NPTB00050_15 [TE]

50W RF Power Transistor;
NPTB00050_15
型号: NPTB00050_15
厂家: TE CONNECTIVITY    TE CONNECTIVITY
描述:

50W RF Power Transistor

文件: 总8页 (文件大小:510K)
中文:  中文翻译
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NPTB00050  
Not recommended for new designs  
Contact applications@nitronex.com for questions or support  
Gallium Nitride 28V, 50W RF Power Transistor  
®
Built using the SIGANTIC NRF1 process - A proprietary GaN-on-Silicon technology  
FEATURES  
• Optimized for broadband operation from  
DC - 4000MHz  
• 50W P3dB CW narrowband power  
• 25W P3dB CW broadband power from  
500-1000MHz  
• Characterized for operation up to 32V  
• 100% RF tested  
• Thermally enhanced industry standard package  
Broadband  
50 Watt, 28 Volt  
• High reliability gold metallization process  
• Lead-free and RoHS compliant  
GaN HEMT  
• Subject to ECCN 3A982.a.1 export control  
RF Specifications (CW): VDS = 28V, IDQ = 450mA, Frequency = 3000MHz, TC = 25°C, Measured in Nitronex Test Fixture  
Symbol  
Parameter  
Min  
Typ  
Max  
Units  
P3dB  
P1dB  
GSS  
h
Average Output Power at 3dB Gain Compression  
Average Output Power at 1dB Gain Compression  
Small Signal Gain  
45  
33  
50  
38  
-
-
-
-
W
W
10.5  
55  
11.5  
60  
dB  
%
Peak Drain Efficiency at POUT = P3dB  
Output mismatch stress, VSWR = 7:1, all phase  
angles, POUT = P1dB  
y
No Performance Degradation After Test  
Typical OFDM Performance: VDS = 28V, IDQ = 300mA, Single carrier OFDM waveform 64-QAM 3/4, 8 burst,  
continuous frame data, 10MHz channel bandwidth. Peak/Avg = 10.3dB @ 0.01% probability on CCDF.  
Frequency = 2400 to 2600MHz. POUT,AVG = 6W, TC=25°C.  
Symbol  
Parameter  
Typ  
Units  
GP  
h
Power Gain  
12.0  
23  
dB  
%
Drain Efficiency  
Error Vector Magnitude  
EVM  
2.0  
%
NPTB00050  
Page 1  
NDS-007 Rev 6, April 2013  
NPTB00050  
Not recommended for new designs  
Contact applications@nitronex.com for questions or support  
DC Specifications: TC = 25°C  
Symbol  
Parameter  
Min  
Typ  
Max  
Units  
Off Characteristics  
Drain-Source Breakdown Voltage  
(VGS = -8V, ID = 16mA)  
VBDS  
IDLK  
100  
-
-
-
V
Drain-Source Leakage Current  
(VGS = -8V, VDS = 60V)  
0.1  
16  
mA  
On Characteristics  
Gate Threshold Voltage  
(VDS = 28V, ID = 16mA)  
VT  
-2.3  
-2.0  
-
-1.8  
-1.5  
0.25  
-1.3  
-1.0  
V
V
W
Gate Quiescent Voltage  
(VDS = 28V, ID = 450mA)  
VGSQ  
RON  
On Resistance  
(VGS = 2V, ID = 120mA)  
0.40  
Drain Current  
ID  
(VDS = 7V pulsed, 300ms pulse width,  
0.2% duty cycle, VGS = 2V)  
9.2  
9.8  
-
A
Absolute Maximum Ratings: Not simultaneous, TC = 25°C unless otherwise noted  
Symbol  
Parameter  
Max  
Units  
VDS  
VGS  
IG  
Drain-Source Voltage  
100  
-10 to 3  
80  
V
V
Gate-Source Voltage  
Gate Current  
mA  
W
PT  
Total Device Power Dissipation (Derated above 25°C)  
Thermal Resistance (Junction-to-Case)  
Storage Temperature Range  
55  
qJC  
TSTG  
TJ  
3.2  
°C/W  
°C  
-65 to 150  
200  
Operating Junction Temperature  
Human Body Model ESD Rating (per JESD22-A114)  
Machine Model ESD Rating (per JESD22-A115)  
°C  
HBM  
MM  
1B (>500V)  
M2 (>100V)  
NPTB00050  
Page 2  
NDS-007 Rev 6, April 2013  
NPTB00050  
Not recommended for new designs  
Contact applications@nitronex.com for questions or support  
Load-Pull Data, Reference Plane at Device Leads  
VDS=28V, I =450mA, TA=25°C unless otherwise noted  
DQ  
Table 1: Optimum Source and Load Impedances for CW Gain, Drain Efficiency, and Output Power Performance  
Frequency  
Drain Efficiency @  
ZS (W)  
ZL (W)  
PSAT (W)  
Gain (dB)  
(MHz)  
PSAT (%)  
2000  
2400  
2500  
2600  
2700  
3000  
3.2 - j3.5  
3.1 - j7.5  
3.1 - j8.4  
3.2 - j9.4  
3.7 - j11.0  
4.4 - j13.0  
4.8 - j2.5  
5.0 - j3.5  
5.2 - j3.6  
5.3 - j3.7  
5.2 - j4.9  
5.2 - j5.3  
50  
50  
50  
50  
50  
50  
15.0  
13.8  
13.8  
13.5  
13.1  
13.0  
65  
62  
62  
61  
60  
60  
Z is the source impedance  
S
presented to the device.  
Z is the load impedance  
L
presented to the device.  
Figure 1 - Optimal Impedances for CW Performance, VDS = 28V, IDQ = 450mA  
NPTB00050  
Page 3  
NDS-007 Rev 6, April 2013  
NPTB00050  
Not recommended for new designs  
Contact applications@nitronex.com for questions or support  
Load-Pull Data, Reference Plane at Device Leads  
VDS=28V, I =450mA, TA=25°C unless otherwise noted.  
DQ  
Figure 2 - Typical CW Performance vs. IDQ  
VDS = 28V, 3000MHz  
Figure 3 - Typical CW Performance  
VDS = 28V, IDQ = 450mA  
NPTB00050  
Page 4  
NDS-007 Rev 6, April 2013  
NPTB00050  
Not recommended for new designs  
Contact applications@nitronex.com for questions or support  
Typical Device Characteristics  
VDS=28V, I =450mA, TA=25°C unless otherwise noted.  
DQ  
Figure 5 - MTTF of NRF1 Devices as a  
Function of Junction Temperature  
Figure 4 - Power Derating Curve  
Figure 6 - Typical CW Performance vs. Temperature  
in Nitronex Test Fixture,  
VDS = 28V, IDQ = 450 mA, 3000MHz  
NPTB00050  
Page 5  
NDS-007 Rev 6, April 2013  
NPTB00050  
Not recommended for new designs  
Contact applications@nitronex.com for questions or support  
NPTB00050, 3000MHz CW Production Test Fixture  
VDS=28V, I =450mA, TA=25°C unless otherwise noted. Additional design information and data available at www.nitronex.com.  
DQ  
VGS  
C1  
C3  
C2  
+
VGS  
VDS  
VDS  
+
C4  
C6  
C10  
R3  
R2  
C9  
C7  
C8  
C5  
RFIN  
RFOUT  
TL5  
TL5  
65mils  
600mils  
65mils  
600mils  
NPTB00050  
RFOUT  
C12  
Nitronex  
RFIN  
NPTB00050  
8/01/2006  
TL4  
65mils  
1040mils  
TL3  
368mils  
297mils  
C11  
TL1  
60mils  
250mils  
TL2  
349mils  
240mils  
C13  
Figure 7 - NPTB00050 3000MHz Test Fixture  
Table 2: NPTB00050 3000MHz Test Fixture Bill of Materials  
Name  
Value  
150uF  
270uF  
0.01uF  
0.1uF  
Vendor  
Nichicon  
United Chmi-Con  
AVX  
Vendor Number  
C1  
C10  
UPW1C151MED  
ELXY630ELL271MK25S  
12061C103KAT2A  
C1206C104K1RACTU  
ECJ-5YB2A105M  
ATC600F5R6CT  
C3, C7  
C2, C8  
C4, C9  
C5, C6, C12  
C11  
Kemet  
1.0 uF  
5.6pF  
1.8pF  
0.7pF  
33 ohm  
0.33 ohm  
-
Panasonic  
ATC  
ATC  
ATC600F1R8AT  
C13  
ATC  
ATC600F0R7AT  
R2  
Panasonic  
Panasonic  
Taconic  
ERJ-6ENF33R0V  
ERJ-6RQFR33V  
R3  
Substrate  
RF35, t=30mil, e =3.5  
r
NPTB00050  
Page 6  
NDS-007 Rev 6, April 2013  
NPTB00050  
Not recommended for new designs  
Contact applications@nitronex.com for questions or support  
1
Ordering Information  
Part Number  
Description  
NPTB00050B  
NPTB00050 in AC360B-2 Metal-Ceramic Bolt-Down Package  
1: To find a Nitronex contact in your area, visit our website at http://www.nitronex.com  
Figure 8 - AC360B-2 Metal-Ceramic Package Dimensions and Pinout (all dimensions are in inches [mm])  
NPTB00050  
Page 7  
NDS-007 Rev 6, April 2013  
NPTB00050  
Not recommended for new designs  
Contact applications@nitronex.com for questions or support  
Nitronex, LLC  
2305 Presidential Drive  
Durham, NC 27703 USA  
+1.919.807.9100 (telephone)  
+1.919.807.9200 (fax)  
info@nitronex.com  
www.nitronex.com  
Additional Information  
This part is lead-free and is compliant with the RoHS directive  
(Restrictions on the Use of Certain Hazardous Substances in Electrical and Electronic Equipment).  
Important Notice  
Nitronex, LLC reserves the right to make corrections, modifications, enhancements, improvements and other changes to  
its products and services at any time and to discontinue any product or service without notice. Customers should obtain  
the latest relevant information before placing orders and should verify that such information is current and complete. All  
products are sold subject to Nitronex terms and conditions of sale supplied at the time of order acknowledgment. The latest  
information from Nitronex can be found either by calling Nitronex at 1-919-807-9100 or visiting our website at  
www.nitronex.com.  
Nitronex warrants performance of its packaged semiconductor or die to the specifications applicable at the time of sale in  
accordance with Nitronex standard warranty. Testing and other quality control techniques are used to the extent Nitronex  
deems necessary to support the warranty. Except where mandated by government requirements, testing of all parameters  
of each product is not necessarily performed.  
Nitronex assumes no liability for applications assistance or customer product design. Customers are responsible for their  
product and applications using Nitronex semiconductor products or services. To minimize the risks associated with  
customer products and applications, customers should provide adequate design and operating safeguards.  
Nitronex does not warrant or represent that any license, either express or implied, is granted under any Nitronex patent right,  
copyright, mask work right, or other Nitronex intellectual property right relating to any combination, machine or process in  
which Nitronex products or services are used.  
Reproduction of information in Nitronex data sheets is permitted if and only if said reproduction does not alter any of the  
information and is accompanied by all associated warranties, conditions, limitations and notices. Any alteration of the  
contained information invalidates all warranties and Nitronex is not responsible or liable for any such statements.  
Nitronex products are not intended or authorized for use in life support systems, including but not limited to surgical  
implants into the body or any other application intended to support or sustain life. Should Buyer purchase or use Nitronex,  
LLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold Nitronex, LLC, its  
ofcers, employees, subsidiaries, affiliates, distributors, and its successors harmless against all claims, costs, damages,  
and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death  
associated with such unintended or unauthorized use, notwithstanding if such claim alleges that Nitronex was negligent  
regarding the design or manufacture of said products.  
Nitronex and the Nitronex logo are registered trademarks of Nitronex, LLC.  
All other product or service names are the property of their respective owners.  
©Nitronex, LLC 2012. All rights reserved.  
NPTB00050  
Page 8  
NDS-007 Rev 6, April 2013  

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