BZG05C15 [TEMIC]
Zener Diode, 15V V(Z), 6.1%, 1.25W, Silicon, Unidirectional, DO-214AC,;
| 型号： | BZG05C15 |
| 厂家： | 
TEMIC SEMICONDUCTORS |
| 描述： | Zener Diode, 15V V(Z), 6.1%, 1.25W, Silicon, Unidirectional, DO-214AC, 二极管 |
| 文件： | 总5页 (文件大小：47K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
BZG05C...
Silicon Z–Diodes
Features
Glass passivated junction
High reliability
Voltage range 3.3V to 15V
Fits onto 5 mm SMD footpads
Wave and reflow solderable
Applications
94 9535
Voltage stabilization
Absolute Maximum Ratings
T = 25 C
j
Parameter
Test Conditions
Type
Symbol
Value
3
Unit
W
R
R
<30K/W, T =60 C
P
V
Power dissipation
thJA
amb
<100K/W, T =25 C
P
V
1.25
60
W
thJA
amb
Non repetitive peak surge
power dissipation
t =100 s sq.pulse, T =25 C
P
ZSM
W
p
j
prior to surge
Junction temperature
T
150
C
C
j
Storage temperature range
T
stg
–65...+150
Maximum Thermal Resistance
T = 25 C
j
Parameter
Test Conditions
Symbol
Value
30
Unit
K/W
K/W
K/W
K/W
Junction lead
R
R
thJL
mounted on epoxy–glass hard tissue, Fig. 1a
mounted on epoxy–glass hard tissue, Fig. 1b
150
125
100
Junction ambient
thJA
thJA
thJA
R
R
mounted on Al–oxid–ceramic (Al O ), Fig. 1b
2
3
Characteristics
T = 25 C
j
Parameter
Forward voltage
Test Conditions
I =0.2A
Type
Symbol
Min
Typ
Max
1.2
Unit
V
V
F
F
TELEFUNKEN Semiconductors
1 (5)
Rev. A2, 24-Jun-96
BZG05C...
Type
V
z
r
zj
TK
at
I
z
r
at I
I
at V
R
vz
zk
zk
R
V
%/K
mA
mA
A
V
BZG05C...
Min. Max. Max. Typ. Max.
Max.
500
500
500
500
500
500
400
300
300
200
200
200
200
300
350
400
500
500
500
600
600
600
750
1000
1000
1000
Max.
40
20
10
3
3V3
3V6
3V9
4V3
4V7
5V1
5V6
6V2
6V8
7V5
8V2
9V1
10
3.1
3.4
3.5
3.8
25
25
20
15
15
15
10
5
–0.08 –0.05
80
60
60
50
45
45
45
35
35
35
25
25
25
20
20
20
15
15
15
10
10
10
8
1
1
1
1
–0.08 –0.05
–0.07 –0.02
–0.07 –0.01
–0.03 0.04
–0.01 0.04
3.7
4.1
1
1
4.0
4.6
1
1
4.4
5.0
1
3
1
4.8
5.4
1
1
1.5
2
5.2
6.0
0.00
0.01
0.02
0.02
0.03
0.04
0.04
0.05
0.05
0.05
0.06
0.06
0.06
0.06
0.05
0.06
0.06
0.07
0.07
0.08
0.08
0.08
0.09
0.09
0.09
0.09
0.09
0.09
1
1
5.8
6.6
1
1
3
6.4
7.2
4
1
1
4
7.0
7.9
3.5
6
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.25
0.25
0.25
0.25
1
4.5
6.2
6.8
7.5
8.2
9.1
10
11
12
13
15
16
18
20
22
24
27
7.7
8.7
1
8.5
9.6
6
1
9.4
10.6
11.6
12.7
14.1
15.6
17.1
19.1
21.2
23.3
25.6
28.9
32
8
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
11
10.4
11.4
12.4
13.8
15.3
16.8
18.8
20.8
22.8
25.1
28
10
10
12
20
20
25
30
30
30
35
35
40
45
12
13
15
16
18
20
22
0.06 0.095
0.06 0.095
0.06 0.095
0.06 0.095
0.06 0.095
0.06 0.095
24
27
30
8
33
31
35
8
36
34
38
8
2 (5)
TELEFUNKEN Semiconductors
Rev. A2, 24-Jun-96
BZG05C...
Typical Characteristics (Tj = 25 C unless otherwise specified)
a)
b)
5.0
2.0
2.0
1.5
2.6
10.0
2.4
2.2
7.0
2.4
1.0
25.0
25.0
94 9314
94 9313
Figure 1. Boards for R
definition (copper overlay 35 )
Figure 2. Recommended foot pads (in mm)
thJA
TELEFUNKEN Semiconductors
3 (5)
Rev. A2, 24-Jun-96
BZG05C...
Dimensions in mm
2.2
technical drawings
according to DIN
specifications
1.5
2.1
Plastic Case
JEDEC DO 214 AC
SOD 106 A
4.75
5.45
5.15
Cathode indicated by a Band
2.55
2.45
4.57
2.65
2.50
1.45
1.30
0.17
0.05
0.2
94 9534
4 (5)
TELEFUNKEN Semiconductors
Rev. A2, 24-Jun-96
BZG05C...
Ozone Depleting Substances Policy Statement
It is the policy of TEMIC TELEFUNKEN microelectronic GmbH to
1. Meet all present and future national and international statutory requirements.
2. Regularly and continuously improve the performance of our products, processes, distribution and operating systems
with respect to their impact on the health and safety of our employees and the public, as well as their impact on
the environment.
It is particular concern to control or eliminate releases of those substances into the atmosphere which are known as
ozone depleting substances (ODSs).
The Montreal Protocol (1987) and its London Amendments (1990) intend to severely restrict the use of ODSs and
forbid their use within the next ten years. Various national and international initiatives are pressing for an earlier ban
on these substances.
TEMIC TELEFUNKEN microelectronic GmbH semiconductor division has been able to use its policy of
continuous improvements to eliminate the use of ODSs listed in the following documents.
1. Annex A, B and list of transitional substances of the Montreal Protocol and the London Amendments respectively
2. Class I and II ozone depleting substances in the Clean Air Act Amendments of 1990 by the Environmental
Protection Agency (EPA) in the USA
3. Council Decision 88/540/EEC and 91/690/EEC Annex A, B and C (transitional substances) respectively.
TEMIC can certify that our semiconductors are not manufactured with ozone depleting substances and do not contain
such substances.
We reserve the right to make changes to improve technical design and may do so without further notice.
Parameters can vary in different applications. All operating parameters must be validated for each customer
application by the customer. Should the buyer use TEMIC products for any unintended or unauthorized
application, the buyer shall indemnify TEMIC against all claims, costs, damages, and expenses, arising out of,
directly or indirectly, any claim of personal damage, injury or death associated with such unintended or
unauthorized use.
TEMIC TELEFUNKEN microelectronic GmbH, P.O.B. 3535, D-74025 Heilbronn, Germany
Telephone: 49 (0)7131 67 2831, Fax number: 49 (0)7131 67 2423
TELEFUNKEN Semiconductors
5 (5)
Rev. A2, 24-Jun-96
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