MS583730BA01-50 [TE]
Ultra Small Gel Filled Pressure Sensor;
| 型号： | MS583730BA01-50 |
| 厂家： | 
TE CONNECTIVITY |
| 描述： | Ultra Small Gel Filled Pressure Sensor |
| 文件： | 总16页 (文件大小：1314K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
MS5837-30BA
Ultra Small Gel Filled Pressure Sensor
SPECIFICATIONS
Ceramic - metal package, 3.3 x 3.3 x 2.75mm
High-resolution module 0.2 mbar
Fast conversion down to 0.5 ms
Low power, 0.6 µA (standby < 0.1 µA at 25°C)
Integrated digital pressure sensor (24 bit ΔΣ ADC)
Supply voltage 1.5 to 3.6 V
Operating range: 0 to 30 bar, -20 to +85 °C
I2C interface
No external components (Internal oscillator)
Excellent long term stability
Hermetically sealable for outdoor devices
Sealing designed for 1.8 x 0.8mm O-ring
The MS5837-30BA is a new generation of high resolution
pressure sensors with I2C bus interface for depth
measurement systems with a water depth resolution of 2 mm.
The sensor module includes a high linearity pressure sensor
and an ultra-low power 24 bit ΔΣ ADC with internal factory
calibrated coefficients. It provides a precise digital 24 Bit
pressure and temperature value and different operation modes
that allow the user to optimize for conversion speed and
current consumption. A high resolution temperature output
allows the implementation in depth measurement systems and
thermometer function without any additional sensor. The
MS5837-30BA can be interfaced to
virtually
any
microcontroller. The communication protocol is simple, without
the need of programming internal registers in the device. The
gel protection and antimagnetic stainless steel cap make the
module water resistant. This new sensor module generation is
based on leading MEMS technology and latest benefits from
MEAS Switzerland proven experience and know-how in high
volume manufacturing, which has been widely used for over a
decade.
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SENSOR SOLUTIONS /// MS5837-30BA
MS5837-30BA
Ultra Small Gel Filled Pressure Sensor
PERFORMANCE SPECIFICATIONS
ABSOLUTE MAXIMUM RATINGS
Parameter
Symbol Conditions
Min.
-0.3
-40
Typ.
Max
+4
Unit
V
Supply voltage
Storage temperature
Overpressure
VDD
TS
+85
50
°C
Pmax
ISO 22810
40 sec max
Bar
Maximum Soldering
Temperature
Tmax
250
+2
°C
Human Body
Model
ESD rating
Latch up
-2
kV
JEDEC standard
No 78
-100
+100
mA
ELECTRICAL CHARACTERISTICS
Parameter
Operating Supply voltage
Operating Temperature
Symbol Conditions
VDD
T
Min.
1.5
Typ.
3.0
Max
3.6
Unit
V
-20
+25
+85
°C
8192
20.09
10.05
5.02
2.51
1.26
0.63
4096
2048
1024
512
Supply current
(1 sample per sec.)
IDD
OSR
µA
256
Peak supplycurrent
Standby supplycurrent
VDD Capacitor
during conversion
at 25°C
1.25
0.01
470
mA
µA
nF
0.1
From VDD to GND
100
ANALOG DIGITAL CONVERTER (ADC)
Parameter
Symbol Conditions
Min.
Typ.
Max
Unit
Output Word
24
Bit
8192
4096
14.8
7.40
3.72
1.88
0.95
0.48
16.44
8.22
4.13
2.08
1.06
0.54
18.08
9.04
4.54
2.28
1.17
0.60
2048
Conversion time (1)
tc
OSR
1024
ms
512
256
(1): Maximum values must be applied to determine w aiting times in I2C communication
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SENSOR SOLUTIONS /// MS5837-30BA
MS5837-30BA
Ultra Small Gel Filled Pressure Sensor
PERFORMANCE SPECIFICATIONS (CONTINUED)
PRESSURE OUTPUT CHARACTERISTICS (VDD = 3 V, T = 25°C UNLESS OTHERWISE NOTED)
Parameter
Conditions
Min.
Typ.
Max
Unit
Operating Pressure Range
Prange
Full Accuracy
0
30
Bar
0 … 6 bar
0 … 20 bar
0 … 30 bar
-50
-100
-200
+50
+100
+200
Absolute Accuracy (1),
Temperature range: 0 … 40°C
mbar
mbar
0 … 6 bar
0 … 20 bar
0 … 30 bar
-100
-200
-400
+100
+200
+400
Absolute Accuracy (1),
Temperature range:-20 … 85°C
Maximum error with supply
voltage (2)
Long-term stability
VDD = 1.5 V … 3.6 V
±30
±30
mbar
mbar/year
8192
4096
2048
1024
512
0.20
0.28
0.38
0.54
0.84
1.57
Resolution RMS
OSR
mbar
256
IPC/JEDEC J-STD-020D.1
(See application note AN808
on http://meas-spec.com)
Reflow soldering impact
-8
7
mbar
Days
Recovering time after reflow (3)
(1) With autozero at one pressure point
(2) With autozero at 3V point
(3) Time to recover at least 66% of the reflow impact.
TEMPERATURE OUTPUT CHARACTERISTICS (VDD = 3 V, T = 25°C UNLESS OTHERWISE NOTED)
Parameter
Conditions
Min.
Typ.
Max
Unit
0 …10 bar, 25°C
-1.5
+1.5
0 …10 bar, 0..60°C
-20..85°C
-2.0
-4.0
+2.0
+4.0
Absolute Accuracy
°C
Maximum error with supply
voltage
VDD = 1.5 V … 3.6 V
± 0.3
°C
°C
8192
4096
2048
1024
512
0.0022
0.0026
0.0033
0.0041
0.0055
0.0086
Resolution RMS
OSR
256
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SENSOR SOLUTIONS /// MS5837-30BA
MS5837-30BA
Ultra Small Gel Filled Pressure Sensor
PERFORMANCE SPECIFICATIONS (CONTINUED)
DIGITAL INPUTS (SCL, SDA)
Parameter
Symbol
Conditions
Min.
Typ.
Typ.
Max
400
Unit
kHz
V
Serial data clock
Input high voltage
Input low voltage
Input leakage current
SCL
V
IH
80% VDD
0% VDD
100% VDD
20% VDD
0.1
V
IL
V
Ileak25°C
at 25°c
µA
DIGITAL OUTPUTS (SDA)
Parameter
Symbol
Conditions
Min.
Max
Unit
Output high voltage
VOH
Isource = 0.6 mA
80% VDD
100% VDD
V
Output low voltage
VOL
Isink = 0.6 mA
0% VDD
20% VDD
V
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SENSOR SOLUTIONS /// MS5837-30BA
MS5837-30BA
Ultra Small Gel Filled Pressure Sensor
PERFORMANCE CHARACTERISTICS
PRESSURE ERROR VS PRESSURE AND TEMPERATURE
TEMPERATURE ERROR VS PRESSURE AND TEMPERATURE
PRESSURE AND TEMPERATURE ERROR VS POWER SUPPLY
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SENSOR SOLUTIONS /// MS5837-30BA
MS5837-30BA
Ultra Small Gel Filled Pressure Sensor
FUNCTIONAL DESCRIPTION
GENERAL
The MS5837-30BA consists of a piezo-resistive sensor and a sensor interface IC. The main function of the
MS5837-30BA is to convert the uncompensated analogue output voltage from the piezo-resistive pressure sensor
to a 24-bit digital value, as well as providing a 24-bit digital value for the temperature of the sensor.
FACTORY CALIBRATION
Every module is individually factory calibrated at two temperatures and two pressures. As a result, 6 coefficients
necessary to compensate for process variations and temperature variations are calculated and stored in the 112-
bit PROM of each module. These bits (partitioned into 6 coefficients W1 to W6) must be read by the
microcontroller software and used in the program converting D1 and D2 into compensated pressure and
temperature values.
The coefficients W0 is for factory configuration and CRC.
SERIAL I2C INTERFACE
The external microcontroller clocks in the data through the input SCL (Serial CLock) and SDA (Serial DAta). The
sensor responds on the same pin SDA which is bidirectional for the I2C bus interface. So this interface type uses
only 2 signal lines and does not require a chip select.
Module ref
Mode
I2C
Pins used
MS5837-30BA
SDA, SCL
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SENSOR SOLUTIONS /// MS5837-30BA
MS5837-30BA
Ultra Small Gel Filled Pressure Sensor
PRESSURE AND TEMPERATURE CALCULATION
Start
Maximum values for calculation results:
PMIN = 0 bar PMAX = 30 bar
TMIN = -20°C TMAX = 85°C TREF = 20°C
Read calibration data (factory calibrated) from PROM
Size[1]
[bit]
Value
Recommended
variable type
Example /
Typical
Description | Equation
Variable
min
0
max
Pressure sensitivity | SENST1
C1
C2
C3
C4
C5
C6
unsigned int 16
unsigned int 16
unsigned int 16
unsigned int 16
unsigned int 16
16
16
16
16
16
16
65535
65535
65535
65535
65535
65535
34982
36352
20328
22354
26646
26146
Pressure offset | OFF
0
T1
Temperature coefficient of pressure sensitivity | TCS
Temperature coefficient of pressure offset | TCO
Reference temperature | TREF
0
0
0
Temperature coefficient of the temperature | TEMPSENS unsigned int 16
0
Readdigitalpressureandtemperaturedata
D1
D2
Digital pressure value
unsigned int 32
unsigned int 32
24
24
0
0
16777215
16777215
4958179
6815414
Digital temperature value
Calculate temperature
[2]
Difference between actual and reference temperatre
dT
signed int 32
signed int 32
25
41
-16776960
-4000
16777215
8500
-5962
dT = D2 - T = D2 - C5 * 28
REF
1981
Actual temperature (-40…85°C with 0.01°C resolution)
TEMP 20°C+dTTEMPSENS 200+dT C6 23
TEMP
= 19.81 °C
Calculate temperature compensated pressure
Offset at actual temperatur[3]
OFF
signed int 64
signed int 64
41
41
-17179344900
-8589672450
25769410560
12884705280
2381326464
1145816755
OFF =OFFT1 + TCO*dT =C2 *216 + (C4* dT)/27
Sensitivity at actual temperatu[4]
SENS
SENS =SENS T1+TCS*dT=C1 * 215 + (C3 *dT )/28
Temperature compensated pressure (0…30 bar with
39998
P
0.25mbar resolution)
signed int 32
58
0
300000
13
P = D1 * SENS - OFF =(D1 * SENS / 2-1 OFF) / 2
= 3999.8 mbar
Display pressure and temperature value
Notes
[1]
Maximal size of intermediate result during evaluation of variable
[2]
[3]
[4]
m
min and max have to be defined
min and max have to be defined
Flow chart for pressure and temperature reading and software compensation.
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SENSOR SOLUTIONS /// MS5837-30BA
MS5837-30BA
Ultra Small Gel Filled Pressure Sensor
SECOND ORDER TEMPERATURE COMPENSATION
Pressure and Temperature parameters values first order:
OFF, SENS and TEMP
Yes
No
(TEMP/ 100)< 20°C
Low temperature
High temperature
Ti = 3 dT2 / 233
OFFi = 3 (TEMP – 2000)2 / 21
SENSi = 5 (TEMP – 2000)2 / 23
Ti = 2 dT2 / 237
OFFi = 1 (TEMP – 2000)2 / 24
SENSi = 0
No
Yes
(TEMP/ 100) < -15°C
Very low temperature
OFFi = OFFi + 7 (TEMP + 1500)2
SENSi = SENSi + 4 (TEMP + 1500)2
Calculate pressure and temperature 2nd order
OFF2 = OFF - OFFi
SENS2 = SENS - SENSi
TEMP2 = (TEMP – Ti) / 100
P2 = ((( D1 SENS2 ) / 221 – OFF2) / 213) / 10
[°C]
[mbar]
Flow chart for pressure and temperature to the optimum accuracy.
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SENSOR SOLUTIONS /// MS5837-30BA
MS5837-30BA
Ultra Small Gel Filled Pressure Sensor
I2C INTERFACE
COMMANDS
The MS5837-30BA has only five basic commands:
1. Reset
2. Read PROM (112 bit of calibration words)
3. D1 conversion
4. D2 conversion
5. Read ADC result (24 bit pressure / temperature)
Each I2C communication message starts with the start condition and it is ended with the stop condition. The
MS5837-30BA address is 1110110x (write: x=0, read: x=1).
Size of each command is 1 byte (8 bits) as described in the table below. After ADC read commands, the device
will return 24 bit result and after the PROM read 16 bit results. The address of the PROM is embedded inside of
the PROM read command using the a2, a1 and a0 bits.
Command byte
hex value
Bit number
Bit name
0
1
2
-
3
4
5
6
7
PRO CO
M
Typ Ad2/ Ad1/ Ad0/ Stop
Os2 Os1 Os0
NV
Command
Reset
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
0
1
1
1
1
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
0
0
0
0
0
0
1
1
1
1
1
1
0
0
1
0
0
0
0
1
1
0
0
0
0
1
1
0
1
0
0
1
1
0
0
0
0
1
1
0
0
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0x1E
0x40
0x42
0x44
0x46
0x48
0x4A
0x50
Convert D1 (OSR=256)
Convert D1 (OSR=512)
Convert D1 (OSR=1024)
Convert D1 (OSR=2048)
Convert D1 (OSR=4096)
Convert D1 (OSR=8192)
Convert D2 (OSR=256)
Convert D2 (OSR=512)
Convert D2 (OSR=1024)
Convert D2 (OSR=2048)
Convert D2 (OSR=4096)
Convert D2 (OSR=8192)
ADC Read
0x52
0x54
0x56
0x58
0x5A
0x00
0xA0 to
0xAE
PROM Read
Ad2 Ad1 Ad0
Command structure
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SENSOR SOLUTIONS /// MS5837-30BA
MS5837-30BA
Ultra Small Gel Filled Pressure Sensor
RESET SEQUENCE
The Reset sequence shall be sent once after power-on to make sure that the calibration PROM gets loaded into
the internal register. It can be also used to reset the device PROM from an unknown condition.
The reset can be sent at any time. In the event that there is not a successful power on reset this may be caused
by the SDA being blocked by the module in the acknowledge state. The only way to get the MS5837-30BA to
function is to send several SCLs followed by a reset sequence or to repeat power on reset.
1
1
1
0
1
1
0
0
0
A
0
0
0
1
1
1
1
0
0
A
Device Address
Device Address
command
cmd byte
S
W
P
From Master
From Slave
S = Start Condition
P = Stop Condition
W = Write
R = Read
A = Acknowledge
N = Not Acknowledge
I2C Reset Command
PROM READ SEQUENCE
The read command for PROM shall be executed once after reset by the user to read the content of the calibration
PROM and to calculate the calibration coefficients. There are in total 7 addresses resulting in a total memory of
112 bit. Addresses contain factory data and the setup, calibration coefficients, the serial code and CRC. The
command sequence is 8 bits long with a 16 bit result which is clocked with the MSB first. The PROM Read
command consists of two parts. First command sets up the system into PROM read mode. The second part gets
the data from the system.
1
1
1
0
1
1
0
0
0
A
1
0
1
0
0
1
1
0
0
A
Device Address
Device Address
command
cmd byte
S
W
P
From Master
From Slave
S = Start Condition
P = Stop Condition
W = Write
R = Read
A = Acknowledge
N = Not Acknowledge
I2C Command to read memory address= 011
1
1
1
0
1
1
0
1
0
A
X
X
X
X
X
X
X
X
0
A
X
X
X
X
X
X
X
X
0
Device Address
Device Address
data
Memory bit 15 - 8
data
Memory bit 7 - 0
S
R
N P
From Master
From Slave
S = Start Condition
P = Stop Condition
W = Write
R = Read
A = Acknowledge
N = Not Acknowledage
I2C answer from MS5837-30BA
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SENSOR SOLUTIONS /// MS5837-30BA
MS5837-30BA
Ultra Small Gel Filled Pressure Sensor
CONVERSION SEQUENCE
The conversion command is used to initiate uncompensated pressure (D1) or uncompensated temperature (D2)
conversion. After the conversion, using ADC read command the result is clocked out with the MSB first. If the
conversion is not executed before the ADC read command, or the ADC read command is repeated, it will give 0
as the output result. If the ADC read command is sent during conversion the result will be 0, the conversion will
not stop and the final result will be wrong. Conversion sequence sent during the already started conversion
process will yield incorrect result as well. A conversion can be started by sending the command to MS5837-30BA.
When command is sent to the system it stays busy until conversion is done. When conversion is finished the data
can be accessed by sending a Read command, when acknowledge is sent from the MS5837-30BA, 24 SCL
cycles may be sent to receive all result bits. Every 8 bits the system waits for an acknowledge signal.
1
1
1
0
1
1
0
0
0
A
0
1
0
0
1
0
0
0
0
A
Device Address
Device Address
command
cmd byte
S
W
P
From Master
From Slave
S = Start Condition
P = Stop Condition
W = Write
R = Read
A = Acknowledge
N = Not Acknowledge
I2C command to initiate a pressure conversion (OSR=4096, typ=D1)
1
1
1
0
1
1
0
0
0
A
0
0
0
0
0
0
0
0
0
A
Device Address
Device Address
command
cmd byte
S
W
P
From Master
From Slave
S = Start Condition
P = Stop Condition
W = Write
R = Read
A = Acknowledge
N = Not Acknowledge
I2C ADC read sequence
1
1
1
0
1
1
0
1
0
X
X
X
X
X
X
X
X
0
X
X
X
X
X
X
X
X
0
X
X
X
X
X
X
X
X
0
Device Address
Device Address
data
Data 23-16
data
Data 15 - 8
data
Data 7 - 0
S
R
A
A
A
N
P
From Master
From Slave
S = Start Condition
P = Stop Condition
W = Write
R = Read
A = Acknowledge
N = Not Acknowledge
I2C answer from MS5837-30BA
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SENSOR SOLUTIONS /// MS5837-30BA
MS5837-30BA
Ultra Small Gel Filled Pressure Sensor
CYCLIC REDUNDANCY CHECK (CRC)
MS5837-30BA contains a PROM memory with 112-Bit. A 4-bit CRC has been implemented to check the data
validity in memory. The besides C code describes in detail CRC-4 calculation.
D
B
1
D
B
1
D
B
1
D
B
1
D
B
1
D
B
1
C6
D
B
9
D
B
8
D
B
7
D
B
6
D
B
5
D
B
4
D
B
3
D
B
2
D
B
1
D
B
0
5
4
3
2
1
0
0
1
2
3
4
5
6
CRC
Factory defined
C1
C2
C3
C4
C5
Memory PROM mapping
C Code example for CRC-4 calculation:
unsigned char crc4(unsigned int n_prom[])
// n_prom defined as 8x unsigned int (n_prom[8])
{
int cnt;
unsigned int n_rem=0;
// simple counter
// crc remainder
unsigned char n_bit;
n_prom[0]=((n_prom[0]) & 0x0FFF);
n_prom[7]=0;
for (cnt =0; cnt < 16; cnt++)
{
// CRC byte is replaced by 0
// Subsidiary value, set to 0
// operation is performed on bytes
// choose LSBor MSB
if (cnt%2==1)
else
n_rem ^= (unsigned short) ((n_prom[cnt>>1]) &0x00FF);
n_rem ^= (unsigned short) (n_prom[cnt>>1]>>8);
for (n_bit = 8; n_bit > 0; n_bit--)
{
if (n_rem & (0x8000))
else
}
n_rem = (n_rem << 1) ^ 0x3000;
n_rem = (n_rem << 1);
}
n_rem= ((n_rem >> 12) & 0x000F);
return (n_rem ^ 0x00);
// final4-bit remainder is CRC code
}
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SENSOR SOLUTIONS /// MS5837-30BA
MS5837-30BA
Ultra Small Gel Filled Pressure Sensor
APPLICATION CIRCUIT
The MS5837 is a circuit that can be used in conjunction with a microcontroller in mobile altimeter applications.
Typical application circuit
PIN CONFIGURATION AND DEVICE PACKAGE OUTLINE
UNLESS OTHERWISE SPECIFIED DIMENSIONS ARE IN MILLIMETERS. GENERAL TOLERANCE ± 0.1
1 GND
2 VDD
3 SCL
GROUND
POSITIVESUPPLY
I2C CLOCK
4 SDA
I2C DATA
Package outlines and Pin configuration
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SENSOR SOLUTIONS /// MS5837-30BA
MS5837-30BA
Ultra Small Gel Filled Pressure Sensor
RECOMMENDED PAD LAYOUT
Pad layout for bottom side of the MS5837-30BA soldered onto printed circuit board.
Recommended PCB footprint
SHIPPING PACKAGE
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SENSOR SOLUTIONS /// MS5837-30BA
MS5837-30BA
Ultra Small Gel Filled Pressure Sensor
MOUNTING AND ASSEMBLY CONSIDERATIONS
SOLDERING
Please refer to the application note AN808 available on our website for all soldering recommendations.
MOUNTING
The MS5837-30BA can be placed with automatic Pick & Place equipment using vacuum nozzles. It will not be
damaged by the vacuum. Due to the low stress assembly the sensor does not show pressure hysteresis effects. It
is important to solder all contact pads.
CONNECTION TO PCB
The package outline of the module allows the use of a flexible PCB for interconnection. This can b e important for
applications in watches and other special devices.
SEALING WITH O-RINGS
In applications such as outdoor watches the electronics must be protected against direct water or humidity. For
such applications the MS5837-30BA provides the possibility to seal with an O-ring. The O-ring shall be placed at
the groove location, i.e. the small outer diameter of the metal lid. The following O-ring / housing dimensions are
recommended:
O-ring inner diameter
O-ring cross-section diameter
Housing bore diameter
1.8 ± 0.05 mm
0.8 ± 0.03 mm
3.07 ± 0.03 mm
Please refer to the application note AN523 available on our website for O-ring mounting recommendations.
CLEANING
The MS5837-30BA has been manufactured under clean-room conditions. It is therefore recommended to
assemble the sensor under class 10’000 or better conditions. Should this not be possible, it is recommended to
protect the sensor opening during assembly from entering particles and dust. To avoid cleaning of the PCB,
solder paste of type “no-clean” shall be used. Warning: cleaning might damage the sensor.
ESD PRECAUTIONS
The electrical contact pads are protected against ESD up to 2 kV HBM (human body model). It is therefore
essential to ground machines and personnel properly during assembly and handling of the device. The MS5837-
30BA is shipped in antistatic transport boxes. Any test adapters or production transport boxes used during the
assembly of the sensor shall be of an equivalent antistatic material.
DECOUPLING CAPACITOR
Particular care must be taken when connecting the device to the power supply. A minimum of 100nF ceramic
capacitor must be placed as close as possible to the MS5837-30BA VDD pin. This capacitor will stabilize the
power supply during data conversion and thus, provide the highest possible accuracy.
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SENSOR SOLUTIONS /// MS5837-30BA
MS5837-30BA
Ultra Small Gel Filled Pressure Sensor
ORDERING INFORMATION
Part Number / Art. Number Product
Delivery Form
MS583730BA01-50
MS5837-30BAUltra Small Gel Filled Pressure Sensor
Tape & Reel
CDOC-DA-0093
7
03/12/2015
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SENSOR SOLUTIONS /// MS5837-30BA
相关型号：
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