MA4L011 [TE]
Silicon PIN Limiter Diodes; 硅PIN二极管限
| 型号： | MA4L011 |
| 厂家： | 
TE CONNECTIVITY |
| 描述： | Silicon PIN Limiter Diodes |
| 文件： | 总6页 (文件大小：159K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
MA4L Series
Silicon PIN Limiter Diodes
V13
Features
•
•
•
•
•
•
Low Insertion Loss and Noise Figure
High Peak and Average Operating Power
Various P1dB Compression Powers
Low Flat Leakage Power
Proven Reliable, Silicon Nitride Passivation
RoHS Compliant
Chip Outline
A Square
Anode
Description
M/A-COM Technology Solutions produces a series of
silicon PIN limiter diodes with small and medium I-region
lengths which are specifically designed for high signal
applications. The devices are designed to provide low
insertion loss, at zero bias, as well as low flat leakage
power with fast signal response/recovery times. Parts are
available as discrete die or assembled into a variety of
surface mount or ceramic pill packages. See the Available
Case Style table on page 6 for the specific ceramic
package styles and their availability for individual part
numbers.
B
Applications
The MA4Lseries of PIN limiter diodes are designed for use
in passive limiter control circuits to protect sensitive
receiver components such as low noise amplifiers (LNA),
detectors, and mixers covering the 10 MHz to 18 GHz
frequency range.
Full Area Cathode
ODS
Dimension
mils
µm
Absolute Maximum Ratings1 TAMB = 25°C
A
B
15 ± 2
381 ± 51
178 ± 25.4
(Unless otherwise specified)
134
7 ±1*
Parameter
Absolute Maximum
100mA
Forward Current
Note:
Operating Temperature
Storage Temperature
Junction Temperature
-55°C to +125°C
-55°C to +150°C
+175°C
The MADL-000301-01340W and MA4L401-134
“B” dimension, is 10 ±1 mils
RF Peak & C.W. Incident Power Per Performance Table
Mounting Temperature +320°C for 10 sec.
Note:
1. Exceeding any of the above ratings may cause
permanent damage.
1
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
Commitment to produce in volume is not guaranteed.
• North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400
• India Tel: +91.80.43537383
• China Tel: +86.21.2407.1588
Visit www.macomtech.com for additional data sheets and product information.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
changes to the product(s) or information contained herein without notice.
MA4L Series
Silicon PIN Limiter Diodes
V13
Un-Packaged Die Electrical Specifications at TAMB = 25°C
Nominal Characteristics
Carrier
Lifetime
IFOR =10mA
IREV = -6mA
nS1
Minimum Maximum
Reverse Reverse
Voltage Voltage
I-Region Contact
Thickness Diameter Resistance
Thermal
Minimum Maximum Maximum
Part Number
Cj0V
Cj0V
RS 10mA
°C/W1
175
175
175
150
150
150
30
Ohms1
2.10
2.10
2.00
2.00
2.50
2.50
2.00
1.50
1.20
µM
2
mils
1.2
1.2
1.2
1.4
1.5
1.5
3.5
3.0
4.5
pF
pF
VR
15
VR
35
35
35
50
50
75
MA4L011-134
MA4L021-134
0.08
0.10
0.09
0.14
0.13
0.07
0.18
0.20
0.19
0.21
0.20
0.15
0.15
0.20
0.30
10
10
20
2
MA4L022-134
20
10
2
MA4L031-134
30
20
3
MA4L032-134
30
15
3
MA4L062-134
50
70
4
MA4L101-134
100
200
250
90
13
20
25
MADL-000301-01340W
MA4L401-134
200
800
30
25
Note:
1. Test performed with the chip mounted in an ODS-30 package.
*Nominal High Signal Performance at TAMB = 25°C
Incident Peak Incident Peak
Incident Peak
Power for
15dB Limiting
@
Power for
1dB Limiting
@
Power for
10dB Limiting
@
Recovery Time
(3 dB)
@
Maximum
Incident
Part Number
Maximum CW
9.4GHz
9.4GHz
9.4GHz
50W Peak Power Peak Power Input Power
dBm
7
dBm
30
dBm
40
nS
10
Watts
80
Watts
MA4L011-134
MA4L021-134
2
3
8
31
41
15
90
MA4L022-134
8
31
41
15
90
3
MA4L031-134
10
11
15
20
23
30
33
43
25
125
125
200
250
500
1000
4
MA4L032-134
34
44
25
4
MA4L062-134
38
50
75
5
MA4L101-134
45
53
100
50
6
MADL-000301-01340W
MA4L401-134
46
59
7
52
60
250
10
*See page 3 for high signal performance parameter notes.
2
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
Commitment to produce in volume is not guaranteed.
• North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400
• India Tel: +91.80.43537383 • China Tel: +86.21.2407.1588
Visit www.macomtech.com for additional data sheets and product information.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
changes to the product(s) or information contained herein without notice.
MA4L Series
Silicon PIN Limiter Diodes
V13
Typical High Signal Peak Power Performance for the Single Shunt Limiter Diode
in a 50 Ω Test Fixture
Typical Peak Power Performance for Single Shunt Limiter Diode in 50 Ohm System
at 9.4 GHz, 1uS Pulse Width, 0.001 Duty
45
40
MA4L011-134, MA4L021-134,
MA4L022-134
MA4L031-134, MA4L032-134
35
30
25
20
15
10
5
MA4L101-134
MA4L401-132
MA4L301-134
0 dB Loss
Line
30 dB Loss
Line
10 dB Loss
Line
20 dB Loss
Line
0
0
10
20
Pin ( dBm )
30
40
50
High Signal Performance: Measured using a single shunt diode (die) attached directly to the gold plated RF
housing ground with 2 mil thick conductive silver epoxy in a 50Ω, SMA, connectorized test fixture. Chip anode
contact is thermo-compression wire bonded using a 1 mil. dia. gold wire onto a 7.2 mil thick Rogers 5880 Duroid
microstrip trace. A shunt coil provides the D.C. return. Test frequency = 9.4 GHz, For peak power
measurements RF pulse width = 1.0 µS, 0.001% duty cycle.
3
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
• North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400
is considering for development. Performance is based on target specifications, simulated results,
• India Tel: +91.80.43537383
• China Tel: +86.21.2407.1588
and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
Commitment to produce in volume is not guaranteed.
Visit www.macomtech.com for additional data sheets and product information.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
changes to the product(s) or information contained herein without notice.
MA4L Series
Silicon PIN Limiter Diodes
V13
Application Circuits
Typical +60dBm Peak Power, 1µS P.W., 0.001% Duty Cycle, +20dBm Flat Leakage Limiter Circuit
Typical +50dBm Peak Power, 1µS P.W., 0.001% Duty Cycle, +20dBm Flat Leakage Limiter Circuit
4
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
Commitment to produce in volume is not guaranteed.
• North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400
• India Tel: +91.80.43537383 • China Tel: +86.21.2407.1588
Visit www.macomtech.com for additional data sheets and product information.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
changes to the product(s) or information contained herein without notice.
MA4L Series
Silicon PIN Limiter Diodes
V13
Notes for Specification and Nominal High Signal Performance Tables:
1) Maximum Series Resistance: RS, is measured at 500 MHz in the ODS-30 package and is equivalent to the
total diode resistance: RS = Rj (Junction Resistance) + RO (Ohmic Resistance)
2) Nominal C.W. Thermal Resistance: ӨTH is measured in a ceramic pill package, ODS-30, mounted to a
metal (infinite) heatsink. Chip only thermal resistance values are approximately 2°C/W lower than the
ODS-30 listed package values in the specifications table.
3) Maximum High Signal Performance: Measured using a single shunt diode (die) attached directly to the gold
plated RF housing ground with 2 mil thick conductive silver epoxy in a 50Ω, SMA, connectorized test fixture.
Chip anode contact is thermo-compression wire bonded using a 1 mil. diameter gold wire onto a 7.2 mil thick
Rogers 5880 Duroid microstrip trace. A shunt coil provides the D.C. return. Test frequency = 9.4 GHz,
RF pulse width = 1.0 µS, Duty Cycle = 0.001%.
4) Maximum C.W. Incident Power: Measured in a 50Ω, SMA, connectorized housing @ 4GHz utilizing a TWT
amplifier and the same single diode assembly configuration as stated in Note 3 above.
Die Handling and Mounting Information
Handling: All semiconductor chips should be handled with care in order to avoid damage or contamination
from perspiration, salts, and skin oils. For individual die, the use of plastic tipped tweezers or vacuum pick up
tools is strongly recommended. Bulk handling should ensure that abrasion and mechanical shock are minimized.
Die Attach: The die have Ti-Pt-Au back and anode metal, with a final gold thickness of 1.0µM. Die can be
mounted with a gold-tin, eutectic solder perform or conductive silver epoxy. The metal RF and D.C. ground plane
mounting surface must be free of contamination and should have a surface flatness or < ± 0.002”.
• Eutectic Die Attachment Using Hot Gas Die Bonder: An 80/20, gold / tin eutectic solder perform is
recommended with a work surface temperature of 255°C and a tool tip temperature of 220°C. When the hot
gas is applied, the temperature at the tool tip should be approximately 290°C. The chip should not be
exposed to a temperatures in excess of 320°C for more than 10 seconds.
• Eutectic Die Attachment Using Reflow Oven: Refer to Application Note M538, “Surface Mounting
Instructions”.
• Epoxy Die Attachment: A thin, controlled amount of electrically conductive silver epoxy should be applied,
approximately 1-2 mils thick to minimize ohmic and thermal resistances. A small epoxy fillet should be visible
around the outer perimeter of the chip after placement to ensure full area coverage. Cure the conductive
silver epoxy per the manufacturer’s schedule, typically 150˚C for 1 hour.
Wire Bonding: The chip’s anode metallization stack is comprised of Ti/Pt/Au with a final gold thickness of
1.0µM. Thermo-compression wedge bonding using a .7 to 1 mil diameter gold wire is recommended, depending
on the contact diameter. The heat stage temperature should be set to approximately 200°C with a bonding tip
temperature of 125˚C and a force of 18 to 40 grams. Use of ultrasonic energy is not advised but if necessary it
should be adjusted to the minimum required to achieve a good bond. Excessive energy or force applied to the top
contact will cause the metallization to dislodge and lift off. Automatic ball bonding may also be used.
See Application Note M541, “Bonding and Handling Procedures for Chip Diode Devices” for more detailed handling and
assembly information.
5
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
• North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400
is considering for development. Performance is based on target specifications, simulated results,
• India Tel: +91.80.43537383
• China Tel: +86.21.2407.1588
and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
Commitment to produce in volume is not guaranteed.
Visit www.macomtech.com for additional data sheets and product information.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
changes to the product(s) or information contained herein without notice.
MA4L Series
Silicon PIN Limiter Diodes
V13
Part Numbering and Ordering Information
When ordering the die only, use the base part number followed by a dash and the number 134.
For example: The chip version of base part number MA4L021 is MA4L021-134.
When ordering packaged parts, use the base part number followed by a dash plus the associated suffix as
defined in Table I “Available Case Styles” below, except where the complete part number with dash number is given.
For example: The MA4L011-134 die in the 186 style package becomes MA4L011-186.
The capacitance values in the specification table on page 2 lists the junction capacitance for the chip. The capacitance for the
same chip in an alternative package will be different and is computed by adding the junction capacitance of the chip plus the
parasitic capacitance of the alternative package as defined in Table II “Associated Package Parasitics” below.
Table I Available Case Styles
Base Part
MA4L011
Available Package Styles
30, 31, 32, 54, 134, 137,186, 1056, 1088
31, 120, 134, 1056
MA4L021
MA4L022
30, 32, 120, 134, 137, 186, 1056
31, 36, 134, 186, 1056
31, 32, 134, 186, 1056
134
MA4L031
MA4L032
MA4L062
MADL-000062-105600
MA4L101
1056 (uses MA4L062 chip)
30, 134, 186
MA4L301
31,1249, 1056
MADL-000301-01340W 134 (chip used in MA4L301 series)
MA4L401
30, 31, 120,134, 1056
Chip
186
30
120
1088
31,32
134
137
1249
1056
Package dimensions can be found on the M/A-COM Technology Solutions website under Outline Drawings
Table II Associated Package Parasitics
Nominal
Package
Style
Package Description
CPKG
pF
LS
nH
30
31
Ceramic Pill
Ceramic Pill
0.18
0.18
0.30
0.13
N/A
0.60
0.60
0.40
0.40
N/A
32
Ceramic Pill
120
134
137
186
1056
1088
1249
Ceramic Pill
Chip
Epoxy Encapsulated Ceramic Surface Mount with Leads
Ceramic Surface Mount with Leads
Ceramic Surface Mount with Wrap Around Contacts
Epoxy Encapsulated Ceramic Surface Mount with Leads
Epoxy Encapsulated Ceramic Surface Mount with Wrap Around Contacts
0.14
0.15
0.20
0.12
0.12
0.70
0.70
0.70
0.70
0.70
6
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
Commitment to produce in volume is not guaranteed.
• North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400
• India Tel: +91.80.43537383 • China Tel: +86.21.2407.1588
Visit www.macomtech.com for additional data sheets and product information.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
changes to the product(s) or information contained herein without notice.
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