MAPCGM0005-DIE [TE]
6-Bit Digital Phase Shifter 7.0-12.0 GHz; 6位数字移相器7.0-12.0 GHz的
| 型号： | MAPCGM0005-DIE |
| 厂家： | 
TE CONNECTIVITY |
| 描述： | 6-Bit Digital Phase Shifter 7.0-12.0 GHz |
| 文件： | 总7页 (文件大小：310K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
RO-P-DS-3053 - -
6-Bit Digital Phase Shifter
7.0-12.0 GHz
Preliminary Information
Features
7.0-12.0 GHz GaAs MMIC Phase Shifter
♦ 6 Bit Digital Phase Shifter
♦ 7.0-12.0 GHz Operation
♦ 360º Coverage, LSB = 5.6º
♦ TTL Control Inputs
♦ Self-Aligned MSAG® MESFET Process
Primary Applications
♦ Satellite Communication
♦ Military and Weather Radar
Description
The MAPCGM0005-Die is a 6-bit Phase Shifter with Parallel
TTL Input Control. This product is fully matched to 50 ohms
on both the input and output. The part has 360º of phase
coverage with LSB of 5.6º.
Each device is 100% RF tested on wafer to ensure
performance compliance. The part is fabricated using
M/A-COM’s repeatable, high performance and highly
reliable GaAs Multifunction Self-Aligned Gate (MSAG®)
MESFET Process.
Electrical Characteristics: TB = 40°C1, Z0 = 50Ω, VEE = -5V
Parameter
Symbol
Typical
Units
Bandwidth
f
7.0-12.0
GHz
Insertion Loss
Input VSWR, All States
IL
10
2.5:1
1.8:1
6
dB
VSWR
VSWR
Output VSWR, All States
RMS Phase Error
º
φRMS
RMS Phase Error, Calibrated
Peak to Peak Gain Variation, All States
Digital Driver Current
3
º
φRMS
∆Gn
3
dB
IEE
< 10
35
mA
dBm
dBm
Input Third Order Intercept
Input 1-dB Compression Point
ITOI
P1dB
23
1. TB = MMIC Base Temperature
RO-P-DS-3053 - -
2/7
6-Bit Digital Phase Shifter
Maximum Operating Conditions 1
MAPCGM0005-DIE
Parameter
Input Power
Absolute Maximum
Units
dBm
V
Symbol
PIN
30
-6.0
Digital Driver Voltage
Junction Temperature
Storage Temperature
VEE
180
°C
TJ
TSTG
-55 to +150
°C
1. Operation outside of these ranges may reduce product reliability. Operation at other than the typical values may
result in performance outside the guaranteed limits.
Recommended Operating Conditions
Characteristic
Symbol
Min
Typ
Max
Unit
Digital Driver Voltage
Control Voltage
Logic High
VEE
-5.2
-5
-4.8
V
V control pads
3
0
5
0
5
V
V
Logic Low
0.4
Operating Instructions
This device is static and light sensitive. The digital
circuitry operation can be impaired under high intensity
light, e.g. microscope light. Please handle with care.
To operate the device, follow these steps.
1. Power Up: Apply VEE = -5 V.
2. Apply Logic Voltages to control Circuits as listed
in Recommended Operating Conditions
3. Power Down: Set VEE = 0
Specifications subject to change without notice.
Customer Service: Tel. (888)-563-3949
Email: macom_adbu_ics@tycoelectronics.com
North America: Tel. (800) 366-2266
Asia/Pacific: Tel.+81-44-844-8296, Fax +81-44-844-8298
Europe: Tel. +44 (1344) 869 595, Fax+44 (1344) 300 020
Visit www.macom.com for additional data sheets and product information.
RO-P-DS-3053 - -
3/7
6-Bit Digital Phase Shifter
MAPCGM0005-DIE
20
6
Insertion Loss
Input VSWR
Output VSWR
5
4
3
2
1
16
12
8
4
0
7
7.5
8
8.5
9
9.5
10
10.5
11
11.5
12
Frequency (GHz)
Figure 1. Reference State Insertion Loss, Input and Output VSWR vs. Frequency
20
15
10
5
0
-5
Average Error
-10
RMS Error
RMS Error, Calibrated
-15
-20
7
7.5
8
8.5
9
9.5
10
10.5
11
11.5
12
Frequency (GHz)
Figure 2. Phase Shifter Figures of Merit: Average Error vs Reference State, RMS
Error and Calibrated RMS Error over All States
Specifications subject to change without notice.
Customer Service: Tel. (888)-563-3949
Email: macom_adbu_ics@tycoelectronics.com
North America: Tel. (800) 366-2266
Asia/Pacific: Tel.+81-44-844-8296, Fax +81-44-844-8298
Europe: Tel. +44 (1344) 869 595, Fax+44 (1344) 300 020
Visit www.macom.com for additional data sheets and product information.
RO-P-DS-3053 - - 4/7
6-Bit Digital Phase Shifter
MAPCGM0005-DIE
0
-40
-80
-120
-160
-200
-240
-280
-320
-360
-400
7.0
7.5
8.0
8.5
9.0
9.5
10.0
10.5
11.0
11.5
12.0
Frequency (GHz)
Figure 3. Relative Phase Shift vs Phase Shifter State
10
8
6
4
2
0
-2
-4
-6
-8
-10
7.0
7.5
8.0
8.5
9.0
9.5
10.0
10.5
11.0
11.5
12.0
Frequency (GHz)
Figure 4. Relative Gain Change vs Phase Shifter State
Specifications subject to change without notice.
Customer Service: Tel. (888)-563-3949
Email: macom_adbu_ics@tycoelectronics.com
North America: Tel. (800) 366-2266
Asia/Pacific: Tel.+81-44-844-8296, Fax +81-44-844-8298
Europe: Tel. +44 (1344) 869 595, Fax+44 (1344) 300 020
Visit www.macom.com for additional data sheets and product information.
RO-P-DS-3053 - - 5/7
6-Bit Digital Phase Shifter
MAPCGM0005-DIE
6
5
4
3
2
1
7.0
7.5
8.0
8.5
9.0
9.5
10.0
10.5
11.0
11.5
12.0
Frequency (GHz)
Figure 5. Input VSWR vs Phase Shifter State
6
5
4
3
2
1
7.0
7.5
8.0
8.5
9.0
9.5
10.0
10.5
11.0
11.5
12.0
Frequency (GHz)
Figure 6. Output VSWR vs Phase Shifter State
Specifications subject to change without notice.
Customer Service: Tel. (888)-563-3949
Email: macom_adbu_ics@tycoelectronics.com
North America: Tel. (800) 366-2266
Asia/Pacific: Tel.+81-44-844-8296, Fax +81-44-844-8298
Europe: Tel. +44 (1344) 869 595, Fax+44 (1344) 300 020
Visit www.macom.com for additional data sheets and product information.
RO-P-DS-3053 - - 6/7
6-Bit Digital Phase Shifter
MAPCGM0005-DIE
Mechanical Information
Chip Size: 2.923 x 2.054 x 0.075 mm
(115 x 81 x 3 mils)
2.054mm.
2.054mm.
1.914mm.
G N D G :
G N D :
G
GND:G
G N D G :
GND:G
G N D :
G
GND:G
GND:G
1.242mm.
1.242mm.
GND:G
GND:G
G N D :
G
G N D G :
0
0
Figure 7. Die Layout
Bond Pad Dimensions
Pad
RF (2)
Size (mils)
Size (μm)
100 x 200
125 x 125
125 x 125
4 x 8
5 x 5
5 x 5
Digital Driver Voltage VEE (1)
TTL Control (6)
Specifications subject to change without notice.
Customer Service: Tel. (888)-563-3949
Email: macom_adbu_ics@tycoelectronics.com
North America: Tel. (800) 366-2266
Asia/Pacific: Tel.+81-44-844-8296, Fax +81-44-844-8298
Europe: Tel. +44 (1344) 869 595, Fax+44 (1344) 300 020
Visit www.macom.com for additional data sheets and product information.
RO-P-DS-3053 - - 7/7
6-Bit Digital Phase Shifter
MAPCGM0005-DIE
VDD
0.1 μF
100 pF
CONTROL
INPUTS
G N D : G
G N D : G
G
N
D
:
G
N
D
:
GND: G
G
N
D
:
RFOUT
RFIN
GND: G
G
ND:G
G
ND:G
GND: G
G N D : G
G
N
D
:
Figure 8. Recommended bonding diagram for pedestal mount.
Support circuitry typical of MMIC characterization.
Assembly Instructions:
Die attach: Low thermal conductivity silver epoxies are acceptable for die attach of this MMIC. Follow the
manufacturer’s instructions. If solder is employed , use AuSn (80/20) 1-2 mil preform solder. Limit time @
300 °C to less than 5 minutes.
Wirebonding: Bond @ 160 °C using standard ball or thermal compression wedge bond techniques. For
DC and RF pad connections, use either ball or wedge bonds. For best performance, especially above 10
GHz, wedge bonds of shortest length employed on the RF interconnects is preferred over ball bonds.
Biasing Note: Must apply negative bias to VEE before applying positive bias to Control Pads.
Specifications subject to change without notice.
Customer Service: Tel. (888)-563-3949
Email: macom_adbu_ics@tycoelectronics.com
North America: Tel. (800) 366-2266
Asia/Pacific: Tel.+81-44-844-8296, Fax +81-44-844-8298
Europe: Tel. +44 (1344) 869 595, Fax+44 (1344) 300 020
Visit www.macom.com for additional data sheets and product information.
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