MA4EX950H1-1225T_V3 [TE]

Silicon Double Balanced HMIC Mixer; 硅双平衡混频器HMIC
MA4EX950H1-1225T_V3
型号: MA4EX950H1-1225T_V3
厂家: TE CONNECTIVITY    TE CONNECTIVITY
描述:

Silicon Double Balanced HMIC Mixer
硅双平衡混频器HMIC

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MA4EX950H1-1225T  
Silicon Double Balanced HMIC Mixer  
700 - 1200 MHz  
M/A-COM Products  
Rev. V3  
Features  
Package Outline  
7.0 dB Typical Conversion Loss  
+13 to +17 dBm LO Drive  
HMIC IC Process  
Silicon High Barrier Schottky Barrier Diodes  
DC - 400 MHz IF Bandwidth  
Low Cost Miniature Plastic Package  
RoHS* Compliant with 260°C Reflow Capability  
100% Matte Tin Plating  
Description  
M/A-COM’s MA4EX950H1-1225T is  
a
silicon  
PIN Configuration  
monolithic 700 - 1200 MHz, high barrier, double  
balanced mixer in a low cost miniature surface  
mount SOT25 package. The die uses M/A-COM’s  
unique HMIC silicon/glass process to realize low  
loss passive elements while retaining the advan-  
tages of high barrier silicon Schottky barrier diodes.  
PIN  
1
Function  
RF  
PIN  
Function  
4
5
Gnd  
IF  
2
Gnd  
3
LO  
Ordering Information  
Applications  
These mixers are well suited for high volume wire-  
less and cellular applications where small size and  
repeatability are required. Typical Applications in-  
clude frequency conversion, modulation, and de-  
modulation in wireless receivers and transmitters.  
Model No.  
Package  
MA4EX950H1-1225T  
Tape and Reel  
Sample Test Board  
MAMX-000950-000SMB  
Electrical Specifications @ 25°C  
Parameter  
Conversion Loss  
L - R Isolation  
L - I Isolation  
R - I Isolation  
RF VSWR  
Frequency Range  
Test Conditions  
Units  
Min.  
Typ.  
Max.  
800 MHz  
0.7 - 1.2 GHz  
LO Drive = +15 dBm  
RF = -10 dBm, IF = 60 MHz  
dB  
dB  
6.6  
8.1  
7.5  
10.5  
800 MHz  
0.7 - 1.2 GHz  
LO Drive = +15 dBm  
RF Level = -10 dBm  
dB  
dB  
27.5  
23.0  
800 MHz  
0.7 - 1.2 GHz  
LO Drive = +15 dBm  
RF Level = -10 dBm  
dB  
dB  
28.5  
28.5  
800 MHz  
0.7 - 1.2 GHz  
LO Drive = +15 dBm  
RF Level = -10 dBm  
dB  
dB  
25.0  
22.5  
800 MHz  
0.7 - 1.2 GHz  
LO Drive = +15 dBm  
RF Level = -10 dBm  
Ratio  
Ratio  
1.20:1  
1.50:1  
LO Drive = +15 dBm  
RF Level = -10 dBm  
IF VSWR  
DC - 400 MHz  
Ratio  
1.55:1  
850 MHz  
0.7 - 1.2 GHz  
LO Drive = +15 dBm  
RF = -5 dBm, IF = 60 MHz  
dBm  
dBm  
21.0  
20.0  
23.8  
25.0  
Input IP3  
850 MHz  
0.7 - 1.2 GHz  
LO Drive = +15 dBm  
RF = -5 dBm, IF = 60 MHz  
dBm  
dBm  
8.3  
9.1  
Input 1 dB Compression  
IF 1 dB Bandwidth  
DC - 400 MHz  
LO = 850 MHz @ +15 dBm  
MHz  
0
400  
1
ADVANCED: Data Sheets contain information regarding a product M/A-COM is considering for  
development. Performance is based on target specifications, simulated results, and/or prototype  
measurements. Commitment to develop is not guaranteed.  
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM has under develop-  
ment. Performance is based on engineering tests. Specifications are typical. Mechanical outline has  
been fixed. Engineering samples and/or test data may be available. Commitment to produce in  
volume is not guaranteed.  
North America Tel: 800.366.2266 Europe Tel: +353.21.244.6400  
India Tel: +91.80.43537383 China Tel: +86.21.2407.1588  
Visit www.macomtech.com for additional data sheets and product information.  
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make  
changes to the product(s) or information contained herein without notice.  
MA4EX950H1-1225T  
Silicon Double Balanced HMIC Mixer  
700 - 1200 MHz  
M/A-COM Products  
Rev. V3  
Schematic  
Absolute Maximum Ratings  
Parameter  
Maximum Ratings  
Operating Temperature  
Storage Temperature  
Incident LO Power  
-40°C to +85°C  
-65°C to +150°C  
+20 dBm  
Incident RF Power  
+20 dBm  
1. Exceeding these limits may cause permanent damage.  
Conversion Loss  
Isolation  
-5.00  
0
PLO = 17dBm  
-6.00  
-5  
L-R  
-10  
-7.00  
PLO = 15dBm  
-15  
-20  
-25  
-30  
-35  
-40  
R-I  
-8.00  
PLO = 13dBm  
-9.00  
-10.00  
-11.00  
L-I  
700  
750  
800  
850  
900  
950  
1000  
1050  
1100  
1150  
1200  
700  
750  
800  
850  
900  
950  
1000  
1050  
1100  
1150  
1200  
FREQUENCY (MHz)  
FREQUENCY (MHz)  
Input IP3 & 1 dB Compression  
VSWR  
35  
30  
25  
20  
15  
10  
5
2.40  
2.20  
2.00  
1.80  
1.60  
1.40  
1.20  
1.00  
PLO = 17dBm  
I Port  
PLO = 13dBm  
PLO = 15dBm  
R Port  
1db Compression Pt.  
700  
50  
750  
100  
800  
150  
850  
200  
900  
250  
950  
300  
1000  
350  
1050  
400  
1100  
450  
1150  
1200  
0
700  
750  
800  
850  
900  
950  
1000  
1050  
1100  
1150  
1200  
500  
FREQUENCY (MHz)  
FREQUENCY (MHz)  
2
ADVANCED: Data Sheets contain information regarding a product M/A-COM is considering for  
development. Performance is based on target specifications, simulated results, and/or prototype  
measurements. Commitment to develop is not guaranteed.  
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM has under develop-  
ment. Performance is based on engineering tests. Specifications are typical. Mechanical outline has  
been fixed. Engineering samples and/or test data may be available. Commitment to produce in  
volume is not guaranteed.  
North America Tel: 800.366.2266 Europe Tel: +353.21.244.6400  
India Tel: +91.80.43537383 China Tel: +86.21.2407.1588  
Visit www.macomtech.com for additional data sheets and product information.  
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make  
changes to the product(s) or information contained herein without notice.  
MA4EX950H1-1225T  
Silicon Double Balanced HMIC Mixer  
700 - 1200 MHz  
M/A-COM Products  
Rev. V3  
Case Styles  
SOT-25  
INCHES  
MIN  
MILLIMETERS  
DIM  
A
MAX  
0.122  
0.118  
0.051  
MIN  
2.70  
2.54  
-
MAX  
3.10  
3.00  
1.30  
0.106  
0.100  
-
B
C
D
.063 REF.  
1.60 REF.  
E
0.032  
0.014  
0.003  
0.000  
0.043  
0.020  
-
0.80  
0.35  
0.08  
0.00  
1.10  
0.50  
-
F
G
H
0.006  
0.15  
2. Leads Coplanarity should be 0.003 (0.08) max.  
J
0.018 REF.  
0.45 REF  
Mounting Information  
The illustration indicates the recommended  
mounting pad configuration for the  
SOT-25 package. Solder paste containing flux  
should be screened onto the pads to a thickness of  
0.005- 0.007 inches. The plastic package is placed  
in position, firmly adhering to the solder paste.  
Permanent attachment is performed by a reflow  
soldering procedure during which the tab  
temperature does not exceed +275 °C and the body  
temperature does not exceed +260 °C for the RoHS  
compliant devices.  
Please refer to Application Note M538 for surface  
mounting instructions.  
3
ADVANCED: Data Sheets contain information regarding a product M/A-COM is considering for  
development. Performance is based on target specifications, simulated results, and/or prototype  
measurements. Commitment to develop is not guaranteed.  
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM has under develop-  
ment. Performance is based on engineering tests. Specifications are typical. Mechanical outline has  
been fixed. Engineering samples and/or test data may be available. Commitment to produce in  
volume is not guaranteed.  
North America Tel: 800.366.2266 Europe Tel: +353.21.244.6400  
India Tel: +91.80.43537383 China Tel: +86.21.2407.1588  
Visit www.macomtech.com for additional data sheets and product information.  
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make  
changes to the product(s) or information contained herein without notice.  

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