MADP-042408 [TE]
Rugged Silicon-Glass Construction;
| 型号： | MADP-042408 |
| 厂家： | 
TE CONNECTIVITY |
| 描述： | Rugged Silicon-Glass Construction |
| 文件： | 总5页 (文件大小：650K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
MADP-042xx8-1306x Series
SURMOUNTTM 8 µM PIN Diodes
RoHS Compliant
Rev. V3
Features
Surmount Chip1,2,3
Surface Mount
No Wirebonds Required
Rugged Silicon-Glass Construction
Silicon Nitride Passivation
Polymer Scratch Protection
Low Parasitic Capacitance and Inductance
High Average and Peak Power Handling
RoHS Compliant
Description
This device is a silicon, glass PIN diode surmount
chip fabricated with MACOMs’ patented HMIC™
process. This device features two silicon pedestals
embedded in a low loss, low dispersion glass. The
diode is formed on the top of one pedestal and
connections to the backside of the device are
facilitated by making the pedestal sidewalls
electrically conductive. Selective backside
metallization is applied producing a surface mount
device. This vertical topology provides for
exceptional heat transfer. The topside is fully
encapsulated with silicon nitride and has an
additional polymer layer for scratch and impact
protection. These protective coatings prevent
damage to the junction and the anode air-bridge
during handling and assembly.
G
D
E
F
Surmount Chip Dimensions
INCHES
DIM
MM
MIN.
0.040
0.021
0.004
0.013
0.011
0.013
0.019
MAX.
0.042
0.023
0.008
0.015
0.013
0.015
0.021
MIN.
1.025
0.525
0.102
0.325
0.275
0.325
0.475
MAX.
1.075
0.575
0.203
0.375
0.325
0.375
0.525
A
B
C
D
E
F
Applications
These packageless devices are suitable for
moderate incident power applications, ≤10 W/CW or
where the peak power is ≤52 W, pulse width is
≤1 μs, and duty cycle is ≤0.01%. Their low parasitic
inductance, 0.4 nH, and excellent RC constant,
make these devices a superior choice for higher
frequency switch elements when compared to their
plastic package counterparts.
G
1. Backside metal: 0.1 μm thick.
2. Yellow hatched areas indicate backside ohmic gold contacts.
3. All devices have the same outline dimensions (A to G).
1
MACOM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit www.macom.com for additional data sheets and product information.
For further information and support please visit:
https://www.macom.com/support
DC-0007038
MADP-042xx8-1306x Series
SURMOUNTTM 8 µM PIN Diodes
RoHS Compliant
Rev. V3
Electrical Specifications @ TA = +25°C
MADP-042308
MADP-042508
Parameter
Symbol
Conditions
Units
Typ.
Max.
Typ.
Max.
-10 V, 1 MHz
-10 V, 1 GHz
-40 V, 1 MHz
-40 V, 1 GHz
0.10
0.10
0.09
0.10
0.20
—
0.20
—
0.18
0.19
0.18
0.18
0.30
—
0.30
—
Capacitance4,6
Resistance5,6
CT
RS
pF
20 mA, 1 GHz
50 mA, 1 GHz
1.38
1.18
0.97
0.87
Ω
—
—
Forward Voltage
VF
IR
+10 mA
-100 V
V
0.85
1.00
10
0.82
1.00
10
Reverse Leakage Current
µA
—
—
Input Third Order
Intercept Point
F1= 1000 MHz, F2 = 1010 MHz,
PIN = +20 dBm, IBIAS = +20 mA
IIP3
θ
dBm
°C/W
ns
73
—
—
—
77
—
—
—
CW Thermal Resistance7
—
145
280
115
310
+10 mA / -6 mA
(50% - 90% V)
Lifetime
TL
MADP-042408
MADP-042908
Parameter
Symbol
Conditions
Units
Typ.
Max.
Typ.
Max.
-10 V, 1 MHz
-10 V, 1 GHz
-40 V, 1 MHz
-40 V, 1 GHz
0.38
0.39
0.36
0.37
0.50
—
0.50
—
0.05
0.05
0.04
0.05
0.15
—
0.15
—
Capacitance4,6
Resistance5,6
CT
RS
pF
20 mA, 1 GHz
50 mA, 1 GHz
0.67
0.61
3.63
3.02
Ω
—
—
Forward Voltage
VF
IR
+10 mA
-100 V
V
0.80
1.00
10
0.91
1.00
10
Reverse Leakage Current
µA
—
—
Input Third Order
Intercept Point
F1= 1000 MHz, F2 = 1010 MHz,
PIN = +20 dBm, IBIAS = +20 mA
IIP3
θ
dBm
°C/W
ns
81
—
—
—
66
—
—
—
CW Thermal Resistance7
—
100
380
185
230
+10 mA / -6 mA
(50% - 90% V)
Lifetime
TL
4. Total capacitance (CT) is equivalent to the sum of junction capacitance (CJ) and parasitic capacitance (CPAR).
5. Series resistance (RS) is equivalent to the total diode resistance: RS = RJ (Junction Resistance) + RC (Ohmic Resistance).
6. RS and CT are measured on an HP4291A Impedance Analyzer with die mounted in an ODS-1134 package.
7. Theta (θ) is measured with the die mounted in an ODS-1134 package.
2
MACOM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit www.macom.com for additional data sheets and product information.
For further information and support please visit:
https://www.macom.com/support
DC-0007038
MADP-042xx8-1306x Series
SURMOUNTTM 8 µM PIN Diodes
RoHS Compliant
Rev. V3
Typical Performance @ TA = +25°C
Ct @ 10V
Ct @ 40V
0.45
0.40
0.35
0.30
0.25
0.20
0.15
0.10
0.05
0.00
0.45
0.40
0.35
0.30
0.25
0.20
0.15
0.10
0.05
0.00
042408
042408
042508
042308
042508
042308
042908
1.4
042908
1.4
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.6
1.8
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.6
1.8
Freq (GHz)
Freq (GHz)
Rs @ 1GHz
Ct @ 1GHz
10.000
1.000
0.100
0.60
0.50
0.40
0.30
0.20
0.10
0.00
042908
042408
042308
042508
042508
042408
042308
042908
0.001
0.010
0.100
0
5
10
15
20
25
30
35
40
Bias (A)
Bias (V)
Rs @ 20mA
Rs @ 10mA
5.00
4.50
4.00
3.50
3.00
2.50
2.00
1.50
1.00
0.50
0.00
5.00
4.50
4.00
3.50
3.00
2.50
2.00
1.50
1.00
0.50
0.00
042908
042908
042308
042508
042308
042508
042408
1.4
042408
1.4
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.6
1.8
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.6
1.8
Freq (GHz)
Freq (GHz)
3
MACOM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit www.macom.com for additional data sheets and product information.
For further information and support please visit:
https://www.macom.com/support
DC-0007038
MADP-042xx8-1306x Series
SURMOUNTTM 8 µM PIN Diodes
RoHS Compliant
Rev. V3
Absolute Maximum Ratings8
@ TA = +25°C
Bonding Techniques
Attachment to a circuit board is made simple through the
use of surface mount technology. Mounting pads are
conveniently located on the bottom surface of these
devices and are removed from the active junction
locations. These devices are well suited for solder
attachment onto hard and soft substrates. The use of
80Au/20Sn, or RoHS compliant solders is recommended.
For applications where the average power is ~1 W,
conductive silver epoxy may also be used. Cure per
manufacturers recommended time and temperature.
Typically 1 hour at 150°C.
Parameter
Absolute Maximum
CW Incident Power
MADP-042308
MADP-042408
MADP-042508
MADP-042908
42 dBm
44 dBm
43 dBm
39 dBm
Forward Current
Reverse Voltage
250 mA
-100 V
When soldering these devices to a hard substrate, hot gas
die bonding is preferred. A vacuum tip pick-up tool and a
force of 60 to100 grams applied to the top surface of the
device is recommended. When soldering to soft
substrates, such as Duroid, it is recommended to use a
soft solder at the circuit board to mounting pad interface.
Position the die so that its mounting pads are aligned with
the circuit board mounting pads. While applying a
downward force perpendicular to the top surface of the
die, apply heat near the circuit trace and diode mounting
pad. The solder connection to the two pads should not be
made one at a time as this will create unequal heat flow
and thermal stress to the part. Solder reflow should not be
performed by causing heat to flow through the top surface
of the die to the back. Since the HMIC glass is
transparent, the edges of the mounting pads can be
visually inspected through the die after attachment is
completed.
Operating Temperature
Storage Temperature
Junction Temperature
Mounting Temperature
-55°C to +125°C
-55°C to +150°C
+175°C
+280°C for 10 seconds
8. Exceeding these limits may cause permanent damage.
Handling Procedures
All semiconductor chips should be handled with care
to avoid damage or contamination from perspiration
and skin oils. The use of plastic tipped tweezers or
vacuum pickups is strongly recommended for
individual components. Bulk handling should insure
that abrasion and mechanical shock are minimized.
Typical re-flow profiles for Sn60/Pb40 and RoHS
compliant solders is provided in Application Note M538 ,
“Surface Mounting Instructions“ and can viewed
@
www.macom.com .
Ordering Information9
Part Number
Gel Pack
MADP-042308-130600
Tape and Reel (Pocket Tape)
MADP-042308-13060P
MADP-042408-13060P
MADP-042508-13060P
MADP-042908-13060P
MADP-042408-130600
MADP-042508-130600
MADP-042908-130600
9. Reference Application Note M513 for reel size information.
4
MACOM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit www.macom.com for additional data sheets and product information.
For further information and support please visit:
https://www.macom.com/support
DC-0007038
MADP-042xx8-1306x Series
SURMOUNTTM 8 µM PIN Diodes
RoHS Compliant
Rev. V3
MACOM Technology Solutions Inc. All rights reserved.
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products. These materials are provided by MACOM as a service to its customers and may be used for
informational purposes only. Except as provided in MACOM's Terms and Conditions of Sale for such products or
in any separate agreement related to this document, MACOM assumes no liability whatsoever. MACOM
assumes no responsibility for errors or omissions in these materials. MACOM may make changes to
specifications and product descriptions at any time, without notice. MACOM makes no commitment to update
the information and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future
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to any intellectual property rights is granted by this document.
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WHICH MAY RESULT FROM THE USE OF THESE MATERIALS.
MACOM products are not intended for use in medical, lifesaving or life sustaining applications. MACOM
customers using or selling MACOM products for use in such applications do so at their own risk and agree to
fully indemnify MACOM for any damages resulting from such improper use or sale.
5
MACOM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit www.macom.com for additional data sheets and product information.
For further information and support please visit:
https://www.macom.com/support
DC-0007038
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