MADP-000907-14020X [TE]
Solderable AlGaAs Flip Chip PIN;
| 型号： | MADP-000907-14020X |
| 厂家： | 
TE CONNECTIVITY |
| 描述： | Solderable AlGaAs Flip Chip PIN |
| 文件： | 总5页 (文件大小：577K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
MADP-000907-14020x
Solderable AlGaAs Flip Chip PIN
Rev. V7
Features
Low Series Resistance
Ultra Low Capacitance
Millimeter Wave Switching & Cutoff Frequency
Useable up to 70 GHz
2 Nanosecond Switching Speed
Can be Driven by a Buffered TTL
Silicon Nitride Passivation
Polyimide Scratch Protection
RoHS Compliant
Description
The MADP-000907-14020 is a solderable, flip-chip
Aluminum Gallium Arsenide (AlGaAs) PIN diode. It
is fabricated with MOCVD grown epitaxy using a
process and design that optimizes device to device
uniformity and produces extremely low parasitics.
The diode exhibits an exceptionally low RC product
(0.1 ps) and a 2-3 ns switching speed. The chips are
fully passivated with silicon nitride and have an
added BCB polymer layer for scratch protection. The
BCB protective coating prevents damage to the
diode junction area and anode air-bridge during
handling and assembly.
1. Backside metal: 0.2 µm gold over 4 µm nickel.
2. Yellow hatched areas indicate backside ohmic gold contacts.
The ultra low capacitance of the MADP-000907-
14020 allows for operation at millimeter wave
frequencies for RF switches and phase shifter
applications. The diode is designed to be used in
pulsed or CW applications, where single digit ns
switching speed is required. The low capacitance of
the PIN diode makes it ideal for use in many
microwave multi-throw switch assemblies, where the
series capacitance of each “off” port adversely loads
the input and affects VSWR.
Outline Dimension
INCHES
Min.
MM
DIM
Max.
0.027
0.015
0.008
0.005
0.0073
0.019
Min.
0.660
0.343
0.165
0.109
0.173
0.462
Max.
0.686
0.368
0.191
0.135
0.185
0.488
A
B
C
D
E
F
0.026
0.014
0.007
0.004
0.007
0.018
Ordering Information
Part Number
Package
MADP-000907-14020W
Waffle Pack
MADP-000907-14020P
Tape and Reel
* Restrictions on Hazardous Substances, European Union Directive 2011/65/EU.
1
MACOM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit www.macom.com for additional data sheets and product information.
For further information and support please visit:
https://www.macom.com/support
DC-0004063
MADP-000907-14020x
Solderable AlGaAs Flip Chip PIN
Rev. V7
Electrical Specifications: TA = +25°C
Symbol
Parameter
Conditions
Units
Min
Typ
Max
CT
Total Capacitance
-10 V, 1 MHz
pF
—
0.025
0.030
RS
VF
IR
Series Resistance
Forward Voltage
10 mA, 1 GHz
10 mA
Ω
V
—
—
—
—
5.2
1.33
—
7.0
1.45
50
Reverse Leakage Current3
Switching Speed4
VR = -45 V
10 GHz
nA
ns
TRISE
TFALL
/
2
—
3. The max rated VR(-45V) is sourced and the resultant reverse leakage current, Ir, is measured to be <50nA
4. Switching speed is measured between 10% and 90% or 90% to 10% RF voltage for a single series mounted diode. Driver delay is not
included.
Absolute Maximum Ratings: TA = 25°C
Parameter
Reverse Voltage
Absolute Maximum
45V
Operating Temperature
Storage Temperature
Junction Temperature
Dissipated Power (RF + DC)
C.W. Incident Power
Mounting Temperature
-55°C to +125°C
-55°C to +150°C
+175°C
100mW
+23 dBm
+280°C for 10 seconds
2
MACOM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit www.macom.com for additional data sheets and product information.
For further information and support please visit:
https://www.macom.com/support
DC-0004063
MADP-000907-14020x
Solderable AlGaAs Flip Chip PIN
Rev. V7
Typical Performance Curves
Insertion Loss vs. Frequency
Return Loss vs. Frequency
0.0
-20
5 mA
15 mA
50 mA
-0.2
-0.4
-24
-28
-32
-36
-40
-0.6
5 mA
15 mA
50 mA
-0.8
-1.0
2
3
4
5
6
7
8
9
10 11 12 13 14 15
2
3
4
5
6
7
8
9
10 11 12 13 14 15
Frequency (GHz)
Frequency (GHz)
Isolation vs. Frequency
-10
Circuit Pad Layout
0 V
-1 V
-10 V
-15
-20
-25
-30
-35
0.013”
0.012”
(2) PL
0.008”
(2) PL
2
3
4
5
6
7
8
9
10 11 12 13 14 15
Frequency (GHz)
3
MACOM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit www.macom.com for additional data sheets and product information.
For further information and support please visit:
https://www.macom.com/support
DC-0004063
MADP-000907-14020x
Solderable AlGaAs Flip Chip PIN
Rev. V7
Device Installation Guidelines
Cleanliness
This device should be handled in a clean environment. The chip is resistant to solvents and may be cleaned
using approved industry standard practices and chemicals.
Static Sensitivity
Aluminum Gallium Arsenide PIN diodes are ESD sensitive and can be damaged by static electricity.
Proper ESD handling techniques should be used. These devices are rated Class 1A, (0-250 V) HBM.
General Handling
The die has a BCB, polymer layer which provides scratch protection for the junction area and the anode air
bridge. Die can be handled with plastic tweezers or picked and placed with a #27 tip vacuum pencil.
Assembly Requirements using Electrically Conductive Silver Epoxy
The MADP-000907-14020 is designed to be inserted onto hard or soft substrates with the junction/pad side down.
It may be mounted onto a silk-screened circuit using electrically conductive silver epoxy, approximately 1-2 mils in
thickness and cured at approximately 90°C to 150°C per manufacturer’s schedule. For extended cure times, >30
minutes, temperatures must be kept below 200°C.
Eutectic Solder Die Attached
63/37 Sn/Pb or any RoHS compliant solder may be used for diode attachment. It is recommended that the
attachment surface be preheated to 100°C prior to re-flow in order to minimize CTE mismatches. Gradual
temperature ramp up and ramp down is also recommended with a maximum soldering temperature of 280°C for
less than 10 seconds. See Application Note M538 for recommended soldering profile.
4
MACOM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit www.macom.com for additional data sheets and product information.
For further information and support please visit:
https://www.macom.com/support
DC-0004063
MADP-000907-14020x
Solderable AlGaAs Flip Chip PIN
Rev. V7
MACOM Technology Solutions Inc. All rights reserved.
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informational purposes only. Except as provided in MACOM's Terms and Conditions of Sale for such products or
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specifications and product descriptions at any time, without notice. MACOM makes no commitment to update
the information and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future
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WHICH MAY RESULT FROM THE USE OF THESE MATERIALS.
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5
MACOM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit www.macom.com for additional data sheets and product information.
For further information and support please visit:
https://www.macom.com/support
DC-0004063
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