MASW-004240-13170W [TE]
HMIC™ SP4T Surface Mount Silicon PIN Diode Switch; HMIC ™ SP4T表面贴装硅PIN二极管开关
| 型号： | MASW-004240-13170W |
| 厂家： | 
TE CONNECTIVITY |
| 描述： | HMIC™ SP4T Surface Mount Silicon PIN Diode Switch |
| 文件： | 总6页 (文件大小：252K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
MASW-004240-13170W
HMIC™ SP4T Surface Mount Silicon PIN Diode Switch
RoHS Compliant
Rev. V1
Features
♦
♦
♦
♦
♦
Frequency of Operation 10 ± 2GHz or 24 ± 2GHz
Surface Mount Device
Integrated Bias Network
No Wire Bonds Required
Low Current Consumption
+12 mA for On State/0V for Off Condition
Rugged, Glass Encapsulated Construction
Fully Monolithic
♦
♦
♦
Polymer Scratch Protection
Description
The MASW-004240-13170W is a surface mount SP4T
switch chip with integrated bias network. It utilizes
M/A-COM's HMICTM (Heterolithic Microwave Integrated
Circuit) process, US Patent 5,268,310, which allows
the incorporation of silicon pedestals that form series
and shunt diodes or vias by imbedding them in low
loss, low dispersion glass. By using small spacing
between elements, this combination of silicon and
glass gives HMIC devices low loss and high isolation
performance with exceptional repeatability through low
millimeter frequencies. Patterned gold backside metal
allows for manual or re-flow soldering without the need
for wire bond connections to the RF and bias ports.
The chip may be soldered using 80Au/20Sn, RoHS
compliant solders or electrically conductive silver
epoxy. The RF bond pads are labeled J1-J5 and are
375x375µM (15x15mils) square. The DC bias bond
pads are labeled B2-B5 and are also 375x375µM
(15x15mils) square.
Yellow areas denote backside soldering points
for bias and RF connections.
Parameter
Absolute Maximum
Operating Temperature
Storage Temperature
Junction Temperature
Applied Forward Current
RF Incident Power
-65oC to +125oC
-65oC to +150oC
+175oC
+40mA
+30dBm C.W.
Mounting Temperature +280oC for 10 Seconds
Applications
The MASW-004240-13170W has been designed for
24GHz automotive radar sensor applications and is
also ideally suited for use at 10GHz. The switch is
turned on by applying a forward current of +12mA
at 4V to the appropriate bias port and is turned off at
0V. The RF bias network has been incorporated into
the design for ease of use and space considerations.
1
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
Commitment to produce in volume is not guaranteed.
• North America Tel: 800.366.2266 / Fax: 978.366.2266
• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300
• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298
Visit www.macomtech.com for additional data sheets and product information.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
changes to the product(s) or information contained herein without notice.
MASW-004240-13170W
HMIC™ SP4T Surface Mount Silicon PIN Diode Switch
RoHS Compliant
Rev. V1
MASW-004240-13170W (SP4T)
Electrical Specifications @ TAMB = +25oC
Mini-
mum
Parameter
Frequency
Port 1 Port 2
Stimulus
Typical
Maximum
J1
J1
J1
J1
J1
J1
J1
J1
J1
J1
J1
J1
J2
J3
J4
J5
J2
J3
J4
J5
J2
J3
J4
J5
12mA @ B2
12mA @ B3
12mA @ B4
12mA @ B5
12mA @ B2
12mA @ B3
12mA @ B4
12mA @ B5
12mA @ B2
12mA @ B3
12mA @ B4
12mA @ B5
2.5
2.5
2.5
2.5
50
50
50
50
14
14
14
14
3.5dB
3.5dB
3.5dB
3.5dB
10GHz
&
24GHz
Insertion
Loss
40dB
40dB
40dB
40dB
10GHz
&
24GHz
Isolation
10GHz
&
24GHz
Input Return
Loss
2
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
Commitment to produce in volume is not guaranteed.
• North America Tel: 800.366.2266 / Fax: 978.366.2266
• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300
• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298
Visit www.macomtech.com for additional data sheets and product information.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
changes to the product(s) or information contained herein without notice.
MASW-004240-13170W
HMIC™ SP4T Surface Mount Silicon PIN Diode Switch
RoHS Compliant
Rev. V1
TYPICAL ISOLATION
TYPICAL INSERTION LOSS
0
0.0
-0.5
-10
-1.0
-1.5
-20
-2.0
-2.5
-30
-3.0
-3.5
-4.0
-4.5
-5.0
-40
-50
-60
0
5
10
15
20
25
30
0
5
10
15
20
25
30
Frequency (GHz)
Frequency (Ghz)
TYPICAL INPUT RETURN LOSS
TYPICAL OUTPUT RETURN LOSS
0
0
-2
-4
-2
-4
-6
-6
-8
-8
-10
-12
-14
-16
-18
-20
-10
-12
-14
-16
-18
-20
0
5
10
15
20
25
30
0
5
10
15
20
25
30
Frequency (GHz)
Frequency (GHz)
3
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
Commitment to produce in volume is not guaranteed.
• North America Tel: 800.366.2266 / Fax: 978.366.2266
• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300
• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298
Visit www.macomtech.com for additional data sheets and product information.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
changes to the product(s) or information contained herein without notice.
MASW-004240-13170W
HMIC™ SP4T Surface Mount Silicon PIN Diode Switch
RoHS Compliant
Rev. V1
MASW-004240-13170W Schematic
Operation of the MASW-004240-13170W
Operation of the MASW-00420-13170W PIN diode switch is achieved by simultaneously applying a current of
+12mA DC to the bias port of the on arm and 0V to the remaining isolated off arms.
Driver Connections
Control Level ( DC Current ) at Port
Condition of RF Output
B2
-12mA
0V
B3
0V
B4
0V
B5
0V
J1-J2
J1-J3
J1-J4
J1-J5
Low Loss
Isolation
Isolation
Isolation
Isolation
Low Loss
Isolation
Isolation
Isolation
Isolation
Low Loss
Isolation
Isolation
Isolation
Isolation
Low Loss
-12mA
0V
0V
0V
0V
-12mA
0V
0V
0V
0V
-12mA
4
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
Commitment to produce in volume is not guaranteed.
• North America Tel: 800.366.2266 / Fax: 978.366.2266
• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300
• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298
Visit www.macomtech.com for additional data sheets and product information.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
changes to the product(s) or information contained herein without notice.
MASW-004240-13170W
HMIC™ SP4T Surface Mount Silicon PIN Diode Switch
RoHS Compliant
Rev. V1
Chip Dimensions and Pad Locations1,2,3
Chip Dimensions
Mils
Millimeters
Dim
Min.
132.0
128.5
4.0
Max
134.0
129.0
6.0
Min.
Max
A
B
C
D
E
F
3.350
3.270
0.102
0.170
0.370
1.100
0.720
0.245
3.400
3.280
0.152
0.180
0.380
1.110
0.730
0.255
67.0
14.5
43.3
28.3
9.5
71.0
15.0
43.7
28.7
10.0
G
H
Bond Pad Centers
Mils
Y
Millimeters
Dim
X
X
Y
J1
J2
J3
J4
J5
B2
B3
B4
B5
0
-57
57
-57
-57
-57
12
-12
-57
-57
0
-1.450
-1.450
1.450
1.450
-0.145
0.380
1.450
1.450
0.380
-57
57
57
-57
15
57
57
15
1.450
1.450
-1.450
-1.450
1.450
0.313
-0.313
-1.450
R.F. & DC ground
Notes:
1. Backside metallization thickness is.01µM.
2. Hatched areas indicate backside ohmic gold contacts
3. Bond pad centers are referenced from chip center.
5
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
Commitment to produce in volume is not guaranteed.
• North America Tel: 800.366.2266 / Fax: 978.366.2266
• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300
• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298
Visit www.macomtech.com for additional data sheets and product information.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
changes to the product(s) or information contained herein without notice.
MASW-004240-13170W
HMIC™ SP4T Surface Mount Silicon PIN Diode Switch
RoHS Compliant
Rev. V1
Die Attachment and Handling Guidelines
Handling
All semiconductor chips should be handled with care to avoid damage or contamination from perspiration and skin
oils. The use of plastic tipped tweezers or vacuum pickups is strongly recommended for individual components.
Bulk handling should insure that abrasion and mechanical shock are minimized.
Bonding
Attachment to a circuit board is made simple through the use of surface mount technology. Mounting pads are
conveniently located on the bottom surface of these devices and are removed from the active junction locations.
These devices are well suited for solder or conductive epoxy attachment onto hard or soft substrates. The use of
60Pb/40Sn, 80Au/20Sn or any RoHS lead-free solder is recommended to achieve the lowest series resistance
and optimum heat sink. .
When soldering these devices a hot gas or oven re-flow process is preferred. We recommend utilizing a vacuum
tip and applying a downward force of 40 - 60 grams to the top surface of the device. When soldering, position the
die so that its mounting pads are aligned with the circuit board mounting pads and reflow the solder by heating the
circuit trace near the mounting pads while applying 40 to 60 grams of force perpendicular to the top surface of the
die. All mounting pads should be heated simultaneously so that the solder under the pads flows at the same time.
Avoid soldering the pads one at a time as doing so would produce an un-equal heat flow and potentially create
thermal stress to the chip.
Solder reflow should not be performed by causing the heat to flow through the top surface of the die. Die should
be uniformly heated in a re-flow oven. A typical heating profile and handling instructions are provided in
Application Notes, M538 Surface Mounting Instructions and M541 Bonding and Handling Procedures on the
MA-COM website at www.macom.com
Conductive silver epoxy may also be used for die attachment, in lower Incident power applications where the
average power is <1W. Apply a thin controlled amount approximately 1- 2 mils thick to minimize ohmic and
thermal stresses. Take care not to bridge the gap between the chip pads with epoxy. A thin epoxy fillet should be
visible around the perimeter of the pads after placement to ensure full coverage. Cure per epoxy per
manufacturer’s recommended schedule. Typically 150°C for 1 hour.
Ordering Information
Part Number
Package
MASW-004240-13170W
Waffle Pack
6
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
Commitment to produce in volume is not guaranteed.
• North America Tel: 800.366.2266 / Fax: 978.366.2266
• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300
• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298
Visit www.macomtech.com for additional data sheets and product information.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
changes to the product(s) or information contained herein without notice.
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