present on the internal reference,
which in turn significantly reduces output noise. If output
noise is not a concern, this input may be left unconnected.
Larger capacitor values may be used, but results in a longer
time period to rated output voltage when power is initially
applied.
GIVEN:
VINMAX= 3.0V ± 10%
VOUTMIN= 2.7V ± 0.5%
ILOADMAX = 250mA
TJ
TA
= 125°C
= 55°C
MAX
MAX
ꢀJA = 200°C/W
Thermal Considerations
8-Pin MSOP Package
Thermal Shutdown
FIND:
1. Actual power dissipation
Integrated thermal protection circuitry shuts the regula-
tor off when die temperature exceeds 150°C. The regulator
remains off until the die temperature drops to approximately
140°C.
2. Maximum allowable dissipation
Actual power dissipation:
PD ≈ (VINMAX - VOUTMIN)ILOAD
MAX
= [(3.0 x 1.1) - (2.7 x .995)]250 x 10-3
Power Dissipation
The amount of power the regulator dissipates is prima-
rilyafunctionofinputandoutputvoltage,andoutputcurrent.
Thefollowingequationisusedtocalculateworstcaseactual
power dissipation:
= 155mW
Maximum allowable power dissipation:
J
A
MAX
PD ≈ (T MAX– T
)
ꢀJA
PD ≈ (VINMAX – VOUTMIN)ILOAD
MAX
Where:
PD = worst case actual power dissipation
VINMAX = maximum voltage on VIN
= (125 – 55)
200
VOUTMIN = minimum regulator output voltage
ILOADMAX = maximum output (load) current
= 350mW
In this example, the TC1173 dissipates a maximum of
only 155mW; far below the allowable limit of 350mW. In a
similar manner, Equation 1 and Equation 2 can be used to
calculate maximum current and/or input voltage limits. For
example, the maximum allowable VIN is found by substitut-
ing the maximum allowable power dissipation of 350mW
into Equation 1, from which VINMAX = 4.1V.
Equation 1.
The maximum allowablepower dissipation (Equation 2)
is a function of the maximum ambient temperature (TAMAX),
the maximum allowable die temperature (125°C), and the
thermal resistance from junction-to-air (ꢀJA). The 8-Pin
SOIC package has a ꢀJA of approximately 160°C/Watt,
while the 8-Pin MSOP package has a ꢀJA of approximately
200°C/Watt; both when mounted on a single layer FR4
dielectric copper clad PC board.
Layout Considerations
The primary path of heat conduction out of the package
isviathepackageleads. Therefore, layoutshavingaground
plane, wide traces at the pads, and wide power supply bus
lines combine to lower ꢀJA and, therefore, increase the
maximum allowable power dissipation limit.
PDMAX = (TJMAX – TA
)
MAX
ꢀJA
Where all terms are previously defined.
Equation 2.
TC1173-2 2/2/00
4
300mA CMOS LDO With Shutdown,
ERROR Output, And Bypass
TC1173
TYPICAL CHARACTERISTICS
Load Regulation
Line Regulation
Output Noise
2.00
1.80
0.012
0.010
10.0
1.0
R
C
= 50Ω
= 1µF
LOAD
OUT
1.60
1.40
1.20
1 to 300mA
1 to 100mA
0.008
0.006
1.00
0.80
0.60
0.40
0.004
0.002
0.000
0.1
0.0
1 to 50mA
–0.002
0.20
0.00
–0.004
0.01
10
–40 –20
0
20 40 60 80 100 120
–40 –20
0.01
1
100
1000
0
20 40 60 80 100 120
FREQUENCY (KHz)
TEMPERATURE (°C)
TEMPERATURE (°C)
Supply Current
Dropout Voltage vs. Load Current
V
vs. Temperature
OUT
100.0
90.0
80.0
3.075
3.025
0.40
0.35
125°C
85°C
V
= 4V
= 100µA
IN
I
LOAD
C
= 3.3µF
LOAD
0.30
0.25
0.20
0.15
0.10
0.05
0.00
70°C
25°C
70.0
60.0
50.0
40.0
0°C
2.975
–40°C
2.925
–40 –20
0
–40 –20
0
20 40 60 80 100 120
50
0
20 40 60 80 100 120
TEMPERATURE (°C)
150 200 250 300
100
TEMPERATURE (°C)
LOAD CURRENT (mA)
Power Supply Rejection Ratio
= 5V
–30dB
–35dB
–40dB
V
R
V
OUT
= 50Ω
= 50mV p-p
LOAD
INAC
–45dB
–50dB
–55dB
–60dB
–65dB
–70dB
–75dB
C
= 1µF
OUT
–80dB
1K
100K
1M
10
100
10K
FREQUENCY (KHz)
5
TC1173-2 2/2/00
300mA CMOS LDO With Shutdown,
ERROR Output, And Bypass
TC1173
TAPE AND REEL DIAGRAMS
Component Taping Orientation for 8-Pin SOIC (Narrow) Devices
User Direction of Feed
User Direction of Feed
PIN 1
W
PIN 1
P
Standard Reel Component Orientation
for TR Suffix Device
Reverse Reel Component Orientation
for RT Suffix Device
Carrier Tape, Number of Components Per Reel and Reel Size
Package
Carrier Width (W)
Pitch (P)
Part Per Full Reel
Reel Size
8-Pin SOIC (N)
12 mm
8 mm
2500
13 in
Component Taping Orientation for 8-Pin MSOP Devices
User Direction of Feed
User Direction of Feed
PIN 1
W
PIN 1
P
Standard Reel Component Orientation
for TR Suffix Device
Reverse Reel Component Orientation
for RT Suffix Device
Carrier Tape, Number of Components Per Reel and Reel Size
Package
Carrier Width (W)
Pitch (P)
Part Per Full Reel
Reel Size
8-Pin MSOP
12 mm
8 mm
2500
13 in
TC1173-2 2/2/00
6
300mA CMOS LDO With Shutdown,
ERROR Output, And Bypass
TC1173
PACKAGE DIMENSIONS
8-Pin SOIC (Narrow)
PIN 1
.157 (3.99)
.150 (3.81)
.244 (6.20)
.228 (5.79)
.050 (1.27) TYP.
.197 (5.00)
.189 (4.80)
.069 (1.75)
.053 (1.35)
.010 (0.25)
.007 (0.18)
8° MAX.
.020 (0.51)
.013 (0.33)
.010 (0.25)
.004 (0.10)
.050 (1.27)
.016 (0.40)
8-Pin MSOP
PIN 1
.197 (5.00)
.189 (4.80)
.122 (3.10)
.114 (2.90)
.026 (0.65) TYP.
.122 (3.10)
.114 (2.90)
.043 (1.10)
MAX.
.008 (0.20)
.005 (0.13)
6° MAX.
.016 (0.40)
.010 (0.25)
.006 (0.15)
.002 (0.05)
.028 (0.70)
.016 (0.40)
Dimensions: inches (mm)
Sales Offices
TelCom Semiconductor, GmbH
Lochhamer Strasse 13
D-82152 Martinsried
Germany
TEL: (011) 49 89 895 6500
FAX: (011) 49 89 895 6502 2
TelCom Semiconductor H.K. Ltd.
10 Sam Chuk Street, Ground Floor
San Po Kong, Kowloon
Hong Kong
TEL: (011) 852-2350-7380
FAX: (011) 852-2354-9957
TelCom Semiconductor, Inc.
1300 Terra Bella Avenue
P.O. Box 7267
Mountain View, CA 94039-7267
TEL: 650-968-9241
FAX: 650-967-1590
E-Mail: liter@telcom-semi.com
7
TC1173-2 2/2/00
相关型号：
©2020 ICPDF网 联系我们和版权申明