5962-8959830MTC [TEMIC]
Standard SRAM, 128KX8, 120ns, CMOS, CDFP32,;
| 型号： | 5962-8959830MTC |
| 厂家： | 
TEMIC SEMICONDUCTORS |
| 描述： | Standard SRAM, 128KX8, 120ns, CMOS, CDFP32, CD 静态存储器 内存集成电路 |
| 文件： | 总89页 (文件大小：343K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
REVISIONS
LTR
F
DESCRIPTION
DATE (YR-MO-DA)
94-12-08
APPROVED
M. A. Frye
Changes in accordance with NOR 5962-R040-95.
Redrawn with changes. Add device types 39 and 40. Add vendor
CAGE 66301 and 0EU86 as sources of supply for device types 39
and 40. Add case 7. Add vendor CAGE 0EU86 as source of supply
for case 7. Convert document to updated SMD boilerplate. Editorial
changes throughout.
96-03-20
M. A. Frye
G
H
Add device type 41. Make corrections to case outline N, dimension b.
Add vendor CAGE 65786 as source of supply for device type 41.
Update boilerplate. Editorial changes throughout.
97-03-26
Raymond Monnin
Add device types 42, 43, 44, 45, and 46. Editorial changes to pages
1, 3, 7-15. Update boilerplate. ksr
98-03-03
00-03-01
Raymond Monnin
Raymond Monnin
J
K
L
Added provisions to accommodate radiation-hardened devices.
Added device type 47 to drawing. glg
Corrected case outline 8 Figure 1 to show correct numbering of
terminals. Corrected Figure 2 Terminal connections. Corrected the
case outline Y Figure 1 to show the proper distance of E and E1.
Added note to Case outline Y Figure 1, to allow for bottom brazed
package as an alternative style to the side brazed package . Update
boilerplate. Editorial changes throughout. ksr
00-12-08
Raymond Monnin
REV
L
35
L
L
36
L
L
37
L
L
L
39
L
L
40
L
L
41
L
L
42
L
L
43
L
L
44
L
L
45
L
L
46
L
L
47
L
L
48
L
L
49
L
L
50
L
L
51
L
L
52
L
SHEET
REV
38
L
L
33
L
L
34
L
SHEET
15
16
17
18
REV
19
20
21
L
22
L
23
L
24
L
25
L
26
L
27
L
28
L
29
L
30
L
31
L
32
L
REV STATUS
OF SHEETS
SHEET
1
2
3
4
5
6
7
8
9
10
11
12
13
14
PREPARED BY
Kenneth S. Rice
PMIC N/A
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216
STANDARD
MICROCIRCUIT
DRAWING
http://www.dscc.dla.mil
CHECKED BY
Raymond Monnin
THIS DRAWING IS
AVAILABLE
FOR USE BY ALL
DEPARTMENTS
APPROVED BY
Michael A. Frye
MICROCIRCUIT, MEMORY, DIGITAL,
CMOS, 128K X 8 STATIC RANDOM
ACCESS MEMORY (SRAM) LOW POWER,
MONOLITHIC SILICON
AND AGENCIES OF THE
DEPARTMENT OF DEFENSE
DRAWING APPROVAL DATE
89-04-21
SIZE
AMSC N/A
REVISION LEVEL
L
CAGE CODE
5962-89598
A
67264
SHEET
1 OF 52
DSCC FORM 2233
APR 97
5962-E233-00
DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited.
1. SCOPE
1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes Q
and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in
the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected
in the PIN.
1.2 PIN. The PIN is as shown in the following example:
5962
-
89598
01
M
X
A
Federal
stock class
designator
\
RHA
designator
(see 1.2.1)
Device
type
(see 1.2.2)
Device
class
designator
(see 1.2.3)
Case
outline
(see 1.2.4)
Lead
finish
(see 1.2.5)
/
\/
Drawing number
1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and
are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix
A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.
1.2.2 Device type(s). The device type(s) identify the circuit function as follows:
Device type
Generic number 1/
Circuit function
Access time
01
02
03
04
05
06
07
08
09
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
128K x 8 low power CMOS SRAM
128K x 8 low power CMOS SRAM
128K x 8 low power CMOS SRAM
128K x 8 low power CMOS SRAM
128K x 8 low power CMOS SRAM
128K x 8 low power CMOS SRAM
128K x 8 low power CMOS SRAM
128K x 8 low power CMOS SRAM
128K x 8 low power CMOS SRAM
128K x 8 low power CMOS SRAM
128K x 8 low power CMOS SRAM
128K x 8 low power CMOS SRAM
128K x 8 low power CMOS SRAM dual CE
128K x 8 low power CMOS SRAM dual CE
128K x 8 low power CMOS SRAM dual CE
128K x 8 low power CMOS SRAM dual CE
128K x 8 low power CMOS SRAM dual CE
128K x 8 low power CMOS SRAM dual CE
128K x 8 low power CMOS SRAM dual CE
128K x 8 low power CMOS SRAM dual CE
128K x 8 low power CMOS SRAM dual CE
128K x 8 standard power CMOS SRAM
128K x 8 standard power CMOS SRAM
128K x 8 standard power CMOS SRAM
128K x 8 standard power CMOS SRAM
128K x 8 standard power CMOS SRAM
128K x 8 standard power CMOS SRAM
128K x 8 standard power CMOS SRAM
128K x 8 standard power CMOS SRAM
128K x 8 standard power CMOS SRAM dual CE
120 ns
100 ns
85 ns
70 ns
120 ns
100 ns
85 ns
70 ns
55 ns
45 ns
35 ns
25 ns
120 ns
100 ns
85 ns
70 ns
55 ns
45 ns
35 ns
25 ns
20 ns
120 ns
100 ns
85 ns
70 ns
55 ns
45 ns
35 ns
25 ns
120 ns
1/ Generic numbers are listed on the Standard Microcircuit Drawing Source Approval Bulletin at the end of this document
and will also be listed in MIL-HDBK-103.
SIZE
STANDARD
5962-89598
A
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
REVISION LEVEL
L
SHEET
2
DSCC FORM 2234
APR 97
Device type
Generic number 1/
Circuit function
Access time
100 ns
85 ns
70 ns
55 ns
45 ns
35 ns
25 ns
20 ns
20 ns
20 ns
15 ns
70 ns
70 ns
15 ns
12 ns
12 ns
30 ns
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
128K x 8 standard power CMOS SRAM dual CE
128K x 8 standard power CMOS SRAM dual CE
128K x 8 standard power CMOS SRAM dual CE
128K x 8 standard power CMOS SRAM dual CE
128K x 8 standard power CMOS SRAM dual CE
128K x 8 standard power CMOS SRAM dual CE
128K x 8 standard power CMOS SRAM dual CE
128K x 8 standard power CMOS SRAM dual CE
128K x 8 standard power CMOS SRAM
128K x 8 low power CMOS SRAM
128K x 8 standard power CMOS SRAM dual CE
128K x 8 low power CMOS SRAM
128K x 8 standard power CMOS SRAM
128K x 8 standard power CMOS SRAM
128K x 8 standard power CMOS SRAM dual CE
128K x 8 standard power CMOS SRAM
128K x 8 very low power CMOS SRAM
1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as
follows:
Device class
M
Device requirements documentation
Vendor self-certification to the requirements for MIL-STD-883 compliant,
non-JAN class level B microcircuits in accordance with MIL-PRF-38535,
appendix A
Q or V
Certification and qualification to MIL-PRF-38535
1.2.4 Case outlines. The case outlines are as designated in MIL-STD-1835 and as follows:
Outline letter
X
Descriptive designator
Terminals
Package style
dual-in-line
SOJ package
dual-in-line
rectangular chip carrier
flat pack
rectangular chip carrier
rectangular chip carrier
J-leaded rectangular chip carrier
zig-zag in-line
GDIP1-T32 or CDIP2-T32
See figure 1
See figure 1
See figure 1
See figure 1
See figure 1
CQCC1-N32
See figure 1
See figure 1
See figure 1
32
32
32
32
32
32
32
32
32
32
Y
Z
U
T
N
M
9
2/
8
7
SOJ package
1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535,
appendix A for device class M.
1.3 Absolute maximum ratings. 3/ 4/
Supply voltage range (V ) ........................................
-0.5 V dc to +7.0 V dc
-0.5 V dc to V +0.5 V dc 5/
-0.5 V dc to V +0.5 V dc 5/
CC
-65 C to +150 C
1.0 W
CC
DC input voltage range (V ).......................................
IN
CC
DC output voltage range (V
Storage temperature range..........................................
).................................
OUT
Maximum power dissipation (P ) ................................
D
Lead temperature (soldering, 10 seconds) ..................
+260 C
1/ Generic numbers are listed on the Standard Microcircuit Drawing Source Approval Bulletin at the end of this document
and will also be listed in MIL-HDBK-103.
2/ A bottom brazed option for this package now exists (See figure 1, case outline Y NOTE:). Customers may specify in the
purchase order to negate the option as acceptable for their use.
3/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the
maximum levels may degrade performance and affect reliability.
4/ All voltages referenced to V
(V = ground) unless otherwise specified.
SS SS
5/ Negative undershoots to a minimum of -3.0 V are allowed with a maximum of 20 ns pulse width.
SIZE
STANDARD
MICROCIRCUIT DRAWING
5962-89598
A
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
REVISION LEVEL
L
SHEET
3
DSCC FORM 2234
APR 97
1.3 Absolute maximum ratings - continued. 3/ 4/
):
JC
Thermal resistance, junction-to-case (
Case M.......................................................................
Cases X, Y, Z, U, and 7 .............................................
Cases T, N, and 9......................................................
Case 8........................................................................
Output voltage applied in high Z state .........................
See MIL-STD-1835
11 C/W 6/
10 C/W 6/
16 C/W 6/
-0.5 V dc to V +0.5 V dc
CC
Maximum power dissipation, (P ) ...............................
Maximum junction temperature (T ) ............................
J
1.0 W
D
+150 C 7/
1.4 Recommended operating conditions.
Supply voltage range (V ) ........................................
CC
4.5 V dc minimum to 5.5 V dc maximum
0.0 V dc
Supply voltage range (V ).........................................
SS
High level input voltage range (V ) ............................
IH
2.2 V dc to V
+ 0.5 V dc
CC
Low level input voltage range (V )..............................
-0.5 V dc to 0.8 V dc
-55 C to +125 C
IL
Case operating temperature range (T )......................
C
1.5 Logic testing for device classes Q and V.
Fault coverage measurement of manufacturing
logic tests (MIL-STD-883, test method 5012) .............. 8/ percent
2. APPLICABLE DOCUMENTS
2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a
part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those
listed in the issue of the Department of Defense Index of Specifications and Standards (DoDISS) and supplement thereto,
cited in the solicitation.
SPECIFICATION
DEPARTMENT OF DEFENSE
MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.
STANDARDS
DEPARTMENT OF DEFENSE
MIL-STD-883 - Test Method Standard Microcircuits.
MIL-STD-973 - Configuration Management.
MIL-STD-1835 - Interface Standard For Microcircuit Case Outlines.
HANDBOOKS
DEPARTMENT OF DEFENSE
MIL-HDBK-103 - List of Standard Microcircuit Drawings (SMD's).
MIL-HDBK-780 - Standard Microcircuit Drawings.
(Unless otherwise indicated, copies of the specification, standards, and handbooks are available from the Standardization
Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
3/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the
maximum levels may degrade performance and affect reliability.
4/ All voltages referenced to V
(V
SS SS
= ground) unless otherwise specified.
6/ When the
for this case is specified in MIL-STD-1835, that value shall supersede the value indicated herein.
JC
7/ Maximum junction temperature may be increased to +175 C during burn-in and steady-state life.
8/ When a value is determined per customer requirements, it shall be provided.
SIZE
STANDARD
MICROCIRCUIT DRAWING
5962-89598
A
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
REVISION LEVEL
L
SHEET
4
DSCC FORM 2234
APR 97
2.2 Non-Government publications. The following documents form a part of this document to the extent specified herein.
Unless otherwise specified, the issues of the documents which are DoD adopted are those listed in the issue of the DODISS
cited in the solicitation. Unless otherwise specified, the issues of documents not listed in the DODISS are the issues of the
documents cited in the solicitation.
AMERICAN SOCIETY FOR TESTING AND MATERIALS (ASTM)
ASTM Standard F1192M-95
-
Standard Guide for the Measurement of Single Event Phenomena from
Heavy Ion Irradiation of Semiconductor Devices.
(Applications for copies of ASTM publications should be addressed to the American Society for Testing and Materials,
1916 Race Street, Philadelphia, PA 19103.)
ELECTRONICS INDUSTRIES ASSOCIATION (EIA)
JEDEC Standard EIA/JESD 78
-
IC Latch-Up Test.
(Applications for copies should be addressed to the Electronics Industries Association, 2500 Wilson Boulevard, Arlington,
VA 22201.)
(Non-Government standards and other publications are normally available from the organizations that prepare or
distribute the documents. These documents also may be available in or through libraries or other informational services.)
2.3 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the
text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations
unless a specific exemption has been obtained.
3. REQUIREMENTS
3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with
MIL-PRF-38535 and as specified herein or as modified in the device manufacturer's Quality Management (QM) plan. The
modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for
device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified
herein.
3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as
specified in MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device
class M.
3.2.1 Case outline(s). The case outline(s) shall be in accordance with 1.2.4 herein and figure 1.
3.2.2 Terminal connections. The terminal connections shall be as specified on figure 2.
3.2.3 Truth table. The truth table shall be as specified on figure 3.
3.2.4 Functional tests. Various functional tests used to test this device are contained in the appendix. If the test patterns
cannot be implemented due to test equipment limitations, alternate test patterns to accomplish the same results shall be
allowed. For device class M, alternate test patterns shall be maintained under document revision level control by the
manufacturer and shall be made available to the preparing or acquiring activity upon request. For device classes Q and V
alternate test patterns shall be under the control of the device manufacturer's Technology Review Board (TRB) in
accordance with MIL-PRF-38535 and shall be made available to the preparing or acquiring activity upon request.
3.2.5 Die overcoat. Polyimide and silicone coatings are allowable as an overcoat on the die for alpha particle protection
only. Each coated microcircuit inspection lot (see inspection lot as defined in MIL-PRF-38535) shall be subjected to and
pass the internal moisture content test at 5000 ppm (see method 1018 of MIL-STD-883). The frequency of the internal water
vapor testing shall not be decreased unless approved by the preparing activity for class M. The TRB will ascertain the
requirements as provided by MIL-PRF-38535 for classes Q and V. Samples may be pulled any time after seal.
3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the
electrical performance characteristics and postirradiation parameter limits are as specified in table I and shall apply over the
full case operating temperature range.
3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table IIA. The
electrical tests for each subgroup are defined in table I.
3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturer's PIN may also be
marked as listed in MIL-HDBK-103. For packages where marking of the entire SMD PIN number is not feasible due to space
limitations, the manufacturer has the option of not marking the "5962-" on the device. For RHA product using this option, the
RHA designator shall still be marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535.
Marking for device class M shall be in accordance with MIL-PRF-38535, appendix A.
SIZE
STANDARD
5962-89598
A
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
REVISION LEVEL
L
SHEET
5
DSCC FORM 2234
APR 97
3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a "QML" or "Q" as
required in MIL-PRF-38535. The compliance mark for device class M shall be a "C" as required in MIL-PRF-38535,
appendix A.
3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a
QML-38535 listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class
M, a certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in
MIL-HDBK-103 (see 6.6.2 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved
source of supply for this drawing shall affirm that the manufacturer's product meets, for device classes Q and V, the
requirements of MIL-PRF-38535 and herein or for device class M, the requirements of MIL-PRF-38535, appendix A and
herein.
3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in
MIL-PRF-38535 or for device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits
delivered to this drawing.
3.8 Notification of change for device class M. For device class M, notification to DSCC-VA of change of product (see 6.2
herein) involving devices acquired to this drawing is required for any change as defined in MIL-STD-973.
3.9 Verification and review for device class M. For device class M, DSCC, DSCC's agent, and the acquiring activity retain
the option to review the manufacturer's facility and applicable required documentation. Offshore documentation shall be
made available onshore at the option of the reviewer.
3.10 Microcircuit group assignment for device class M. Device class M devices covered by this drawing shall be in
microcircuit group number 41 (see MIL-PRF-38535, appendix A).
3.11 Substitution. Substitution data shall be as indicated in appendix B herein.
4. QUALITY ASSURANCE PROVISIONS
4.1 Sampling and inspection. For device classes Q and V, sampling and inspection procedures shall be in accordance
with MIL-PRF-38535 or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the
QM plan shall not affect the form, fit, or function as described herein. For device class M, sampling and inspection
procedures shall be in accordance with MIL-PRF-38535, appendix A.
4.2 Screening. For device classes Q and V, screening shall be in accordance with MIL-PRF-38535, and shall be conducted
on all devices prior to qualification and technology conformance inspection. For device class M, screening shall be in
accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance
inspection.
SIZE
STANDARD
5962-89598
A
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
REVISION LEVEL
L
SHEET
6
DSCC FORM 2234
APR 97
TABLE I. Electrical performance characteristics.
Test
Symbol
Conditions
+125 C
5.5 V
Group A
subgroups
Device
types
Limits
Max
Unit
-55 C
T
C
= 0 V; 4.5 V
V
V
V
CC
Min
SS
unless otherwise specified
High level input
current
I
= 5.5 V, V = 5.5 V
1, 2, 3
All
10
2/
A
IH
CC
IN
M,D,P
1 1/
Low level input current
I
V
= 5.5 V, V = 0.0 V
IN
1, 2, 3
All
All
-10
2/
A
A
IL
CC
CC
M,D,P
1 1/
High impedance output
leakage current
I
V
V
= 5.5 V, V = 5.5 V
O
1, 2, 3
10
2/
OZH
= 0.0 V, V = 5.0 V
IL
IH
V
OE
V
CC
IH
M,D,P
= 5.5 V, V = 0.0 V
1 1/
I
V
V
1, 2, 3
All
-10
OZL
CC
IL
O
= 0.0 V, V = 5.0 V
IH
V
IH
OE
V
CC
M,D,P
= 4.5 V
1 1/
2/
Output high voltage
V
OH
I
V
= -4.0 mA, V
CC
1, 2, 3
01-
41,47
2.4
V
OH
IH
= 2.2 V, V = 0.8 V
IL
M,D,P
= 4.5 V
1 1/
2/
I
= -1.0 mA, V
CC
42- 46
2.4
OH
V
= 2.2 V, V = 0.8 V
IH
IL
M,D,P
1 1/
2/
Output low voltage
V
OL
I
V
= 8.0 mA, V
= 4.5 V
1, 2, 3
01-
41,47
0.4
V
OL
IH
CC
= 2.2 V, V = 0.8 V
IL
M,D,P
1 1/
2/
I
V
= 2.1 mA, V
= 4.5 V
42- 46
0.4
OL
IH
CC
= 2.2 V, V = 0.8 V
IL
M,D,P
1 1/
2/
See footnotes at end of table.
SIZE
STANDARD
5962-89598
A
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
REVISION LEVEL
L
SHEET
7
DSCC FORM 2234
APR 97
TABLE I. Electrical performance characteristics Continued.
Test
Symbol
Conditions
-55 C +125 C
= 0 V; 4.5 V 5.5 V
unless otherwise specified
Group A
subgroups
Device
types
Limits
Max
Unit
mA
T
C
Min
V
V
CC
SS
Operating supply
current
I
1, 2, 3
01-04,
11,19,
26,27,
34,35,
42
125
CC1
V
= 5.5 V, CE = V max
IL
CC
OE , WE , and CE = V
IH
2
f = 1/t
min
AVAV
05, 06,
13, 14
100
110
07, 08,
15, 16,
22, 23,
30, 31
09, 10,
17, 18
115
120
24, 25,
32, 33,
43
12,20,
47
130
135
140
28, 36
21, 29,
37, 39,
40
38
150
180
250
2/
41
44-46
All
M,D,P
1 1/
See footnotes at end of table.
SIZE
STANDARD
5962-89598
A
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
REVISION LEVEL
L
SHEET
8
DSCC FORM 2234
APR 97
TABLE I. Electrical performance characteristics Continued.
Test
Symbol
Conditions
-55 C +125 C
= 0 V; 4.5 V 5.5 V
unless otherwise specified
Group A
subgroups
Device
types
Limits
Max
Unit
mA
T
C
Min
V
V
CC
SS
Standby supply current
TTL
I
I
I
1, 2, 3
47
2
CC2
CC3
CC4
V
= 5.5 V, CE = V
CC
IH
CE = V , f = 0 Hz
01-04,
42
10
2
IL
05-40,
43
25
41
40
60
2/
44-46
All
M,D,P
1 1/
Standby supply current
CMOS
1, 2, 3
47
42
0.3
1
mA
V
-0.2 V
V
= 5.5 V, CE
CC
CC
Inputs = V or V , f = 0
IH IL
01-04,
40,43
5
05-39,
41
10
44-46
All
15
2/
M,D,P
1 1/
Data retention current
V
= 2.0 V, f = 0
1, 2, 3
01-04
05-21
40
2
mA
A
CC
CE
inputs = 0.2 V or V
V
- 0.2 V, all other
1
CC
- 0.2 V
CC
750
400
150
2/
42
47
M,D,P
1 1/
4
All
01-38,
41-47
12
Input capacitance 3/
(A0 - A16)
C
IN
V
= 0 V, f = 1.0 MHz
IN
= +25 C, see 4.4.1e
pF
T
C
39, 40
5
01-38,
41-47
20
Input capacitance 3/
( CE , WE , OE )
C
C
V
T
= 0 V, f = 1.0 MHz
OUT
4
4
pF
pF
CLK
= +25 C, see 4.4.1e
C
39, 40
5
01-38,
41-47
14
Output capacitance 3/
V
= 0 V, f = 1.0 MHz
OUT
OUT
T
C
= +25 C, see 4.4.1e
39, 40
5
See footnotes at end of table.
SIZE
STANDARD
5962-89598
A
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
REVISION LEVEL
L
SHEET
9
DSCC FORM 2234
APR 97
TABLE I. Electrical performance characteristics Continued.
Test
Symbol
Conditions
-55 C +125 C
= 0 V; 4.5 V 5.5 V
unless otherwise specified
Group A
subgroups
Device
types
Limits
Max
Unit
T
C
V
V
CC
Min
SS
Functional tests
Read cycle time
4/
See 4.4.1c
7, 8A, 8B
7 1/
All
M,D,P
See figure 4, as applicable 5/ 6/
2/
2/
t
9, 10, 11
01,05,
13,22,30
120
ns
ns
AVAV
02,06,
14,23,31
100
03,07,15,
24,32
85
70
04,08,16,
25,33,42,
43
09,17,
26,34
55
45
35
10,18,
27,35
11,19,
28,36
47
30
25
12,20,
29,37
21,38-40
41,44
45,46
All
20
15
12
2/
M,D,P
9 1/
See footnotes at end of table.
SIZE
STANDARD
5962-89598
A
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
REVISION LEVEL
L
SHEET
10
DSCC FORM 2234
APR 97
TABLE I. Electrical performance characteristics Continued.
Test
Symbol
Conditions
-55 C +125 C
= 0 V; 4.5 V 5.5 V
unless otherwise specified
Group A
subgroups
Device
types
Limits
Max
Unit
ns
T
C
V
V
CC
Min
SS
Address access time
t
See figure 4, as applicable
9, 10, 11
01,05,
13,22,
30
120
100
85
AVQV
02,06,
14,23,
31
03,07,
15,24,
32
04,08,
16,25,
33,42,
43
70
09,17,
26,34
55
45
35
10,18,
27,35
11,19,
28,36
47
30
25
12,20,
29,37
21,
20
38-40
41,44
45,46
All
15
12
2/
M,D,P
9 1/
See footnotes at end of table.
SIZE
STANDARD
5962-89598
A
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
REVISION LEVEL
L
SHEET
11
DSCC FORM 2234
APR 97
TABLE I. Electrical performance characteristics Continued.
Test
Symbol
Conditions
-55 C +125 C
= 0 V; 4.5 V 5.5 V
unless otherwise specified
Group A
subgroups
Device
types
Limits
Max
Unit
ns
T
C
Min
V
V
CC
SS
Chip enable access
time
t
See figure 4, as applicable
9, 10, 11
01,05,
13,22,30
120
100
85
ELQV
02,06,
14,23,31
03,07,
15,24,32
04,08,
70
16,25,
33,42,43
09,17,
26,34
55
45
35
10,18,
27,35
11,19,
28,36
47
30
25
12,20,
29,37
21,38-40
41,44
45,46
All
20
15
12
2/
M,D,P
9 1/
See footnotes at end of table.
SIZE
STANDARD
5962-89598
A
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
REVISION LEVEL
L
SHEET
12
DSCC FORM 2234
APR 97
TABLE I. Electrical performance characteristics Continued.
Test
Symbol
Conditions
-55 C +125 C
= 0 V; 4.5 V 5.5 V
unless otherwise specified
Group A
subgroups
Device
types
Limits
Max
Unit
ns
T
C
Min
V
V
CC
SS
Output enable to output
valid
9, 10, 11
01,02,
05,06,
13,14,
22,23,
30,31
50
See figure 4, as applicable
t
OLQV
42, 43
35
30
03,07,
15,24,32
04,08,
16,25,33
25
20
09,10,
17,18,
26,27,
34,35
11,19,
28,36
15
47
12
10
12,20,
29,37
21,38,
41,44,
45,46
7
39,40
All
6
M,D,P
9 1/
2/
See footnotes at end of table.
SIZE
STANDARD
5962-89598
A
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
REVISION LEVEL
L
SHEET
13
DSCC FORM 2234
APR 97
TABLE I. Electrical performance characteristics Continued.
Test
Symbol
Conditions
+125 C
5.5 V
unless otherwise specified
Group A
subgroups
Device
types
Limits
Max
Unit
-55 C
T
C
V
= 0 V; 4.5 V
V
CC
Min
SS
Output hold after
address change
t
t
t
See figure 4, as applicable
M,D,P
9, 10, 11
9 1/
All
All
3
ns
ns
ns
AVQX
ELQX
EHQZ
2/
3
Chip enable to
output in low Z
3/ 7/
9, 10, 11
9 1/
M,D,P
2/
Chip disable to output
in high Z
9, 10, 11
01-08,
13-16,
22-25,
30-33,
42, 43
30
3/ 7/
09,10,
17,18,
26,27,
34,35
20
15
11,19,
28,36,
47
12,20,
29,37
10
8
21,38-
40
41,44,
45,46
7
M,D,P
M,D,P
9 1/
All
All
2/
Output enable
to output in low Z
3/ 7/
t
9, 10, 11
9 1/
0
ns
OLQX
2/
See footnotes at end of table.
SIZE
STANDARD
5962-89598
A
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
REVISION LEVEL
L
SHEET
14
DSCC FORM 2234
APR 97
TABLE I. Electrical performance characteristics Continued.
Test
Symbol
Conditions
+125 C
5.5 V
unless otherwise specified
Group A
subgroups
Device
types
Limits
Max
Unit
ns
-55 C
T
C
V
= 0 V; 4.5 V
V
CC
Min
SS
Output disable to
output in high Z
t
See figure 4, as applicable
9, 10, 11
01-08,
13-16,
22-25,
30-33,
42,43
30
OHQZ
3/ 7/
09,10,
17,18,
26,27,
34,35
20
11,19,
28,36
15
10
8
12,20,
29,37
21,38,
47
41,44,
45,46
7
39,40
All
6
M,D,P
9 1/
2/
See footnotes at end of table.
SIZE
STANDARD
5962-89598
A
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
REVISION LEVEL
L
SHEET
15
DSCC FORM 2234
APR 97
TABLE I. Electrical performance characteristics - Continued.
Conditions
+125 C
5.5 V
unless otherwise specified
Test
Symbol
Group A
subgroups
Device
types
Limits
Max
Unit
-55 C
T
C
Min
V
= 0 V; 4.5 V
V
CC
SS
Write cycle time
t
See figure 4, as applicable
9, 10, 11
01,05,
13,22,
30
120
ns
AVAV
02,06,
14,23,
31
100
85
03,07,
15,24,
32
04,08,
16,25,
33,42,
43
70
09,17,
26,34
55
45
35
10,18,
27,35
11,19,
28,36
47
30
25
12,20,
29,37
21,
20
38-40
41,44
45,46
All
15
12
2/
0
M,D,P
M,D,P
9 1/
Address setup to
beginning of write
t
t
9, 10, 11
9 1/
All
ns
ns
AVWL
AVEL
2/
5
Data hold after end of
write
t
t
9, 10, 11
01-04
05-47
All
WHDX
EHDX
0
M,D,P
9 1/
2/
See footnotes at end of table.
SIZE
STANDARD
5962-89598
A
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
REVISION LEVEL
L
SHEET
16
DSCC FORM 2234
APR 97
TABLE I. Electrical performance characteristics - Continued.
Conditions
-55 C +125 C
= 0 V; 4.5 V 5.5 V
unless otherwise specified
Test
Symbol
Group A
subgroups
Device
types
Limits
Max
Unit
ns
T
C
V
V
CC
Min
SS
Write pulse width
t
See figure 4, as applicable
9, 10, 11
05,13,22,30
06,14,23,31
07,15, 24,32
42, 43
100
80
70
65
50
40
WLWH
01
10,18, 27,35
02,03
04,08, 09,16,
17,25, 26,33,
34
35
11,19, 28,36
12,20, 29,37
47
30
20
22
15
12
11
2/
21, 38-40
41,44
45,46
All
M,D,P
9 1/
Address setup to
end of write
t
t
9, 10, 11
01,05, 13,22,
30
100
ns
AVWH
ELWH
Chip select to end
of write
02,06, 14,23,
31
85
75
03,07, 15,24,
32
42, 43
65
60
04,08, 16,25,
33
09,17, 26,34
10,18, 27,35
11,19, 28,36
47
45
35
25
22
20
15
12
11
2/
12,20, 29,37
21,38
39-41,44
45, 46
All
M,D,P
9 1/
See footnotes at end of table.
SIZE
STANDARD
5962-89598
A
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
REVISION LEVEL
L
SHEET
17
DSCC FORM 2234
APR 97
TABLE I. Electrical performance characteristics - Continued.
Test
Symbol
Conditions
-55 C +125 C
= 0 V; 4.5 V 5.5 V
unless otherwise specified
Group A
subgroups
Device
types
Limits
Max
Unit
ns
T
C
V
V
CC
SS
Min
5
01-10, 13-18,
22-27, 30-35,
44-46
Address hold after
end of write
t
t
See figure 4, as applicable
9, 10, 11
WHAX
EHAX
11,12,19-21,
28,29,36-43,
47
0
All
2/
M,D,P
9 1/
01,02,05, 06,
13,14, 22,23,
30,31
40
Data setup to end of
write
t
t
9, 10, 11
ns
DVWH
DVEH
03,07,
35
30
15,24,32
04,08, 16,25,
33,42,43
09,17, 26,34
25
20
10,11,18, 19,
27,28, 35,36
47
18
15
10
8
12,20, 29,37
21,38-40
41,44, 45,46
All
2/
M,D,P
9 1/
01-08, 13-16,
22-25, 30-33,
42, 43
35
20
Write enable to output
t
9, 10, 11
ns
WLQZ
disable
3/ 7/
09,10, 17,18,
26,27, 34,35
11,19, 28,36
12,20, 29,37
21,38-40
47
15
10
9
8
41, 44-46
All
7
2/
M,D,P
9 1/
Output active after
end of write 3/
t
See figure 4, as applicable
9, 10, 11
All
5
ns
WHQX
M,D,P
9 1/
2/
See footnotes at end of table.
SIZE
STANDARD
5962-89598
A
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
REVISION LEVEL
SHEET
L
18
DSCC FORM 2234
APR 97
TABLE I. Electrical performance characteristics - Continued.
Test
Conditions
+125 C
5.5 V
unless otherwise specified
Symbol
Group A
subgroups
Device
types
Limits
Max
Unit
-55 C
T
C
Min
0
V
= 0 V; 4.5 V
V
CC
SS
Retention time 3/
t
t
See figure 4, as applicable
M,D,P
9, 10, 11
9 1/
All
ns
ns
CDR
R
2/
01,05,
13,22,
30
120
Operation recovery time
3/
9, 10, 11
02,06,
14,23,
31
100
85
03,07,
15,24,
32
04,08,
16,25,
33,42,
43
70
09,17,
26,34
55
45
35
10,18,
27,35
11,19,
28,36
47
30
25
12,20,
29,37
21,
38- 40
20
41,44
45,46
All
15
12
2/
M,D,P
9 1/
1/ When performing postirradiation electrical measurements for any RHA level TA = +25 C. Limits shown are guaranteed at
TA = +25 C 5 C. The M, D, and P in the test condition column are the postirradiation limits for the device types specified in
the device types column.
2/ Preirradiation values for RHA marked devices shall also be the postirradiation values unless otherwise specified.
3/ This parameter is tested initially and after any design or process change which could affect this parameter, and therefore
shall be guaranteed to the limits specified in table I.
4/ Functional tests shall include the test table and other test patterns used for fault detection as approved by the qualifying
activity. Outputs are measured at V
< 1.5 V, V > 1.5 V.
OL
OH
5/ For timing waveforms see figure 4 and for output load circuits, see figure 5.
6/ AC measurements assume transition time 5 ns, input levels are from ground to 3.0 V, and output load C
except as noted on figure 5. Timing reference levels are 1.5 V.
30 pF
L
7/ Transition is measured 500 mV from steady state voltage.
SIZE
STANDARD
MICROCIRCUIT DRAWING
5962-89598
A
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
REVISION LEVEL
L
SHEET
19
DSCC FORM 2234
APR 97
Case Y
Inches
Millimeters
Symbol
Min
Max
.165
.120
Ref.
Ref.
Typ.
Ref.
.045
.838
Ref.
.431
.445
.380
Min
Max
4.19
3.05
---
A
.120
.088
.070
.010
.030R
.020
.025
.816
.750
.419
.430
.360
3.05
2.24
1.78
0.25
0.76
0.51
0.64
A1
A2
B
---
B1
B2
B3
D
---
---
1.14
20.73 21.29
19.05 ---
D1
E
10.64 10.95
10.42 11.30
E1
E2
e
9.14
9.65
.050 BSC
1.27 BSC
e1
e2
j
.038
.005
.005
.030
.020
Typ.
0.97
0.13
0.13
0.76
0.51
---
---
Typ.
.040
Typ.
---
S
1.02
---
S1
NOTE: A bottom brazed package may be shipped as an alternative package style, provided the vendor makes the
receiving customer aware of the intent to ship the part as a bottom brazed package rather than the one shown on this
figure.
FIGURE 1. Case outlines.
SIZE
STANDARD
5962-89598
A
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
REVISION LEVEL
L
SHEET
20
DSCC FORM 2234
APR 97
Case Z
Symbol
Inches
Max
Millimeters
Min
---
Min
Max
5.89
A
.232
.023
.065
.015
1.700
.405
.420
---
b
.014
.038
.008
---
0.36
0.97
0.20
---
0.58
b1
c
1.65
0.38
D
41.05
10.29
10.67
E
.350
.390
9.78
9.91
E1
e
.100 BSC
2.54 BSC
L
.125
.150
.015
---
.200
---
3.18
3.81
0.38
---
5.08
---
L1
Q
S
.060
.100
---
1.52
2.54
S1
S2
.005
.005
0
0.13
0.13
---
---
---
---
---
15
N
32
Note: Either configuration in detail A is allowed.
FIGURE 1. Case outlines - Continued.
SIZE
STANDARD
5962-89598
A
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
REVISION LEVEL
L
SHEET
21
DSCC FORM 2234
APR 97
Case U
Symbol
Inches
Nom
Millimeters
Min
Max
Min
Max
Notes
Nom
2.29
0.64
0.36
---
A
.080
.022
.006
.040
.800
.392
.090
.025
.100
.028
.022
---
2.03
0.56
0.15
1.02
2.54
0.71
0.56
---
b
b1
b2
D
E
.014
4
---
.820
.840
.408
20.32 20.83 21.34
9.96 10.16 10.36
1.27 BSC
.400
e
.050 BSC
.012 REF
.075
h
0.30 REF
7
L
.070
.090
.003
.080
.110
.015
1.78
2.29
0.08
1.90
2.54
0.23
---
2.03
2.79
0.38
L1
L2
N
.100
5
4
8
.009
32
FIGURE 1. Case outlines – Continued.
SIZE
STANDARD
5962-89598
A
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
REVISION LEVEL
L
SHEET
22
DSCC FORM 2234
APR 97
Case U – Continued.
NOTES:
1. Dimensions are in inches.
2. Metric equivalents are given for general information only.
3. All dimensions and tolerances conform to ANSI Y14.5M-1982.
4. Metallized castellations shall be connected to plane 1 terminals.
5. Index area: A pin identification mark shall be located adjacent to pin one within the shaded area shown.
Plane 1 terminal identification may be an extension of the length of the metallized terminal which shall not be
wider than the b dimension.
6. The cover shall not extend beyond the edges of the body.
7. The corner shape (square, notch, radius, etc.) may vary at the manufacturer's option.
8. N indicates the number of terminals.
9. Unless otherwise specified, a minimum clearance of .015 inch (.381 mm) shall be maintained between all
metallized features (e.g., lid, castellation, terminals, thermal pads, etc.).
10. Solder finish is optional with a maximum allowable thickness of .007 inch. Measurement of dimensions A, b1,
and L2 may be made prior to solder application.
FIGURE 1. Case outlines – Continued.
SIZE
STANDARD
5962-89598
A
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
REVISION LEVEL
L
SHEET
23
DSCC FORM 2234
APR 97
Case T
Symbol
Inches
Millimeters
Notes
Min
Max
.125
.019
.009
.830
.420
.450
---
Min
Max
3.18
0.48
0.23
21.08
A
.097
.015
.003
---
2.46
0.38
0.08
---
b
5
5
3
c
D
E
.400
---
10.16 10.67
E1
E2
E3
e
---
11.43
---
3
.180
.030
4.57
0.76
---
---
9
.050 BSC
1.27 BSC
4,6
L
.250
.026
---
.370
.045
.045
---
6.35
0.66
---
9.40
1.14
1.14
---
Q
S
7
S1
S2
.000
---
0.00
---
7,8
---
---
---
---
---
---
N
32
6
NOTES:
1. Index area; a notch or a pin one identification mark shall be located adjacent to pin one and shall be located within the
shaded area shown. The manufacturer's identification shall not be used as a pin one identification mark. Alternatively,
a tab (dim. k) may be used to identify pin one. This tab may be located in the shaded area on either side of the terminal
as shown in detail G, or it may be located in the shaded area as shown in detail H.
2. Dimension Q shall be measured at the point of exit of the lead from the body. Dimension Q minimum shall be reduced
by .0015 inch (0.038 mm) maximum when lead finish A is applied.
3. This dimension allows for off-center lid, meniscus, and glass overrun.
4. The basic lead spacing is .050 (1.27 mm) between centerlines. Each lead centerline shall be located within .005 (0.13
mm) of its exact longitudinal position relative to lead 1 and the highest numbered (N) lead.
5. All leads - Increase maximum limit by .003 (0.08 mm) measured at the center of the flat, when lead finish A or B is
applied.
6. Total number of spaces = (N-2). Symbol "N" is the maximum number of leads.
7. Measure all four corner leads.
8. Dimension S1 (see 5.2.2 of MIL-STD-1835) may be .000 (0.00 mm) if the corner leads, upon entering the body of the
package, and within one lead's width, bend toward the die cavity. See 5.2.2 of MIL-STD-1835 for measurement of S1
on bottom-brazed flat packs.
9. Bottom brazed lead configuration. If this configuration is used, no organic or polymeric materials shall be molded to the
bottom of the package to cover the leads.
10. Dimensions are in inches.
11. Metric equivalents are given for general information only.
12. Case outline configurations 3 and 4 and all bottom-brazed outlines with a "Q" dimension less than .026 inch (0.66 mm)
minimum, but not less than .010 inch (.025 mm) minimum, are acceptable only for use in equipment designed or
redesigned on or before 29 November 1986.
13.
FIGURE 1. Case outlines – Continued.
SIZE
STANDARD
5962-89598
A
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
REVISION LEVEL
L
SHEET
24
DSCC FORM 2234
APR 97
Case N
Symbol
Inches
Millimeters
Min
.070
.022
.009 R
.038
.445
.295
.695
.395
Max
.100
.028
Min
Max
2.54
0.71
A
1.78
0.56
b
b1
b2
D
.23 R
.97
.042
.460
.305
.715
.405
1.07
11.68
7.75
---
11.30
7.49
D1
E
17.65
10.03
E1
e
10.29
.050 TYP
1.27 TYP
h
.020 REF
.035 REF
.51 REF
.89 REF
J
L
.045
.077
.055
.093
1.14
1.96
1.40
2.36
L1
FIGURE 1. Case outlines – Continued.
SIZE
STANDARD
5962-89598
A
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
REVISION LEVEL
L
SHEET
25
DSCC FORM 2234
APR 97
Case 9
FIGURE 1. Case outlines – Continued.
SIZE
STANDARD
5962-89598
A
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
REVISION LEVEL
L
SHEET
26
DSCC FORM 2234
APR 97
Case 9 – Continued.
Symbol
Inches
Min
Millimeters
Max
.177
Min
Max
4.50
2.26
A
.141
.073
3.58
1.85
A1
A2
A3
B
.089
.078 REF
1.98 REF
.033
.065
.84
1.65
.017 REF
.028 REF
.43 REF
.71 REF
11.63
B1
D
.445
.458
.310
.440
.710
.410
.690
11.30
7.37
D3
D4
E
.290
.400
.695
.390
.650
7.87
11.18
18.03
10.41
17.53
10.16
17.65
9.91
E3
E4
e
16.51
.050 TYP
1.27 TYP
e1
h
.007 REF
.020 REF
.18 REF
.51 REF
L
.075
.115
1.91
2.92
Q
.040 MIN
1.02 MIN
R1
S1
.023 R REF TYP
.58 R REF TYP
.003
.035
.08
.89
FIGURE 1. Case outlines - Continued.
SIZE
STANDARD
5962-89598
A
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
REVISION LEVEL
L
SHEET
27
DSCC FORM 2234
APR 97
Case 8
Symbol
Inches
Max
.500 11.68 12.70
.040 0.51 1.02
Millimeters
Notes
3
Min
Min Max
A
.460
.020
.440
.565
.016
.008
A1
A2
A3
B
.460 11.18 11.68
.645 14.35 16.38
.020
.012
0.41
0.20
0.51
0.30
C
D
1.630 1.670 41.40 42.42
.090 .130 2.29 3.30
.050 BSC 1.27 BSC
.100 BSC 2.54 BSC
6
1
E
e1
eA
L
.125
.155
.105
3.18
3.95
2.67
M
N
.055
1.40
32
S
.030
.070
0.76
1.78
NOTES:
1. N is the number of leads.
2. The chamfer on the body is optional. If is not present, a visual index feature must be located within the cross hatched
area.
3. Lead configuration in this area is optional.
4. Controlling dimension: Inches.
5. Solder finish is optional. However, if leads are solder dipped or plated, increase maximum limit of all leads by 0.003"
from center of flat.
6. The cover shall not extend beyond the edges of the ceramic body.
FIGURE 1. Case outlines - Continued.
SIZE
STANDARD
5962-89598
A
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
REVISION LEVEL
L
SHEET
28
DSCC FORM 2234
APR 97
Case 7
Symbol
Millimeters
Inches
Min
Min
3.35
0.66
0.38
0.76
Max
3.66
0.91
0.48
1.02
Max
.144
.036
.019
.040
.828
.760
.415
.445
.380
A
.132
.026
.015
.030
.812
.740
.405
.435
.360
A2
b
B1
D
20.62 21.03
18.80 19.30
10.29 10.54
11.05 11.30
D1
E
E1
E2
e
9.14
9.85
1.27 BSC
.050 BSC
N
32
FIGURE 1. Case outlines - continued.
SIZE
STANDARD
5962-89598
A
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
REVISION LEVEL
L
SHEET
29
DSCC FORM 2234
APR 97
01 through 12,
22 through 29,39,
40,42 through 46
13 through 21,
30 through 38,
41,47
01 through 12,
22 through 29,
39
Device types
8
Case outlines
X, Y, Z, U, T, N, M, 9, and 7
Terminal symbol
Terminal number
NC
1
2
3
4
5
6
7
8
NC
NC
A16
A14
A12
A7
VCC
A16
A14
A12
A7
A16
A15
A14
A6
A6
NC
A12
A5
A5
A4
A4
WE
A7
9
10
11
12
13
14
15
16
17
18
A3
A3
A2
A2
A13
A6
A1
A1
A0
A0
A8
I/O0
I/O1
I/O2
VSS
I/O3
I/O4
I/O0
I/O1
I/O2
VSS
I/O3
I/O4
A5
A9
A4
A11
A3
OE
A2
19
20
21
22
I/O5
I/O6
I/O7
I/O5
I/O6
I/O7
A10
A1
CS
CE
A10
CE 1
A10
23
24
A0
I/O7
OE
A11
A9
OE
A11
A9
25
26
27
28
29
30
31
32
I/O0
I/O6
I/O1
I/O5
I/O2
I/O4
VSS
I/O3
A8
A8
A13
A13
WE
WE
NC
A15
VCC
CE2
A15
VCC
NC = No connection
FIGURE 2. Terminal connections.
SIZE
STANDARD
MICROCIRCUIT DRAWING
5962-89598
A
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
REVISION LEVEL
SHEET
L
30
DSCC FORM 2234
APR 97
Mode
*CE2
I/O
WE
CE
H
OE
Standby
Standby
Read
X
L
X
X
High Z
High Z
DOUT
X
L
L
L
X
H
L
X
L
H
H
H
Write
X
H
DIN
Read
H
High Z
H = logic "1" state, L = logic "0" state.
X = logic "don't care" state, and Z = high impedance state.
* = only applies to devices with dual CE .
FIGURE 3. Truth table.
SIZE
STANDARD
MICROCIRCUIT DRAWING
5962-89598
A
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
REVISION LEVEL
L
SHEET
31
DSCC FORM 2234
APR 97
Read Cycle (see notes 1 and 2)
NOTES:
1. WE is held high during the read cycle.
2. Timing measurement reference level is 1.5 V.
FIGURE 4. Timing waveform diagrams.
SIZE
STANDARD
5962-89598
A
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
REVISION LEVEL
L
SHEET
32
DSCC FORM 2234
APR 97
Write cycle 1 (see notes 1, 2, and 3)
( CE 1 or CE2 controlled)
NOTES:
1. Either CE 1 or CE2 may be used to control the write cycle. If CE 1 is used, CE2 should be high when WE is low. If
CE2 is used, CE 1 should be low when WE is low.
2. In a CE 1 or CE2 controlled write cycle, the outputs assume a high impedance state, whether OE is high or low, as
long as WE is low.
3. Timing measurement reference is 1.5 V.
FIGURE 4. Timing waveform diagrams - Continued.
SIZE
STANDARD
5962-89598
A
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
REVISION LEVEL
L
SHEET
33
DSCC FORM 2234
APR 97
Write cycle 2 (see notes 1 and 2)
( WE controlled)
NOTES:
1. In the WE controlled write cycle, while WE is low, it will force the outputs into a high impedance state, whether OE
is high or low.
2. Timing measurement reference level is 1.5 V.
FIGURE 4. Timing waveform diagrams - Continued.
SIZE
STANDARD
5962-89598
A
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
REVISION LEVEL
L
SHEET
34
DSCC FORM 2234
APR 97
Data retention Waveform (see notes 1 and 2)
NOTES:
1. Either CE 1 or CE2 may be used to begin data retention mode.
2. For tCDR and tR: CE 1
VCC -0.2 V or CE2 0.2 V, VIN VCC -2.0 V or VIN 0.2 V.
FIGURE 4. Timing waveform diagrams - Continued.
SIZE
STANDARD
MICROCIRCUIT DRAWING
5962-89598
A
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
REVISION LEVEL
L
SHEET
35
DSCC FORM 2234
APR 97
NOTES:
1.
2.
3.
Use these output load circuits or equivalent for testing.
Including scope and jig.
Minimum of 5 pF for t
, t
, t
, t
, and t
.
WHQX
EHQZ OHQZ ELQX OLQX
FIGURE 5. Output load circuits.
SIZE
STANDARD
MICROCIRCUIT DRAWING
5962-89598
A
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
REVISION LEVEL
L
SHEET
36
DSCC FORM 2234
APR 97
NOTE: Input protection resistors = 1 k .
FIGURE 6. Bias conditions for irradiation testing.
SIZE
STANDARD
5962-89598
A
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
REVISION LEVEL
L
SHEET
37
DSCC FORM 2234
APR 97
TABLE IIA. Electrical test requirements. 1/ 2/ 3/ 4/ 5/ 6/ 7/
Line
no.
Test requirements
Subgroups
(in accordance with
MIL-STD-883,
Subgroups
(in accordance with
MIL-PRF-38535, table III)
TM 5005, table I)
Device
class M
Device
class Q
Device
class V
1
2
Interim electrical
1, 7, 9
parameters (see 4.2)
Static burn-in
(method 1015)
Not
required
Not
required
Required
3
4
Same as line 1
1*, 7*
Dynamic burn-in
(method 1015)
Required
Required
Required
5
6
Same as line 1
1*, 7*
Final electrical
parameters (see 4.2)
1*, 2, 3, 7*, 8A,
8B, 9, 10, 11
1*, 2, 3, 7*, 8A,
8B, 9, 10, 11
1*, 2, 3, 7*, 8A,
8B, 9, 10, 11
7
8
Group A test
1, 2, 3, 4**, 7,
1, 2, 3, 4**, 7,
1, 2, 3, 4**, 7,
requirements (see 4.4)
8A, 8B, 9, 10, 11
8A, 8B, 9, 10, 11
8A, 8B, 9, 10, 11
Group C end-point
electrical
parameters (see 4.4)
2, 3, 7,
8A, 8B
1, 2, 3, 7,
8A, 8B
1, 2, 3, 7, 8A,
8B, 9, 10, 11
9
Group D end-point
electrical
2, 3, 8A, 8B
1, 7, 9
2, 3, 8A, 8B
1, 7, 9
2, 3, 8A, 8B
1, 7, 9
parameters (see 4.4)
10
Group E end-point
electrical
parameters (see 4.4)
1/ Blank spaces indicate tests are not applicable.
2/ Any or all subgroups may be combined when using high-speed testers.
3/ Subgroups 7 and 8 functional tests shall verify the truth table.
4/ * indicates PDA applies to subgroup 1 and 7.
5/ ** see 4.4.1e.
6/ indicates delta limit (see table IIB) shall be required where specified, and the delta values shall be
computed with reference to the previous interim electrical parameters (see line 1).
7/ See 4.4.1d.
TABLE IIB. Delta limits at +25 C.
Parameter 1/
Device types
All
10% of specified
value in table I
I
I
I
standby
CC3
10% of specified
value in table I
, I
IH IL
10% of specified
value in table I
, I
OHZ OLZ
1/ The above parameter shall be recorded before and after
the required burn-in and life tests to determine the delta
.
SIZE
STANDARD
5962-89598
A
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
REVISION LEVEL
L
SHEET
38
DSCC FORM 2234
APR 97
4.2.1 Additional criteria for device class M.
a. Delete the sequence specified as initial (preburn-in) electrical parameters through interim (postburn-in)
electrical parameters of method 5004 and substitute lines 1 through 6 of table IIA herein.
b. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made
available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs,
biases, and power dissipation, as applicable, in accordance with the intent specified in test method 1015.
(1) Dynamic burn-in (method 1015 of MIL-STD-883, test condition D; for circuit, see 4.2.1b herein).
c. Interim and final electrical parameters shall be as specified in table IIA herein.
4.2.2 Additional criteria for device classes Q and V.
a. The burn-in test duration, test condition and test temperature, or approved alternatives shall be as specified in the
device manufacturer's QM plan in accordance with MIL-PRF-38535. The burn-in test circuit shall be maintained
under document revision level control of the device manufacturer's Technology Review Board (TRB) in accordance
with MIL-PRF-38535 and shall be made available to the acquiring or preparing activity upon request. The test
circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent
specified in test method 1015 of MIL-STD-883.
b. Interim and final electrical test parameters shall be as specified in table IIA herein.
c. Additional screening for device class V beyond the requirements of device class Q shall be as specified in MIL-PRF-
38535, appendix B.
4.3 Qualification inspection for device classes Q and V. Qualification inspection for device classes Q and V shall be in
accordance with MIL-PRF-38535. Inspections to be performed shall be those specified in MIL-PRF-38535 and herein for
groups A, B, C, D, and E inspections (see 4.4.1 through 4.4.4).
4.4 Conformance inspection. Technology conformance inspection for classes Q and V shall be in accordance with MIL-
PRF-38535 including groups A, B, C, D, and E inspections and as specified herein except where option 2 of MIL-PRF-38535
permits alternate in-line control testing. Quality conformance inspection for device class M shall be in accordance with MIL-
PRF-38535, appendix A and as specified herein. Inspections to be performed for device class M shall be those specified in
method 5005 of MIL-STD-883 and herein for groups A, B, C, D, and E inspections (see 4.4.1 through 4.4.4).
4.4.1 Group A inspection.
a. Tests shall be as specified in table IIA herein.
b. Subgroups 5 and 6 of table I of method 5005 of MIL-STD-883 shall be omitted.
c. For device class M, subgroups 7 and 8 tests shall be sufficient to verify the truth table. For device classes Q and V,
subgroups 7 and 8 shall include verifying the functionality of the device; these tests shall have been fault graded in
accordance with MIL-STD-883, test method 5012 (see 1.5 herein).
d. O/V (latch-up) tests shall be measured only for initial qualification and after any design or process changes which
may affect the performance of the device. For device class M, procedures and circuits shall be maintained under
document revision level control by the manufacturer and shall be made available to the preparing activity or
acquiring activity upon request. For device classes Q and V, the procedures and circuits shall be under the control
of the device manufacturer's TRB in accordance with MIL-PRF-38535 and shall be made available to the preparing
activity or acquiring activity upon request. Testing shall be on all pins, on five devices with zero failures. Latch-up
test shall be considered destructive. Information contained in JEDEC Standard EIA/JESD 78 may be used for
reference.
e. Subgroup 4 (C and C
IN OUT
measurements) shall be measured only for initial qualification and after any process or
design changes which may affect input or output capacitance. Capacitance shall be measured between the
designated terminal and GND at a frequency of 1 MHz. Sample size is 15 devices with no failures, and all input and
output terminals tested.
4.4.2 Group C inspection. The group C inspection end-point electrical parameters shall be as specified in table IIA
herein.
SIZE
STANDARD
5962-89598
A
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
REVISION LEVEL
L
SHEET
39
DSCC FORM 2234
APR 97
4.4.2.1 Additional criteria for device class M. Steady-state life test conditions, method 1005 of MIL-STD-883:
a. Test condition D. The test circuit shall be maintained by the manufacturer under document revision level control
and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the
inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in test method
1005 of MIL-STD-883.
b. TA = +125 C, minimum.
c. Test duration: 1,000 hours, except as permitted by method 1005 of MIL-STD-883.
4.4.2.2 Additional criteria for device classes Q and V. The steady-state life test duration, test condition and test
temperature, or approved alternatives shall be as specified in the device manufacturer's QM plan in accordance with MIL-
PRF-38535. The test circuit shall be maintained under document revision level control by the device manufacturer's TRB in
accordance with MIL-PRF-38535 and shall be made available to the acquiring or preparing activity upon request. The test
circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified
in test method 1005 of MIL-STD-883.
4.4.3 Group D inspection. The group D inspection end-point electrical parameters shall be as specified in table IIA herein.
4.4.4 Group E inspection. Group E inspection is required only for parts intended to be marked as radiation hardness
assured (see 3.5 herein).
a.End-point electrical parameters shall be as specified in table IIA herein.
b.For device classes Q and V, the devices or test vehicle shall be subjected to radiation hardness assured tests as
specified in MIL-PRF-38535 for the RHA level being tested. For device class M, the devices shall be subjected to
radiation hardness assured tests as specified in MIL-PRF-38535, appendix A for the RHA level being tested. All
device classes must meet the postirradiation end-point electrical parameter limits as defined in table I at TA = +25 C
5 C, after exposure, to the subgroups specified in table IIA herein.
c. When specified in the purchase order or contract, a copy of the RHA delta limits shall be supplied.
4.4.4.1 Total dose irradiation testing. Total dose irradiation testing shall be performed in accordance with MIL-STD-883
method 1019 condition A, and as specified herein.
4.4.4.1.1 Accelerated aging test. Accelerated aging tests shall be performed on all devices requiring a RHA level greater
than 5k rads(Si). The post-anneal end-point electrical parameter limits shall be as specified in table I herein and shall be the
pre-irradiation end-point electrical parameter limit at 25 C 5 C. Testing shall be performed at initial qualification and after
any design or process changes which may affect the RHA response of the device.
4.4.4.2 Dose rate induced latchup testing. Dose rate induced latchup shall not occur under any recommended operating
condition.
4.4.4.3 Dose rate upset testing. Dose rate upset testing shall be performed in accordance with test method 1021 of MIL-
STD-883 and herein.
a.Transient dose rate upset testing for class M devices shall be performed at initial qualification and after any design or
process changes which may effect the RHA performance of the devices. Test 10 devices with 0 defects unless
otherwise specified.
b.Transient dose rate upset testing for class Q and V devices shall be performed as specified by a TRB approved
radiation hardness assurance plan and MIL-PRF-38535. Device parametric parameters that influence upset
immunity shall be monitored at the wafer level in accordance with the wafer level hardness assurance plan and
MIL-PRF-38535.
c. The transient dose rate upset level shall be greater than or equal to 510 rads(Si)/s with a pulse width less than or
equal to 1.0 s.
SIZE
STANDARD
5962-89598
A
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
REVISION LEVEL
L
SHEET
40
DSCC FORM 2234
APR 97
4.4.4.4 Single event phenomena (SEP). SEP testing shall be required on class V devices (see 1.4 herein). SEP testing
shall be performed on a technology process on the Standard Evaluation Circuit (SEC) or alternate SEP test vehicle as
approved by the qualifying activity at inital qualification and after any design or process changes which may affect the upset
or latchup characteristics. The recommended test conditions for SEP are as follows:
a. The ion beam angle of incidence shall be between normal to the die surface and 60 to the normal, inclusive (i.e.
0
angle 60 ). No shadowing of the ion beam due to fixturing or package related effects is allowed.
b. The fluence shall be 100 errors or 107 ions/cm2.
c. The flux shall be between 102 and 105 ions/cm2/s. The cross-section shall be verified to be flux independent by
measuring the cross-section at two flux rates which differ by at least an order of magnitude.
d. The particle range shall be 20 microns in silicon.
e. The test temperature shall be +25 C and the maximum rated operating temperature 10 C.
f. Bias conditions shall be VCC = 4.5 V dc for the upset measurements and VCC = 5.5 V dc for the latchup
measurements.
4.5 Delta measurements for device class V. Delta measurements, as specified in table IIA, shall be made and recorded
before and after the required burn-in screens and steady-state life tests to determine delta compliance. The electrical
parameters to be measured, with associated delta limits are listed in table IIB. The device manufacturer may, at his option,
either perform delta measurements or within 24 hours after life test perform final electrical parameter tests, subgroups 1, 7,
and 9.
5. PACKAGING
5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-PRF-38535 for device
classes Q and V or MIL-PRF-38535, appendix A for device class M.
6. NOTES
6.1 Intended use. Microcircuits conforming to this drawing are intended for use for Government microcircuit applications
(original equipment), design applications, and logistics purposes.
6.1.1 Replaceability. Microcircuits covered by this drawing will replace the same generic device covered by a contractor
prepared specification or drawing.
6.1.2 Substitutability. Device class Q devices will replace device class M devices.
6.2 Configuration control of SMD's. All proposed changes to existing SMD's will be coordinated with the users of record
for the individual documents. This coordination will be accomplished in accordance with MIL-STD-973 using DD Form 1692,
Engineering Change Proposal.
6.3 Record of users. Military and industrial users should inform Defense Supply Center Columbus when a system
application requires configuration control and which SMD's are applicable to that system. DSCC will maintain a record of
users and this list will be used for coordination and distribution of changes to the drawings. Users of drawings covering
microelectronic devices (FSC 5962) should contact DSCC-VA, telephone (614) 692-0525.
6.4 Comments. Comments on this drawing should be directed to DSCC-VA , Columbus, Ohio 43216-5000, or telephone
(614) 692-0674.
6.5 Abbreviations, symbols, and definitions. The abbreviations, symbols, and definitions used herein are defined in
MIL-PRF-38535, MIL-HDBK-1331, and as follows:
C
C
Input and bi-directional output, terminal-to-GND capacitance.
IN, OUT .........................................
GND.................................................... Ground zero voltage potential.
I
I
I
..................................................... Supply current.
....................................................... Input current low.
....................................................... Input current high.
CC
IL
IH
SIZE
STANDARD
5962-89598
A
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
REVISION LEVEL
L
SHEET
41
DSCC FORM 2234
APR 97
T ....................................................... Case temperature.
C
T ....................................................... Ambient temperature.
A
V
V
.................................................... Positive supply voltage.
CC
...................................................... Positive input clamp voltage.
IC
O/V ..................................................... Latch-up over-voltage.
6.5.1 Timing parameter abbreviations. All timing abbreviations use lower case characters with upper case character
subscripts. The initial character is always "t" and is followed by four descriptors. These characters specify two signal points
arranged in a "from-to" sequence that define a timing interval. The two descriptors for each signal specify the signal name
and the signal transitions. Thus the format is:
t
X
X
X
X
Signal name from which interval is derived
Transition direction for first signal
Signal name to which interval is defined
Transition direction for second signal
a. Signal definitions:
A = Address
D = Data in
Q = Data out
W = Write enable
E = Chip enable
O = Output enable
b. Transition definitions:
H = Transition to high
L = Transition to low
V = Transition to valid
X = Transition to invalid or don't care
Z = Transition to off (high impedance)
6.5.2.1 Timing limits. The table of timing values shows either a minimum or a maximum limit for each parameter. Input
requirements are specified from the external system point of view. Thus, address setup time is shown as a minimum since
the system must supply at least that much time (even though most devices do not require it). On the other hand, responses
from the memory are specified from the device point of view. Thus, the access time is shown as a maximum since the
device never provides data later than that time.
6.5.3 Waveforms.
6.6 Sources of supply.
6.6.1 Sources of supply for device classes Q and V. Sources of supply for device classes Q and V are listed in
QML-38535. The vendors listed in QML-38535 have submitted a certificate of compliance (see 3.6 herein) to DSCC-VA and
have agreed to this drawing.
6.6.2 Approved sources of supply for device class M. Approved sources of supply for class M are listed in MIL-HDBK-
103. The vendors listed in MIL-HDBK-103 have agreed to this drawing and a certificate of compliance (see 3.6 herein) has
been submitted to and accepted by DSCC-VA.
SIZE
STANDARD
5962-89598
A
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
REVISION LEVEL
L
SHEET
42
DSCC FORM 2234
APR 97
APPENDIX A
FORMS A PART OF SMD 5962-89598
FUNCTIONAL ALGORITHMS
10. SCOPE
10.1 Scope. Functional algorithms are test patterns which define the exact sequence of events used to verify proper
operation of a random access memory (RAM). Each algorithm serves a specific purpose for the testing of the device. It is
understood that all manufacturers do not have the same test equipment; therefore, it becomes the responsibility of each
manufacturer to guarantee that the test patterns described herein are followed as closely as possible, or equivalent patterns
be used that serve the same purpose. Each manufacturer should demonstrate that this condition will be met. Algorithms
shall be applied to the device in a topologically pure fashion. This appendix is a mandatory part of the specification. The
information contained herein is intended for compliance.
20. APPLICABLE DOCUMENTS. This section is not applicable to this appendix.
30. ALGORITHMS
30.1 Algorithm A (pattern 1).
30.1.1 Checkerboard, checkerboard-bar.
Step 1. Load memory with a checkerboard data pattern by incrementing from location 0 to maximum.
Step 2. Read memory, verifying the output checkerboard pattern by incrementing from location 0 to maximum.
Step 3. Load memory with a checkerboard-bar pattern by incrementing from location 0 to maximum.
Step 4. Read memory, verifying the output checkerboard-bar pattern by incrementing from location 0 to
maximum.
30.2 Algorithm B (pattern 2).
30.2.1 March.
Step 1. Load memory with background data, incrementing from minimum to maximum address locations (All
"0's").
Step 2. Read data in location 0.
Step 3. Write complement data to location 0.
Step 4. Read complement data in location 0.
Step 5. Repeat steps 2 through 4 incrementing X-fast sequentially, for each location in the array.
Step 6. Read complement data in maximum address location.
Step 7. Write data to maximum address location.
Step 8. Read data in maximum address location.
Step 9. Repeat steps 6 through 8 decrementing X-fast sequentially for, each location in the array.
Step 10. Read data in location 0.
Step 11. Write complement data to location 0.
Step 12. Read complement data in location 0.
Step 13. Repeat steps 10 through 12 decrementing X-fast sequentially for each location in the array.
Step 14. Read complement data in maximum address location.
Step 15. Write data to maximum address location.
Step 16. Read data in maximum address location.
Step 17. Repeat steps 14 through 16 incrementing X-fast sequentially for each location in the array.
Step 18. Read background data from memory, decrementing X-fast from maximum to minimum address locations.
SIZE
STANDARD
5962-89598
A
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
REVISION LEVEL
L
SHEET
43
DSCC FORM 2234
APR 97
APPENDIX A - Continued.
30.3 Algorithm C (pattern 3).
30.2.1 XY March.
Step 1. Load memory with background data, incrementing from minimum to maximum address locations (All
"0's").
Step 2. Read data in location 0.
Step 3. Write complement data to location 0.
Step 4. Read complement data in location 0.
Step 5. Repeat steps 2 through 4 incrementing Y-fast sequentially, for each location in the array.
Step 6. Read complement data in maximum address location.
Step 7. Write data to maximum address location.
Step 8. Read data in maximum address location.
Step 9. Repeat steps 6 through 8 decrementing X-fast sequentially for each location in the array.
Step 10. Read data in location 0.
Step 11. Write complement data to location 0.
Step 12. Read complement data in location 0.
Step 13. Repeat steps 10 through 12 decrementing Y-fast sequentially for each location in the array.
Step 14. Read complement data in maximum address location.
Step 15. Write data to maximum address location.
Step 16. Read data in maximum address location.
Step 17. Repeat steps 14 through 16 incrementing X-fast sequentially for each location in the array.
Step 18. Read background data from memory, decrementing Y-fast from maximum to minimum address locations.
30.4 Algorithm D (pattern 4).
30.4.1 CEDES - CE deselect checkerboard, checkerboard-bar.
Step 1. Load memory with a checkerboard data pattern by incrementing from location 0 to maximum.
Step 2. Deselect device, attempt to load memory with checkerboard-bar data pattern by incrementing from
location 0 to maximum.
Step 3. Read memory, verifying the output checkerboard pattern by incrementing from location 0 to maximum.
Step 4. Load memory with a checkerboard-bar pattern by incrementing from location 0 to maximum.
Step 5. Deselect device, attempt to load memory with checkerboard data pattern by incrementing from location 0
to maximum.
Step 6. Read memory, verifying the output checkerboard-bar pattern by incrementing from location 0 to
maximum.
SIZE
STANDARD
5962-89598
A
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
REVISION LEVEL
L
SHEET
44
DSCC FORM 2234
APR 97
APPENDIX B
FORMS A PART OF SMD 5962-89598
SUBSTITUTION DATA
10. SCOPE
10.1 Scope. This appendix contains the PIN substitution information to support the one part-one part number system.
For new designs, after the date of this document the NEW PIN shall be used in lieu of the OLD PIN. For existing designs
prior to the date of this document the NEW PIN can be used in lieu of the OLD PIN. This appendix is a mandatory part of
the specification. The information contained herein is intended for compliance. The PIN substitution data shall be as
follows:
20. APPLICABLE DOCUMENTS
This section is not applicable to this appendix.
30. SUBSTITUTION DATA
NEW PIN
OLD PIN
5962-8959801MXX
5962-8959802MXX
5962-8959803MXX
5962-8959804MXX
5962-8959801XX
5962-8959802XX
5962-8959803XX
5962-8959804XX
SIZE
STANDARD
5962-89598
A
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
REVISION LEVEL
L
SHEET
45
DSCC FORM 2234
APR 97
APPENDIX C
FORMS A PART OF SMD 5962-89598
10. SCOPE
10.1 Scope. This appendix establishes minimum requirements for microcircuit die to be supplied under the Qualified
Manufacturers List (QML) Program. QML microcircuit die meeting the requirements of MIL-PRF-38535 and the
manufacturers approved QML plan for use in monolithic microcircuits, multichip modules (MCMs), hybrids, electronic
modules, or devices using chip and wire designs in accordance with MIL-PRF-38534 are specified herein. Two product
assurance classes consisting of military high reliability (device class Q) and space application (device Class V) are reflected
in the Part or Identification Number (PIN). When available a choice of Radiation Hardness Assurance (RHA) levels are
reflected in the PIN.
10.2 PIN. The PIN is as shown in the following example:
5962
-
89598
01
V
6
A
Federal
stock class
designator
\
RHA
designator
(see 10.2.1)
Device
type
(see 10.2.2)
Device
class
designator
(see 10.2.3)
Die
code
(see 10.2.4)
Die
Details
(see 10.2.5)
/
\/
Drawing number
10.2.1 RHA designator. Device classes Q and V RHA identified die shall meet the MIL-PRF-38535 specified RHA levels.
A dash (-) indicates a non-RHA die.
10.2.2 Device type(s). The device type(s) shall identify the circuit function as follows:
Device type
47
Generic number
65608EV-30
Circuit function
Access time
30ns
128K X 8 very low power CMOS SRAM
10.2.3 Device class designator.
Device class
Device requirements documentation
Q or V
Certification and qualification to the die requirements of MIL-PRF-38535
10.2.4 Die code. The die code designator shall be a number 6 for all devices supplied as die only with no case outline.
10.2.5. Die Details. The die details designation shall be a unique letter which designates the die’s physical dimensions,
bonding pad location(s) and related electrical function(s), interface materials, and other assembly related information, for
each product and variant supplied to this appendix.
SIZE
STANDARD
5962-89598
A
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
REVISION LEVEL
L
SHEET
46
DSCC FORM 2234
APR 97
APPENDIX C
FORMS A PART OF SMD 5962-89598
10.2.5.1 Die physical dimensions.
Die type
01
Figure number
A-1
10.2.5.2. Die bonding pad locations and electrical functions.
Die type
Figure number
A-1
01
10.2.5.3. Interface materials.
Die type
Figure number
A-1
01
10.2.5.4. Assembly related information.
Die type
01
Figure number
A-1
10.3. Absolute maximum ratings. See paragraph 1.3 within the body of this drawing for details.
10.4 Recommended operating conditions. See paragraph 1.4 within the body of this drawing for details.
20. APPLICABLE DOCUMENTS.
20.1 Government specifications, standards, and handbooks. Unless otherwise specified, the following specification,
standard, and handbook of the issue listed in that issue of the Department of Defense Index of Specifications and Standards
specified in the solicitation, form a part of this drawing to the extent specified herein.
SPECIFICATION
DEPARTMENT OF DEFENSE
MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.
STANDARDS
DEPARTMENT OF DEFENSE
MIL-STD-883 - Test Method Standard Microcircuits.
HANDBOOK
DEPARTMENT OF DEFENSE
MIL-HDBK-103 - List of Standard Microcircuit Drawings (SMD’s).
(Copies of the specification, standard, and handbook required by manufacturers in connection with specific acquisition
functions should be obtained from the contracting activity or as directed by the contracting activity).
20.2. Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the
text of this drawing shall take precedence.
SIZE
STANDARD
5962-89598
A
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
REVISION LEVEL
L
SHEET
47
DSCC FORM 2234
APR 97
APPENDIX C
FORMS A PART OF SMD 5962-89598
30. REQUIREMENTS
30.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with
MIL-PRF-38535 and as specified herein or as modified in the device manufacturer•s Quality Management (QM) plan. The
modification in the QM plan shall not effect the form, fit or function as described herein.
30.2 Design, construction and physical dimensions. The design, construction and physical dimensions shall be as
specified in MIL-PRF-38535 and the manufacturer’s QM plan, for device classes Q and V and herein.
30.2.1 Die physical dimensions. The die physical dimensions shall be as specified in 10.2.4.1 and on figure A-1.
30.2.2 Die bonding pad locations and electrical functions. The die bonding pad locations and electrical functions shall be
as specified in 10.2.4.2 and on figure A-1.
30.2.3 Interface materials. The interface materials for the die shall be as specified in 10.2.4.3 and on figure A-1.
30.2.4 Assembly related information. The assembly related information shall be as specified in 10.2.4.4 and figure A-1.
30.2.5 Truth table(s). The truth table(s) shall be as defined within paragraph 3.2.3. of the body of this document.
30.2.6 Radiation exposure circuit. The radiation exposure circuit shall be as defined within paragraph 3.2.4. of the body of
this document.
30.3 Electrical performance characteristics and post-irradiation parameter limits. Unless otherwise specified herein, the
electrical performance characteristics and post-irradiation parameter limits are as specified in table I of the body of this
document.
30.4 Electrical test requirements. The wafer probe test requirements shall include functional and parametric testing
sufficient to make the packaged die capable of meeting the electrical performance requirements in table I.
30.5 Marking. As a minimum, each unique lot of die, loaded in single or multiple stack of carriers, for shipment to a
customer, shall be identified with the wafer lot number, the certification mark, the manufacturer’s identification and the PIN
listed in 10.2 herein. The certification mark shall be a “QML” or “Q” as required by MIL-PRF-38535.
30.6 Certification of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-
38535 listed manufacturer in order to supply to the requirements of this drawing (see 60.4 herein). The certificate of
compliance submitted to DSCC-VA prior to listing as an approved source of supply for this appendix shall affirm that the
manufacturer’s product meets, for device classes Q and V, the requirements of MIL-PRF-38535 and the requirements
herein.
30.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535
shall be provided with each lot of microcircuit die delivered to this drawing.
40. QUALITY ASSURANCE PROVISIONS
40.1 Sampling and inspection. For device classes Q and V, die sampling and inspection procedures shall be in
accordance with MIL-PRF-38535 or as modified in the device manufacturer's Quality Management (QM) plan. The
manufacturer's modifications in the QM plan shall not effect the form, fit or function as described herein.
40.2 Screening. For device classes Q and V, screening shall be in accordance with MIL-PRF-38535, and as defined in
the manufacturer's QM plan. As a minimum it shall consist of:
a) Wafer lot acceptance for Class V product using the criteria defined within MIL-STD-883 test method 5007.
b) 100% wafer probe (see paragraph 30.4).
c) 100% internal visual inspection to the applicable class Q or V criteria defined within MIL-STD-883 test method
2010 or the alternate procedures allowed within MIL-STD-883 test method 5004.
SIZE
STANDARD
5962-89598
A
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
REVISION LEVEL
L
SHEET
48
DSCC FORM 2234
APR 97
APPENDIX C
FORMS A PART OF SMD 5962-89598
40.3 Conformance inspection.
40.3.1 Group E inspection. Group E inspection is required only for parts intended to be identified as radiation assured
(see 30.5 herein). RHA levels for device classes Q and V shall be as specified in MIL-PRF-38535. End point electrical
testing of packaged die shall be as specified in table IIA herein. Group E tests and conditions are as specified within
paragraphs 4.4.4.1, 4.4.4.1.1., 4.4.4.2, 4.4.4.3 and 4.4.4.4.
50. DIE CARRIER
50.1 Die carrier requirements. The requirements for the die carrier shall be accordance with the manufacturer’s QM plan
or as specified in the purchase order by the acquiring activity. The die carrier shall provide adequate physical, mechanical
and electrostatic protection.
60 NOTES
60.1 Intended use. Microcircuit die conforming to this drawing are intended for use in microcircuits built in accordance
with MIL-PRF-38535 or MIL-PRF-38534 for government microcircuit applications (original equipment), design applications
and logistics purposes.
60.2 Comments. Comments on this appendix should be directed to DSCC-VA, Columbus, Ohio, 43216-5000 or
telephone (614)-692-0536.
60.3 Abbreviations, symbols and definitions. The abbreviations, symbols, and definitions used herein are defined within
MIL-PRF-38535 and MIL-STD-1331.
60.4 Sources of supply for device classes Q and V. Sources of supply for device classes Q and V are listed in QML-
38535. The vendors listed within QML-38535 have submitted a certificate of compliance (see 30.6 herein) to DSCC-VA and
have agreed to this drawing.
SIZE
STANDARD
5962-89598
A
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
REVISION LEVEL
L
SHEET
49
DSCC FORM 2234
APR 97
APPENDIX C
FORMS A PART OF SMD 5962-89598
Pad number
Top left corner reference
Pad
Position relative to center of die
(dimensions are in millimeters)
Rotation angle
In degrees
Manufacturer
Pad reference
Signal
name
X
Y
1
A
A
A
A
A
A
A
A
A
B
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
-7,706
2,297
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
(A3)
(A2)
(Al)
2
-7,706
-7,706
-7,706
-7,706
-7,706
-7,706
-7,706
-7,706
-7,706
-7,706
-7,706
-7,706
-7,706
-7,706
-7,706
-7,706
-7,706
-7,706
-7,706
-7,488
-7,227
-6,947
-5,787
-4,787
-3,787
-0,187
3,813
2,117
1,937
1,757
1,522
1,242
0,992
0,742
0,242
0,042
-0,158
-0,408
-0,688
-0,913
-1,138
-1,418
-1,698
-1,938
-2,118
-2,298
-2,504
-2,504
-2,504
-2,504
-2,504
-2,504
-2,504
-2,504
-2,504
3
4
(A0)
(1/O0)
I/O1
Gnd
I/O2
Gnd
Gnd
Gnd
I/O3
I/O4
Gnd
I/O5
(I/O6)
(I/O7)
(CS1/)
(A1O)
(OE/)
I/O6
Gnd
I/O7
CS1/
Al0
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
OE/
Gnd
All
4,813
A9
Figure A-1, MMO-65608EV Bond Pad Locations and Functions
SIZE
STANDARD
MICROCIRCUIT DRAWING
5962-89598
A
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
REVISION LEVEL
SHEET
L
50
DSCC FORM 2234
APR 97
APPENDIX C
FORMS A PART OF SMD 5962-89598
Pad number
Top left corner reference
Pad
Position relative to center of die
(dimensions are in millimeters)
Rotation angle
In degrees
Manufacturer
Pad reference
Signal
name
X
Y
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
A
A
A
A
A
A
A
A
A
A
A
A
B
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
5,813
-2,504
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
49
50
51
52
53
54
55
56
57
58
59
60
61
62
1
A8
A13
W/
6,613
7,213
7,729
7,729
7,729
7,729
7,729
7,729
7,729
7,729
7,729
7,722
7,729
7,729
7,729
7,729
7,729
7,729
7,729
7,729
7,729
7,729
7,638
6,813
6,613
4,413
0,013
-3,787
-4,787
-6,787
-6,387
-7,481
-2,504
-2,504
-2,333
-2,158
-1,983
-1,808
-1,633
-1,407
-1,183
-0,983
-0,188
0,042
0,272
0,842
1,067
1,267
1,436
1,617
1,792
1,967
2,142
2,323
2,504
2,504
2,504
2,504
2,504
2,804
2,504
2,504
2,504
2,504
(A11)
(A9)
(A8)
(A13)
(W)
CS2
Gnd
A15
Vcc
Vcc
Vcc
A16
Gnd
A14
(A12)
(A7)
(A6)
(A5)
(A4)
A12
A7
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
A6
A5
A4
Gnd
A3
A2
A1
A0
I/O0
Figure A-1, MMO-65608EV Bond Pad Locations and Functions – Continued
SIZE
STANDARD
MICROCIRCUIT DRAWING
5962-89598
A
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
REVISION LEVEL
L
SHEET
51
DSCC FORM 2234
APR 97
APPENDIX C
FORMS A PART OF SMD 5962-89598
Die physical dimensions.
Die size: 15 860 X 5 410 microns
Die thickness: 475 microns
Interface materials.
Top metallization: Aluminium + 1% Copper
Backside metallization: bare silicon
Glassivation.
Type: Silicon Oxide + Nitride
Thickness: 15 000 Angstroms
Substrate: Single crystal silicon
Assembly related information.
Substrate potential: not connected
Special assembly instructions: None
Figure A-1, MMO-65608EV Bond Pad Locations and Functions – Continued
SIZE
STANDARD
MICROCIRCUIT DRAWING
5962-89598
A
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
REVISION LEVEL
L
SHEET
52
DSCC FORM 2234
APR 97
STANDARD MICROCIRCUIT DRAWING BULLETIN
DATE: 00-12-08
Approved sources of supply for SMD 5962-89598 are listed below for immediate acquisition only and shall be added to
MIL-HDBK-103 and QML-38535, as applicable, during the next revision. MIL-HDBK-103 and QML-38535 will be revised
to include the addition or deletion of sources. The vendors listed below have agreed to this drawing and a certificate of
compliance has been submitted to and accepted by DSCC-VA. This bulletin is superseded by the next dated revisions of
MIL-HDBK-103 and QML-38535.
Standard
microcircuit drawing
PIN 1/
Vendor
CAGE
number
Vendor
similar
PIN 2/
5962-8959801MXA
3/
3/
3/
S128K8L-120MC
MSM8128SXLMC-12
EDI88128LPS120CB
5962-8959801MYA
5962-8959801MZA
3/
3/
3/
S128K8L-120MS
EDI88128LPS120NB
L7C108YMB25
3/
3/
3/
3/
S128K8L-120ME
MSM8128KXLMC-12
EDI88128LPS120TB
L7C108CMB25
5962-8959801MUA
5962-8959801MTA
3/
3/
S128K8L-120ML
EDI88128LPS120LB
3/
3/
3/
3/
S128K8L-120MF
MSM8128GXLMC-12
EDI88128LPS120FB
L7C108MMB25
5962-8959801MNA
5962-8959801M9A
5962-8959801M8A
5962-8959802MXA
3/
3/
MSM8128WXLMC-12
L7C108KMB25
3/
3/
MSM8128JXLMC-12
EDI88128LPS120ZB
3/
3/
3/
S128K8L-100MC
MSM8128SXLMC-10
EDI88128LPS100CB
See footnotes at end of table.
1 of 37
Standard
microcircuit drawing
PIN 1/
Vendor
CAGE
number
Vendor
Similar
PIN 2/
5962-8959802MYA
3/
3/
3/
S128K8L-100MS
EDI88128LPS100NB
L7C108YMB25
5962-8959802MZA
3/
3/
3/
3/
S128K8L-100ME
MSM8128KXLMC-10
EDI88128LPS100TB
L7C108CMB25
5962-8959802MUA
5962-8959802MTA
3/
3/
S128K8L-100ML
EDI88128LPS100LB
3/
3/
3/
3/
S128K8L-100MF
MSM8128GXLMC-10
EDI88128LPS100FB
L7C108MMB25
5962-8959802MNA
5962-8959802M9A
5962-8959802M8A
5962-8959803MXA
3/
3/
MSM8128WXLMC-10
L7C108KMB25
3/
3/
MSM8128JXLMC-10
EDI88128LPS100ZB
3/
3/
3/
S128K8L-85MC
MSM8128SXLMC-85
EDI88128LPS85CB
5962-8959803MYA
5962-8959803MZA
3/
3/
3/
S128K8L-85MS
EDI88128LPS85NB
L7C108YMB25
3/
3/
3/
3/
S128K8L-85ME
MSM8128KXLMC-85
EDI88128LPS85TB
L7C108CMB25
5962-8959803MUA
3/
3/
S128K8L-85ML
EDI88128LPS85LB
See footnotes at end of table.
2 of 37
Standard
microcircuit drawing
PIN 1/
Vendor
CAGE
number
Vendor
Similar
PIN 2/
5962-8959803MTA
3/
3/
3/
3/
S128K8L-85MF
MSM8128GXLMC-85
EDI88128LPS85FB
L7C108MMB25
5962-8959803MNA
5962-8959803M9A
5962-8959803M8A
5962-8959804MXA
3/
3/
MSM8128WXLMC-85
L7C108KMB25
3/
3/
MSM8128JXLMC-85
EDI88128LPS85ZB
3/
3/
3/
S128K8L-70MC
MSM8128SXLMC-70
EDI88128LPS70CB
5962-8959804MYA
5962-8959804MZA
3/
3/
3/
S128K8L-70MS
EDI88128LPS70NB
L7C108YMB25
3/
3/
3/
3/
S128K8L-70ME
MSM8128KXLMC-70
EDI88128LPS70TB
L7C108CMB25
5962-8959804MUA
5962-8959804MTA
3/
3/
S128K8L-70ML
EDI88128LPS70LB
3/
3/
3/
3/
S128K8L-70MF
MSM8128GXLMC-70
EDI88128LPS70FB
L7C108MMB25
5962-8959804MNA
3/
3/
MSM8128WXLMC-70
L7C108KMB25
5962-8959804M9A
5962-8959804M8A
3/
3/
MSM8128JXLMC-70
EDI88128LPS70ZB
See footnotes at end of table.
3 of 37
Standard
microcircuit drawing
PIN 1/
Vendor
CAGE
number
Vendor
Similar
PIN 2/
5962-8959805MXA
3/
S128K8L-120MC
3/
54230
0EU86
MSM8128SXLMC-12
EDI88128LPS120CB
MT5C1009CW-120L883C
5962-8959805MYA
5962-8959805MZA
3/
54230
3/
S128K8L-120MS
EDI88128LPS120NB
L7C108YMB25
0EU86
MT5C1009SOJ-120L883C
3/
3/
54230
3/
S128K8L-120ME
MSM8128KXLMC-12
EDI88128LPS120TB
L7C108CMB25
0EU86
MT5C1009C-120L883C
5962-8959805MUA
5962-8959805MTA
3/
54230
0EU86
S128K8L-120ML
EDI88128LPS120LB
MT5C1009EC-120L883C
3/
3/
54230
3/
S128K8L-120MF
MSM8128GXLMC-12
EDI88128LPS120FB
L7C108MMB25
0EU86
MT5C1009F-120L883C
5962-8959805MNA
3/
3/
MSM8128WXLMC-12
L7C108KMB25
5962-8959805MMA
5962-8959805M9A
0EU86
3/
MT5C1009ECA-120L883C
MSM8128JXLMC-12
5962-8959805M8A
5962-8959805M7A
5962-8959806MXA
54230
0EU86
EDI88128LPS120ZB
MT5C1009DCJ-120L883C
3/
S128K8L-100MC
3/
54230
0EU86
MSM8128SXLMC-10
EDI88128LPS100CB
MT5C1009CW-100L883C
See footnotes at end of table.
4 of 37
Standard
microcircuit drawing
PIN 1/
Vendor
CAGE
number
Vendor
Similar
PIN 2/
5962-8959806MYA
3/
S128K8L-100MS
54230
3/
EDI88128LPS100NB
L7C108YMB25
0EU86
MT5C1009SOJ-100L883C
5962-8959806MZA
3/
3/
54230
3/
S128K8L-100ME
MSM8128KXLMC-10
EDI88128LPS100TB
L7C108CMB25
0EU86
MT5C1009C-100L883C
5962-8959806MUA
5962-8959806MTA
3/
54230
0EU86
S128K8L-100ML
EDI88128LPS100LB
MT5C1009EC-100L883C
3/
3/
54230
3/
S128K8L-100MF
MSM8128GXLMC-10
EDI88128LPS100FB
L7C108MMB25
0EU86
MT5C1009F-100L883C
5962-8959806MNA
3/
3/
MSM8128WXLMC-10
L7C108KMB25
5962-8959806MMA
5962-8959806M9A
0EU86
3/
MT5C1009ECA-100L883C
MSM8128JXLMC-10
5962-8959806M8A
5962-8959806M7A
5962-8959807MXA
54230
0EU86
EDI88128LPS100ZB
MT5C1009DCJ-100L883C
3/
S128K8L-85MC
3/
54230
0EU86
MSM8128SXLMC-85
EDI88128LPS85CB
MT5C1009CW-85L883C
5962-8959807MYA
3/
S128K8L-85MS
54230
3/
EDI88128LPS85NB
L7C108YMB25
0EU86
MT5C1009SOJ-85L883C
See footnotes at end of table.
5 of 37
Standard
microcircuit drawing
PIN 1/
Vendor
CAGE
number
Vendor
Similar
PIN 2/
5962-8959807MZA
3/
3/
54230
3/
S128K8L-85ME
MSM8128KXLMC-85
EDI88128LPS85TB
L7C108CMB25
0EU86
MT5C1009C-85L883C
5962-8959807MUA
5962-8959807MTA
3/
54230
0EU86
S128K8L-85ML
EDI88128LPS85LB
MT5C1009EC-85L883C
3/
3/
54230
3/
S128K8L-85MF
MSM8128GXLMC-85
EDI88128LPS85FB
L7C108MMB25
0EU86
MT5C1009F-85L883C
5962-8959807MNA
3/
3/
MSM8128WXLMC-85
L7C108KMB25
5962-8959807MMA
5962-8959807M9A
0EU86
3/
MT5C1009ECA-85L883C
MSM8128JXLMC-85
5962-8959807M8A
5962-8959807M7A
5962-8959808MXA
54230
0EU86
EDI88128LPS85ZB
MT5C1009DCJ-85L883C
3/
S128K8L-70MC
3/
54230
0EU86
MSM8128SXLMC-70
EDI88128LPS70CB
MT5C1009CW-70L883C
5962-8959808MYA
5962-8959808MZA
3/
54230
3/
S128K8L-70MS
EDI88128LPS70NB
L7C108YMB25
0EU86
MT5C1009SOJ-70L883C
3/
3/
54230
3/
S128K8L-70ME
MSM8128KXLMC-70
EDI88128LPS70TB
L7C108CMB25
0EU86
MT5C1009C-70L883C
See footnotes at end of table.
6 of 37
Standard
microcircuit drawing
PIN 1/
Vendor
CAGE
number
Vendor
Similar
PIN 2/
5962-8959808MUA
3/
S128K8L-70ML
54230
0EU86
EDI88128LPS70LB
MT5C1009EC-70L883C
5962-8959808MTA
3/
3/
54230
3/
S128K8L-70MF
MSM8128GXLMC-70
EDI88128LPS70FB
L7C108MMB25
0EU86
MT5C1009F-70L883C
5962-8959808MNA
5962-8959808MMA
3/
3/
MSM8128WXLMC-70
L7C108KMB25
0EU86
MT5C1009ECA-70L883C
5962-8959808M9A
5962-8959808M8A
3/
MSM8128JXLMC-70
EDI88128LPS70ZB
54230
5962-8959808M7A
5962-8959809MXA
0EU86
MT5C1009DCJ-70L883C
3/
3/
3/
S128K8L-55MC
MSM8128SXLMC-55
PDM41024L55CE0B
EDI88128LPS55CB
MT5C1009CW-55L883C
54230
0EU86
5962-8959809MYA
5962-8959809MZA
3/
54230
3/
S128K8L-55MS
EDI88128LPS55NB
L7C108YMB25
0EU86
MT5C1009SOJ-55L883C
3/
3/
54230
3/
S128K8L-55ME
MSM8128KXLMC-55
EDI88128LPS55TB
L7C108CMB25
0EU86
MT5C1009C-55L883C
5962-8959809MUA
5962-8959809MTA
3/
54230
0EU86
S128K8L-55ML
EDI88128LPS55LB
MT5C1009EC-55L883C
3/
3/
54230
3/
S128K8L-55MF
MSM8128GXLMC-55
EDI88128LPS55FB
L7C108MMB25
0EU86
MT5C1009F-55L883C
See footnotes at end of table.
7 of 37
Standard
microcircuit drawing
PIN 1/
Vendor
CAGE
number
Vendor
Similar
PIN 2/
5962-8959809MNA
3/
3/
MSM8128WXLMC-55
L7C108KMB25
5962-8959809MMA
5962-8959809M9A
0EU86
3/
MT5C1009ECA-55L883C
MSM8128JXLMC-55
5962-8959809M8A
5962-8959809M7A
5962-8959810MXA
54230
0EU86
EDI88128LPS55ZB
MT5C1009DCJ-55L883C
3/
3/
3/
S128K8L-45MC
MSM8128SXLMC-45
PDM41024L45CE0B
EDI88128LPS45CB
MT5C1009CW-45L883C
54230
0EU86
5962-8959810MYA
5962-8959810MZA
3/
54230
3/
S128K8L-45MS
EDI88128LPS45NB
L7C108YMB25
0EU86
MT5C1009SOJ-45L883C
3/
3/
54230
3/
S128K8L-45ME
MSM8128KXLMC-45
EDI88128LPS45TB
L7C108CMB25
0EU86
MT5C1009C-45L883C
5962-8959810MUA
5962-8959810MTA
3/
54230
0EU86
S128K8L-45ML
EDI88128LPS45LB
MT5C1009EC-45L883C
3/
3/
54230
3/
S128K8L-45MF
MSM8128GXLMC-45
EDI88128LPS45FB
L7C108MMB25
0EU86
MT5C1009F-45L883C
5962-8959810MNA
3/
3/
MSM8128WXLMC-45
L7C108KMB25
5962-8959810MMA
5962-8959810M9A
5962-8959810M8A
0EU86
3/
MT5C1009ECA-45L883C
MSM8128JXLMC-45
EDI88128LPS45ZB
54230
See footnotes at end of table.
8 of 37
Standard
microcircuit drawing
PIN 1/
Vendor
CAGE
number
Vendor
Similar
PIN 2/
5962-8959810M7A
5962-8959811MXA
0EU86
MT5C1009DCJ-45L883C
3/
3/
3/
S128K8L-35MC
MSM8128SXLMC-35
PDM41024L35CE0B
EDI88128LPS35CB
MT5C1009CW-35L883C
54230
0EU86
5962-8959811MYA
5962-8959811MZA
3/
54230
3/
S128K8L-35MS
EDI88128LPS35NB
L7C108YMB25
0EU86
MT5C1009SOJ-35L883C
3/
3/
54230
3/
S128K8L-35ME
MSM8128KXLMC-35
EDI88128LPS35TB
L7C108CMB25
0EU86
MT5C1009C-35L883C
5962-8959811MUA
5962-8959811MTA
3/
54230
0EU86
S128K8L-35ML
EDI88128LPS35LB
MT5C1009EC-35L883C
3/
3/
54230
3/
S128K8L-35MF
MSM8128GXLMC-35
EDI88128LPS35FB
L7C108MMB25
0EU86
MT5C1009F-35L883C
5962-8959811MNA
3/
3/
MSM8128WXLMC-35
L7C108KMB25
5962-8959811MMA
5962-8959811M9A
0EU86
3/
MT5C1009ECA-35L883C
MSM8128JXLMC-35
5962-8959811M8A
5962-8959811M7A
54230
0EU86
EDI88128LPS35ZB
MT5C1009DCJ-35L883C
See footnotes at end of table.
9 of 37
Standard
microcircuit drawing
PIN 1/
Vendor
CAGE
number
Vendor
Similar
PIN 2/
5962-8959812MXA
3/
3/
3/
S128K8L-25MC
MSM8128SXLMC-25
PDM41024L25CE0B
EDI88128LPS25CB
MT5C1009CW-25L883C
54230
0EU86
5962-8959812MYA
5962-8959812MZA
3/
54230
3/
S128K8L-25MS
EDI88128LPS25NB
L7C108YMB25
0EU86
MT5C1009SOJ-25L883C
3/
3/
54230
3/
S128K8L-25ME
MSM8128KXLMC-25
EDI88128LPS25TB
L7C108CMB25
0EU86
MT5C1009C-25L883C
5962-8959812MUA
5962-8959812MTA
3/
54230
0EU86
S128K8L-25ML
EDI88128LPS25LB
MT5C1009EC-25L883C
3/
3/
54230
3/
S128K8L-25MF
MSM8128GXLMC-25
EDI88128LPS25FB
L7C108MMB25
0EU86
MT5C1009F-25L883C
5962-8959812MNA
3/
3/
MSM8128WXLMC-25
L7C108KMB25
5962-8959812MMA
5962-8959812M9A
0EU86
3/
MT5C1009ECA-25L883C
MSM8128JXLMC-25
5962-8959812M8A
5962-8959812M7A
54230
0EU86
EDI88128LPS25ZB
MT5C1009DCJ-25L883C
See footnotes at end of table.
10 of 37
Standard
microcircuit drawing
PIN 1/
Vendor
CAGE
number
Vendor
Similar
PIN 2/
5962-8959813MXA
3/
S128K8TL-120MC
3/
0EU86
54230
MSM8128SLMC-12
MT5C1008CW-120L883C
EDI88130LPS120CB
5962-8959813MYA
5962-8959813MZA
3/
54230
3/
S128K8TL-120MS
EDI88130LPS120NB
L7C108YMB25
0EU86
MT5C10089SOJ-120L883C
3/
3/
0EU86
54230
65786
3/
S128K8TL-120ME
MSM8128KLMC-12
MT5C1008C-120L883C
EDI88130LPS120TB
CY7C1009L-120DMB
MMC965608V120/883
L7C108CMB25
3/
5962-8959813MUA
5962-8959813MTA
3/
0EU86
54230
S128K8TL-120ML
MT5C1008EC-120L883C
EDI88130LPS120LB
3/
3/
0EU86
54230
3/
S128K8TL-120MF
MSM8128GLMC-12
MT5C1008F-120L883C
EDI88130LPS120FB
L7C108MMB25
5962-8959813MTC
5962-8959813MNA
3/
MMDJ65608V120/883
3/
3/
MSM8128WLMC-12
L7C108KMB25
5962-8959813MMA
0EU86
65786
54230
MT5C1008ECA-120L883C
CY7C1009L-120LMB
EDI88130LPS120L32B
5962-8959813M9A
5962-8959813M7A
3/
MSM8128JLMC-12
0EU86
MT5C1008DCJ-120L883C
See footnotes at end of table.
11 of 37
Standard
microcircuit drawing
PIN 1/
Vendor
CAGE
number
Vendor
Similar
PIN 2/
5962-8959814MXA
3/
S128K8TL-100MC
3/
0EU86
54230
MSM8128SLMC-10
MT5C1008CW-100L883C
EDI88130LPS100CB
5962-8959814MYA
5962-8959814MZA
3/
54230
3/
S128K8TL-100MS
EDI88130LPS100NB
L7C108YMB25
0EU86
MT5C10089SOJ-100L883C
3/
3/
0EU86
54230
65786
3/
S128K8TL-100ME
MSM8128KLMC-10
MT5C1008C-100L883C
EDI88130LPS100TB
CY7C1009L-100DMB
MMC965608V100/883
L7C108CMB25
3/
5962-8959814MUA
5962-8959814MTA
3/
0EU86
54230
S128K8TL-100ML
MT5C1008EC-100L883C
EDI88130LPS100LB
3/
3/
0EU86
54230
3/
S128K8TL-100MF
MSM8128GLMC-10
MT5C1008F-100L883C
EDI88130LPS100FB
L7C108MMB25
5962-8959814MTC
5962-8959814MNA
3/
MMDJ65608V100/883
3/
3/
MSM8128WLMC-10
L7C108KMB25
5962-8959814MMA
0EU86
65786
54230
MT5C1008ECA-100L883C
CY7C1009L-100LMB
EDI88130LPS100L32B
5962-8959814M9A
5962-8959814M7A
3/
MSM8128JLMC-10
0EU86
MT5C1008DCJ-100L883C
See footnotes at end of table.
12 of 37
Standard
microcircuit drawing
PIN 1/
Vendor
CAGE
number
Vendor
Similar
PIN 2/
5962-8959815MXA
3/
S128K8TL-85MC
3/
0EU86
54230
MSM8128SLMC-85
MT5C1008CW-85L883C
EDI88130LPS85CB
5962-8959815MYA
5962-8959815MZA
3/
54230
3/
S128K8TL-85MS
EDI88130LPS85NB
L7C108YMB25
0EU86
MT5C10089SOJ-85L883C
3/
3/
0EU86
54230
65786
3/
S128K8TL-85ME
MSM8128KLMC-85
MT5C1008C-85L883C
EDI88130LPS85TB
CY7C1009L-85DMB
MMC965608V85/883
L7C108CMB25
3/
5962-8959815MUA
5962-8959815MTA
3/
0EU86
54230
S128K8TL-85ML
MT5C1008EC-85L883C
EDI88130LPS85LB
3/
3/
0EU86
54230
3/
S128K8TL-85MF
MSM8128GLMC-85
MT5C1008F-85L883C
EDI88130LPS85FB
L7C108MMB25
5962-8959815MTC
5962-8959815MNA
3/
MMDJ65608V85/883
3/
3/
MSM8128WLMC-85
L7C108KMB25
5962-8959815MMA
0EU86
65786
54230
MT5C1008ECA-85L883C
CY7C1009L-85LMB
EDI88130LPS85L32B
5962-8959815M9A
5962-8959815M7A
3/
MSM8128JLMC-85
0EU86
MT5C1008DCJ-85L883C
See footnotes at end of table.
13 of 37
Standard
microcircuit drawing
PIN 1/
Vendor
CAGE
number
Vendor
Similar
PIN 2/
5962-8959816MXA
3/
S128K8TL-70MC
3/
0EU86
54230
MSM8128SLMC-70
MT5C1008CW-70L883C
EDI88130LPS70CB
5962-8959816MYA
5962-8959816MZA
3/
54230
3/
S128K8TL-70MS
EDI88130LPS70NB
L7C108YMB25
0EU86
MT5C10089SOJ-70L883C
3/
3/
0EU86
54230
65786
3/
S128K8TL-70ME
MSM8128KLMC-70
MT5C1008C-70L883C
EDI88130LPS70TB
CY7C1009L-70DMB
MMC965608V70/883
L7C108CMB25
3/
5962-8959816MUA
5962-8959816MTA
3/
0EU86
54230
S128K8TL-70ML
MT5C1008EC-70L883C
EDI88130LPS70LB
3/
3/
0EU86
54230
3/
S128K8TL-70MF
MSM8128GLMC-70
MT5C1008F-70L883C
EDI88130LPS70FB
L7C108MMB25
5962-8959816MTC
5962-8959816MNA
3/
MMDJ65608V70/883
3/
3/
MSM8128WLMC-70
L7C108KMB25
5962-8959816MMA
0EU86
65786
54230
MT5C1008ECA-70L883C
CY7C1009L-70LMB
EDI88130LPS70L32B
5962-8959816M9A
5962-8959816M7A
3/
MSM8128JLMC-70
0EU86
MT5C1008DCJ-70L883C
See footnotes at end of table.
14 of 37
Standard
microcircuit drawing
PIN 1/
Vendor
CAGE
number
Vendor
Similar
PIN 2/
5962-8959817MXA
3/
3/
3/
S128K8TL-55MC
MSM8128SLMC-55
PDM41024L55CB
0EU86
54230
MT5C1008CW-55L883C
EDI88130LPS55CB
5962-8959817MYA
5962-8959817MZA
3/
54230
3/
3/
0EU86
S128K8TL-55MS
EDI88130LPS55NB
L7C108YMB25
NS41024L55S/883
MT5C1008SOJ-55L883C
3/
3/
3/
S128K8TL-55ME
MSM8128KLMC-55
PDM41024L55CB
MT5C1008C-55L883C
EDI88130LPS55TB
CY7C1009L-55DMB
MMC965608V55/883
L7C108CMB25
0EU86
54230
65786
3/
3/
3/
NS41024L55D/883
5962-8959817MUA
5962-8959817MTA
3/
S128K8TL-55ML
0EU86
54230
3/
MT5C1008EC-55L883C
EDI88130LPS55LB
NS41024L55Y/883
3/
3/
0EU86
54230
3/
S128K8TL-55MF
MSM8128GLMC-55
MT5C1008F-55L883C
EDI88130LPS55FB
L7C108MMB25
3/
NS41024L55F/883
5962-8959817MTC
5962-8959817MNA
3/
MMDJ65608V55/883
3/
3/
MSM8128WLMC-55
L7C108KMB25
5962-8959817MMA
3/
3/
PDM41024L55L32B
NS41024L55E/883
0EU86
65786
54230
MT5C1008ECA-55L883C
CY7C1009L-55LMB
EDI88130LPS55L32B
See footnotes at end of table.
15 of 37
Standard
microcircuit drawing
PIN 1/
Vendor
CAGE
number
Vendor
Similar
PIN 2/
5962-8959817M9A
3/
MSM8128JLMC-55
5962-8959817M7A
5962-8959818MXA
0EU86
MT5C1008DCJ-55L883C
3/
3/
3/
S128K8TL-45MC
MSM8128SLMC-45
PDM41024L45CB
0EU86
54230
MT5C1008CW-45L883C
EDI88130LPS45CB
5962-8959818MYA
5962-8959818MZA
3/
54230
3/
3/
0EU86
S128K8TL-45MS
EDI88130LPS45NB
L7C108YMB25
NS41024L45S/883
MT5C1008SOJ-45L883C
3/
3/
3/
S128K8TL-45ME
MSM8128KLMC-45
PDM41024L45CB
MT5C1008C-45L883C
EDI88130LPS45TB
CY7C1009L-45DMB
MMC965608V45/883
L7C108CMB25
0EU86
54230
65786
F7400
3/
3/
NS41024L45D/883
5962-8959818VZC
5962-8959818MUA
F7400
SMC965608EV45SV
3/
S128K8TL-45ML
0EU86
54230
3/
MT5C1008EC-45L883C
EDI88130LPS45LB
NS41024L45Y/883
5962-8959818MTA
3/
3/
0EU86
54230
3/
S128K8TL-45MF
MSM8128GLMC-45
MT5C1008F-45L883C
EDI88130LPS45FB
L7C108MMB25
3/
NS41024L45F/883
See footnotes at end of table.
16 of 37
Standard
microcircuit drawing
PIN 1/
Vendor
CAGE
number
Vendor
Similar
PIN 2/
5962-8959818MTC
F7400
MMDJ65608EV-45/883
5962-8959818QTC
5962-8959818VTC
F7400
F7400
MMDJ65608EV-45MQ
SMDJ65608EV-45SV
5962-8959818MNA
5962-8959818MMA
3/
3/
MSM8128WLMC-45
L7C108KMB25
3/
3/
PDM41024L45L32B
NS41024L45E/883
0EU86
65786
54230
MT5C1008ECA-45L883C
CY7C1009L-45LMB
EDI88130LPS45L32B
5962-8959818M9A
5962-8959818M7A
3/
MSM8128JLMC-45
0EU86
MT5C1008DCJ-45L883C
5962-8959819MXA
3/
3/
3/
S128K8TL-35MC
MSM8128SLMC-35
PDM41024L35CB
0EU86
54230
MT5C1008CW-35L883C
EDI88130LPS35CB
5962-8959819MYA
5962-8959819MZA
3/
54230
3/
3/
0EU86
S128K8TL-35MS
EDI88130LPS35NB
L7C108YMB25
NS41024L35S/883
MT5C1008SOJ-35L883C
3/
3/
3/
S128K8TL-35ME
MSM8128KLMC-35
PDM41024L35CB
MT5C1008C-35L883C
EDI88130LPS35TB
CY7C1009L-35DMB
MMC965608V-35/883
L7C108CMB25
0EU86
54230
3/
3/
3/
3/
NS41024L35D/883
5962-8959819VZC
F7400
SMC965608EV-35SV
See footnotes at end of table.
17 of 37
Standard
microcircuit drawing
PIN 1/
Vendor
CAGE
number
Vendor
Similar
PIN 2/
5962-8959819MUA
3/
0EU86
54230
3/
S128K8TL-35ML
MT5C1008EC-35L883C
EDI88130LPS35LB
NS41024L35Y/883
5962-8959819MTA
3/
3/
0EU86
54230
3/
S128K8TL-35MF
MSM8128GLMC-35
MT5C1008F-35L883C
EDI88130LPS35FB
L7C108MMB25
3/
NS41024L35F/883
5962-8959819MTC
F7400
MMDJ65608EV-35/883
5962-8959819QTC
5962-8959819VTC
F7400
F7400
MMDJ65608EV-35MQ
SMDJ65608EV-35SV
5962-8959819MNA
5962-8959819MMA
3/
3/
MSM8128WLMC-35
L7C108KMB25
3/
27014
0EU86
3/
PDM41024L35L32B
NS41024L35E/883
MT5C1008ECA-35L883C
CY7C1009L-35LMB
EDI88130LPS35L32B
54230
5962-8959819M9A
5962-8959819M7A
3/
MSM8128JLMC-35
MT5C1008DCJ-35L
0EU86
5962-8959820MXA
3/
3/
3/
S128K8TL-25MC
MSM8128SLMC-25
PDM41024L25CB
0EU86
54230
MT5C1008CW-25L883C
EDI88130LPS25CB
5962-8959820MYA
3/
54230
3/
S128K8TL-25MS
EDI88130LPS25NB
L7C108YMB25
3/
0EU86
NS41024L25S/883
MT5C1008SOJ-25L883C
See footnotes at end of table.
18 of 37
Standard
microcircuit drawing
PIN 1/
Vendor
CAGE
number
Vendor
Similar
PIN 2/
5962-8959820MZA
3/
3/
3/
S128K8TL-25ME
MSM8128KLMC-25
PDM41024L25CB
MT5C1008C-25L883C
EDI88130LPS25TB
CY7C1009L-25DMB
MMC965608V25/883
L7C108CMB25
0EU86
54230
65786
3/
3/
3/
27014
SMJ5C1008L-25JDCM
NS41024L25D/883
5962-8959820MUA
5962-8959820MTA
3/
S128K8TL-25ML
0EU86
54230
27014
MT5C1008EC-25L883C
EDI88130LPS25LB
NS41024L25Y/883
3/
3/
0EU86
54230
3/
S128K8TL-25MF
MSM8128GLMC-25
MT5C1008F-25L883C
EDI88130LPS25FB
L7C108MMB25
3/
NS41024L25F/883
5962-8959820MTC
5962-8959820MNA
3/
MMDJ65608EV25/883
3/
3/
MSM8128WLMC-25
L7C108KMB25
5962-8959820MMA
3/
3/
PDM41024L25L32B
NS41024L25E/883
0EU86
65786
54230
MT5C1008ECA-25L883C
CY7C1009L-25LMB
EDI88130LPS25L32B
5962-8959820M9A
5962-8959820M7A
3/
MSM8128JLMC-25
0EU86
MT5C1008DCJ-25L883C
5962-8959821MXA
3/
3/
3/
S128K8TL-20MC
MSM8128SLMC-20
PDM41024L20CB
0EU86
54230
MT5C1008CW-20L883C
EDI88130LPS20CB
See footnotes at end of table.
19 of 37
Standard
microcircuit drawing
PIN 1/
Vendor
CAGE
number
Vendor
Similar
PIN 2/
5962-8959821MYA
3/
S128K8TL-20MS
54230
3/
0EU86
EDI88130LPS20NB
NS41024L20S/883
MT5C1008SOJ-20L883C
5962-8959821MZA
3/
3/
3/
S128K8TL-20ME
MSM8128KLMC-20
PDM41024L20CB
MT5C1008C-20L883C
EDI88130LPS20TB
CY7C1009L-20DMB
NS41024L20D/883
0EU86
54230
65786
3/
5962-8959821MUA
5962-8959821MTA
3/
0EU86
54230
3/
S128K8TL-20ML
MT5C1008EC-20L883C
EDI88130LPS20LB
NS41024L20Y/883
3/
3/
0EU86
54230
3/
S128K8TL-20MF
MSM8128GLMC-20
MT5C1008F-20L883C
EDI88130LPS20FB
NS41024L20F/883
5962-8959821MNA
5962-8959821MMA
3/
MSM8128WLMC-20
3/
3/
PDM41024L20L32B
NS41024L20E/883
0EU86
65786
54230
MT5C1008ECA-20L883C
CY7C1009L-20LMB
EDI88130LPS20L32B
5962-8959821M9A
5962-8959821M7A
3/
MSM8128JLMC-20
0EU86
MT5C1008DCJ-20L883C
5962-8959822MXA
3/
S128K8-120MC
3/
0EU86
54230
MSM8128SXMC-12
MT5C1009CW-120883C
EDI88128CS120CB
5962-8959822MYA
3/
S128K8-120MS
54230
3/
EDI88128CS120NB
L7C108YMB25
0EU86
MT5C1009SOJ-120883C
See footnotes at end of table.
20 of 37
Standard
microcircuit drawing
PIN 1/
Vendor
CAGE
number
Vendor
Similar
PIN 2/
5962-8959822MZA
3/
3/
3/
S128K8-120ME
MSM8128KXMC-12
L7C108CMB25
0EU86
54230
MT5C1009C-120883C
EDI88128CS120TB
5962-8959822MUA
5962-8959822MTA
3/
0EU86
54230
S128K8-120ML
MT5C1009EC-120883C
EDI88128CS120LB
3/
3/
0EU86
54230
3/
S128K8-120MF
MSM8128GXMC-12
MT5C1009F-120L883C
EDI88128CS120FB
L7C108MMB25
5962-8959822MNA
5962-8959822MNC
3/
3/
MSM8128WXMC-12
L7C108KMB25
3/
L7C108KMB25
5962-8959822MMA
5962-8959822M9A
5962-8959822M8A
5962-8959822M7A
0EU86
3/
MT5C1009ECA-120L883C
MSM8128JXMC-12
54230
0EU86
EDI88128CS120ZB
MT5C1009DCJ-120883C
5962-8959823MXA
3/
S128K8-100MC
3/
0EU86
54230
MSM8128SXMC-10
MT5C1009CW-100883C
EDI88128CS100CB
5962-8959823MYA
3/
S128K8-100MS
54230
3/
EDI88128CS100NB
L7C108YMB25
0EU86
MT5C1009SOJ-100883C
5962-8959823MZA
5962-8959823MUA
3/
3/
3/
S128K8-100ME
MSM8128KXMC-10
L7C108CMB25
MT5C1009C-100883C
EDI88128CS100TB
0EU86
54230
3/
S128K8-100ML
0EU86
54230
MT5C1009EC-100883C
EDI88128CS100LB
See footnotes at end of table.
21 of 37
Standard
microcircuit drawing
PIN 1/
Vendor
CAGE
number
Vendor
Similar
PIN 2/
5962-8959823MTA
3/
3/
0EU86
54230
3/
S128K8-100MF
MSM8128GXMC-10
MT5C1009F-100883C
EDI88128CS100FB
L7C108MMB25
5962-8959823MNA
5962-8959823MNC
3/
3/
MSM8128WXMC-10
L7C108KMB25
3/
L7C108KMB25
5962-8959823MMA
5962-8959823M9A
5962-8959823M8A
5962-8959823M7A
0EU86
3/
MT5C1009ECA-100L883C
MSM8128JXMC-10
54230
0EU86
EDI88128CS100ZB
MT5C1009DCJ-100883C
5962-8959824MXA
3/
S128K8-85MC
3/
0EU86
54230
MSM8128SXMC-85
MT5C1009CW-85883C
EDI88128CS85CB
5962-8959824MYA
3/
S128K8-85MS
54230
3/
EDI88128CS85NB
L7C108YMB25
0EU86
MT5C1009SOJ-85883C
5962-8959824MZA
3/
3/
3/
S128K8-85ME
MSM8128KXMC-85
L7C108CMB25
0EU86
54230
MT5C1009C-85883C
EDI88128CS85TB
5962-8959824MUA
5962-8959824MTA
3/
0EU86
54230
S128K8-85ML
MT5C1009EC-85883C
EDI88128CS85LB
3/
3/
0EU86
54230
3/
S128K8-85MF
MSM8128GXMC-85
MT5C1009F-85883C
EDI88128CS85FB
L7C108MMB25
5962-8959824MNA
3/
3/
MSM8128WXMC-85
L7C108KMB25
5962-8959824MNC
5962-8959824MMA
3/
L7C108KMB25
0EU86
MT5C1009ECA-85L883C
See footnotes at end of table.
22 of 37
Standard
microcircuit drawing
PIN 1/
Vendor
CAGE
number
Vendor
Similar
PIN 2/
5962-8959824M9A
5962-8959824M8A
5962-8959824M7A
3/
MSM8128JXMC-85
EDI88128CS85ZB
54230
0EU86
MT5C1009DCJ-85883C
5962-8959825MXA
3/
S128K8-70MC
3/
0EU86
54230
MSM8128SXMC-70
MT5C1009CW-70883C
EDI88128CS70CB
5962-8959825MYA
3/
S128K8-70MS
54230
3/
EDI88128CS70NB
L7C108YMB25
0EU86
MT5C1009SOJ-70883C
5962-8959825MZA
3/
3/
3/
S128K8-70ME
MSM8128KXMC-70
L7C108CMB25
0EU86
54230
MT5C1009C-70883C
EDI88128CS70TB
5962-8959825MUA
5962-8959825MTA
3/
0EU86
54230
S128K8-70ML
MT5C1009EC-70883C
EDI88128CS70LB
3/
3/
0EU86
54230
3/
S128K8-70MF
MSM8128GXMC-70
MT5C1009F-70883C
EDI88128CS70FB
L7C108MMB25
5962-8959825MNA
3/
3/
MSM8128WXMC-70
L7C108KMB25
5962-8959825MNC
5962-8959825MMA
3/
L7C108KMB25
0EU86
MT5C1009ECA-70L883C
5962-8959825M9A
5962-8959825M8A
5962-8959825M7A
3/
MSM8128JXMC-70
EDI88128CS70ZB
54230
0EU86
MT5C1009DCJ-70883C
See footnotes at end of table.
23 of 37
Standard
microcircuit drawing
PIN 1/
Vendor
CAGE
number
Vendor
Similar
PIN 2/
5962-8959826MXA
3/
3/
3/
S128K8-55MC
MSM8128SXMC-55
PDM41024S55CE0B
MT5C1009CW-55883C
EDI88128CS55CB
0EU86
54230
5962-8959826MYA
5962-8959826MZA
3/
54230
3/
S128K8-55MS
EDI88128CS55NB
L7C108YMB25
0EU86
MT5C1009SOJ-55883C
3/
3/
3/
S128K8-55ME
MSM8128KXMC-55
L7C108CMB25
0EU86
54230
MT5C1009C-55883C
EDI88128CS55TB
5962-8959826MUA
5962-8959826MTA
3/
0EU86
54230
S128K8-55ML
MT5C1009EC-55883C
EDI88128CS55LB
3/
3/
0EU86
54230
3/
S128K8-55MF
MSM8128GXMC-55
MT5C1009F-55883C
EDI88128CS55FB
L7C108MMB25
5962-8959826MNA
5962-8959826MNC
3/
3/
MSM8128WXMC-55
L7C108KMB25
3/
L7C108KMB25
5962-8959826MMA
5962-8959826M9A
5962-8959826M8A
5962-8959826M7A
0EU86
3/
MT5C1009ECA-55L883C
MSM8128JXMC-55
54230
0EU86
EDI88128CS55ZB
MT5C1009DCJ-55883C
5962-8959827MXA
3/
3/
3/
S128K8-45MC
MSM8128SXMC-45
PDM41024S45CE0B
MT5C1009CW-45883C
EDI88128CS45CB
0EU86
54230
5962-8959827MYA
3/
S128K8-45MS
54230
3/
EDI88128CS45NB
L7C108YMB25
0EU86
MT5C1009SOJ-45883C
See footnotes at end of table.
24 of 37
Standard
microcircuit drawing
PIN 1/
Vendor
CAGE
number
Vendor
Similar
PIN 2/
5962-8959827MZA
3/
3/
3/
S128K8-45ME
MSM8128KXMC-45
L7C108CMB25
0EU86
54230
MT5C1009C-45883C
EDI88128CS45TB
5962-8959827MUA
5962-8959827MTA
3/
0EU86
54230
S128K8-45ML
MT5C1009EC-45883C
EDI88128CS45LB
3/
3/
0EU86
54230
3/
S128K8-45MF
MSM8128GXMC-45
MT5C1009F-45883C
EDI88128CS45FB
L7C108MMB25
5962-8959827MNA
5962-8959827MNC
3/
3/
MSM8128WXMC-45
L7C108KMB25
3/
L7C108KMB25
5962-8959827MMA
5962-8959827M9A
5962-8959827M8A
5962-8959827M7A
0EU86
3/
MT5C1009ECA-45L883C
MSM8128JXMC-45
54230
0EU86
EDI88128CS45ZB
MT5C1009DCJ-45883C
5962-8959828MXA
3/
3/
3/
S128K8-35MC
MSM8128SXMC-35
PDM41024S35CE0B
MT5C1009CW-35883C
EDI88128CS35CB
0EU86
54230
5962-8959828MYA
5962-8959828MZA
3/
54230
3/
S128K8-35MS
EDI88128CS35NB
L7C108YMB25
0EU86
MT5C1009SOJ-35883C
3/
3/
3/
S128K8-35ME
MSM8128KXMC-35
L7C108CMB25
0EU86
54230
MT5C1009C-35883C
EDI88128CS35TB
5962-8959828MUA
3/
S128K8-35ML
0EU86
54230
MT5C1009EC-35883C
EDI88128CS35LB
See footnotes at end of table.
25 of 37
Standard
microcircuit drawing
PIN 1/
Vendor
CAGE
number
Vendor
Similar
PIN 2/
5962-8959828MTA
3/
3/
0EU86
54230
3/
S128K8-35MF
MSM8128GXMC-35
MT5C1009F-35883C
EDI88128CS35FB
L7C108MMB25
5962-8959828MNA
5962-8959828MNC
3/
3/
MSM8128WXMC-35
L7C108KMB25
3/
L7C108KMB25
5962-8959828MMA
5962-8959828M9A
5962-8959828M8A
5962-8959828M7A
0EU86
3/
MT5C1009ECA-35L883C
MSM8128JXMC-35
54230
0EU86
EDI88128CS35ZB
MT5C1009DCJ-35883C
5962-8959829MXA
3/
3/
3/
S128K8-25MC
MSM8128SXMC-25
PDM41024S25CE0B
MT5C1009CW-25883C
EDI88128CS25CB
0EU86
54230
5962-8959829MYA
5962-8959829MZA
3/
54230
3/
S128K8-25MS
EDI88128CS25NB
L7C108YMB25
0EU86
MT5C1009SOJ-25883C
3/
3/
3/
S128K8-25ME
MSM8128KXMC-25
L7C108CMB25
0EU86
54230
MT5C1009C-25883C
EDI88128CS25TB
5962-8959829MUA
5962-8959829MTA
3/
0EU86
54230
S128K8-25ML
MT5C1009EC-25883C
EDI88128CS25LB
3/
3/
0EU86
54230
3/
S128K8-25MF
MSM8128GXMC-25
MT5C1009F-25883C
EDI88128CS25FB
L7C108MMB25
5962-8959829MNA
5962-8959829MNC
3/
3/
MSM8128WXMC-25
L7C108KMB25
3/
L7C108KMB25
See footnotes at end of table.
26 of 37
Standard
microcircuit drawing
PIN 1/
Vendor
CAGE
number
Vendor
Similar
PIN 2/
5962-8959829MMA
5962-8959829M9A
5962-8959829M8A
5962-8959829M7A
0EU86
3/
MT5C1009ECA-25L883C
MSM8128JXMC-25
54230
0EU86
EDI88128CS25ZB
MT5C1009DCJ-25883C
5962-8959830MXA
3/
S128K8-120MC
3/
0EU86
54230
MSM8128SMC-12
MT5C1008CW-120883C
EDI88130CS120CB
5962-8959830MYA
3/
S128K8-120MS
54230
3/
EDI88130CS120NB
L7C109YMB25
0EU86
MT5C1008SOJ-120883C
5962-8959830MZA
3/
3/
3/
S128K8-120ME
MSM8128KMC-12
L7C109CMB25
0EU86
54230
65786
3/
MT5C1008C-120883C
EDI88130CS120TB
CY7C1009-120DMB
MMC965608L120/883
5962-8959830MUA
5962-8959830MTA
3/
0EU86
54230
S128K8-120ML
MT5C1008EC-120883C
EDI88130CS120LB
3/
3/
0EU86
54230
3/
S128K8-120MF
MSM8128GMC-12
MT5C1008F-120883C
EDI88130CS120FB
L7C109MMB25
5962-8959830MTC
5962-8959830MNA
3/
MMDJ65608L120/883
3/
3/
MSM8128WMC-12
L7C109KMB25
5962-8959830MNC
5962-8959830MMA
3/
L7C109KMB25
0EU86
65786
54230
MT5C1008ECA-120L883C
CY7C1009-120LMB
EDI88130CS120L32B
5962-8959830M9A
5962-8959830M7A
3/
MSM8128JMC-12
0EU86
MT5C1008DCJ-120883C
See footnotes at end of table.
27 of 37
Standard
microcircuit drawing
PIN 1/
Vendor
CAGE
number
Vendor
Similar
PIN 2/
5962-8959831MXA
3/
S128K8-100MC
3/
0EU86
54230
MSM8128SMC-10
MT5C1008CW-100883C
EDI88130CS100CB
5962-8959831MYA
3/
S128K8-100MS
54230
3/
0EU86
EDI88130CS100NB
L7C109YMB25
MT5C1008SOJ-100883C
5962-8959831MZA
3/
3/
3/
S128K8-100ME
MSM8128KMC-10
L7C109CMB25
0EU86
54230
65786
3/
MT5C1008C-100883C
EDI88130CS100TB
CY7C1009-100DMB
MMC965608L100/883
5962-8959831MUA
5962-8959831MTA
3/
0EU86
54230
S128K8-100ML
MT5C1008EC-100883C
EDI88130CS100LB
3/
3/
0EU86
54230
3/
S128K8-100MF
MSM8128GMC-10
MT5C1008F-100883C
EDI88130CS100FB
L7C109MMB25
5962-8959831MTC
5962-8959831MNA
3/
MMDJ65608L100/883
3/
3/
MSM8128WMC-10
L7C109KMB25
5962-8959831MNC
5962-8959831MMA
3/
L7C109KMB25
0EU86
65786
54230
MT5C1008ECA-100L883C
CY7C1009-100LMB
EDI88130CS100L32B
5962-8959831M9A
5962-8959831M7A
3/
MSM8128JMC-10
0EU86
MT5C1008DCJ-100883C
5962-8959832MXA
3/
S128K8-85MC
3/
0EU86
54230
MSM8128SMC-85
MT5C1008CW-85883C
EDI88130CS85CB
5962-8959832MYA
3/
S128K8-85MS
54230
3/
0EU86
EDI88130CS85NB
L7C109YMB25
MT5C1008SOJ-85883C
See footnotes at end of table.
28 of 37
Standard
microcircuit drawing
PIN 1/
Vendor
CAGE
number
Vendor
Similar
PIN 2/
5962-8959832MZA
3/
3/
3/
S128K8-85ME
MSM8128KMC-85
L7C109CMB25
0EU86
54230
65786
3/
MT5C1008C-85883C
EDI88130CS85TB
CY7C1009-85DMB
MMC965608L85/883
5962-8959832MUA
5962-8959832MTA
3/
0EU86
54230
S128K8-85ML
MT5C1008EC-85883C
EDI88130CS85LB
3/
3/
0EU86
54230
3/
S128K8-85MF
MSM8128GMC-85
MT5C1008F-85883C
EDI88130CS85FB
L7C109MMB25
5962-8959832MTC
5962-8959832MNA
3/
MMDJ65608L85/883
3/
3/
MSM8128WMC-85
L7C109KMB25
5962-8959832MNC
5962-8959832MMA
3/
L7C109KMB25
0EU86
65786
54230
MT5C1008ECA-85L883C
CY7C1009-85LMB
EDI88130CS85L32B
5962-8959832M9A
5962-8959832M7A
3/
MSM8128JMC-85
0EU86
MT5C1008DCJ-85883C
5962-8959833MXA
3/
S128K8-70MC
3/
0EU86
54230
MSM8128SMC-70
MT5C1008CW-70883C
EDI88130CS70CB
5962-8959833MYA
3/
S128K8-70MS
54230
3/
EDI88130CS70NB
L7C109YMB25
0EU86
MT5C1008SOJ-70883C
5962-8959833MZA
3/
3/
3/
S128K8-70ME
MSM8128KMC-70
L7C109CMB25
0EU86
54230
65786
3/
MT5C1008C-70883C
EDI88130CS70TB
CY7C1009-70DMB
MMC965608L70/883
See footnotes at end of table.
29 of 37
Standard
microcircuit drawing
PIN 1/
Vendor
CAGE
number
Vendor
Similar
PIN 2/
5962-8959833MUA
3/
0EU86
54230
S128K8-70ML
MT5C1008EC-70883C
EDI88130CS70LB
5962-8959833MTA
3/
3/
0EU86
54230
3/
S128K8-70MF
MSM8128GMC-70
MT5C1008F-70883C
EDI88130CS70FB
L7C109MMB25
5962-8959833MTC
5962-8959833MNA
3/
MMDJ65608L70/883
3/
3/
MSM8128WMC-70
L7C109KMB25
5962-8959833MNC
5962-8959833MMA
3/
L7C109KMB25
0EU86
65786
54230
MT5C1008ECA-70L883C
CY7C1009-70LMB
EDI88130CS70L32B
5962-8959833M9A
5962-8959833M7A
3/
MSM8128JMC-70
0EU86
MT5C1008DCJ-70883C
5962-8959834MXA
5962-8959834MYA
5962-8959834MZA
3/
3/
S128K8-55MC
MSM8128SMC-55
PDM41024S55CB
MT5C1008CW-55883C
EDI88130CS55CB
3/
0EU86
54230
3/
54230
3/
3/
0EU86
S128K8-55MS
EDI88130CS55NB
L7C109YMB25
NS41024S55S/883
MT5C1008SOJ-55883C
3/
3/
3/
S128K8-55ME
MSM8128KMC-55
PDM41024S55TCB
MT5C1008C-55883C
CY7C109A-55DMB
EDI88130CS55TB
L7C109CMB25
0EU86
3/
54230
3/
3/
3/
65786
MMC965608L55/883
NS41024S55D/883
CY7C1009-55DMB
5962-8959834MUA
3/
0EU86
3/
54230
3/
S128K8-55ML
MT5C1008EC-55883C
CY7C109A-55LMB
EDI88130CS55LB
NS41024S55Y/883
See footnotes at end of table.
30 of 37
Standard
microcircuit drawing
PIN 1/
Vendor
CAGE
number
Vendor
Similar
PIN 2/
5962-8959834MTA
3/
3/
0EU86
3/
54230
3/
S128K8-55MF
MSM8128GMC-55
MT5C1008F-55883C
CY7C109A-55FMB
EDI88130CS55FB
L7C109MMB25
3/
NS41024S55F/883
5962-8959834MTC
5962-8959834MNA
3/
MMDJ65608L55/883
3/
3/
MSM8128WMC-55
L7C109KMB25
5962-8959834MNC
5962-8959834MMA
3/
L7C109KMB25
3/
65786
3/
0EU86
54230
PDM41024S55L32B
CY7C1009-55LMB
NS41024S55E/883
MT5C1008ECA-55L883C
EDI88130CS55L32B
5962-8959834M9A
5962-8959834M7A
3/
MSM8128JMC-55
0EU86
MT5C1008DCJ-55883C
5962-8959835MXA
3/
3/
3/
S128K8-45MC
MSM8128SMC-45
PDM41024S45CB
MT5C1008CW-45883C
EDI88130CS45CB
0EU86
54230
5962-8959835MYA
3/
54230
3/
S128K8-45MS
EDI88130CS45NB
L7C109YMB25
NS41024S45S/883
MT5C1008SOJ-45883C
3/
0EU86
5962-8959835MZA
3/
3/
3/
S128K8-45ME
MSM8128KMC-45
PDM41024S45TCB
MT5C1008C-45883C
CY7C109A-45DMB
EDI88130CS45TB
L7C109CMB25
0EU86
3/
54230
3/
3/
3/
65786
MMC965608EV45/883
NS41024S45D/883
CY7C1009-45DMB
5962-8959835MZC
5962-8959835VZC
F7400
F7400
MMC965608EV-45MQ
SMC965608EV-45SV
See footnotes at end of table.
31 of 37
Standard
microcircuit drawing
PIN 1/
Vendor
CAGE
number
Vendor
Similar
PIN 2/
5962-8959835MUA
3/
0EU86
3/
54230
3/
S128K8-45ML
MT5C1008EC-45883C
CY7C109A-45LMB
EDI88130CS45LB
NS41024S45Y/883
5962-8959835MTA
3/
3/
S128K8-45MF
MSM8128GMC-45
MT5C1008F-45883C
CY7C109A-45FMB
EDI88130CS45FB
L7C109MMB25
0EU86
3/
54230
3/
3/
NS41024S45F/883
5962-8959835MTC
5962-8959835QTC
5962-8959835VTC
5962-8959835MNA
F7400
F7400
F7400
MMDJ65608EV-45/883
MMDJ65608EV-45MQ
SMDJ65608EV-45SV
3/
3/
MSM8128WMC-45
L7C109KMB25
5962-8959835MNC
5962-8959835MMA
3/
L7C109KMB25
3/
65786
3/
0EU86
54230
PDM41024S45L32B
CY7C1009-45LMB
NS41024S45E/883
MT5C1008ECA-45L883C
EDI88130CS45L32B
5962-8959835M9A
5962-8959835M7A
5962-8959836MXA
3/
MSM8128JMC-45
0EU86
MT5C1008DCJ-45883C
3/
3/
3/
S128K8-35MC
MSM8128SMC-35
PDM41024S35CB
MT5C1008CW-35883C
EDI88130CS35CB
0EU86
54230
5962-8959836MYA
5962-8959836MZA
3/
54230
3/
S128K8-35MS
EDI88130CS35NB
L7C109YMB25
NS41024S35S/883
MT5C1008SOJ-35883C
3/
0EU86
3/
3/
3/
S128K8-35ME
MSM8128KMC-35
PDM41024S35TCB
MT5C1008C-35883C
CY7C109A-35DMB
EDI88130CS35TB
L7C109CMB25
0EU86
3/
54230
3/
3/
MMC965608EV35/883
NS41024S35D/883
CY7C1009-35DMB
3/
3/
See footnotes at end of table.
32 of 37
Standard
microcircuit drawing
PIN 1/
Vendor
CAGE
number
Vendor
Similar
PIN 2/
5962-8959836QZA
5962-8959836VZA
5962-8959836MUA
F7400
F7400
MMC965608EV-35MQ
SMC965608EV-35SV
3/
0EU86
3/
54230
3/
S128K8-35ML
MT5C1008EC-35883C
CY7C109A-35LMB
EDI88130CS35LB
NS41024S35Y/883
5962-8959836MTA
3/
3/
0EU86
3/
54230
3/
S128K8-35MF
MSM8128GMC-35
MT5C1008F-35883C
CY7C109A-35FMB
EDI88130CS35FB
L7C109MMB25
3/
NS41024S35F/883
5962-8959836MTC
5962-8959836QTC
5962-8959836VTC
5962-8959836MMA
F7400
F7400
F7400
MMDJ65608EV-35/883
MMDJ65608EV-35MQ
SMDJ65608EV-35SV
3/
3/
PDM41024S35L32B
CY7C1009-35LMB
3/
0EU86
54230
NS41024S35E/883
MT5C1008ECA-35L883C
EDI88130CS35L32B
5962-8959836M7A
5962-8959836MNA
5962-8959836MNC
5962-8959837MXA
0EU86
MT5C1008DCJ-35883C
L7C109KMB25
3/
3/
L7C109KMB25
3/
3/
3/
S128K8-25MC
MSM8128SMC-25
PDM41024S25CB
MT5C1008CW-25883C
EDI88130CS25CB
SMJ5C1008-25JDDM
0EU86
54230
3/
5962-8959837MYA
3/
54230
3/
S128K8-25MS
EDI88130CS25NB
L7C109YMB25
NS41024S25S/883
MT5C1008SOJ-25883C
3/
0EU86
See footnotes at end of table.
33 of 37
Standard
microcircuit drawing
PIN 1/
Vendor
CAGE
number
Vendor
Similar
PIN 2/
5962-8959837MZA
3/
3/
3/
S128K8-25ME
MSM8128KMC-25
SMJ5C1008-25JDCM
MT5C1008C-25883C
CY7C109A-25DMB
EDI88130CS25TB
L7C109CMB25
0EU86
3/
54230
3/
3/
3/
3/
MMC965608EV25/883
NS41024S25D/883
CY7C1009-25DMB
5962-8959837MUA
5962-8959837MTA
3/
0EU86
3/
54230
3/
S128K8-25ML
MT5C1008EC-25883C
CY7C109A-25LMB
EDI88130CS25LB
NS41024S25Y/883
SMJ5C1008-25HMM
3/
3/
3/
0EU86
3/
54230
3/
S128K8-25MF
MSM8128GMC-25
MT5C1008F-25883C
CY7C109A-25FMB
EDI88130CS25FB
L7C109MMB25
3/
NS41024S25F/883
5962-8959837MTC
5962-8959837MNA
3/
MMDJ65608L-25/883
3/
3/
MSM8128WMC-25
L7C109KMB25
5962-8959837MNC
5962-8959837MMA
3/
L7C109KMB25
3/
3/
PDM41024S25L32B
CY7C1009-25LMB
3/
0EU86
54230
NS41024S25E/883
MT5C1008ECA-25L883C
EDI88130CS25L32B
5962-8959837M9A
5962-8959837M7A
3/
MSM8128JMC-25
0EU86
MT5C1008DCJ-25883C
5962-8959838MXA
3/
3/
0EU86
54230
3/
S128K8-20MC
MSM8128SMC-20
MT5C1008CW-20883C
EDI88130CS20CB
SMJ5C1008-20JDDM
5962-8959838MYA
3/
S128K8-20MS
54230
3/
0EU86
EDI88130CS20NB
NS41024S20S/883
MT5C1008SOJ-20883C
See footnotes at end of table.
34 of 37
Standard
microcircuit drawing
PIN 1/
Vendor
CAGE
number
Vendor
Similar
PIN 2/
5962-8959838MZA
3/
3/
3/
S128K8-20ME
MSM8128KMC-20
SMJ5C1008-20JDCM
MT5C1008C-20883C
EDI88130CS20TB
NS41024S20D/883
CY7C1009-20DMB
0EU86
54230
3/
65786
5962-8959838MUA
5962-8959838MTA
3/
0EU86
54230
3/
S128K8-20ML
MT5C1008EC-20883C
EDI88130CS20LB
NS41024S20Y/883
SMJ5C1008-20HMM
3/
3/
3/
0EU86
54230
3/
S128K8-20MF
MSM8128GMC-20
MT5C1008F-20883C
EDI88130CS20FB
NS41024S20F/883
5962-8959838MNA
5962-8959838MMA
3/
MSM8128WMC-20
3/
65786
3/
0EU86
54230
PDM41024S20L32B
CY7C1009-20LMB
NS41024S20E/883
MT5C1008ECA-20L883C
EDI88130CS20L32B
5962-8959838M9A
5962-8959838M7A
3/
MSM8128JMC-20
0EU86
MT5C1008DCJ-20883C
5962-8959839MXA
5962-8959839MYA
5962-8959839MZA
5962-8959839MUA
5962-8959839MTA
MT5C1009CW-20883C
EDI88128CS20CB
0EU86
54230
MT5C1009SOJ-20883C
EDI88128CS20NB
0EU86
54230
MT5C1009C-20883C
EDI88128CS20TB
0EU86
54230
MT5C1009EC-20883C
EDI88128CS20LB
0EU86
54230
MT5C1009F-20883C
EDI88128CS20FB
0EU86
54230
5962-8959839MMA
5962-8959839M8A
5962-8959839M7A
MT5C1009ECA-20883C
EDI88128CS20ZB
0EU86
54230
0EU86
MT5C1009DCJ-20883C
See footnotes at end of table.
35 of 37
Standard
microcircuit drawing
PIN 1/
Vendor
CAGE
number
Vendor
Similar
PIN 2/
5962-8959840MXA
5962-8959840MYA
5962-8959840MZA
5962-8959840MUA
5962-8959840MTA
MT5C1009CW-20L883C
EDI88128LPS20CB
0EU86
54230
MT5C1009SOJ-20L883C
EDI88128LPS20NB
0EU86
54230
MT5C1009C-20L883C
EDI88128LPS20TB
0EU86
54230
MT5C1009EC-20L883C
EDI88128LPS20LB
0EU86
54230
MT5C1009F-20L883C
EDI88128LPS20FB
0EU86
54230
5962-8959840MMA
5962-8959840M8A
5962-8959840M7A
5962-8959841MZA
MT5C1009ECA-20L883C
EDI88128LPS20ZB
0EU86
54230
0EU86
MT5C1009DCJ-20L883C
CY7C1009-15DMB
EDI88130CS15TB
65786
54230
5962-8959841MMA
CY7C1009-15LMB
EDI88130CS15L32B
65786
54230
5962-8959842MXA
5962-8959842MYA
5962-8959843MXA
5962-8959843MYA
5962-8959844MZA
5962-8959845MZA
5962-8959845MMA
5962-8959846MZA
5962-8959847QZC
5962-8959847VZC
5962-8959847QTC
5962-8959847VTC
EDI88128LP70CB
EDI88128LP70NB
EDI88128C70CB
54230
54230
54230
54230
54230
54230
54230
54230
F7400
F7400
F7400
F7400
EDI88128C70NB
EDI88128CS15TB
EDI88130CS12TB
EDI88130CS12L32B
EDI88128CS12TB
MMC965608EV-30MQ
SMC965608EV-30SV
MMDJ965608EV-30MQ
SMDJ965608EV-30SV
See footnotes at end of table.
36 of 37
1/ The lead finish shown for each PIN, representing a hermetic package, is the
most readily available from the manufacturer listed for that part. If the desired
lead finish is not listed contact the Vendor to determine availability.
2/ Caution. Do not use this number for item acquisition. Items acquired to this
number may not satisfy the performance requirements of this drawing.
3/ Not available from an approved source of supply.
Vendor CAGE
Number
Vendor name
and address
0EU86
65786
54230
F7400
Austin Semiconductor
8701 Cross Park Drive
Austin, TX 78754
Cypress Semiconductor
3901 N. First Street
San Jose, CA 95134-1599
White Electronic Designs Corp.
3601 East University Drive
Phoenix, AZ 85034
Atmel Nantes,
part of Atmel Wireless and Microcontrollers
La Chantrerie BP 70602
44306 NANTES CEDEX 3
France
The following table lists the SMD part numbers for die.
Standard
microcircuit drawing
PIN
Vendor
CAGE
number
Vendor
Similar
PIN 1/
5962-8959847Q6A
5962-8959840V6A
MMO-65608EV-30MQ
MMO-65608EV-30SV
F7400
F7400
1/ Caution. Do not use this number for item acquisition. Items
acquired to this number may not satisfy the performance
requirements of this drawing.
F7400
Atmel Nantes,
part of Atmel Wireless and Microcontrollers
La Chantrerie BP 70602
44306 NANTES CEDEX 3
France
The information contained herein is disseminated for convenience only and the
government assumes no liability whatsoever for any inaccuracies in this
information bulletin.
37 of 37
相关型号：
©2020 ICPDF网 联系我们和版权申明