QEN62FDB [TEMEX]

Plastic J LEAD SMD XO - Communications Equipment Application; 塑料J引线SMD XO - 通信设备中的应用
QEN62FDB
型号: QEN62FDB
厂家: TEMEX    TEMEX
描述:

Plastic J LEAD SMD XO - Communications Equipment Application
塑料J引线SMD XO - 通信设备中的应用

石英晶振 通信设备
文件: 总5页 (文件大小:462K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
FREQUENCY  
QEN62  
Plastic J LEAD SMD XO – Communications Equipment Application  
Specification (Rev-F)  
Electrical Characteristics ......................................................P01  
Mechanical Characteristics...................................................P02  
Ordering Information.............................................................P03  
Suggested Reflow Soldering profile......................................P03  
Tape Drawing........................................................................P04  
Reel Drawing ........................................................................P04  
F r e q u e n c y  
QEN62  
Plastic J LEAD SMD XO – Communications Equipment Application  
Specification (rev-F)  
February 06th, 2006  
Electrical Characteristics  
Electrical Parameters  
Unit  
Minimum  
Typical  
Maximum  
Test conditions  
Frequency range  
MHz  
1
66.667  
Output logic  
HCMOS / TTL Output  
-10 to +70  
Operating temperature  
range (see table 1)  
Storage temperature  
range  
Refer to Ordering  
Information  
°C  
°C  
-40 to +85  
+125  
+5.0  
-55  
Power supply voltage  
(Vcc)  
Refer to Ordering  
Information  
Refer to Ordering  
Information  
V
+3.3  
Frequency Stability  
± ppm  
± ppm  
mA  
50  
100  
(see note 1)  
Aging (First Year)  
5
Ref at 25°C  
Input current  
(see table 2)  
HCMOS load  
TTL load  
Output load  
pF  
LS-TTL  
15  
1
30  
10  
Refer to Ordering  
Information  
Duty cycle  
%
ns  
ns  
40/60  
Rise & Fall time  
Start-up time  
From 10% Vcc to  
90% Vcc  
From 10% Vcc to  
90% Vcc  
8
10  
Note 1: Include 25°C tolerance, operating temperature range, input voltage change (±5%), load change  
(±10%), first year aging, shock and vibration.  
Table 1 : Stability Codes  
Table 2 : Input Current  
± 50ppm  
± 100ppm  
Frequency  
Vcc=5V Vcc=3.3V  
Cl=15 pF Cl=15pF  
-10 to +70°C  
- 40 to +85°C  
B
F
A
D
range (MHz)  
1.000 to 23.99  
24.00 to 49.99  
50.00 to 66.667  
20 mA  
30 mA  
40 mA  
15 mA  
20 mA  
30 mA  
1
TEMEX reserves the right to modify herein specifications and informations at any time when necessary to provide optimum performance and cost.  
F r e q u e n c y  
QEN62  
Plastic J LEAD SMD XO – Communications Equipment Application  
Specification (rev-F)  
February 06th, 2006  
Mechanical Characteristics  
BOTTOM VIEW  
SUGGESTED PAD  
#4  
#3  
1.27  
3.81  
1.27  
9.8  
max  
#1  
#2  
14.0 max  
3.0  
3.0  
5.8  
4.7  
max  
0.52  
1.52  
0.25  
min  
7.62  
5.08  
Pin connections  
Tri state function  
Pin #1  
Output (Pin #3)  
#1  
#2  
#3  
#4  
Tri state  
Open  
“1”  
Active  
Active  
High Z  
Ground  
Output  
+Vcc  
“0”  
Marking  
Line 1 QEN62 + stability/supply voltage/output code  
Line 2 Frequency in MHz (6 digits)  
Line 3 Date code (YYWW)+Manugacturing code  
Example for QEN62AAB / 3.6864MHz  
Line 1 : QEN62AAB  
Line 2 : 3.6864  
Line 3 : 0547-N  
2
TEMEX reserves the right to modify herein specifications and informations at any time when necessary to provide optimum performance and cost.  
F r e q u e n c y  
QEN62  
Plastic J LEAD SMD XO – Communications Equipment Application  
Specification (rev-F)  
Ordering Information  
QEN62  
February 06th, 2006  
Part numbering system  
A
A
B
3.6864MHZ  
Package type  
Temperature Stability  
Supply  
Voltage  
Output  
Nominal Frequency  
(MHz)  
SMD Package  
QEN62 : Plastic J Lead  
SMD  
A : + 5.0V  
D : +3.3V  
A : HCMOS 15pF  
B : HCMOS 30pF  
Please enter the nominal  
frequency  
A : ± 100ppm vs -10 to +70°C  
B : ± 50ppm vs -10 to +70°C  
D : ± 100ppm vs -40 to +85°C  
F : ± 50ppm vs -40 to +85°C  
Suggested Reflow Soldering Profile  
3
TEMEX reserves the right to modify herein specifications and informations at any time when necessary to provide optimum performance and cost.  
F r e q u e n c y  
QEN62  
Plastic J LEAD SMD XO – Communications Equipment Application  
Specification (rev-F)  
February 06th, 2006  
Tape Drawing  
Item  
Code  
Dimension  
12  
Tolerance  
Pitch of components  
P
Po  
P1  
W
± 0.1  
± 0.1  
± 0.1  
± 0.3  
± 0.1  
± 0.1  
± 0.1  
± 0.1  
± 0.05  
± 0.25  
± 0.1  
4.0  
Pitch of sprocket hole  
2.0  
Length from hole center to component center  
Width of carrier tape  
24.0  
11.5  
Width of adhesive tape  
W0  
A
14.65  
9.60  
Height of component hole  
Width of component hole  
Gap of hold down tape and carrier tape  
Diameter of sprocket hole  
Diameter of feed hole  
B
1.75  
W2  
Do  
D1  
K
1.55  
1.55  
5.60  
Total of tape thickness  
Reel Drawing  
25  
1.5  
Multiple : 1Kpcs per Reel  
Ø20.2  
Ø13  
Unit : mm  
4
TEMEX reserves the right to modify herein specifications and informations at any time when necessary to provide optimum performance and cost.  

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