MA4P161-134 [TE]
Silicon PIN Chips; 硅PIN芯片
| 型号： | MA4P161-134 |
| 厂家： | 
TE CONNECTIVITY |
| 描述： | Silicon PIN Chips |
| 文件： | 总6页 (文件大小：388K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Silicon PIN Chips
V15
RoHS Compliant
Absolute Maximum Ratings1
Features
T
AMB = +25°C (Unless otherwise specified)
♦ Switch & Attenuator Die
♦ Extensive Selection of I-Region Lengths
♦ Hermetic
Absolute Maximum
♦ Glass Passivated CERMACHIP®
♦ Oxide Passivated Planar Chips
♦ Voltage Ratings to 3000V
♦ Fast Switching Speed
♦ Low Loss
Parameter
Value
Per P/N Rs vs. I Graph
Per Specification Table
Forward Current (IF)
Reverse Voltage (VR)
♦ High Isolation
♦ RoHS Compliant
(175°C –T
°C ) / Theta
Power Dissipation (W)
Operating Temperature
Storage Temperature
Junction Temperature
Mounting Temperature
plate
-55°C to +175°C
-55°C to +200°C
+175°C
Description
M/A-COM offers
a
comprehensive line of low
capacitance, planar and mesa, silicon PIN diode chips
which use ceramic glass and silicon nitride passivation
technology. The Silicon PIN series of devices cover a
broad spectrum of performance requirements for control
circuit applications. They are available in several choices
of I-region lengths and have been optimally designed to
minimize parametric trade offs when considering low
capacitance, low series resistance, and high breakdown
voltages. Their small size and low parasitics, make them
an ideal choice for broadband, high frequency,
micro-strip hybrid assemblies.
+320°C for 10 seconds
1. Exceeding these limits may cause permanent
damage to the chip
Anode
The attenuator line of PIN diode chips are a planar
or mesa construction and because of their thicker
I-regions and predictable Rs vs. I characteristics, they
are well suited for low distortion attenuator and switch
circuits. Incorporated in the chip’s construction is
M/A-COM’s, time proven, hard glass, CERMACHIP® .
The hard glass passivation completely encapsulates the
entire PIN junction area resulting in a hermetically
sealed chip which has been qualified in many military
applications. These CERMACHIP® diodes are available
in a wide variety of voltage ratings, up to 3,000 volts and
are capable of controlling kilowatts of power.
Many of M/A-COM’s silicon PIN diode chips are
also available in several different package styles.
Please consult the “Packaged PIN Diode Datasheet”
for case style availability and specifications. The
datasheet is located on the M/A-COM website at :
www.macomtech.com/DataSheets/packagedpindiodes.pdf
Full Area Cathode
M/A-COM Inc. and its affiliates reserve the right to make changes to the
product(s) or information contained herein without notice. M/A-COM makes
no warranty, representation or guarantee regarding the suitability of its
products for any particular purpose, nor does M/A-COM assume any liability
whatsoever arising out of the use or application of any product(s) or
information.
• North America Tel: 800.366.2266 / Fax: 978.366.2266
• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300
• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298
Visit www.macomtech.com for additional data sheets and product information.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
changes to the product(s) or information contained herein without notice.
Silicon PIN Chips
V15
RoHS Compliant
Low Capacitance PIN Specification @ TAMB = +25°C
Nominal Characteristics
Reverse
Max.
Cap. Series Res.
Max.
Carrier
Recovery
I Region
Length Theta
Max. Rev.
Volt.3
Anode
Dia.
Chip
Size
Chip
Thk.
Lifetime1
Time 2
1 MHz
Cj @ -
500 MHz
VR
RS @
TL
TRR
± 0.5
mils
± 2
mils
± 1
mils
Part Number
<10 µA
VDC
10 V
10 mA
pF
Ω
ηS
ηS
μm
°C/W
MA4P161-134
MA4P203-134
100
0.10
1.50
150
150
200
440
15
25
20
44
13
65
3.5
3.1
1.8
3.1
13X13
13X13
13X13
13x13
6
6
100
200
200
0.15
0.06
0.15
1.50
2.50
1.20
13
19
19
75
150
35
MADP-000165-01340W
MADP-000135-01340W
10
10
Notes:
1. Nominal carrier life time,TL , specified at IF = + 10mA , IREV = - 6mA.
2. Nominal reverse recovery time specified at IF = + 20mA , IREV = - 200mA.
3. VR ( Reverse Voltage ) is sourced and the resultant reverse leakage current, Ir, is measured to be <10µA.
Attenuator PIN Specification @ TAMB = +25°C
Nominal Characteristics
Max.
Series
Res.
Max.
Rev.
Series
Res.
Series
Res.
100MHz
Carrier
Chip
Thk.
Max. Cap.
1MHz
I Region
Length Theta
Anode
Dia.
Chip
Size
Lifetime1
Volt.2
100MHz
100MHz
VR <
VDC
Cj @
RS @
RS @
± 0.5
mils
± 2
mils
± 1
mils
TL
μS
RS @
10 µA
-100 V
10 mA
1 mA
Part Number
10 μA
pF
Ω
Ω
Ω
mils
°C/W
7.5 X7.53
MA47416-132
MA47418-134
200
0.15
6
2
1
30
2000
4
30
19X19
13X13
7
7
200
0.15
3
15
500
2
25
7.5
Notes:
1. Nominal carrier life time,TL, specified at IF = + 10mA, IREV = - 6mA.
2. VR ( Reverse Voltage ) is sourced and the resultant reverse leakage current, IR, is measured to be <10μA.
3. Anode top contact is square.
M/A-COM Inc. and its affiliates reserve the right to make changes to the
product(s) or information contained herein without notice. M/A-COM makes
no warranty, representation or guarantee regarding the suitability of its
products for any particular purpose, nor does M/A-COM assume any liability
whatsoever arising out of the use or application of any product(s) or
information.
• North America Tel: 800.366.2266 / Fax: 978.366.2266
• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300
• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298
Visit www.macomtech.com for additional data sheets and product information.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
changes to the product(s) or information contained herein without notice.
Silicon PIN Chips
V15
RoHS Compliant
CERMACHIP® PIN Chips Specification @ TAMB = +25°C
Nominal Characteristics
Unless
Unless
otherwise noted
otherwise noted
Carrier
Max. Rev.
Volt.5
Max. Cap.
1 MHz
Max. Series Res.
100 MHz
I Region
Length Theta
Anode
Dia.
Chip
size
Chip
Thk.
4
Lifetime
Part Number
VR
CJ @ -
RS @
100 mA
< 10 µA
100 V
VDC
pF
Ω
μS
μm
°C/W ± 0.5 mil ± 2 mils ± 1 mil
2
MA4P303-134
MA4P404-132
200
250
500
500
500
900
0.15 @ 10 V
0.20 @ 50 V
0.20
0.3
20
30
20
15
3.0
6.8
6.8
13X13
20X20
20X20
10.0
7.0
1.5 @ 50 mA
2
0.6
1
30
50
0.70 @ 50 mA
MA4P504-132
0.60
12.0
MA4P505-131
0.35
0.70
0.45
2
3
50
50
14
11
45
10
8
13.0
15.8
12.2
17.0
21.0
37.0
72.0
85.0
27X27
27X27
11.0
12.0
13.5
13.5
14.0
18.5
21.0
28.0
MA4P506-131
0.30
MADP-000488-13740W
MA4P604-131
0.16 @ 50V
0.30
1.6 @ 50 mA
1.00
4
140
90
23X23
1000
1000
1000
2000
3000
3
27X27
MA4P606-131
0.60
0.70
4
90
32X32
MA4P607-212
1.30
0.40
5
127
230
350
4
62X62
1
3
3
2.40
10
40
2
111X111
172X172
MA4PK2000-223
0.20 @ 500 mA
0.25 @ 500 mA
1
2.90
1.5
MA4PK3000-1252
Notes:
1. Upon completion of installation into a circuit, the chip must be covered with a dielectric conformal
coating such as SYLGARD 539® to prevent voltage arcing.
2. Test Frequency = 500 MHz.
3. Test Frequency = 4 MHz.
4. Nominal carrier lifetime, TL, specified at IF = + 10 mA , IREV = - 6 mA.
5. Minimum specified VR (Reverse Voltage) is sourced and the resultant reverse leakage current, IREV
,
is measured to be < 10 μA.
Anode
M/A-COM Inc. and its affiliates reserve the right to make changes to the
product(s) or information contained herein without notice. M/A-COM makes
no warranty, representation or guarantee regarding the suitability of its
products for any particular purpose, nor does M/A-COM assume any liability
whatsoever arising out of the use or application of any product(s) or
information.
• North America Tel: 800.366.2266 / Fax: 978.366.2266
• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300
• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298
Visit www.macomtech.com for additional data sheets and product information.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
changes to the product(s) or information contained herein without notice.
Silicon PIN Chips
V15
RoHS Compliant
Typical Series Resistance vs. Forward Current Performance
M/A-COM Inc. and its affiliates reserve the right to make changes to the
product(s) or information contained herein without notice. M/A-COM makes
no warranty, representation or guarantee regarding the suitability of its
products for any particular purpose, nor does M/A-COM assume any liability
whatsoever arising out of the use or application of any product(s) or
information.
• North America Tel: 800.366.2266 / Fax: 978.366.2266
• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300
• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298
Visit www.macomtech.com for additional data sheets and product information.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
changes to the product(s) or information contained herein without notice.
Silicon PIN Chips
V15
RoHS Compliant
MA4PK2000 & MA4PK3000 (2kV & 3kV) Chips
M/A-COM Inc. and its affiliates reserve the right to make changes to the
product(s) or information contained herein without notice. M/A-COM makes
no warranty, representation or guarantee regarding the suitability of its
products for any particular purpose, nor does M/A-COM assume any liability
whatsoever arising out of the use or application of any product(s) or
information.
• North America Tel: 800.366.2266 / Fax: 978.366.2266
• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300
• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298
Visit www.macomtech.com for additional data sheets and product information.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
changes to the product(s) or information contained herein without notice.
Silicon PIN Chips
V15
RoHS Compliant
Die Handling and Mounting Information
Handling: All semiconductor chips should be handled with care to avoid damage or contamination
from perspiration, salts, and skin oils. The use of plastic tipped tweezers or vacuum pickup is
strongly recommended for the handling and placing of individual components. Bulk handling should
ensure that abrasion and mechanical shock are minimized.
Die Attach Surface: Die can be mounted with an 80Au/Sn20, eutectic solder preform, RoHS
compliant solders or electrically conductive silver epoxy. The metal RF and D.C. ground plane
mounting surface must be free of contamination and should have a surface flatness of < ±0.002”.
Eutectic Die Attachment Using Hot Gas Die Bonder: A work surface temperature of 255oC is
recommended. When hot forming gas (95%N/5%H) is applied, the work area temperature should be
approximately 290oC. The chip should not be exposed to temperatures greater than 320oC for more
than 10 seconds.
Eutectic Die Attachment Using Reflow Oven: Refer to pages 5-7 of Application Note M538,
“Surface Mounting Instructions” at www.macom.com for recommended time-temperature profile.
Electrically Conductive Epoxy Die Attachment: A controlled amount of electrically conductive,
silver epoxy, approximately 1–2 mils in thickness, should be used to minimize ohmic and thermal
resistance. A thin epoxy fillet should be visible around the perimeter of the chip after placement to
ensure full area coverage. Cure conductive epoxy per manufacturer’s schedule. Typically 150°C for
1 hour.
Wire and Ribbon Bonding: The die anode bond pads have a Ti-Pt-Au metallization scheme, with a
final gold thickness of 1.0 micron. Thermo-compression or thermo-sonic wedge bonding of either
gold wire or ribbon is recommended. A bonder heat stage temperature setting of 200oC, tool tip
temperature of 150°C and a force of 18 to 50 grams is suggested. Ultrasonic energy may also be
used but should be adjusted to the minimum amplitude required to achieve an acceptable bond.
Excessive energy may cause the anode metallization to separate from the chip. Automatic ball or
wedge bonding may also be used.
For more detailed handling and assembly instructions, see Application Note M541,
“Bonding and Handling Procedures for Chip Diode Devices” at www.macom.com.
M/A-COM Inc. and its affiliates reserve the right to make changes to the
product(s) or information contained herein without notice. M/A-COM makes
no warranty, representation or guarantee regarding the suitability of its
products for any particular purpose, nor does M/A-COM assume any liability
whatsoever arising out of the use or application of any product(s) or
information.
• North America Tel: 800.366.2266 / Fax: 978.366.2266
• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300
• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298
Visit www.macomtech.com for additional data sheets and product information.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
changes to the product(s) or information contained herein without notice.
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