MA4GP907-T [TE]
GaAs Flip-Chip PIN Diodes; 砷化镓倒装芯片PIN二极管
| 型号： | MA4GP907-T |
| 厂家： | 
TE CONNECTIVITY |
| 描述： | GaAs Flip-Chip PIN Diodes |
| 文件： | 总4页 (文件大小：151K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
V 5.00
GaAs Flip-Chip PIN Diodes
Features
Package Outline
Top View Is Shown With Diode Junction Up
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Low Series Resistance, 4 W
Ultra Low Capacitance, 25 fF
High Switching Cutoff Frequency, 40 GHz
2 Nanosecond Switching Speed
Can be Driven by Buffered TTL
Silicon Nitride Passivation
Cathode
Polyimide Scratch Protection
Description
M/A-COM's MA4GP907 is a Gallium Arsenide Flip-Chip PIN
diode.These devices are fabricated on OMCVD epitaxial
wafers using a process designed for high device uniformity and
extremely low parasitics. The diodes exhibit an extremely low
RC Product, ( 0.1 ps ) and 2 nS switching characteristics. They
are fully passivated with silicon nitride and have an additional
layer of a polymer for scratch protection.The protective
coatings prevent damage to the junction and the anode
airbridge during handling.
Applications
The 25 fF capacitance of the MA4GP907 allows use through
mmwave switch and switched phase shifter applications. This
diode is designed for use in pulsed or CW applications, where
single digit nS switching speed is required. For surface mount
assembly, the low capacitance of the MA4GP907 makes it
ideal for use in microwave multithrow switch assemblies,
where the series capacitance of each “off” port adversely loads
the input and affects VSWR.
Ordering Information
Part Number
MA4GP907
Packaging
Die in Carrier
MA4GP907-T
MA4GP907-W
Tape/Reel
Wafer on Frame
1
GaAs Flip-Chip PIN Diodes
MA4GP907
V5.00
Electrical Specifications and RF Data @TA = 25 °C
Parameters and Test Conditions
Symbol Units
1 MHz & DC
Specifications
10 GHz Reference
Data 1,2
Min.
Typ.
Max.
Min.
Typ.
Max.
0.025
Total Capacitance at -10 V
Ct
Rs
Vf
pF
Ohms
Volts
Volts
nS
0.025 0.030
4.2
Forward Resistance at +10mA
Forward Voltage at +10mA
1.33
-50
1.45
-45
Reverse Breakdown Voltage at -10uA3
Vb
Switching Speed (10 to 90% RF Voltage)4
& (90 to 10% RF Voltage)4
2
Trise
Tfall
Notes:
1. Capacitance is determined by measuring Single Series Diode Isolation in a 50 ohm line at 10 GHz.
2. Forward Series Resistance is determined by measuring Single Series Diode Insertion Loss in a 50 ohm line
at 10 GHz.
3. Reverse current will not exceed 10 microamperes at the Maximum Voltage Rating.
4. Switching speed is measured between 10% and 90% or 90% to 10% RF Voltage for a Single Series Mounted Diode.
Driver delay is Not included.
Single Series Diode Insertion Loss vs Frequency
I. Loss @5mA
I. Loss @15mA
I. Loss @50mA
0.0
-0.2
-0.4
-0.6
-0.8
2
4
6
8 10 12 14 16 18 20 22 24 26 28 30 32 34 36 38 40
Frequency (GHz)
2
n North America: Tel. (800) 366-2266
n Asia/Pacific: Tel.+81-44-844-8296, Fax +81-44-844-8298
n Europe: Tel. +44 (1344) 869 595, Fax+44 (1344) 300 020
M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s)
or information contained herein without notice.
Visit www.macom.com for additional data sheets and product information.
GaAs Flip-Chip PIN Diodes
MA4GP907
V5.00
Single Series Diode Return Loss vs Frequency
R. Loss @5mA
R. Loss @15mA
R. Loss @50mA
0.0
-5.0
-10.0
-15.0
-20.0
-25.0
-30.0
-35.0
-40.0
2
4
6
8 10 12 14 16 18 20 22 24 26 28 30 32 34 36 38 40
Frequency (GHz)
Single Series Diode Isolation vs Frequency
Isolation @ -10V
Isolation @ 0V
0.0
-5.0
-10.0
-15.0
-20.0
-25.0
-30.0
-35.0
2
4
6
8 10 12 14 16 18 20 22 24 26 28 30 32 34 36 38 40
Frequency ( GHz )
3
n North America: Tel. (800) 366-2266
n Asia/Pacific: Tel.+81-44-844-8296, Fax +81-44-844-8298
n Europe: Tel. +44 (1344) 869 595, Fax+44 (1344) 300 020
M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s)
or information contained herein without notice.
Visit www.macom.com for additional data sheets and product information.
GaAs Flip-Chip PIN Diodes
Device Installation Procedures
MA4GP907
V 5.00
Assembly Requirements Using
Electrically Conductive Ag Epoxy
and Solder
The following guidelines should be observed to avoid damag-
ing GaAs Flip-Chips.
These chips are designed to be inserted onto hard or soft sub-
strates with the junction side down. They should be mounted
onto silkscreened circuits using Electrically Conductive Ag
Epoxy, approximately 1-2 mils in thickness and cured at ap-
proximately 90 °C to 150 °C per manufacturer’s schedule.
For extended cure times > 30 minutes, temperatures must be
below 200 °C.
Cleanliness
These devices should be handled in a clean environment.
Do Not attempt to clean die After installation.
Static Sensitivity
Gallium arsenide PIN diodes are ESD sensitive and can be
damaged by static electricity. Proper ESD techniques should
be used when handling these devices. These devices are rated
Class 0, (0-199 V) per HBM MIL-STD-883, method 3015.7
[C = 100pF ±10%, R = 1.5kW ±1%]. Even though tested die
pass 50V ESD, they must be handled in a static-free environment.
Sn Rich Solders are not recommended due to the Tungsten
Metallization scheme beneath the gold contacts. Indalloy or
80 Au/20 Sn Solders are acceptable. Maximum soldering
temperature must be < 300 °C for < 10 sec.
General Handling
Circuit Mounting Dimensions
(Inches)
These devices have a polymer layer which provides scratch
protection for the junction area and the anode air bridge. Die
can be handled with plastic tweezers or picked and placed
with a #27 tip vacuum pencil.
0.013
Absolute Maximum Ratings5
Parameter
Maximum Ratings
-65 °C to +125 °C
-65 °C to +150 °C
50 mW
0.012
(2) PL
Operating Temperature
Storage Temperature
Dissipated RF & DC Power
RF C.W. Incident Power
Mounting Temperature
+ 23 dBm C.W.
0.008
(2) PL
+300 °C for 10 seconds
5. Exceeding any of these values may result in permanent
damage
Ordering Information
Part Number
Package
MA4GP907
Die in Carrier
MA4GP907-T
MA4GP907-W
Tape and Reel
Wafer on Frame
4
n North America: Tel. (800) 366-2266
n Asia/Pacific: Tel.+81-44-844-8296, Fax +81-44-844-8298
n Europe: Tel. +44 (1344) 869 595, Fax+44 (1344) 300 020
M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s)
or information contained herein without notice.
Visit www.macom.com for additional data sheets and product information.
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